TEA5582PN [NXP]
暂无描述;型号: | TEA5582PN |
厂家: | NXP |
描述: | 暂无描述 解码器 消费电路 商用集成电路 光电二极管 |
文件: | 总12页 (文件大小:101K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
TEA5582
PLL stereo decoder (BTSC system)
July 1990
Product specification
File under Integrated Circuits, IC02
Philips Semiconductors
Product specification
PLL stereo decoder (BTSC system)
TEA5582
GENERAL DESCRIPTION
Features
The TEA5582, a 20-pin integrated phase-locked loop
(PLL) stereo decoder, is designed primarily for low cost
stereo decoding in a low- to medium-line TV. The MUX
input (pin 1) is a low impedance current input, the gain of
the input amplifier is therefore determined by the external
resistor R1 (see Fig.5). All characteristics are measured
with R1 = 47 kΩ. The de-emphasis of (L, R) and (L-R) can
be chosen by means of external capacitors and resistors.
The supply voltage range of the device is from 7 V to 16 V.
• Wide supply voltage range
• Automatic mono/stereo switching (pilot presence
detector)
• LED driver for stereo indicator
• Smooth mono/stereo control
• Matrix and two amplifiers for left and right output signals
• A source selector to switch between the MUX signal and
an external signal
• Mute circuit for 60 dB muting of the output level
• External de-emphasis control of (L, R) and (L − R)
• 6 dB fixed attenuation of (L − R) with respect to (L + R)
prior to matrix
• All pins are protected against Electrostatic Discharge
(ESD)
QUICK REFERENCE DATA
PARAMETER
Supply voltage range
CONDITIONS
SYMBOL
MIN.
7.0
TYP.
8.5
MAX.
16
UNIT
VS
Itot
V
Total current consumption
without LED driver
−
19
25
mA
Decoder
Overall gain
mono; R1 = 47 kΩ
Vo = 600 mV
Go(Vo/Vi)
14 = V15
4
5.8
245
0.3
0.1
28
7
−
−
−
−
dB
mV
%
AF output voltage (RMS value)
Total harmonic distortion
Output channel unbalance
Channel separation
V
−
THD
V14/V15
α
−
−
dB
dB
L = 1; R = 0
24
Source selector
Suppression of MUX signal
V6 ≥ 2 V
α
α
80
56
90
60
−
−
dB
dB
Suppression of external signal
V6 ≤ 0.8 V
Output amplifiers
Gain output amplifier
MUX signal
Gv
Gv
6.7
7.2
0
7.7
dB
dB
mV
external signal
−0.5
460
+0.5
640
AF output voltage (RMS value)
Mute suppression
MUX signal
V11 = V10
560
V7 ≤ 0.8 V
α
α
56
56
60
60
−
−
dB
dB
external signal
PACKAGE OUTLINE
20-LEAD DIL; PLASTIC (SOT146); SOT146-1; 1996 November 18.
July 1990
2
This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in
_white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in
white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ...
Fig.1 Block diagram.
Philips Semiconductors
Product specification
PLL stereo decoder (BTSC system)
TEA5582
PINNING
Fig.2 Pinning diagram.
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
PARAMETER
Supply voltage range (pin 5)
SYMBOL
MIN.
MAX.
UNIT
VP
I3
−
−
18
75
V
LED-driver current (peak value)
Total power dissipation
mA
Ptot
see Fig.3
Storage temperature range
Operating ambient temperature range
Electrostatic handling(1)
Tstg
Tamb
Ves
−65
0
+150
+70
+2
°C
°C
kV
−2
Note
1. ESD withstand voltage is defined by MIL STD 883C (C = 100 pF; R = 1.5 kΩ).
July 1990
4
Philips Semiconductors
Product specification
PLL stereo decoder (BTSC system)
TEA5582
Fig.3 Power derating curve.
DC CHARACTERISTICS
All voltages are with respect to ground (pin 20); all currents are positive into the device; all parameters are measured in
the test set-up (see Fig.5) at a nominal supply voltage of VS = 8.5 V; Tamb = 25 °C unless otherwise specified.
PARAMETER
Supply voltage
CONDITIONS
SYMBOL
VS
MIN.
7.0
TYP.
8.5
MAX.
16
UNIT
V
Total current consumption
Power dissipation
Voltage
without LED driver
Itot
−
−
19
25
mA
Ptot
160
−
mW
pin 1
V1
−
−
2.1
4.2
−
−
V
V
pins 8, 9, 10, 11, 12 and 13
DC output current
pins 14 and 15
LED-driver current
pin 3
V8 − V13
−I14, I15
1.1
−
1.4
−
1.8
20
−
mA
mA
V
I3
Switch “VCO-OFF”
voltage
I19 = 50 µA
V19
−
2
Switch “VCO-OFF”
current
I19
50
−
−
µA
July 1990
5
Philips Semiconductors
Product specification
PLL stereo decoder (BTSC system)
TEA5582
AC CHARACTERISTICS
Measured in the test circuit of Fig.5; VS = 8.5 V; Tamb = 25 °C.
AC conditions: (1) input signal (Vi) of 815 mV p-p for L = 1, R = 1 (mono) fm = 1 kHz (= 80% modulation). (2) MUX input
signal (Vi) of 1.2 V p-p for L = 1, R = 0 and no DBX; fm = 1 kHz (stereo) and Vpilot = 200 mV p-p. (3) S1 open, unless
specified (without L−R filter); voltage controlled oscillator (VCO) adjusted to 188.8 kHz at Vi = 0 V; values are measured
with an external IF roll-off network (−2 dB at 31.5 kHz = 2fH) at the input (dashed components RS and CS in Fig.5).
All the above conditions apply unless otherwise specified.
PARAMETER
CONDITIONS
SYMBOL
MIN.
TYP.
MAX.
UNIT
Overall performance (Vi to Vo)
Input current (RMS value)
Overall gain
Il(rms)
−
−
12
µA
mono; R1 = 47 kΩ
Go (Vo/Vi)
4
5.8
7
dB
AF output voltage (mono)
(RMS value)
V11 = V10
460
560
640
mV
AF output voltage (mono)
(RMS value)
V
15 = V14
−
245
0.3
800
0.1
28
−
mV
%
Total harmonic distortion
Output voltage
note 1
THD
−
0.5
−
THD = 1%
V11 = V10
V11/V10
α
−
mV
dB
dB
Output channel unbalance
Channel separation
−
1
L = 1; R = 0
24
−
Signal-to-noise ratio
bandwidth
20 Hz to 16 kHz
S/N
S/N
−
−
76
82
−
−
dB
dB
bandwidth IEC 79
(curve Din A)
note 2
Pilot presence detector
Switching to:
stereo
Vpilot
Vpilot
∆Vpilot
−
40
30
2.5
60
−
mV
mV
dB
mono
15
−
hysteresis
−
Smooth mono/stereo control
(pin 16)
see Fig.4
Channel separation (α)
Full stereo
V16 ≥ 1.25 V
V16 = typ. 1 V
V16 ≤ 0.75 V
α
α
α
24
−
28
10
−
−
−
1
dB
dB
dB
Smooth operation
Full mono
−
July 1990
6
Philips Semiconductors
Product specification
PLL stereo decoder (BTSC system)
TEA5582
PARAMETER
Attenuation (L-R)
CONDITIONS
SYMBOL
MIN.
TYP.
MAX.
UNIT
dB
−
6
−
Carrier and harmonic
suppression at the output
note 3
Pilot signal suppression
fpilot = 15.734 kHz
(1 fH)
αfH
32
−
36
60
75
−
−
−
dB
dB
dB
Subcarrier suppression
f = 2 fH
α2fH
VCO suppression
f = 12fH
α12fH
−
SAP signal suppression
(Second Audio Programme)
f = 5fH
α5fH
−
−
60
60
−
−
dB
dB
Intermodulation suppression
fm = 8.367 kHz
note 4
spurious signal
fs = 1 kHz
α2
α3
fm = 10.823 kHz
Ripple rejection
spurious signal
fs = 1 kHz
−
−
70
50
−
−
dB
dB
f = 120 Hz;
Vripple = 100 mV;
mono
RR120
VCO
R adjust (R5)
fOSC = 188.808 kHz
R7 = 10 kΩ 5%
C6 = 820 pF 1%
Radj
0
−
8
kΩ
Capture range
deviation from
fOSC centre
frequency;
Vpilot = 200 mV p-p
∆f/f
−
−
4.5
−
−
%
250
× 10−6
Temperature coefficient
uncompensated
TC
K−1
Output amplifiers
Gain
MUX signal
Gv
Gv
Zi
6.7
−0.5
−
7.2
0
7.7
+0.5
−
dB
dB
kΩ
Ω
external signal
Input impedance
Output impedance
External load impedance
External load capacitance
Mute suppression
MUX signal
50
10
−
Zo
Z1
Z1
−
−
10
−
−
kΩ
nF
−
1.5
V7 ≤ 0.8 V
α
α
56
56
60
60
−
−
dB
dB
external signal
July 1990
7
Philips Semiconductors
Product specification
PLL stereo decoder (BTSC system)
TEA5582
PARAMETER
CONDITIONS
SYMBOL
MIN.
TYP.
10
MAX.
50
UNIT
mV
DC offset voltage at outputs
mute OFF-to-ON
mute ON-to-OFF
∆V
∆V
−
−
10
50
mV
Source selector (pin 6)
Suppression of MUX signal
Suppression of external signal
Switching level
voltage
V6 ≥ 2 V
α
α
80
56
90
60
−
−
dB
dB
V6 ≤ 0.8 V
MUX selected
VIL
IIL
−
−
−
0.8
25
V
current
VI = 0.8 V
10
µA
Switching level
voltage
external selected
VIH
IIH
2
−
VP
1
V
current
VI = VP
−
0.1
µA
Muting circuit (pin 7)
Input voltage
mute ON
VIL
VIH
−
−
−
0.8
VP
V
V
mute OFF
2
Input current
mute ON;
VIL = 0.8 V
−IIL
−
−
10
25
1
µA
µA
mute OFF;
VIH = VP
IIL
0.1
Notes
1. Guaranteed for mono, mono + pilot and stereo.
2. Adjustable.
3. S1 closed; reference: AF output voltage f = 1 kHz (mono).
4. Intermodulation suppression (Beat-Frequency Components (BFC)):
Vo (signal) (at 1 kHz)
α2
α3
=
=
; f = (2 × 8.367 kHz) – fH
---------------------------------------------------------------
s
Vo (spurious) (at 1 kHz)
Vo (signal) (at 1 kHz)
; f = (3 × 10.823 kHz) – 2fH
------------------------------------------------------------
s
Vo (spurious) (at 1 kHz)
measured with 100% modulated input signal: L = R; pilot signal = 200 mV p-p; fm = 8.367 or 10.823 kHz.
July 1990
8
Philips Semiconductors
Product specification
PLL stereo decoder (BTSC system)
TEA5582
Fig.4 Smooth mono/stereo control.
July 1990
9
This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in
_white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in
white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ...
Fig.5 Test and application circuit.
Philips Semiconductors
Product specification
PLL stereo decoder (BTSC system)
TEA5582
PACKAGE OUTLINE
DIP20: plastic dual in-line package; 20 leads (300 mil)
SOT146-1
D
M
E
A
2
A
A
1
L
c
e
w M
Z
b
1
(e )
1
b
M
H
20
11
pin 1 index
E
1
10
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
(1)
A
A
A
(1)
(1)
Z
1
2
UNIT
mm
b
b
c
D
E
e
e
1
L
M
M
H
w
1
E
max.
min.
max.
max.
1.73
1.30
0.53
0.38
0.36
0.23
26.92
26.54
6.40
6.22
3.60
3.05
8.25
7.80
10.0
8.3
4.2
0.51
3.2
2.54
0.10
7.62
0.30
0.254
0.01
2.0
0.068
0.051
0.021
0.015
0.014
0.009
1.060
1.045
0.25
0.24
0.14
0.12
0.32
0.31
0.39
0.33
inches
0.17
0.020
0.13
0.078
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
92-11-17
95-05-24
SOT146-1
SC603
July 1990
11
Philips Semiconductors
Product specification
PLL stereo decoder (BTSC system)
TEA5582
SOLDERING
Introduction
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and
surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for
surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often
used.
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our
“IC Package Databook” (order code 9398 652 90011).
Soldering by dipping or by wave
The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the
joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may
be necessary immediately after soldering to keep the temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more
than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
July 1990
12
相关型号:
TEA5594P
IC AM/FM, AUDIO SINGLE CHIP RECEIVER, PDIP32, SHRINK, PLASTIC, SOT-232, DIP-32, Receiver IC
NXP
©2020 ICPDF网 联系我们和版权申明