TEF810X [NXP]
76 GHz to 81 GHz car RADAR transceiver;
| 型号： | TEF810X |
| 厂家： | 
NXP |
| 描述： | 76 GHz to 81 GHz car RADAR transceiver |
| 文件： | 总13页 (文件大小：972K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TEF810X
76 GHz to 81 GHz car RADAR transceiver
Rev. 1.0 — 10 May 2019
Product short data sheet
COMPANY PUBLIC
1 General description
The TEF810X Car RADAR transceiver is a single-chip automotive FMCW RADAR
transceiver for short-, medium- and long-range RADAR applications, covering the full car
RADAR frequency band from 76 GHz to 81 GHz.
The packaged IC offers a low-cost fully integrated solution for all critical mm-wave
functions, in combination with ADCs at each receiver path. The mm-wave front end part
consists of a waveform generator offering flexible chirp control, three transmit chains
featuring binary phase control and output level stabilization, and four receive chains with
high input compression and low noise figure.
Each receive chain contains high-pass filters for suppression of strong low frequency
signals, as well as low-pass filter functionality for suppression of signals in the ADC
aliasing band. Each receive chain includes a 12-bit SAR ADC sampling at an effective
rate of 40 MS/s (M samples per second). The ADC is followed by a programmable
decimation filter with decimation factors of 1, 2, 4, 8 and 16.
The digitized signals from the four receiver chains are serialized. There are two digital
output variants available:
• TEF8101 output is through four high-speed LVDS data lines, plus a bit and frame clock
signals for data synchronization
• TEF8102 includes a CSI-2-DPHY interface with four data lanes and a clock lane
The chip uses a full-duplex SPI interface with 40 Mbps maximal transfer rate for bi-
directional exchange of control and monitoring data between the RADAR IC and a host
microcontroller.
The TEF810X contains a functional safety monitoring circuit, keeping track of key
operational parameters such as chip temperature, status of RF connections to the PCB
board, locking status of the PLLs during a frequency chirp, etc. The monitoring circuitry
transfers some of the monitoring functions normally performed by the microcontroller
into the TEF810X, creating a virtual layered functional safety concept, with the TEF810X
functional monitoring circuitry as the inner layer.
The RADAR transceiver is packaged in a 7.5 mm x 7.5 mm eWLB package. The
package has a 15 x 15 sized Ball Grid Array (BGA) with 0.5 mm pitch for easy interfacing
to a wide range of antenna board technologies.
NXP Semiconductors
TEF810X
76 GHz to 81 GHz car RADAR transceiver
2 Features and benefits
• Single-chip fully integrated automotive FMCW RADAR transceiver with digital output
• Developed in accordance to ISO26262 SEoOC methodology. Supporting ASIL-B
applications
• Car RADAR frequency band from 76 GHz to 81 GHz, addressing short-, medium- and
long-range RADAR applications for the global automotive market
• The mm-wave front end part consists of a waveform generator offering flexible chirp
control with a chirp bandwidth up to 2 GHz, three transmit chains featuring binary
phase control and output level stabilization, and four receive chains with high input
compression point and low noise figure
• The timing engine supports different MIMO RADAR operation modes by simple
programming of digital registers controlling timing parameters and front end
configuration on a chirp-to-chirp basis
• The phase of the TX signals can be controlled on a chirp-to-chirp basis by the timing
engine, or by digital I/O signals directly connected to the binary phase shifters of
different TX sections
• Each receive chain contains programmable high-pass filters for suppression of strong
low frequency signals, as well as low-pass filter functionality for suppression of signals
in the ADC aliasing band.
• Each receive chain includes a 12-bit SAR ADC sampling at an effective rate of 40 MS/
s. The ADC is followed by a programmable decimation filter with decimation factors of
1, 2, 4, 8 and 16
• TEF8101: data output on four high-speed LVDS lines, in two modes: raw ADC serial
data streaming, or packetized format with added CRC information
• TEF8102: four data lanes and a clock lane. Lane speed configurable from 120 Mbps to
480 Mbps, as a function of the decimation factor
• The chip uses a full-duplex SPI interface with 40 Mbps maximal transfer rate for bi-
directional exchange of control and monitoring data between the RADAR IC and a host
microcontroller
• The TEF810X contains a functional safety monitoring circuit, keeping track of key
operational parameters such as chip temperature, status of RF connections to the PCB
board, locking status of the PLLs during a frequency chirp, etc.
• The functional monitoring circuitry transfers some of the monitoring functions normally
performed by the microcontroller into the TEF810X, creating a virtual “layered
functional safety” concept, with the TEF810X functional monitoring circuitry as the inner
layer
• Total average power dissipation at typical conditions under 1.2 W (2TX at 50 % duty
cycle) and peak dissipation under 2.5 W
• Operating junction temperature from -40 oC up to 135 oC
• Closed-loop, linear frequency chirp generator with < 0.2 % typical chirp nonlinearity
• Three chirp modes with Low Phase Noise:
Chirp BW
(MHz/µs)
Slope (MHz/µs)
Phase noise (dBc/Hz @ 1 MHz)
MRR
SRR
USR
0.5
1.0
2.0
15
30
60
< -90 (typical, in 76 GHz to 77 GHz band)
< -88 (typical, in 76 GHz to 81 GHz band)
< -86 (typical, in 77 GHz to 81 GHz band)
TEF810X
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2019. All rights reserved.
Product short data sheet
COMPANY PUBLIC
Rev. 1.0 — 10 May 2019
2 / 13
NXP Semiconductors
TEF810X
76 GHz to 81 GHz car RADAR transceiver
• 2 GHz chirp deviation for high-resolution distance detection in USR mode. Higher
phase noise level allowed (-86 dBc/Hz @ 1 MHz), with respect to nominal 1 GHz
deviation mode
• Excellent phase stability for high angular resolution
• Transmit power of typical 12 dBm at antenna reference plane
• Typical receiver noise figure less than 12 dB at antenna reference plane
• Operation from a 40 MHz crystal oscillator
• Provides the 40 MHz clock signal to a microcontroller
• Power consumption < 50 mW in standby mode. In this condition the crystal oscillator is
operative as well as the master 3.3 V LDOs
• GPIO 3.3 V digital interface signals for compatibility with a wide range of MCUs
• The core circuitry operates on 1.8 V and 1.1 V supply voltages. To simplify the
application and decrease overall system BOM, the TEF810X offers two LDO circuits to
generate the 1.8 V and 1.1 V operational voltages from a typical 2.3 V to 3.3 V supply
available on the customer PCB. The internal band gap and voltage comparators drive
external transistors, to decrease on-chip power dissipation and overall chip-area
• The RADAR transceiver is packaged in a 7.5 mm x 7.5 mm eWLB package. The
package has a 15 x 15 sized Ball Grid Array (BGA) with 0.5 mm pitch. Package
ꢀRth Junction -footprint ~18 K/W
• ESD immunity at 2000 V Human Body Model (HBM), 300 V Charged Device Model
(CDM), 750 V CDM for corner balls
3 Applications
Front-side of car
• Autonomous Emergency Braking (AEB)
• Adaptive Cruise Control (ACC)
• Narrow path assist
• Lateral collision avoidance
• Side pre-crash
• Traffic jam assist
Rear-Side of car:
• Lane Change Assist (LCA)
• Blind Spot Detection (BSD)
• Rear Cross Traffic Alert (RCTA)
• Rear pre-crash
• Parking Assist (PA)
4 Ordering information
Table 1.ꢀOrdering information
Type number Package
Name
Description
Version
TEF8101
TEF8102
WFBGA155 plastic very-very-thin profile fine-pitch ball grid array package; 155 balls
SOT1456-1
TEF810X
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2019. All rights reserved.
Product short data sheet
COMPANY PUBLIC
Rev. 1.0 — 10 May 2019
3 / 13
NXP Semiconductors
TEF810X
76 GHz to 81 GHz car RADAR transceiver
5 TEF810X block diagram
Figure 1.ꢀ Block diagram of TEF810X car RADAR transceiver
TEF810X
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2019. All rights reserved.
Product short data sheet
COMPANY PUBLIC
Rev. 1.0 — 10 May 2019
4 / 13
NXP Semiconductors
TEF810X
76 GHz to 81 GHz car RADAR transceiver
6 Limiting values
Table 2.ꢀLimiting values
In accordance with limiting maximum rating system (IEC 60134).
Supplies
Conditions
Min
-0.5
-0.5
-0.5
Max
3.96
2.16
1.54
Unit
V
3.3 V supply voltage
1.8 V supply voltage
1.1 V supply voltage
ESD
V
V
VESD
Human body model [1]
Charge device model (CDM) [2]
corner pins
2000
-
V
750
300
-
-
V
V
all other pins
[1] Class 2 according to AEC-Q100-002 Rev – E.
[2] Class C3 according to AEC-Q100-011 Rev – C.
7 Characteristics
7.1 Global characteristics
Table 3.ꢀGlobal characteristics
Description
Condition
Min
Typ
Max
81
Unit
GHz
°C
Operational frequency range
Operational junction temperature
Power dissipation
76
- 40
-
-
-
135
-
Strongly dependent on use-case. Stated
value for 2 TX at 50 % duty cycle.
1.2
W
7.2 Supply specifications
Table 4.ꢀSupply specifications
Description
Condition
Min
Typ
Max
Unit
1.1 V supply voltage range
1.1 V supply voltage range
1.8 V supply voltage range
1.8 V supply voltage range
3.3 V supply voltage
±5 % tolerance, spec compliance and 1.045
reliability limits
1.13
1.13
1.85
1.85
3.3
1.155
V
V
V
V
V
-5 % / +10 % tolerance, spec
compliance limits
1.045
1.21
1.89
1.98
3.63
±5 % tolerance, spec compliance and 1.71
reliability limits
-5 % / +10 % tolerance, spec
compliance limits
1.71
±10 % tolerance
2.97
TEF810X
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2019. All rights reserved.
Product short data sheet
COMPANY PUBLIC
Rev. 1.0 — 10 May 2019
5 / 13
NXP Semiconductors
TEF810X
76 GHz to 81 GHz car RADAR transceiver
7.3 TX Characteristics
Table 5.ꢀTX characteristics
Description
Condition
Min
Typ
12
Max
Unit
dBm
dBm
Output power (76 GHz to 78 GHz)
Output power (78 GHz to 81 GHz)
-
-
-
-
11
7.4 RX Characteristics
Table 6.ꢀRX characteristics
Description
Condition
Min
Typ
12
Max
Unit
dB
RX NF (76 GHz to 77 GHz)
RX NF (77 GHz to 81 GHz)
ADC resolution
-
-
-
-
-
-
-
-
13
dB
12
bit
ADC clock
40
MHz
7.5 Chirp generator characteristics
Table 7.ꢀChip generator characteristics
Description
Condition
Min
Typ
Max
Unit
Chirp bandwidth
76 GHz to 81 GHz band
76 GHz to 77 GHz band
0
2000
MHz
Phase noise
-90
-88
-86
dBc/Hz
@1 MHz
0.5 GHz chirp (mode 1)
Phase noise
76 GHz to 81 GHz band
77 GHz to 81 GHz band
dBc/Hz
@1 MHz
1 GHz chirp (mode 2)
Phase noise
dBc/Hz
@1 MHz
2 GHz chirp (mode 3)
TEF810X
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2019. All rights reserved.
Product short data sheet
COMPANY PUBLIC
Rev. 1.0 — 10 May 2019
6 / 13
NXP Semiconductors
TEF810X
76 GHz to 81 GHz car RADAR transceiver
8 Application information
Figure 2 shows the overall configuration of a RADAR sensor based on a single TEF810X
device. The main functional blocks are the TEF810X, an MCU, a power supply network
and a CAN, FlexRay or Ethernet interface.
The interface from the TEF810X to the MCU consists purely of digital signals, with
the digitized and serialized received signals being transferred by LVDS or CSI-2 lines
(RADAR data line), in combination with general-purpose I/O (GPIO) lines operating at
nominal logical levels of 3.3 V, for timing signaling, SPI programming, and functional
monitoring interface.
Figure 2.ꢀTEF810X in a RADAR sensor with a companion MCU
9 Package information
9.1 General
The TEF810X is packaged on a 7.5 mm x 7.5 mm eWLB package, with a pinning pitch of
500 µm.
TEF810X
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© NXP B.V. 2019. All rights reserved.
Product short data sheet
COMPANY PUBLIC
Rev. 1.0 — 10 May 2019
7 / 13
NXP Semiconductors
TEF810X
76 GHz to 81 GHz car RADAR transceiver
9.2 Package Dimensions
Figure 3.ꢀTEF810X package dimensions
TEF810X
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© NXP B.V. 2019. All rights reserved.
Product short data sheet
COMPANY PUBLIC
Rev. 1.0 — 10 May 2019
8 / 13
NXP Semiconductors
TEF810X
76 GHz to 81 GHz car RADAR transceiver
10 Revision history
Table 8.ꢀRevision history
Document ID
Release date Data sheet status
Change notice
Supersedes
TEF810X v.1.0 20190510
Product short data sheet
-
-
TEF810X
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© NXP B.V. 2019. All rights reserved.
Product short data sheet
COMPANY PUBLIC
Rev. 1.0 — 10 May 2019
9 / 13
NXP Semiconductors
TEF810X
76 GHz to 81 GHz car RADAR transceiver
11 Legal information
11.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product
development.
Preliminary [short] data sheet
Product [short] data sheet
Qualification
Production
This document contains data from the preliminary specification.
This document contains the product specification.
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term 'short data sheet' is explained in section "Definitions".
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple
devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
11.2 Definitions
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences
of use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is
intended for quick reference only and should not be relied upon to contain
detailed and full information. For detailed and full information see the
relevant full data sheet, which is available on request via the local NXP
Semiconductors sales office. In case of any inconsistency or conflict with the
short data sheet, the full data sheet shall prevail.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes
no representation or warranty that such applications will be suitable
for the specified use without further testing or modification. Customers
are responsible for the design and operation of their applications and
products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications
and products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with
their applications and products. NXP Semiconductors does not accept any
liability related to any default, damage, costs or problem which is based
on any weakness or default in the customer’s applications or products, or
the application or use by customer’s third party customer(s). Customer is
responsible for doing all necessary testing for the customer’s applications
and products using NXP Semiconductors products in order to avoid a
default of the applications and the products or of the application or use by
customer’s third party customer(s). NXP does not accept any liability in this
respect.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product
is deemed to offer functions and qualities beyond those described in the
Product data sheet.
11.3 Disclaimers
Limited warranty and liability — Information in this document is believed
to be accurate and reliable. However, NXP Semiconductors does not
give any representations or warranties, expressed or implied, as to the
accuracy or completeness of such information and shall have no liability
for the consequences of use of such information. NXP Semiconductors
takes no responsibility for the content in this document if provided by an
information source outside of NXP Semiconductors. In no event shall NXP
Semiconductors be liable for any indirect, incidental, punitive, special or
consequential damages (including - without limitation - lost profits, lost
savings, business interruption, costs related to the removal or replacement
of any products or rework charges) whether or not such damages are based
on tort (including negligence), warranty, breach of contract or any other
legal theory. Notwithstanding any damages that customer might incur for
any reason whatsoever, NXP Semiconductors’ aggregate and cumulative
liability towards customer for the products described herein shall be limited
in accordance with the Terms and conditions of commercial sale of NXP
Semiconductors.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those
given in the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Right to make changes — NXP Semiconductors reserves the right to
make changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
TEF810X
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2019. All rights reserved.
Product short data sheet
COMPANY PUBLIC
Rev. 1.0 — 10 May 2019
10 / 13
NXP Semiconductors
TEF810X
76 GHz to 81 GHz car RADAR transceiver
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or
the grant, conveyance or implication of any license under any copyrights,
patents or other industrial or intellectual property rights.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
11.4 Trademarks
Notice: All referenced brands, product names, service names and
trademarks are the property of their respective owners.
TEF810X
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2019. All rights reserved.
Product short data sheet
COMPANY PUBLIC
Rev. 1.0 — 10 May 2019
11 / 13
NXP Semiconductors
TEF810X
76 GHz to 81 GHz car RADAR transceiver
Tables
Tab. 1.
Tab. 2.
Tab. 3.
Tab. 4.
Ordering information ..........................................3
Tab. 5.
Tab. 6.
Tab. 7.
Tab. 8.
TX characteristics ..............................................6
RX characteristics ............................................. 6
Chip generator characteristics ...........................6
Revision history .................................................9
Limiting values .................................................. 5
Global characteristics ........................................5
Supply specifications .........................................5
Figures
Fig. 1.
Block diagram of TEF810X car RADAR
transceiver .........................................................4
Fig. 2.
Fig. 3.
TEF810X in a RADAR sensor with a
companion MCU ............................................... 7
TEF810X package dimensions ......................... 8
TEF810X
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2019. All rights reserved.
Product short data sheet
COMPANY PUBLIC
Rev. 1.0 — 10 May 2019
12 / 13
NXP Semiconductors
TEF810X
76 GHz to 81 GHz car RADAR transceiver
Contents
1
General description ............................................ 1
2
3
4
5
6
7
7.1
7.2
7.3
7.4
7.5
8
Features and benefits .........................................2
Applications .........................................................3
Ordering information .......................................... 3
TEF810X block diagram ..................................... 4
Limiting values ....................................................5
Characteristics .................................................... 5
Global characteristics ........................................ 5
Supply specifications ......................................... 5
TX Characteristics ............................................. 6
RX Characteristics .............................................6
Chirp generator characteristics ..........................6
Application information ......................................7
Package information ...........................................7
General .............................................................. 7
Package Dimensions .........................................8
Revision history .................................................. 9
Legal information ..............................................10
9
9.1
9.2
10
11
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section 'Legal information'.
© NXP B.V. 2019.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 10 May 2019
Document identifier: TEF810X
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