TFF1012HN/N1,115 [NXP]
TFF1012HN - Integrated mixer oscillator PLL for satellite LNB QFN 16-Pin;
| 型号： | TFF1012HN/N1,115 |
| 厂家： | 
NXP |
| 描述： | TFF1012HN - Integrated mixer oscillator PLL for satellite LNB QFN 16-Pin |
| 文件： | 总12页 (文件大小：143K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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TFF1012HN
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Integrated mixer oscillator PLL for satellite LNB
Rev. 1 — 10 October 2013
Product data sheet
1. General description
The TFF1012HN is an integrated downconverter for use in Low Noise Block (LNB)
convertors in a 10.7 GHz to 12.75 GHz Ku band satellite receiver system.
2. Features and benefits
Low current consumption integrated pre-amplifier, mixer, buffer amplifier and
PLL synthesizer
Flat gain over frequency
Single 5 V supply pin
Low cost 25 MHz crystal
Crystal controlled LO frequency generation
Switched LO frequency (9.75 GHz and 10.6 GHz)
Low phase noise
Low spurious
Low external component count
Alignment-free concept
ESD protection on all pins
3. Applications
Ku band LNB converters for digital satellite reception (DVB-S / DVB-S2)
4. Quick reference data
Table 1.
Quick reference data
VCC = 5 V; Tamb = 25 C; fLO = 9.75 GHz or 10.6 GHz; fxtal = 25 MHz; Z0 = 50 unless otherwise specified.
Symbol Parameter
Conditions
Min Typ Max Unit
[1]
[1]
VCC
supply voltage
RF input and IF output AC coupled
RF input and IF output AC coupled
4.5
5
5.5
V
ICC
supply current
-
-
52
9
-
-
mA
dB
NFSSB
fi(RF)
single sideband noise figure
RF input frequency
low band
high band
10.7 -
11.7 GHz
12.75 GHz
11.7
-
-
Gconv
conversion gain
measured at low band fIF = 1450 MHz and
high band fIF = 1625 MHz
30
-
dB
TFF1012HN
NXP Semiconductors
Integrated mixer oscillator PLL for satellite LNB
Table 1.
Quick reference data …continued
VCC = 5 V; Tamb = 25 C; fLO = 9.75 GHz or 10.6 GHz; fxtal = 25 MHz; Z0 = 50 unless otherwise specified.
Symbol Parameter
Conditions
Min Typ Max Unit
s11
input reflection coefficient
output reflection coefficient
fi(RF) = 10.7 GHz to 12.7 GHz
fo(IF) = 950 MHz to 2150 MHz; Z0 = 75
-
-
-
10
10
-
-
dB
s22
dB
IP3o
output third-order intercept point carrier power = 10 dBm (measured at output)
17.5 -
dBm
[1] DC values.
5. Ordering information
Table 2.
Ordering information
Type number
Package
Name
Description
Version
SOT763-1
TFF1012HN
DHVQFN16
plastic dual in-line compatible thermal enhanced very thin quad flat
package; no leads;16 terminals; body 2.5 3.5 0.85 mm
6. Block diagram
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Fig 1. TFF1012HN block diagram
TFF1012HN
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 1 — 10 October 2013
2 of 12
TFF1012HN
NXP Semiconductors
Integrated mixer oscillator PLL for satellite LNB
7. Functional diagram
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Fig 2. Functional diagram
8. Pinning information
8.1 Pinning
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Fig 3. Pin configuration
8.2 Pin description
Table 3.
Symbol
GND
Pin description
Pin Description
ground (exposed die pad)
RF ground. Connect this pin to the exposed die pad landing.
0
RF_GND3 1
RF_GND1 2
RF ground. Connect this pin to the exposed die pad landing and the RF input CPW line.
not connected. Connect to RF on PCB. [1]
n.c.
RF
3
4
RF input.
RF_GND2 5
RF ground. Connect this pin to the exposed die pad landing and the RF input CPW line.
TFF1012HN
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 1 — 10 October 2013
3 of 12
TFF1012HN
NXP Semiconductors
Integrated mixer oscillator PLL for satellite LNB
Table 3.
Symbol
GND1
n.c.
Pin description …continued
Pin Description
6
7
8
9
Ground. Connect this pin to the exposed die pad landing and the RF input CPW line.
not connected. Use this pin to route the ground layer on top of the PCB to the exposed die pad.
Loop filter PLL. Connect loop filter between this pin and VREG (pin 9).
LF
VREG
Regulated output voltage for PLL loop filter. Connect loop filter to this pin. Decouple against die pad via
pin 7.
HB
10 High band / low band selection. Connect this pin to the tone detector or to a logic signal.
11 Crystal connection 2. Connect crystal between this pin and XO1 (pin 12).
12 Crystal connection 1. Connect crystal between this pin and XO2 (pin 11).
13 Ground. Connect this pin to the exposed die pad landing.
14 IF output
XO2
XO1
GND2
IF
IF_GND
VCC
15 IF output ground. Connect this pin to the exposed die pad landing and the output transmission line ground.
16 Supply voltage
[1] The distance between the outer edges of pin 2 and 3 is 740 m. This gives an optimum transition from a 1.1 mm wide, Z0 = 50 line on
RO4223 Printed-Circuit Board (PCB) material of 0.5 mm height to the TFF1012HN.
9. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
VCC
Parameter
Conditions
Min
0.5
0.5
40
Max
+6
Unit
V
supply voltage
VI(HB)
Tstg
input voltage on pin HB
storage temperature
+6
V
+125
C
10. Recommended operating conditions
Table 5.
Symbol
VCC
Operating conditions
Parameter
Conditions
Min
Typ
Max
Unit
supply voltage
4.5
5
5.5
5.5
+85
-
V
VI(HB)
Tamb
input voltage on pin HB
ambient temperature
characteristic impedance
RF input frequency
0
-
V
40
+25
C
Z0
-
50
fi(RF)
low band
high band
low band
high band
low band
high band
10.7
-
11.7
12.75
-
GHz
GHz
GHz
GHz
GHz
GHz
pF
11.7
-
fLO
LO frequency
-
9.75
[1]
-
10.6
-
fo(IF)
IF output frequency
0.95
-
1.95
2.15
-
1.1
-
CL(xtal)
ESR
fxtal
crystal load capacitance
equivalent series resistance
crystal frequency
-
-
-
10
-
40
-
25
MHz
[1] For a 10.75 GHz LO frequency, select high band and use a crystal with frequency 10.75 GHz / 424 = 25.353774 MHz.
TFF1012HN
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 1 — 10 October 2013
4 of 12
TFF1012HN
NXP Semiconductors
Integrated mixer oscillator PLL for satellite LNB
11. Thermal characteristics
Table 6.
Symbol
Rth(j-c)
Thermal characteristics
Parameter
Conditions
Typ
Unit
thermal resistance from junction to case
35
K/W
12. Characteristics
Table 7.
Characteristics
VCC = 5 V; Tamb = 25 C; fLO = 9.75 GHz or 10.6 GHz; fxtal = 25 MHz; Z0 = 50 unless otherwise specified.
Symbol Parameter
Conditions
Min Typ Max Unit
[1]
ICC
supply current
RF input and IF output AC coupled
-
-
52
-
-
mA
n(itg)
integrated phase noise density
integration offset frequency =
10 kHz to 13 MHz;
1.4
RMS
loop bandwidth = crossover bandwidth
NFSSB
Gconv
single sideband noise figure
conversion gain
measured at low band fIF = 1450 MHz
and high band fIF = 1625 MHz
-
-
9
-
-
dB
dB
measured at low band fIF = 1450 MHz
and high band fIF = 1625 MHz
30
Gconv conversion gain variation
over whole IF band
-
-
-
-
-
2.0
0.5
10
10
-
-
-
-
dB
in every 36 MHz band
dB
s11
input reflection coefficient
fi(RF) = 10.7 GHz to 12.7 GHz
fo(IF) = 950 MHz to 2150 MHz; Z0 = 75
dB
s22
output reflection coefficient
output third-order intercept point
dB
IP3o
carrier power is 10 dBm (measured at
17.5 -
dBm
the output)
PL(1dB)
VIL(HB)
output power at 1 dB gain compression
LOW-level input voltage on pin HB
-
6
-
-
dBm
V
-
0.8
-
VIH(HB) HIGH-level input voltage on pin HB
Rpd(HB) pull-down resistance on pin HB
2.0
-
V
80 110 140 k
[1] DC values.
TFF1012HN
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 1 — 10 October 2013
5 of 12
TFF1012HN
NXP Semiconductors
Integrated mixer oscillator PLL for satellite LNB
13. Application information
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Fig 4. Application diagram of TFF1012HN
Table 8.
List of netnames
See Figure 4.
Netname
GH
Description
Gate voltage of 1st stage LNA. Horizontal polarization
Drain voltage of 1st stage LNA. Horizontal polarization
Gate voltage of 1st stage LNA. Vertical polarization
Drain voltage of 1st stage LNA. Vertical polarization
Gate voltage of 2nd stage LNA
DH
GV
DV
G2
D2
Drain voltage of 2nd stage LNA
HB
High band oscillator supply control
LB
Low band oscillator supply control
TFF1012HN
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 1 — 10 October 2013
6 of 12
TFF1012HN
NXP Semiconductors
Integrated mixer oscillator PLL for satellite LNB
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Fig 5. LNB system block diagram with TFF1012HN
TFF1012HN
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 1 — 10 October 2013
7 of 12
TFF1012HN
NXP Semiconductors
Integrated mixer oscillator PLL for satellite LNB
14. Package outline
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Fig 6. Package outline SOT763-1
TFF1012HN
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 1 — 10 October 2013
8 of 12
TFF1012HN
NXP Semiconductors
Integrated mixer oscillator PLL for satellite LNB
15. Abbreviations
Table 9.
Abbreviations
Description
Acronym
CPW
DVB-S
DVB-S2
ESD
CoPlanar Waveguide
Digital Video Broadcasting by Satellite
Digital Video Broadcasting - Satellite - Second generation
ElectroStatic Discharge
IF
Intermediate Frequency
Ku band
LO
K-under band
Local Oscillator
PFD
Phase Frequency Detector
Pseudomorphic High Electron Mobility Transistor
Phase-Locked Loop
pHEMT
PLL
V/T
Voltage / Tone
XO
Crystal Oscillator
16. Revision history
Table 10. Revision history
Document ID
Release date
20131010
Data sheet status
Product data sheet
Change notice
Supersedes
TFF1012HN v.1
-
-
TFF1012HN
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 1 — 10 October 2013
9 of 12
TFF1012HN
NXP Semiconductors
Integrated mixer oscillator PLL for satellite LNB
17. Legal information
17.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
Suitability for use — NXP Semiconductors products are not designed,
17.2 Definitions
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
17.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
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agreed in a valid written individual agreement. In case an individual
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agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
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Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
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No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
TFF1012HN
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 1 — 10 October 2013
10 of 12
TFF1012HN
NXP Semiconductors
Integrated mixer oscillator PLL for satellite LNB
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
17.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
18. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
TFF1012HN
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 1 — 10 October 2013
11 of 12
TFF1012HN
NXP Semiconductors
Integrated mixer oscillator PLL for satellite LNB
19. Contents
1
2
3
4
5
6
7
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3
8
8.1
8.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
9
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Recommended operating conditions. . . . . . . . 4
Thermal characteristics . . . . . . . . . . . . . . . . . . 5
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 5
Application information. . . . . . . . . . . . . . . . . . . 6
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 9
10
11
12
13
14
15
16
17
Legal information. . . . . . . . . . . . . . . . . . . . . . . 10
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11
17.1
17.2
17.3
17.4
18
19
Contact information. . . . . . . . . . . . . . . . . . . . . 11
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2013.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 10 October 2013
Document identifier: TFF1012HN
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