TEA1833TS/1Z [NXP]
Switching Controller;
| 型号： | TEA1833TS/1Z |
| 厂家： | 
NXP |
| 描述： | Switching Controller 开关 |
| 文件： | 总25页 (文件大小：252K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TEA1833TS
GreenChip SMPS control IC
Rev. 1 — 31 August 2015
Product data sheet
1. General description
The TEA1833TS is a low-cost Switched Mode Power Supply (SMPS) controller IC
intended for flyback topologies. The TEA1833TS operates in peak current and frequency
control mode. Frequency jitter has been implemented to reduce ElectroMagnetic
Interference (EMI). Slope compensation is integrated for Continuous Conduction Mode
(CCM) operation.
The TEA1833TS IC features OverPower Protection (OPP). The controller accepts an
overpower situation up to 200 % for a limited amount of time.
Mains undervoltage protection (brownin/brownout), output OverVoltage Protection (OVP),
and OverTemperature Protection (OTP) can be implemented using a minimal number of
external components.
At low-power levels, the primary peak current is set to 22 % of the maximum peak current.
The switching frequency is reduced to limit the switching losses. The combination of fixed
frequency operation at high output power and frequency reduction at low output power
provides high efficiency over the total load range.
The TEA1833TS makes the design of low-cost, highly efficient and reliable supplies
easier by requiring a minimum number of external components. The device is especially
suited for medium power applications.
2. Features and benefits
SMPS controller IC enabling low-cost applications
Large input voltage range (10.5 V to 36 V)
Integrated OverVoltage Protection (OVP) on the VCC pin
Accurate OverVoltage Protection (OVP) via the ISENSE pin
Dedicated burst mode, allowing a low VCC capacitor value
Very low supply current during start-up and restart (11 A typical)
Low supply current during normal operation (0.58 mA typical without load)
Adaptive internal overpower time-out
Overpower protection including high/low line compensation
Fixed switching frequency with frequency jitter to reduce EMI
Frequency reduction with fixed minimum peak current to maintain high efficiency at
low output power levels
Peak power operation up to 200 % by frequency increase and peak current increase
Slope compensation for CCM operation
TEA1833TS
NXP Semiconductors
GreenChip SMPS control IC
Limitation of switching frequency at high mains to reduce the maximum drain voltage
Integrated soft-start
Drive capability 300 mA source, 750 mA sink
Maximum duty cycle set at 90 %
Mains undervoltage protection (brownin/brownout)
Output Short Circuit Protection (OSCP), avoiding transformer saturation
External OverTemperature Protection (OTP)
IC overtemperature protection
Internal VCC OVP, external OVP, internal OTP, and external OTP are latched
protections; all other protections cause a restart
3. Applications
All applications that require an efficient and cost-effective power supply solution. The
TEA1833TS is especially suited for medium power applications.
4. Ordering information
Table 1.
Ordering information
Type number
Package
Name
Description
Version
TEA1833TS/1
TSOP6
plastic surface-mounted package; 6 leads
SOT457
TEA1833TS
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© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
Rev. 1 — 31 August 2015
2 of 25
TEA1833TS
NXP Semiconductors
GreenChip SMPS control IC
5. Block diagram
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Fig 1. TEA1833TS block diagram
TEA1833TS
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
Rev. 1 — 31 August 2015
3 of 25
TEA1833TS
NXP Semiconductors
GreenChip SMPS control IC
6. Pinning information
6.1 Pinning
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Fig 2. TEA1833TS pin configuration
6.2 Pin description
Table 2.
Pin description
Symbol
VCC
Pin
1
Description
supply voltage
ground
GND
2
PROTECT
CTRL
3
protection and mains detect input
control input
4
ISENSE
DRIVER
5
current sense and accurate OVP input
gate driver output
6
TEA1833TS
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© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
Rev. 1 — 31 August 2015
4 of 25
TEA1833TS
NXP Semiconductors
GreenChip SMPS control IC
7. Functional description
7.1 General control
The TEA1833TS contains a controller for a flyback circuit. A typical configuration is shown
in Figure 3.
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Fig 3. TEA1833TS typical configuration
7.2 Start-up and UnderVoltage LockOut (UVLO)
Initially, the capacitor on the VCC pin, C3, is charged from the high-voltage mains via
resistor R1.
As long as the voltage on the VCC pin is below Vstartup, the IC current consumption is low
(11 A typical). When the voltage on the VCC pin reaches Vstartup, the IC first checks the
PROTECT pin. Only when the current exceeds the brownin level (Imains(bi)) during mains
detect and the voltage surpasses Vdet(PROTECT) during external OTP measurement the IC
starts switching. An internal soft-start time of 3.5 ms allows the ISENSE peak voltage to
increase gradually to prevent audible noise. In a typical application, the auxiliary winding
of the transformer takes over the supply voltage.
If a protection is triggered, the controller stops switching. Depending on the protection
triggered, it either causes a restart or latches the converter to an off-state.
The OPP, UVLO, brownin/brownout, maximum duty cycle protections cause a safe restart.
The internal and external OVP and the internal and external OTP latch the converter to an
off-state.
A restart protection disables the switching of the IC. The supply voltage of the IC drops to
the UVLO level. When the UVLO level is reached, the IC switches to power-down mode,
where it consumes a low supply current (11 A typical). The VCC capacitor is recharged
via R1 until the VCC start-up level is reached. The IC starts switching again.
The OPP protection performs a slow restart to lower the average input power during a
fault condition. The restart sequence that discharges and recharges the VCC capacitor is
performed three times, before switching recommences (see Figure 4).
TEA1833TS
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© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
Rev. 1 — 31 August 2015
5 of 25
TEA1833TS
NXP Semiconductors
GreenChip SMPS control IC
When a latched protection is triggered, the TEA1833TS immediately enters power-down
mode. The VCC pin is clamped to a voltage just above the latch protection reset voltage
(Vrst(latch) + 1 V).
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Fig 4. Start-up sequence, normal operation and restart sequence
When the voltage on pin VCC drops below the Vth(UVLO) level during normal operation, the
controller stops switching. The TEA1833TS waits for the rectified mains to charge the
VCC pin to Vstartup using resistor R1.
7.3 Supply management
All internal reference voltages are derived from a temperature compensated on-chip band
gap circuit. Internal reference currents are derived from a trimmed and temperature
compensated current reference circuit.
TEA1833TS
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© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
Rev. 1 — 31 August 2015
6 of 25
TEA1833TS
NXP Semiconductors
GreenChip SMPS control IC
7.4 External overtemperature protection and mains detect input
(pin PROTECT)
The PROTECT input combines the functions of the mains voltage detection
(browin/brownout) and the external OverTemperature Protection (OTP). An internal clock
separates the period of measuring the mains voltage and the period of detecting external
OverTemperature Protection (OTP). In a typical application, the PROTECT pin is
connected to the mains via a resistor. It is connected to ground via a
Negative Temperature Coefficient (NTC) thermistor and a diode.
When measuring the mains voltage, the PROTECT pin is regulated to 0.25 V to prevent
that the external diode conducts current. The current into the PROTECT pin is measured
and stored. Once the measured current is above the brownin level, the system is allowed
to start switching. If the mains voltage is continuously below the brownout level for at least
32 ms, a brownout is detected. The system immediately stops switching and performs a
restart. The VCC capacitor is discharged to the UVLO level and then charged to Vstartup
once before switching recommences (See Figure 5).
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Fig 5. Mains detection
When detecting the external temperature, a current of 200 A (typical) out of the
PROTECT pin flows through the external capacitor and the NTC thermistor. If the
PROTECT voltage at the end of the measuring period is below Vdet(PROTECT) for four
consecutive measuring cycles, the IC detects overtemperature. It activates a latched
protection.
TEA1833TS
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© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
Rev. 1 — 31 August 2015
7 of 25
TEA1833TS
NXP Semiconductors
GreenChip SMPS control IC
The offset due to the current from the mains is canceled internally by remembering the
sinking current Iin when measuring the mains voltage (See Figure 6). The stored current is
also used as the input of high/low line compensation and for the maximum switching
frequency limitation.
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Fig 6. External overtemperature protection
An internal clamp of 4.1 V (typical) protects this pin from excessive voltages.
7.5 Duty cycle control (pin CTRL)
Pin CTRL regulates the output power of the converter. This pin is connected to an internal
voltage source of 5.4 V via an internal resistor (typical resistance: 26 k).
The CTRL pin voltage sets the peak current which is measured using the ISENSE pin
(see Section 7.8). At low output power, the switching frequency is reduced
(see Section 7.12). The maximum duty cycle is limited to 90 % (typical).
After eight consecutive converter strokes at maximum duty cycle, the restart protection is
activated. In a restart, the VCC capacitor is quickly discharged to the Vth(UVLO) level and
recharged to the start-up level from the high-voltage mains, before switching
recommences.
7.6 Slope compensation (pin CTRL)
A slope compensation circuit is integrated for CCM. The slope compensation guarantees
stable operation for duty cycles exceeding 50 %.
TEA1833TS
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© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
Rev. 1 — 31 August 2015
8 of 25
TEA1833TS
NXP Semiconductors
GreenChip SMPS control IC
7.7 Overpower timer
A temporary overload situation is allowed. If Vsense (see Figure 1) set by pin CTRL
exceeds 400 mV, an internal timer is started. If the overload situation continues to exist for
more than 27.5 ms (typical), an OverPower Protection (OPP) is triggered (see Figure 7).
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Fig 7. Overpower delay
The TEA1833TS enters the overpower restart mode when the overload time-out is
reached. In overpower restart mode, the VCC capacitor is discharged to UVLO level and
then charged to the start-up level three times before the converter switches again.
7.8 Peak current mode control (pin ISENSE)
Peak current mode control is used because it ensures a good line regulation.
Pin ISENSE senses the primary current across external resistor R6 and compares it with
an internal control voltage. The internal control voltage is proportional to the CTRL pin
voltage (see Figure 8).
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Fig 8. Peak current control
Leading-edge blanking prevents false triggering due to capacitive discharge when
switching on the external power switch (see Figure 9).
TEA1833TS
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© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
Rev. 1 — 31 August 2015
9 of 25
TEA1833TS
NXP Semiconductors
GreenChip SMPS control IC
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7.9 Overvoltage protection (pin ISENSE)
Accurate overvoltage protection can be realized at the ISENSE pin by sensing the
auxiliary voltage. During the primary stroke, diode D4 (see Figure 3) is blocked so that the
converter still works under current mode control. During the secondary stroke, the
ISENSE voltage represents the output voltage via the resistor divider R5 and R3
(see Figure 3). The ISENSE voltage is sampled 2 s after the gate signal drops to avoid
the ringing of the transformer. If the sampled voltage exceeds Vovp(ISENSE) for four
consecutive switching cycles, the IC triggers the latched protection.
7.10 Overvoltage protection (pin VCC)
An OverVoltage Protection (OVP) circuit is connected to the VCC pin. When the VCC
exceeds Vth(OVP) (36 V typical) for four consecutive switching cycles, the IC triggers the
latched protection. When VCC drops below Vth(OVP) before count = 4 is reached, the
counter is reset to zero.
7.11 Output Short Circuit Protection (OSCP)
A flyback controller operating in CCM at a fixed frequency turns on the primary MOSFET
after a predefined period (see Figure 10). The minimum on-time equals the blanking time.
If after the blanking time the measured peak current (VISENSE) is higher than the Ipeak
regulation level, the driver is switched off.
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Fig 10. Peak current runaway
TEA1833TS
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© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
Rev. 1 — 31 August 2015
10 of 25
TEA1833TS
NXP Semiconductors
GreenChip SMPS control IC
The output voltage can drop, for instance, because a load is too high or a short circuit
event occurs. If the output voltage drops, the decrease of the transformer current during
the secondary stroke time (tsec) becomes less. As a result, the next cycle starts at a higher
peak current.
Also, at the next cycle, the minimum on-time equals the blanking time. During this
blanking time, the peak current can increase to above the targeted regulation level. If the
transformer current does not decrease sufficiently during the secondary stroke, the peak
current can continuously increase to such a level that the transformer saturates
(see Figure 10).
To avoid this continuous peak current increase, also called runaway, the IC features a
special protection (see Figure 11).
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Fig 11. OSCP peak current runaway
If the system detects that the peak current already exceeds the targeted level after 1 s,
the next switching period time is extended from 7.7 s (fsw = 130 kHz) to 28 s
(fsw = 36 kHz). The time of the secondary stroke is then sufficient to decrease the
transformer current to below the targeted peak current again.
To avoid activation at low loads, the OSCP is only enabled when the overpower timer is
active. Additionally, to avoid activation during peak power, Vout must be below half the
OVP level.
The Vout level is measured on the ISENSE pin in a similar way the overvoltage protection
is measured.
To limit the input power during a short circuit or an overload event, the OPP time is
reduced to 50 % when OSCP is enabled.
TEA1833TS
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© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
Rev. 1 — 31 August 2015
11 of 25
TEA1833TS
NXP Semiconductors
GreenChip SMPS control IC
7.12 Peak power, high-power medium power, and low-power operation
During high-power operation, with the converter running at a 65 kHz (typical) fixed
frequency, the power is controlled by varying the peak current.
A peak power mode is implemented to supply a short overload situation. In peak power
mode, both frequency and peak current are increased.
In medium power operation, lowering the switching frequency to 25 kHz reduces the
switching losses.
In low-power operation, lowering of the switching frequency to below 25 kHz further
reduces switching losses. The switching frequency of the converter is reduced while the
peak current is set to 22 % of the maximum peak current (see Figure 8 and Figure 12).
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Fig 12. Frequency control
TEA1833TS
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© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
Rev. 1 — 31 August 2015
12 of 25
TEA1833TS
NXP Semiconductors
GreenChip SMPS control IC
7.13 Overpower or high/low line compensation
The overpower compensation function can be used to realize a maximum output power
which is nearly constant over the full input mains. The overpower compensation circuit
measures the mains detect input current on the PROTECT pin and outputs a
proportionally dependent current on the ISENSE pin. The DC voltage across resistor R3
(see Figure 3) limits the maximum peak current on the current sense resistor (see
Figure 13).
At low output power levels, the overpower compensation circuit is switched off.
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Fig 13. Overpower compensation
7.14 Burst mode
If the CTRL voltage (VCTRL) is < 1.45 V, the system is not switching. It waits until the VCTRL
exceeds this minimum level before starting the next cycle. During this period, the
TEA1833TS discharges the primary VCC capacitor. If the voltage on the VCC pin then
drops to below the burst threshold level (Vth(burst)), the system asserts two DRIVER pulses
to recharge the VCC capacitor. The assertion avoids that the voltage on the VCC pin
drops to below the UVLO level during a large off-time.
Worst off-time occurs when there is a load transient from peak load to no-load. The output
voltage shows an overshoot and stops switching until the output voltage drops to below
the regulation level while there is no-load at the output.
For minimum no-load input power, the chosen value of the external capacitor at the VCC
pin must be high enough to prevent that the voltage on the VCC pin drops below the burst
threshold level at continuous no-load operation. The burst mode is only intended to assist
at load changes until the output voltage drops to below the regulation level while there is
no-load at the output.
TEA1833TS
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© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
Rev. 1 — 31 August 2015
13 of 25
TEA1833TS
NXP Semiconductors
GreenChip SMPS control IC
7.15 Limitation of the maximum switching frequency
At high mains, the maximum switching frequency is limited (see Figure 14). The 130 kHz
switching frequency is required at low mains only. At high mains, the high switching
frequency during peak power causes an unnecessary high voltage on the drain of the
MOSFET, because the high switching frequency increases the clamp voltage.
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Fig 14. Switching frequency limitation
7.16 Driver (pin DRIVER)
The driver circuit to the gate of the power MOSFET has a current sourcing capability of
typically 300 mA and a current sink capability of typically 750 mA. These capabilities
enable a fast turn-on and turn-off of the power MOSFET for efficient operation.
7.17 OverTemperature Protection (OTP)
If the junction temperature exceeds the thermal shutdown limit, integrated
overtemperature protection ensures that the IC stops switching.
OTP is a latched protection. It can be reset by removing the voltage on pin VCC.
TEA1833TS
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8. Limiting values
Table 3.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Voltages
VCC
Parameter
Conditions
Min
Max
Unit
supply voltage
0.4
0.4
0.4
0.7
+40
+5
V
V
V
V
VPROTECT voltage on pin PROTECT
current limited
VCTRL
voltage on pin CTRL
+5.5
+5
VISENSE
voltage on pin ISENSE
current limited to
2 mA
Currents
IVCC
current on pin VCC
< 10 %
-
0.4
+1
A
II(PROTECT) input current on pin
PROTECT
1
mA
ICTRL
IISENSE
IDRIVER
General
Ptot
current on pin CTRL
current on pin ISENSE
current on pin DRIVER
3
0
mA
mA
A
10
0.4
+0.5
+1
< 10 %
total power dissipation
storage temperature
junction temperature
Tamb < 75 C
-
0.29
W
Tstg
55
40
+150
+150
C
C
Tj
ESD
VESD
electrostatic discharge
voltage
Human Body
Model (HBM)
JEDEC class 2;
all pin
2500
750
+2500
+750
V
V
Charged Device
Model (CDM)
JEDEC class 3;
all pins
9. Thermal characteristics
Table 4.
Symbol
Rth(j-a)
Thermal characteristics
Parameter
Conditions
Typ
Unit
thermal resistance from junction in free air; single layer
to ambient JEDEC test board
259
K/W
Rth(j-c)
thermal resistance from junction in free air; JEDEC test
to case board
152
K/W
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10. Characteristics
Table 5.
amb = 25 C; VCC = 20 V; all voltages are measured with respect to ground (pin 2); currents are positive when flowing into
the IC; unless otherwise specified.
Characteristics
T
Symbol Parameter
Conditions
Min
Typ
Max
Unit
Supply voltage management (pin VCC)
Vstartup
start-up voltage
20
22
24
V
V
Vth(UVLO)
undervoltage lockout
threshold voltage
9.4
10.5
11.6
Vhys
hysteresis voltage
Vstartup - Vth(UVLO)
8.5
-
11.5
11.1
14.5
-
V
V
Vth(burst)
burst mode threshold
voltage
[1]
Vth(burst-UVLO) burst mode to UVLO Vth(burst) > Vth(UVLO)
0.5
0.6
0.7
V
threshold voltage
difference
Vrst(latch)
latched reset voltage
3.5
4.5
-
5.5
-
V
V
Vclamp(VCC)
clamp voltage on pin latched protection mode;
Vrst(latch) + 1
VCC
ICC = 15 A
latched protection mode;
ICC = 500 A
-
-
V
16
-
rst(latch) + 4
V
ICC(startup)
ICC(oper)
start-up supply
current
VCC < Vstartup
6
-
11
0.58
A
mA
operating supply
current
no-load on pin DRIVER;
= 2 %; excluding
opto current
no-load on pin DRIVER;
= 25 %, excluding
opto current
-
0.62
2.5
-
-
mA
mA
ICC(restart)
restart supply current
1
Protection input (pin PROTECT)
Vdet(PROTECT)
detection voltage on II(PROTECT) = 200 A
1.95
2
2.05
V
pin PROTECT
IO(PROTECT)
output current on pin VPROTECT = Vdet(PROTECT
PROTECT
)
212.5
205
200
260
187.5
315
A
mV
Vclamp(PROTECT) clamp voltage on pin II(PROTECT) = 6 A;
PROTECT
mains detect period;
Cmax(PROTECT) = 10 pF
[2]
II(PROTECT) 200 A;
3.5
4.1
4.7
V
OTP measurement period
Mains detect (pin PROTECT)
Imains(bi)
mains brownin
current
5.28
4.63
5.7
5.0
6.12
5.37
A
A
Imains(bo)
mains brownout
current
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Table 5.
Characteristics …continued
Tamb = 25 C; VCC = 20 V; all voltages are measured with respect to ground (pin 2); currents are positive when flowing into
the IC; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Peak current control (pin CTRL)
VCTRL
voltage on pin CTRL for minimum flyback peak
current
1.3
3.4
20
1.6
3.9
26
1.9
4.3
32
V
for maximum flyback peak
current
V
Rint(CTRL)
IO(CTRL)
internal resistance on
pin CTRL
k
output current on pin VCTRL = 1.4 V
183
138
50
93
A
A
CTRL
VCTRL = 3.7 V
67.5
32.5
Pulse width modulator
fosc
oscillator frequency
OSCP
30
38
46
kHz
kHz
kHz
kHz
Hz
peak power
high power
medium power
118
60.5
21
130
65
142
69.5
31
26
fmod
modulation
frequency
195
260
325
fmod
modulation
frequency variation
high power
3
4
5
kHz
%
max
maximum duty cycle
86
7
90
-
94
8
Ncy(sw)max
number of switching to trigger maximum duty
cycles with maximum cycle protection
duty cycle
VCTRL
voltage on pin CTRL for zero duty cycle
1.15
1.4
1.45
1.6
1.75
1.8
V
V
for start of frequency
reduction from medium to
low power
for end of frequency
reduction from high to
medium power mode
1.6
1.8
2.0
V
V
V
V
for start of frequency
reduction from high to
medium power mode
1.9
2.15
3.8
2.40
4.05
5.05
for start of frequency
increase from high to
peak power mode
3.55
4.45
for maximum frequency
(peak power mode); at
low mains; Iprot < 8.5 A
4.75
Overpower protection
tto(opp) overpower protection
time-out time
Current sense and overpower compensation (pin ISENSE)
26
30
34
ms
V
Vsense(max)
maximum sense
voltage
V/t = 0 V/s
0.555
0.590
0.625
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Table 5.
Characteristics …continued
Tamb = 25 C; VCC = 20 V; all voltages are measured with respect to ground (pin 2); currents are positive when flowing into
the IC; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
tPD(sense)
sense propagation
delay
130
155
180
ns
Vth(sense)opp
overpower protection
sense threshold
voltage
380
-
410
20
440
-
mV
VISENSE/t
slope compensation high-power mode
mV/s
voltage on pin
ISENSE
tleb
leading edge
blanking time
275
325
2
375
ns
Iopc(ISENSE)
overpower
IPROTECT = 10 A;
ctrl(Ipeak) > 400 mV
1.5
5.5
2.5
6.5
A
A
compensation
current on pin
ISENSE
V
IPROTECT = 18 A;
Vctrl(Ipeak) > 400 mV
6
Soft start (pin ISENSE)
tstart(soft)
soft start time
2.7
-
3.5
4.2
ms
A
Driver (pin DRIVER)
Isource(DRIVER)
source current on pin VDRIVER = 2 V
0.3
0.25
DRIVER
Isink(DRIVER)
sink current on pin
DRIVER
VDRIVER = 2 V
VDRIVER = 10 V
0.25
0.6
9
0.3
-
A
A
V
0.75
10.5
-
VO(DRIVER)max
maximum output
voltage on pin
DRIVER
12
Overvoltage protection (pins VCC and ISENSE)
Vovp(VCC)
overvoltage
protection voltage on
pin VCC
34.8
2.4
1.7
4
36
2.5
2.1
4
37.2
2.6
2.5
4
V
Vovp(ISENSE)
overvoltage
protection voltage on
pin ISENSE
V
tblank(ovp)ISENSE overvoltage
protection blanking
s
time on pin ISENSE
Ncy(ovp)
number of
overvoltage
protection cycles
Output short circuit protection
Vdis(oscp)ISENSE output short circuit
protection disable
voltage on pin
OSCP is disabled when
VISENSE exceeds
Vdis(oscp)ISENSE
1.2
1.25
1.3
V
ISENSE
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GreenChip SMPS control IC
Table 5.
Characteristics …continued
Tamb = 25 C; VCC = 20 V; all voltages are measured with respect to ground (pin 2); currents are positive when flowing into
the IC; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
tto(oscp)
output short circuit
protection time-out
time
11
14
17
ms
Temperature protection
Tpl(IC) IC protection level
temperature
130
140
150
C
[1] Guaranteed by design.
[2] The clamp voltage on the PROTECT pin is lowered when the IC is in power-down mode. (latched or restart protection).
[3] The Output Short Circuit Protection (OSCP) is only enabled when the voltage level on the ISENSE pin during the secondary stroke is
below Vdis(oscp)ISENSE level (half the Vovp(ISENSE) level). When enabled, the OSCP becomes active when the Vsense level exceeds
Vth(sense)opp and the Vsense level is reached within 1 s (cycle-by-cycle). The switching period is then stretched to 28 s (36 kHz, fosc
OSCP).
TEA1833TS
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11. Application information
A power supply with the TEA1833TS is a flyback converter which operates in both
Discontinuous Conduction Mode (DCM) and Continuous Conduction Mode (CCM). Which
mode depends on the input voltage and output power.
Resistor R1 charges the small buffer capacitor C3 at start-up. The auxiliary winding takes
over during normal operation.
The driver pin switches the MOSFET. Resistor R4 is added to protect the driver against
switching spikes due to parasitics (inductance and capacitance of tracks, MOSFET, and
transformer).
Resistor R6 converts the MOSFET current to a voltage. It is measured on the ISENSE pin.
The R6 value determines the maximum primary peak current through the MOSFET.
The measured peak current is compensated for the mains input voltage using a current
through resistor R3 that is proportional to the bus voltage of capacitor C1. During the
secondary stroke, the auxiliary voltage is measured using diode D4 and resistors R5, R3,
and R6. The measured value can be used for an overvoltage protection for the output
voltage.
Place capacitor C2 close to the CTRL pin to suppress noise.
The PROTECT pin cycles between mains voltage detect and external overtemperature
measurement. During mains voltage detection, the current through resistor R8 is
measured. This current relates to the voltage on capacitor C1 and the input voltage. The
current is used to realize brownin, brownout, and input voltage compensation for the
overpower protection.
During overtemperature protection, a current is sourced from the pin. The voltage over
diode D5 and NTC resistor R2 is measured. A fixed comparator level detects when the
NTC value drops too much.
To avoid pickup of disturbance, place both resistor R8 and diode D5/resistor R2 as close
as possible to the pin.
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TEA1833TS
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20 of 25
TEA1833TS
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GreenChip SMPS control IC
12. Package outline
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Fig 16. Package outline SOT457 (TSOP6)
TEA1833TS
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13. Revision history
Table 6.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
TEA1833TS v.1
20150831
Product data sheet
-
-
TEA1833TS
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14. Legal information
14.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
Suitability for use — NXP Semiconductors products are not designed,
14.2 Definitions
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
14.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
TEA1833TS
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Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
non-automotive qualified products in automotive equipment or applications.
14.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
GreenChip — is a trademark of NXP Semiconductors N.V.
15. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
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16. Contents
1
2
3
4
5
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
6
6.1
6.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
7
Functional description . . . . . . . . . . . . . . . . . . . 5
General control. . . . . . . . . . . . . . . . . . . . . . . . . 5
Start-up and UnderVoltage LockOut (UVLO) . . 5
Supply management. . . . . . . . . . . . . . . . . . . . . 6
External overtemperature protection
7.1
7.2
7.3
7.4
and mains detect input (pin PROTECT). . . . . . 7
Duty cycle control (pin CTRL). . . . . . . . . . . . . . 8
Slope compensation (pin CTRL). . . . . . . . . . . . 8
Overpower timer. . . . . . . . . . . . . . . . . . . . . . . . 9
Peak current mode control (pin ISENSE). . . . . 9
Overvoltage protection (pin ISENSE) . . . . . . . 10
Overvoltage protection (pin VCC). . . . . . . . . . 10
Output Short Circuit Protection (OSCP) . . . . . 10
Peak power, high-power medium power,
7.5
7.6
7.7
7.8
7.9
7.10
7.11
7.12
and low-power operation . . . . . . . . . . . . . . . . 12
Overpower or high/low line compensation . . . 13
Burst mode . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Limitation of the maximum switching
7.13
7.14
7.15
frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Driver (pin DRIVER) . . . . . . . . . . . . . . . . . . . . 14
OverTemperature Protection (OTP) . . . . . . . . 14
7.16
7.17
8
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 15
Thermal characteristics . . . . . . . . . . . . . . . . . 15
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 16
Application information. . . . . . . . . . . . . . . . . . 20
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 21
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 22
9
10
11
12
13
14
Legal information. . . . . . . . . . . . . . . . . . . . . . . 23
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 23
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 24
14.1
14.2
14.3
14.4
15
16
Contact information. . . . . . . . . . . . . . . . . . . . . 24
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2015.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 31 August 2015
Document identifier: TEA1833TS
相关型号：
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