TEA5582PN [NXP]

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TEA5582PN
型号: TEA5582PN
厂家: NXP    NXP
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INTEGRATED CIRCUITS  
DATA SHEET  
TEA5582  
PLL stereo decoder (BTSC system)  
July 1990  
Product specification  
File under Integrated Circuits, IC02  
Philips Semiconductors  
Product specification  
PLL stereo decoder (BTSC system)  
TEA5582  
GENERAL DESCRIPTION  
Features  
The TEA5582, a 20-pin integrated phase-locked loop  
(PLL) stereo decoder, is designed primarily for low cost  
stereo decoding in a low- to medium-line TV. The MUX  
input (pin 1) is a low impedance current input, the gain of  
the input amplifier is therefore determined by the external  
resistor R1 (see Fig.5). All characteristics are measured  
with R1 = 47 k. The de-emphasis of (L, R) and (L-R) can  
be chosen by means of external capacitors and resistors.  
The supply voltage range of the device is from 7 V to 16 V.  
Wide supply voltage range  
Automatic mono/stereo switching (pilot presence  
detector)  
LED driver for stereo indicator  
Smooth mono/stereo control  
Matrix and two amplifiers for left and right output signals  
A source selector to switch between the MUX signal and  
an external signal  
Mute circuit for 60 dB muting of the output level  
External de-emphasis control of (L, R) and (L R)  
6 dB fixed attenuation of (L R) with respect to (L + R)  
prior to matrix  
All pins are protected against Electrostatic Discharge  
(ESD)  
QUICK REFERENCE DATA  
PARAMETER  
Supply voltage range  
CONDITIONS  
SYMBOL  
MIN.  
7.0  
TYP.  
8.5  
MAX.  
16  
UNIT  
VS  
Itot  
V
Total current consumption  
without LED driver  
19  
25  
mA  
Decoder  
Overall gain  
mono; R1 = 47 kΩ  
Vo = 600 mV  
Go(Vo/Vi)  
14 = V15  
4
5.8  
245  
0.3  
0.1  
28  
7
dB  
mV  
%
AF output voltage (RMS value)  
Total harmonic distortion  
Output channel unbalance  
Channel separation  
V
THD  
V14/V15  
α
dB  
dB  
L = 1; R = 0  
24  
Source selector  
Suppression of MUX signal  
V6 2 V  
α
α
80  
56  
90  
60  
dB  
dB  
Suppression of external signal  
V6 0.8 V  
Output amplifiers  
Gain output amplifier  
MUX signal  
Gv  
Gv  
6.7  
7.2  
0
7.7  
dB  
dB  
mV  
external signal  
0.5  
460  
+0.5  
640  
AF output voltage (RMS value)  
Mute suppression  
MUX signal  
V11 = V10  
560  
V7 0.8 V  
α
α
56  
56  
60  
60  
dB  
dB  
external signal  
PACKAGE OUTLINE  
20-LEAD DIL; PLASTIC (SOT146); SOT146-1; 1996 November 18.  
July 1990  
2
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Fig.1 Block diagram.  
Philips Semiconductors  
Product specification  
PLL stereo decoder (BTSC system)  
TEA5582  
PINNING  
Fig.2 Pinning diagram.  
RATINGS  
Limiting values in accordance with the Absolute Maximum System (IEC 134)  
PARAMETER  
Supply voltage range (pin 5)  
SYMBOL  
MIN.  
MAX.  
UNIT  
VP  
I3  
18  
75  
V
LED-driver current (peak value)  
Total power dissipation  
mA  
Ptot  
see Fig.3  
Storage temperature range  
Operating ambient temperature range  
Electrostatic handling(1)  
Tstg  
Tamb  
Ves  
65  
0
+150  
+70  
+2  
°C  
°C  
kV  
2  
Note  
1. ESD withstand voltage is defined by MIL STD 883C (C = 100 pF; R = 1.5 k).  
July 1990  
4
Philips Semiconductors  
Product specification  
PLL stereo decoder (BTSC system)  
TEA5582  
Fig.3 Power derating curve.  
DC CHARACTERISTICS  
All voltages are with respect to ground (pin 20); all currents are positive into the device; all parameters are measured in  
the test set-up (see Fig.5) at a nominal supply voltage of VS = 8.5 V; Tamb = 25 °C unless otherwise specified.  
PARAMETER  
Supply voltage  
CONDITIONS  
SYMBOL  
VS  
MIN.  
7.0  
TYP.  
8.5  
MAX.  
16  
UNIT  
V
Total current consumption  
Power dissipation  
Voltage  
without LED driver  
Itot  
19  
25  
mA  
Ptot  
160  
mW  
pin 1  
V1  
2.1  
4.2  
V
V
pins 8, 9, 10, 11, 12 and 13  
DC output current  
pins 14 and 15  
LED-driver current  
pin 3  
V8 V13  
I14, I15  
1.1  
1.4  
1.8  
20  
mA  
mA  
V
I3  
Switch “VCO-OFF”  
voltage  
I19 = 50 µA  
V19  
2
Switch “VCO-OFF”  
current  
I19  
50  
µA  
July 1990  
5
Philips Semiconductors  
Product specification  
PLL stereo decoder (BTSC system)  
TEA5582  
AC CHARACTERISTICS  
Measured in the test circuit of Fig.5; VS = 8.5 V; Tamb = 25 °C.  
AC conditions: (1) input signal (Vi) of 815 mV p-p for L = 1, R = 1 (mono) fm = 1 kHz (= 80% modulation). (2) MUX input  
signal (Vi) of 1.2 V p-p for L = 1, R = 0 and no DBX; fm = 1 kHz (stereo) and Vpilot = 200 mV p-p. (3) S1 open, unless  
specified (without LR filter); voltage controlled oscillator (VCO) adjusted to 188.8 kHz at Vi = 0 V; values are measured  
with an external IF roll-off network (2 dB at 31.5 kHz = 2fH) at the input (dashed components RS and CS in Fig.5).  
All the above conditions apply unless otherwise specified.  
PARAMETER  
CONDITIONS  
SYMBOL  
MIN.  
TYP.  
MAX.  
UNIT  
Overall performance (Vi to Vo)  
Input current (RMS value)  
Overall gain  
Il(rms)  
12  
µA  
mono; R1 = 47 kΩ  
Go (Vo/Vi)  
4
5.8  
7
dB  
AF output voltage (mono)  
(RMS value)  
V11 = V10  
460  
560  
640  
mV  
AF output voltage (mono)  
(RMS value)  
V
15 = V14  
245  
0.3  
800  
0.1  
28  
mV  
%
Total harmonic distortion  
Output voltage  
note 1  
THD  
0.5  
THD = 1%  
V11 = V10  
V11/V10  
α
mV  
dB  
dB  
Output channel unbalance  
Channel separation  
1
L = 1; R = 0  
24  
Signal-to-noise ratio  
bandwidth  
20 Hz to 16 kHz  
S/N  
S/N  
76  
82  
dB  
dB  
bandwidth IEC 79  
(curve Din A)  
note 2  
Pilot presence detector  
Switching to:  
stereo  
Vpilot  
Vpilot  
Vpilot  
40  
30  
2.5  
60  
mV  
mV  
dB  
mono  
15  
hysteresis  
Smooth mono/stereo control  
(pin 16)  
see Fig.4  
Channel separation (α)  
Full stereo  
V16 1.25 V  
V16 = typ. 1 V  
V16 0.75 V  
α
α
α
24  
28  
10  
1
dB  
dB  
dB  
Smooth operation  
Full mono  
July 1990  
6
Philips Semiconductors  
Product specification  
PLL stereo decoder (BTSC system)  
TEA5582  
PARAMETER  
Attenuation (L-R)  
CONDITIONS  
SYMBOL  
MIN.  
TYP.  
MAX.  
UNIT  
dB  
6
Carrier and harmonic  
suppression at the output  
note 3  
Pilot signal suppression  
fpilot = 15.734 kHz  
(1 fH)  
αfH  
32  
36  
60  
75  
dB  
dB  
dB  
Subcarrier suppression  
f = 2 fH  
α2fH  
VCO suppression  
f = 12fH  
α12fH  
SAP signal suppression  
(Second Audio Programme)  
f = 5fH  
α5fH  
60  
60  
dB  
dB  
Intermodulation suppression  
fm = 8.367 kHz  
note 4  
spurious signal  
fs = 1 kHz  
α2  
α3  
fm = 10.823 kHz  
Ripple rejection  
spurious signal  
fs = 1 kHz  
70  
50  
dB  
dB  
f = 120 Hz;  
Vripple = 100 mV;  
mono  
RR120  
VCO  
R adjust (R5)  
fOSC = 188.808 kHz  
R7 = 10 k5%  
C6 = 820 pF 1%  
Radj  
0
8
kΩ  
Capture range  
deviation from  
fOSC centre  
frequency;  
Vpilot = 200 mV p-p  
f/f  
4.5  
%
250  
× 106  
Temperature coefficient  
uncompensated  
TC  
K1  
Output amplifiers  
Gain  
MUX signal  
Gv  
Gv  
Zi  
6.7  
0.5  
7.2  
0
7.7  
+0.5  
dB  
dB  
kΩ  
external signal  
Input impedance  
Output impedance  
External load impedance  
External load capacitance  
Mute suppression  
MUX signal  
50  
10  
Zo  
Z1  
Z1  
10  
kΩ  
nF  
1.5  
V7 0.8 V  
α
α
56  
56  
60  
60  
dB  
dB  
external signal  
July 1990  
7
Philips Semiconductors  
Product specification  
PLL stereo decoder (BTSC system)  
TEA5582  
PARAMETER  
CONDITIONS  
SYMBOL  
MIN.  
TYP.  
10  
MAX.  
50  
UNIT  
mV  
DC offset voltage at outputs  
mute OFF-to-ON  
mute ON-to-OFF  
V  
V  
10  
50  
mV  
Source selector (pin 6)  
Suppression of MUX signal  
Suppression of external signal  
Switching level  
voltage  
V6 2 V  
α
α
80  
56  
90  
60  
dB  
dB  
V6 0.8 V  
MUX selected  
VIL  
IIL  
0.8  
25  
V
current  
VI = 0.8 V  
10  
µA  
Switching level  
voltage  
external selected  
VIH  
IIH  
2
VP  
1
V
current  
VI = VP  
0.1  
µA  
Muting circuit (pin 7)  
Input voltage  
mute ON  
VIL  
VIH  
0.8  
VP  
V
V
mute OFF  
2
Input current  
mute ON;  
VIL = 0.8 V  
IIL  
10  
25  
1
µA  
µA  
mute OFF;  
VIH = VP  
IIL  
0.1  
Notes  
1. Guaranteed for mono, mono + pilot and stereo.  
2. Adjustable.  
3. S1 closed; reference: AF output voltage f = 1 kHz (mono).  
4. Intermodulation suppression (Beat-Frequency Components (BFC)):  
Vo (signal) (at 1 kHz)  
α2  
α3  
=
=
; f = (2 × 8.367 kHz) fH  
---------------------------------------------------------------  
s
Vo (spurious) (at 1 kHz)  
Vo (signal) (at 1 kHz)  
; f = (3 × 10.823 kHz) 2fH  
------------------------------------------------------------  
s
Vo (spurious) (at 1 kHz)  
measured with 100% modulated input signal: L = R; pilot signal = 200 mV p-p; fm = 8.367 or 10.823 kHz.  
July 1990  
8
Philips Semiconductors  
Product specification  
PLL stereo decoder (BTSC system)  
TEA5582  
Fig.4 Smooth mono/stereo control.  
July 1990  
9
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Fig.5 Test and application circuit.  
Philips Semiconductors  
Product specification  
PLL stereo decoder (BTSC system)  
TEA5582  
PACKAGE OUTLINE  
DIP20: plastic dual in-line package; 20 leads (300 mil)  
SOT146-1  
D
M
E
A
2
A
A
1
L
c
e
w M  
Z
b
1
(e )  
1
b
M
H
20  
11  
pin 1 index  
E
1
10  
0
5
10 mm  
scale  
DIMENSIONS (inch dimensions are derived from the original mm dimensions)  
(1)  
A
A
A
(1)  
(1)  
Z
1
2
UNIT  
mm  
b
b
c
D
E
e
e
1
L
M
M
H
w
1
E
max.  
min.  
max.  
max.  
1.73  
1.30  
0.53  
0.38  
0.36  
0.23  
26.92  
26.54  
6.40  
6.22  
3.60  
3.05  
8.25  
7.80  
10.0  
8.3  
4.2  
0.51  
3.2  
2.54  
0.10  
7.62  
0.30  
0.254  
0.01  
2.0  
0.068  
0.051  
0.021  
0.015  
0.014  
0.009  
1.060  
1.045  
0.25  
0.24  
0.14  
0.12  
0.32  
0.31  
0.39  
0.33  
inches  
0.17  
0.020  
0.13  
0.078  
Note  
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
EIAJ  
92-11-17  
95-05-24  
SOT146-1  
SC603  
July 1990  
11  
Philips Semiconductors  
Product specification  
PLL stereo decoder (BTSC system)  
TEA5582  
SOLDERING  
Introduction  
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and  
surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for  
surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often  
used.  
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our  
“IC Package Databook” (order code 9398 652 90011).  
Soldering by dipping or by wave  
The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the  
joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.  
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the  
specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may  
be necessary immediately after soldering to keep the temperature within the permissible limit.  
Repairing soldered joints  
Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more  
than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to  
10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.  
DEFINITIONS  
Data sheet status  
Objective specification  
Preliminary specification  
Product specification  
This data sheet contains target or goal specifications for product development.  
This data sheet contains preliminary data; supplementary data may be published later.  
This data sheet contains final product specifications.  
Limiting values  
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or  
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation  
of the device at these or at any other conditions above those given in the Characteristics sections of the specification  
is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices, or systems where malfunction of these  
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for  
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such  
improper use or sale.  
July 1990  
12  

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