TEA1795T/N1,118 [NXP]
Dual synchronous rectification controller suitable for both high-side and low-side control SOIC 8-Pin;
| 型号： | TEA1795T/N1,118 |
| 厂家： | 
NXP |
| 描述： | Dual synchronous rectification controller suitable for both high-side and low-side control SOIC 8-Pin |
| 文件： | 总14页 (文件大小：131K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TEA1795T
GreenChip synchronous rectifier controller
Rev. 1 — 4 November 2010
Product data sheet
1. General description
The TEA1795T is a member of the new generation of Synchronous Rectifier (SR)
controller ICs for switched mode power supplies. Its high level of integration enables the
design of a cost-effective power supply with a minimum number of external components.
The TEA1795T is a dedicated controller IC for synchronous rectification on the secondary
side of resonant converters. It has two driver stages for driving the SR MOSFETs, which
are rectifying the outputs of the central tap secondary transformer windings.
The two gate driver stages have their own sensing inputs and operate independently of
each other.
The TEA1795T is fabricated in a Silicon On Insulator (SOI) process.
2. Features and benefits
2.1 Distinctive features
Accurate synchronous rectification functionality
Wide supply voltage range (8.5 V to 38 V)
Separate sense inputs for sensing the drain and source voltage of each SR MOSFET
High level of integration, resulting in a minimum external component count
High driver output voltage of 10 V to drive all MOSFET brands to the lowest RDSon
2.2 Green features
Low current consumption
High system efficiency from no load to full load
2.3 Protection features
UnderVoltage Protection (UVP)
3. Applications
The TEA1795T is intended for resonant power supplies. In such applications, it can drive
two external synchronous rectifier MOSFETs which replace diodes for the rectification of
the voltages on the two secondary windings of the transformer. It can be used in
applications such as:
Adapters
ATX power supplies
TEA1795T
NXP Semiconductors
GreenChip synchronous rectifier controller
Server power supplies
LCD television
Plasma television
4. Ordering information
Table 1.
Ordering information
Type number
Package
Name
Description
plastic small outline package; 8 leads; body width 3.9 mm
Version
TEA1795T/N1
SO8
SOT96-1
5. Block diagram
V
CC
7
SUPPLY
AND
UVLO
BIAS
control A
TIMER
0.4 μs
4
1
R
S
Q
Q
TIMER
0.5 μs
3
DSA
GDA
&
DRIVER
−25 mV
−12 mV
−220 mV
SSA
TEA1795T
control B
TIMER
0.4 μs
5
8
R
S
Q
Q
TIMER
0.5 μs
6
DSB
SSB
GDB
&
DRIVER
−25 mV
−12 mV
−220 mV
2
GND
001aal796
Fig 1. Block diagram
TEA1795T
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© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 — 4 November 2010
2 of 14
TEA1795T
NXP Semiconductors
GreenChip synchronous rectifier controller
6. Pinning information
6.1 Pinning
1
2
3
4
8
7
6
5
SSA
GND
GDA
DSA
SSB
V
CC
TEA1795T
GDB
DSB
014aaa976
Fig 2. Pin configuration
6.2 Pin description
Table 2.
Symbol
SSA
Pin description
Pin
1
Description
source sense input MOSFET A
ground
GND
GDA
DSA
2
3
gate driver output MOSFET A
drain sense input for synchronous timing MOSFET A
drain sense input for synchronous timing MOSFET B
gate driver output MOSFET B
supply voltage
4
DSB
5
GDB
VCC
6
7
SSB
8
source sense input MOSFET B
7. Functional description
7.1 Introduction
The TEA1795T is a controller for synchronous rectification to be used in resonant
applications. It can drive two synchronous rectifier MOSFETs on the secondary side of the
central tap transformer winding. A typical configuration is shown in Figure 3.
TEA1795T
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© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 — 4 November 2010
3 of 14
TEA1795T
NXP Semiconductors
GreenChip synchronous rectifier controller
V
in
Q
Q
prim1
C
PRIMARY
SIDE
CONTROLLER
HB
TR
prim2
V
out
C
out
R
Q
R
DRNSENSE2
DRNSENSE1
V
Q
CC
IC1
sec1
sec2
DSA
GDA
SSA
DSB
GDB
SSB
TEA1795T
GND
001aal797
Fig 3. TEA1795T: typical configuration
7.2 Start-up and UnderVoltage LockOut (UVLO)
The IC leaves the UVLO state and activates the synchronous rectifier circuitry when the
voltage on the VCC pin is above Vstartup (8.5 V typical). When the voltage drops below
8.0 V (typical), the UVLO state is reentered and the SR MOSFET gate driver outputs are
actively kept low.
7.3 Supply management
All (internal) reference voltages are derived from a temperature compensated, on-chip
band gap circuit.
7.4 Synchronous rectification (DSA, SSA, DSB and SSB pins)
The voltages present between the drain and source terminals of the SR MOSFETs are
used to derive the timing for the gate drive signal. The IC senses the voltage difference
between the drain sense (pins DSA and DSB) and the source sense (pins SSA and SSB)
connections. When this voltage difference is lower than Vact(drv) (−220 mV typical), the
corresponding gate driver output voltage is driven high and the external SR MOSFET is
switched on.
When the external SR MOSFET is switched on, the input signals on the drain sense pins
and source sense pins are ignored during the minimum synchronous rectification active
time (tact(sr)(min), 520 ns typical). This minimizes false switch-off due to the sensing of high
frequency ringing signals at the start of the conduction phase.
Once this minimum synchronous rectification active time has ended, the IC monitors the
difference between the drain sense inputs and the source sense inputs. When the
difference is higher than Vreg(drv) (−25 mV typical), the gate driver output voltage is
regulated to maintain this −25 mV difference between the drain sense pins and the source
sense pins. As a result, the SR MOSFET can be switched off quickly when the current
through the external SR MOSFET reaches zero.
TEA1795T
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© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 — 4 November 2010
4 of 14
TEA1795T
NXP Semiconductors
GreenChip synchronous rectifier controller
The zero current is detected by sensing a Vdeact(drv) (−12 mV typical) difference between
the drain sense pins and the source sense pins (see Figure 4). A synchronous
rectification off-timer (toff(sr)(min), 400 ns typical) is started and the next switching cycle can
only be started when the synchronous rectification off-timer has finished.
secondary
0 A
current
drain sense-
source sense
voltage
0 V
V
V
V
deact(drv)
reg(drv)
act(drv)
gate driver
0 V
blanking
windows
t
t
t
off(sr)(min)
act(sr)(min)
001aal798
Fig 4. Synchronous rectification signals
7.5 Gate driver (GDA and GDB pins)
The gate driver circuit to the gate of the external SR MOSFET has a source capability of
typically 400 mA and a sink capability of typically 2.7 A. This allows fast turn-on and
turn-off of the external SR MOSFET for efficient operation. The source stage is coupled to
the timer (see Figure 1). When the timer has finished, the source capability is reduced to a
small current (4 mA typical) capable of keeping the driver output voltage at its level.
The output voltage of the driver is limited to 10 V (typical). This high output voltage drives
all MOSFET brands to the minimum on-state resistance.
During start-up conditions (VCC < Vstartup) and UVLO the driver output voltage is actively
pulled low.
7.6 Source sense (SSA and SSB pins)
The IC is equipped with additional source sense pins (SSA and SSB). These pins are
used for the measurement of the drain-to-source voltage of the external SR MOSFET.
This drain-to-source voltage determines the timing of the gate driver. The source sense
input should be connected as close as possible to the source pin of the external
SR MOSFET to minimize timing errors, caused by voltage difference on PCB tracks, due
to parasitic inductance in combination with large dI/dt values.
TEA1795T
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© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 — 4 November 2010
5 of 14
TEA1795T
NXP Semiconductors
GreenChip synchronous rectifier controller
8. Limiting values
Table 3.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are measured
with respect to ground (pin 2); positive currents flow into the chip. Voltage ratings are valid provided
other ratings are not violated; current ratings are valid provided the other ratings are not violated.
Symbol
Voltages
VCC
Parameter
Conditions
Min
Max
Unit
supply voltage
continuous
continuous
continuous
−0.4
+38
120
120
V
V
V
Vsense(D)A drain sense voltage A
Vsense(D)B drain sense voltage B
Currents
-
-
Idrv(G)A
Idrv(G)B
II(DSA)
II(DSB)
II(SSA)
II(SSB)
General
Ptot
gate driver current A
δ < 10 %
δ < 10 %
−0.8
−0.8
−3
+3.0
+3.0
-
A
gate driver current B
A
input current on pin DSA
input current on pin DSB
input current on pin SSA
input current on pin SSB
mA
mA
mA
mA
−3
-
−1
+1
+1
−1
total power dissipation
storage temperature
junction temperature
Tamb < 80 °C
-
0.45
W
Tstg
−55
−40
+150
+150
°C
°C
Tj
ElectroStatic Discharge voltage (ESD)
VESD
electrostatic discharge
voltage
class 2
[1]
[2]
human body
model
-
2000
V
machine model
-
-
200
500
V
V
charged device
model
[1] Equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor.
[2] Equivalent to discharging a 200 pF capacitor through a 0.75 μH coil and a 10 Ω resistor.
9. Thermal characteristics
Table 4.
Thermal characteristics
Parameter
Symbol
Conditions
Typ
Unit
Rth(j-a)
thermal resistance from junction JEDEC test board
to ambient
150
K/W
Rth(j-c)
thermal resistance from junction JEDEC test board
to case
100
K/W
TEA1795T
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© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 — 4 November 2010
6 of 14
TEA1795T
NXP Semiconductors
GreenChip synchronous rectifier controller
10. Characteristics
Table 5.
amb = 25 °C; VCC = 20 V; all voltages are measured with respect to ground (pin 2); currents are positive when flowing into
the IC; unless otherwise specified.
Characteristics
T
Symbol Parameter
Supply voltage management (pin VCC
Conditions
Min
Typ
Max
Unit
)
Vstartup
Vhys
start-up voltage
8.2
8.5
8.8
V
[1]
hysteresis voltage
operating supply current
-
-
-
0.5
-
-
-
V
ICC(oper)
VCC = 8 V (VCC < Vstartup
)
0.35
1.85
mA
mA
fsw = 200 kHz;
no load on pins GDA and GDB
Synchronous rectification sense input (pins DSA/SSA and pins DSB/SSB)
Vact(drv)
Vreg(drv)
Vdeact(drv)
VI(cm)
driver activation voltage
driver regulation voltage
driver deactivation voltage
Vsense(S)A = 0 V; Vsense(S)B = 0 V
Vsense(S)A = 0 V; Vsense(S)B = 0 V
Vsense(S)A = 0 V; Vsense(S)B = 0 V
−260
−33
-
−220 −180
mV
mV
mV
V
−25
−12
-
−17
[2]
-
common-mode input voltage pins SSA and SSB
−0.7
-
+0.7
-
td(act)(drv)
driver activation delay time Vsense(S)A = 0 V; Vsense(S)B = 0 V;
Vsense(D)A = falling from +0.5 V to −0.5 V;
100
ns
Vsense(D)B = falling from +0.5 V to −0.5 V
td(deact)(drv) driver deactivation delay
time
Vsense(S)A = 0 V; Vsense(S)B = 0 V;
Vsense(D)A = rising from −0.35 V to +0.5 V;
Vsense(D)B = rising from −0.35 V to +0.5 V
-
35
-
ns
tact(sr)(min)
toff(sr)(min)
minimum synchronous
rectification active time
415
310
520
400
625
490
ns
ns
minimum synchronous
rectification off-time
Gate driver (pins GDA/GDB)
Isource
source current
VCC = 15 V; pins GDA/GDB = 2 V; during
minimum synchronous rectification active
time
−0.46 −0.4
−0.34
A
VCC = 15 V; pins GDA/GDB = 5 V;
-
−4
-
mA
minimum synchronous rectification active
time has ended
Isink
sink current
VCC = 15 V
pins GDA/GDB = 2 V
pins GDA/GDB = 9.5 V
VCC = 15 V
1
1.4
2.7
10
-
A
A
V
2.2
-
-
Vo(max)
maximum output voltage
12
Switching
fsw(max)
maximum switching
frequency
500
-
-
kHz
[1] The VCC stop voltage is Vstartup − Vhys
.
[2] The Vdeact(drv) level is always above the Vreg(drv) level.
TEA1795T
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© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 — 4 November 2010
7 of 14
TEA1795T
NXP Semiconductors
GreenChip synchronous rectifier controller
11. Application information
A switched mode power supply with the TEA1795T consists of a primary side half bridge,
a transformer, a resonant capacitor and an output stage. In the output stage
SR MOSFETs are used to obtain low conduction loss rectification. These SR MOSFETs
are controlled by the TEA1795T.
The timing for the synchronous rectifier switch is derived from the voltage difference
between the corresponding drain sense and source sense pins. The resistor in the drain
sense connection is needed to protect the TEA1795T against excessive voltages. These
resistors should typically be 1 kΩ. Higher values might impair correct timing, lower values
may not provide sufficient protection.
Special attention should be paid to the connection of the drain sense and source sense
pins. The voltages measured on these pins are used for the timing of the gate driver
output. Wrong measurement results in wrong timing. The connections to these pins
should not interfere with the power wiring. The power wiring conducts currents with high
dI/dt values. This can easily cause measurement errors resulting from induced voltages
due to parasitic inductances. The separate source sense pins make it possible to sense
the source voltage of the external MOSFETs directly, without having to use the current
carrying power ground tracks for this.
11.1 Application diagram resonant application
V
in
Q
prim1
C
PRIMARY
SIDE
CONTROLLER
HB
TR
Q
prim2
V
C
out
R
Q
R
DRNSENSE2
out
DRNSENSE1
1 kΩ
sec1
1 kΩ
V
Q
CC
IC1
sec2
DSA
GDA
SSA
DSB
GDB
SSB
TEA1795T
GND
001aal799
Fig 5. Typical resonant application with TEA1795T
TEA1795T
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© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 — 4 November 2010
8 of 14
TEA1795T
NXP Semiconductors
GreenChip synchronous rectifier controller
11.2 Application diagram multi-output flyback application
TR
V
out2
V
in
C
out2
V
out1
C
R
Q
R
DRNSENSE2
out1
DRNSENSE1
1 kΩ
sec1
1 kΩ
Q
V
prim
Q
CC
IC1
sec2
DSA
GDA
SSA
DSB
PRIMARY
SIDE
CONTROLLER
GDB
SSB
TEA1795T
GND
001aal800
Fig 6. Multi-output flyback application with TEA1795T
TEA1795T
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© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 — 4 November 2010
9 of 14
TEA1795T
NXP Semiconductors
GreenChip synchronous rectifier controller
12. Package outline
SO8: plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
D
E
A
X
v
c
y
H
M
A
E
Z
5
8
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
4
e
w
M
detail X
b
p
0
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
(1)
(1)
(2)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.
0.25
0.10
1.45
1.25
0.49
0.36
0.25
0.19
5.0
4.8
4.0
3.8
6.2
5.8
1.0
0.4
0.7
0.6
0.7
0.3
mm
1.27
0.05
1.05
0.041
1.75
0.25
0.01
0.25
0.01
0.25
0.1
8o
0o
0.010 0.057
0.004 0.049
0.019 0.0100 0.20
0.014 0.0075 0.19
0.16
0.15
0.244
0.228
0.039 0.028
0.016 0.024
0.028
0.012
inches 0.069
0.01 0.004
Notes
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-18
SOT96-1
076E03
MS-012
Fig 7. Package outline SOT096-1 (SO8)
TEA1795T
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© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 — 4 November 2010
10 of 14
TEA1795T
NXP Semiconductors
GreenChip synchronous rectifier controller
13. Revision history
Table 6.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
TEA1795T v.1
20101104
Product data sheet
-
-
TEA1795T
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© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 — 4 November 2010
11 of 14
TEA1795T
NXP Semiconductors
GreenChip synchronous rectifier controller
14. Legal information
14.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
malfunction of an NXP Semiconductors product can reasonably be expected
14.2 Definitions
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
14.3 Disclaimers
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
TEA1795T
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© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 — 4 November 2010
12 of 14
TEA1795T
NXP Semiconductors
GreenChip synchronous rectifier controller
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
non-automotive qualified products in automotive equipment or applications.
14.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
GreenChip — is a trademark of NXP B.V.
15. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
TEA1795T
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 — 4 November 2010
13 of 14
TEA1795T
NXP Semiconductors
GreenChip synchronous rectifier controller
16. Contents
1
General description. . . . . . . . . . . . . . . . . . . . . . 1
2
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Distinctive features . . . . . . . . . . . . . . . . . . . . . . 1
Green features . . . . . . . . . . . . . . . . . . . . . . . . . 1
Protection features . . . . . . . . . . . . . . . . . . . . . . 1
2.1
2.2
2.3
3
4
5
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2
6
6.1
6.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
7
Functional description . . . . . . . . . . . . . . . . . . . 3
Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Start-up and UnderVoltage LockOut (UVLO) . . 4
Supply management. . . . . . . . . . . . . . . . . . . . . 4
Synchronous rectification (DSA, SSA, DSB
7.1
7.2
7.3
7.4
and SSB pins). . . . . . . . . . . . . . . . . . . . . . . . . . 4
Gate driver (GDA and GDB pins) . . . . . . . . . . . 5
Source sense (SSA and SSB pins) . . . . . . . . . 5
7.5
7.6
8
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6
Thermal characteristics . . . . . . . . . . . . . . . . . . 6
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 7
9
10
11
11.1
11.2
Application information. . . . . . . . . . . . . . . . . . . 8
Application diagram resonant application. . . . . 8
Application diagram multi-output flyback
application . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
12
13
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 11
14
Legal information. . . . . . . . . . . . . . . . . . . . . . . 12
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 12
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 13
14.1
14.2
14.3
14.4
15
16
Contact information. . . . . . . . . . . . . . . . . . . . . 13
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 4 November 2010
Document identifier: TEA1795T
相关型号：
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