TJA1051T/2Z [NXP]
Interface Circuit, PDSO8;型号: | TJA1051T/2Z |
厂家: | NXP |
描述: | Interface Circuit, PDSO8 电信 光电二极管 电信集成电路 |
文件: | 总25页 (文件大小:204K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
TJA1051
High-speed CAN transceiver
Rev. 9 — 28 November 2017
Product data sheet
1. General description
The TJA1051 is a high-speed CAN transceiver that provides an interface between a
Controller Area Network (CAN) protocol controller and the physical two-wire CAN bus.
The transceiver is designed for high-speed CAN applications in the automotive industry,
providing differential transmit and receive capability to (a microcontroller with) a CAN
protocol controller.
The TJA1051 belongs to the third generation of high-speed CAN transceivers from NXP
Semiconductors, offering significant improvements over first- and second-generation
devices such as the TJA1050. It offers improved ElectroMagnetic Compatibility (EMC)
and ElectroStatic Discharge (ESD) performance, and also features:
• Ideal passive behavior to the CAN bus when the supply voltage is off
• TJA1051T/3 and TJA1051TK/3 can be interfaced directly to microcontrollers with
supply voltages from 3 V to 5 V
The TJA1051 implements the CAN physical layer as defined in ISO 11898-2:2016 and
SAE J2284-1 to SAE J2284-5. This implementation enables reliable communication in the
CAN FD fast phase at data rates up to 5 Mbit/s.
These features make the TJA1051 an excellent choice for all types of HS-CAN networks,
in nodes that do not require a standby mode with wake-up capability via the bus.
2. Features and benefits
2.1 General
ISO 11898-2:2016 and SAE J2284-1 to SAE J2284-5 compliant
Timing guaranteed for data rates up to 5 Mbit/s in the CAN FD fast phase
Suitable for 12 V and 24 V systems
Low ElectroMagnetic Emission (EME) and high ElectroMagnetic Immunity (EMI)
VIO input on TJA1051T/3 and TJA1051TK/3 allows for direct interfacing with 3 V to 5 V
microcontrollers (available in SO8 and very small HVSON8 packages respectively)
EN input on TJA1051T/E allows the microcontroller to switch the transceiver to a very
low-current Off mode
Available in SO8 package or leadless HVSON8 package (3.0 mm 3.0 mm) with
improved Automated Optical Inspection (AOI) capability
Dark green product (halogen free and Restriction of Hazardous Substances (RoHS)
compliant)
AEC-Q100 qualified
TJA1051
NXP Semiconductors
High-speed CAN transceiver
2.2 Low-power management
Functional behavior predictable under all supply conditions
Transceiver disengages from the bus when not powered up (zero load)
2.3 Protection
High ElectroStatic Discharge (ESD) handling capability on the bus pins
Bus pins protected against transients in automotive environments
Transmit Data (TXD) dominant time-out function
Undervoltage detection on pins VCC and VIO
Thermally protected
3. Quick reference data
Table 1.
Quick reference data
Symbol
VCC
Parameter
Conditions
Min
4.5
2.8
3.5
Typ
Max
5.5
Unit
V
supply voltage
-
-
-
VIO
supply voltage on pin VIO
5.5
V
Vuvd(VCC) undervoltage detection
voltage on pin VCC
4.5
V
Vuvd(VIO)
undervoltage detection
voltage on pin VIO
1.3
2.0
2.7
V
ICC
supply current
Silent mode
0.1
2.5
1
5
2.5
10
mA
mA
Normal mode; bus
recessive
Normal mode; bus
dominant
20
50
70
mA
IIO
supply current on pin VIO
Normal/Silent mode
recessive; VTXD = VIO
dominant; VTXD = 0 V
-
80
350
-
250
500
+8
A
A
kV
-
VESD
electrostatic discharge
voltage
IEC 61000-4-2 at pins
CANH and CANL
8
VCANH
VCANL
Tvj
voltage on pin CANH
voltage on pin CANL
58
58
40
-
-
-
+58
+58
V
V
virtual junction temperature
+150 C
4. Ordering information
Table 2.
Ordering information
Type number
Package
Name
SO8
Description
Version
TJA1051T
plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
TJA1051
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© NXP N.V. 2017. All rights reserved.
Product data sheet
Rev. 9 — 28 November 2017
2 of 25
TJA1051
NXP Semiconductors
High-speed CAN transceiver
Table 2.
Ordering information …continued
Type number
Package
Name
SO8
Description
Version
TJA1051T/3[1]
TJA1051T/E[1]
TJA1051TK/3[1]
plastic small outline package; 8 leads; body width 3.9 mm
plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
SOT96-1
SOT782-1
SO8
HVSON8
plastic thermal enhanced very thin small outline package; no leads;
8 terminals; body 3 3 0.85 mm
[1] TJA1051T/3 and TJA1051TK/3 with VIO pin; TJA1051T/E with EN pin.
5. Block diagram
(1)
V
V
IO
CC
3
5
V
CC
TJA1051
TEMPERATURE
PROTECTION
(1)
7
V
I/O
CANH
SLOPE
CONTROL
AND
1
8
6
TIME-OUT
DRIVER
TXD
S
CANL
MODE
CONTROL
5
4
(2)
EN
RXD
DRIVER
2
015aaa036
GND
(1) In a transceiver without a VIO pin, the VIO input is internally connected to VCC
.
(2) Only present in the TJA1051T/E.
Fig 1. Block diagram
TJA1051
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© NXP N.V. 2017. All rights reserved.
Product data sheet
Rev. 9 — 28 November 2017
3 of 25
TJA1051
NXP Semiconductors
High-speed CAN transceiver
6. Pinning information
6.1 Pinning
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c. TJA1051T/3: SO8
Fig 2. Pin configuration diagrams
d. TJA1051TK/3: HVSON8
6.2 Pin description
Table 3.
Pin description
Symbol Pin Description
TXD
GND[1]
VCC
1
2
3
4
5
5
5
6
7
8
transmit data input
ground
supply voltage
RXD
n.c.
receive data output; reads out data from the bus lines
not connected; in TJA1051T version
EN
enable control input; TJA1051T/E only
VIO
supply voltage for I/O level adapter; TJA1051T/3 and TJA1051TK/3 only
LOW-level CAN bus line
CANL
CANH
S
HIGH-level CAN bus line
Silent mode control input
[1] HVSON8 package die supply ground is connected to both the GND pin and the exposed center pad. The
GND pin must be soldered to board ground. For enhanced thermal and electrical performance, it is
recommended that the exposed center pad also be soldered to board ground.
TJA1051
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© NXP N.V. 2017. All rights reserved.
Product data sheet
Rev. 9 — 28 November 2017
4 of 25
TJA1051
NXP Semiconductors
High-speed CAN transceiver
7. Functional description
The TJA1051 is a high-speed CAN stand-alone transceiver with Silent mode. It combines
the functionality of the TJA1050 transceiver with improved EMC and ESD handling
capability. Improved slope control and high DC handling capability on the bus pins
provides additional application flexibility.
The TJA1051 is available in three versions, distinguished only by the function of pin 5:
• The TJA1051T is backwards compatible with the TJA1050
• The TJA1051T/3 and TJA1051TK/3 allow for direct interfacing to microcontrollers with
supply voltages down to 3 V
• The TJA1051T/E allows the transceiver to be switched to a very low-current Off
mode.
7.1 Operating modes
The TJA1051 supports two operating modes, Normal and Silent, which are selected via
pin S. An additional Off mode is supported in the TJA1051T/E via pin EN. See Table 4 for
a description of the operating modes under normal supply conditions.
Table 4.
Mode
Operating modes
Inputs
Outputs
CAN driver
dominant
recessive
recessive
floating
Pin EN[1]
Pin S
LOW
LOW
HIGH
X[3]
Pin TXD
LOW
HIGH
X[3]
Pin RXD
active[2]
active[2]
active[2]
floating
Normal
HIGH
HIGH
Silent
Off[1]
HIGH
LOW
X[3]
[1] Only available on the TJA1051T/E.
[2] LOW if the CAN bus is dominant, HIGH if the CAN bus is recessive.
[3] ‘X’ = don’t care.
7.1.1 Normal mode
A LOW level on pin S selects Normal mode. In this mode, the transceiver is able to
transmit and receive data via the bus lines CANH and CANL (see Figure 1 for the block
diagram). The differential receiver converts the analog data on the bus lines into digital
data which is output to pin RXD. The slopes of the output signals on the bus lines are
controlled internally and are optimized in a way that guarantees the lowest possible
ElectroMagnetic Emission (EME).
7.1.2 Silent mode
A HIGH level on pin S selects Silent mode. In Silent mode the transmitter is disabled,
releasing the bus pins to recessive state. All other IC functions, including the receiver,
continue to operate as in Normal mode. Silent mode can be used to prevent a faulty CAN
controller from disrupting all network communications.
TJA1051
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© NXP N.V. 2017. All rights reserved.
Product data sheet
Rev. 9 — 28 November 2017
5 of 25
TJA1051
NXP Semiconductors
High-speed CAN transceiver
7.1.3 Off mode
A LOW level on pin EN of TJA1051T/E selects Off mode. In Off mode the entire
transceiver is disabled, allowing the microcontroller to save power when CAN
communication is not required. The bus pins are floating in Off mode, making the
transceiver invisible to the rest of the network.
7.2 Fail-safe features
7.2.1 TXD dominant time-out function
A ‘TXD dominant time-out’ timer is started when pin TXD is set LOW. If the LOW state on
pin TXD persists for longer than tto(dom)TXD, the transmitter is disabled, releasing the bus
lines to recessive state. This function prevents a hardware and/or software application
failure from driving the bus lines to a permanent dominant state (blocking all network
communications). The TXD dominant time-out timer is reset when pin TXD is set HIGH.
The TXD dominant time-out time also defines the minimum possible bit rate of 20 kbit/s.
7.2.2 Internal biasing of TXD, S and EN input pins
Pin TXD has an internal pull-up to VIO and pins S and EN (TJA1051T/E) have internal
pull-downs to GND. This ensures a safe, defined state in case one or more of these pins
is left floating.
7.2.3 Undervoltage detection on pins VCC and VIO
Should VCC or VIO drop below their respective undervoltage detection levels (Vuvd(VCC)
and Vuvd (VIO); see Table 7), the transceiver will switch off and disengage from the bus
(zero load) until VCC and VIO have recovered.
7.2.4 Overtemperature protection
The output drivers are protected against overtemperature conditions. If the virtual junction
temperature exceeds the shutdown junction temperature, Tj(sd), the output drivers will be
disabled until the virtual junction temperature falls below Tj(sd) and TXD becomes
recessive again. Including the TXD condition ensures that output driver oscillations due to
temperature drift are avoided.
7.3 VIO supply pin
There are three versions of the TJA1051 available, only differing in the function of a single
pin. Pin 5 is either an enable control input (EN), a VIO supply pin or is not connected.
Pin VIO on the TJA1051T/3 and TJA1051TK/3 should be connected to the microcontroller
supply voltage (see Figure 6). This will adjust the signal levels of pins TXD, RXD and S to
the I/O levels of the microcontroller. For versions of the TJA1051 without a VIO pin, the VIO
input is internally connected to VCC. This sets the signal levels of pins TXD, RXD and S to
levels compatible with 5 V microcontrollers.
TJA1051
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© NXP N.V. 2017. All rights reserved.
Product data sheet
Rev. 9 — 28 November 2017
6 of 25
TJA1051
NXP Semiconductors
High-speed CAN transceiver
8. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are referenced to GND.
Symbol
Parameter
voltage on pin x[1]
Conditions
Min
58
0.3
27
Max
+58
+7
Unit
V
Vx
on pins CANH, CANL
on any other pin
V
V(CANH-CANL) voltage between pin CANH
and pin CANL
+27
V
[2]
Vtrt
transient voltage
on pins CANH, CANL
pulse 1
100
-
V
V
V
V
pulse 2a
-
75
-
pulse 3a
150
pulse 3b
-
100
[3]
[4]
VESD
electrostatic discharge voltage IEC 61000-4-2 (150 pF, 330 )
at pins CANH and CANL
8
+8
kV
Human Body Model (HBM); 100 pF, 1.5 k
at pins CANH and CANL
at any other pin
8
4
+8
+4
kV
kV
[5]
[6]
Machine Model (MM); 200 pF, 0.75 H, 10
at any pin
300 +300
V
Charged Device Model (CDM); field Induced
charge; 4 pF
at corner pins
at any pin
750 +750
500 +500
V
V
[7]
Tvj
virtual junction temperature
storage temperature
40
55
+150
+150
C
C
Tstg
[1] The device can sustain voltages up to the specified values over the product lifetime, provided applied voltages (including transients)
never exceed these values.
[2] According to IEC TS 62228 (2007), Section 4.2.4; parameters for standard pulses defined in ISO7637 part 2: 2004-06.
[3] According to IEC TS 62228 (2007), Section 4.3; DIN EN 61000-4-2.
[4] According to AEC-Q100-002.
[5] According to AEC-Q100-003.
[6] AEC-Q100-011 Rev-C1. The classification level is C4B.
[7] In accordance with IEC 60747-1. An alternative definition of virtual junction temperature is: Tvj = Tamb + P Rth(vj-a), where Rth(vj-a) is a
fixed value to be used for the calculation of Tvj. The rating for Tvj limits the allowable combinations of power dissipation (P) and ambient
temperature (Tamb).
9. Thermal characteristics
Table 6.
Thermal characteristics
According to IEC 60747-1.
Symbol
Parameter
Conditions
Value
155
55
Unit
K/W
K/W
Rth(vj-a)
thermal resistance from virtual junction to ambient
SO8 package; in free air
HVSON8 package; in free air
TJA1051
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© NXP N.V. 2017. All rights reserved.
Product data sheet
Rev. 9 — 28 November 2017
7 of 25
TJA1051
NXP Semiconductors
High-speed CAN transceiver
10. Static characteristics
Table 7.
Static characteristics
Tvj = 40 C to +150 C; VCC = 4.5 V to 5.5 V; VIO = 2.8 V to 5.5 V[1]; RL = 60 unless specified otherwise; All voltages are
defined with respect to ground; Positive currents flow into the IC[2].
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Supply; pin VCC
VCC
ICC
supply voltage
4.5
1
-
5.5
8
V
supply current
Off mode (TJA1051T/E)
Silent mode
5
1
A
mA
0.1
2.5
Normal mode
[3]
recessive; VTXD =VIO
dominant; VTXD = 0 V
-
5
10
mA
mA
mA
-
50
80
70
dominant; VTXD = 0 V;
2.5
110
short circuit on bus lines;
3 V VCANH = VCANL) +18 V
Vuvd(VCC)
undervoltage detection
voltage on pin VCC
[1]
3.5
2.8
-
-
4.5
5.5
V
V
I/O level adapter supply; pin VIO
VIO
IIO
supply voltage on pin VIO
supply current on pin VIO
Normal/Silent mode
[3]
recessive; VTXD = VIO
-
80
250
500
2.7
A
A
V
dominant; VTXD = 0 V
-
350
2.0
Vuvd(VIO)
undervoltage detection
voltage on pin VIO
1.3
Mode control inputs; pins S and EN[4]
[5]
[3]
VIH
VIL
IIH
HIGH-level input voltage
LOW-level input voltage
HIGH-level input current
LOW-level input current
0.7VIO
0.3
1
-
VIO + 0.3[3]
V
[3]
-
0.3VIO
V
[3]
VS = VIO; VEN = VIO
4
0
10
+1
A
A
IIL
VS = 0 V; VEN = 0 V
1
CAN transmit data input; pin TXD
[5]
[6]
[3]
VIH
VIL
IIH
IIL
HIGH-level input voltage
LOW-level input voltage
HIGH-level input current
LOW-level input current
input capacitance
0.7VIO
0.3
5
-
VIO + 0.3[3]
V
[3]
-
+0.3VIO
V
[3]
VTXD = VIO
0
+5
A
A
pF
Normal mode; VTXD = 0 V
260
-
150
30
10
Ci
5
CAN receive data output; pin RXD
IOH
IOL
HIGH-level output current
LOW-level output current
VRXD = VIO 0.4 V[3]
8
3
1
mA
mA
VRXD = 0.4 V; bus dominant
2
5
12
Bus lines; pins CANH and CANL
VO(dom) dominant output voltage
VTXD = 0 V; t < tto(dom)TXD
pin CANH; RL = 50 to 65
pin CANL; RL = 50 to 65
2.75
0.5
3.5
1.5
-
4.5
V
2.25
+400
V
Vdom(TX)sym transmitter dominant voltage Vdom(TX)sym = VCC VCANH VCANL
400
mV
symmetry
TJA1051
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© NXP N.V. 2017. All rights reserved.
Product data sheet
Rev. 9 — 28 November 2017
8 of 25
TJA1051
NXP Semiconductors
High-speed CAN transceiver
Table 7.
Static characteristics …continued
Tvj = 40 C to +150 C; VCC = 4.5 V to 5.5 V; VIO = 2.8 V to 5.5 V[1]; RL = 60 unless specified otherwise; All voltages are
defined with respect to ground; Positive currents flow into the IC[2].
Symbol
Parameter
transmitter voltage symmetry VTXsym = VCANH + VCANL
TXD = 250 kHz, 1 MHz and 2.5 MHz;
Conditions
Min
Typ
Max
Unit
[6]
[7]
VTXsym
;
0.9VCC
-
1.1VCC
V
f
VCC = 4.75 V to 5.25 V;
CSPLIT = 4.7 nF
VO(dif)
differential output voltage
dominant: Normal mode; VTXD = 0 V;
t < tto(dom)TXD; VCC = 4.75 V to 5.25 V
RL = 45 to 65
RL = 45 to 70
RL = 2240
1.5
1.5
1.5
-
-
-
3
V
V
V
3.3
5
recessive; no load
[3]
Normal mode: VTXD = VIO
50
-
+50
3
mV
V
[3]
VO(rec)
recessive output voltage
Normal/Silent mode; VTXD = VIO
no load
;
2
0.5VCC
Vth(RX)dif
differential receiver threshold Normal/Silent mode;
0.5
4
0.7
0.9
0.5
9.0
200
V
voltage
30 V VCANL +30 V;
30 V VCANH +30 V
Vrec(RX)
receiver recessive voltage
Normal/Silent mode;
30 V VCANL +30 V;
30 V VCANH +30 V
-
V
Vdom(RX)
Vhys(RX)dif
IO(sc)dom
receiver dominant voltage
Normal/Silent mode;
30 V VCANL +30 V;
30 V VCANH +30 V
0.9
50
-
V
differential receiver
hysteresis voltage
Normal/Silent mode;
30 V VCANL +30 V;
30 V VCANH +30 V
120
mV
dominant short-circuit output VTXD = 0 V; t < tto(dom)TXD; VCC = 5 V
current
pin CANH; VCANH = 15 V to
100
70
40
mA
+40 V
pin CANL; VCANL = 15 V to +40 V
40
70
-
100
+5
mA
mA
[3]
IO(sc)rec
IL
recessive short-circuit output Normal/Silent mode; VTXD = VIO
;
5
current
VCANH = VCANL = 27 V to +32 V
leakage current
VCC = VIO = 0 V or VCC = VIO
shorted to ground via 47 k;
VCANH = VCANL = 5 V
=
5
0
+5
A
[6]
[6]
[6]
[6]
Ri
input resistance
2 V VCANL +7 V;
2 V VCANH +7 V
9
15
-
28
+1
52
20
k
%
Ri
input resistance deviation
differential input resistance
0 V VCANL +5 V;
0 V VCANH +5 V
1
19
-
Ri(dif)
Ci(cm)
2 V VCANL +7 V;
2 V VCANH +7 V
30
-
k
pF
common-mode input
capacitance
TJA1051
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© NXP N.V. 2017. All rights reserved.
Product data sheet
Rev. 9 — 28 November 2017
9 of 25
TJA1051
NXP Semiconductors
High-speed CAN transceiver
Table 7.
Static characteristics …continued
Tvj = 40 C to +150 C; VCC = 4.5 V to 5.5 V; VIO = 2.8 V to 5.5 V[1]; RL = 60 unless specified otherwise; All voltages are
defined with respect to ground; Positive currents flow into the IC[2].
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
[6]
[6]
Ci(dif)
differential input capacitance
-
-
10
pF
Temperature protection
Tj(sd) shutdown junction
temperature
-
190
-
C
[1] Only TJA1051T/3 and TJA1051TK/3 have a VIO pin. In transceivers without a VIO pin, the VIO input is internally connected to VCC
.
[2] All parameters are guaranteed over the virtual junction temperature range by design. Factory testing uses correlated test conditions to
cover the specified temperature and power supply voltage range.
[3]
VIO = VCC for the non-VIO product variants TJA1051T(/E)
[4] Only TJA1051T/E has an EN pin.
[5] Maximum value assumes VCC < VIO; if VCC > VIO, the maximum value will be VCC + 0.3 V.
[6] Not tested in production; guaranteed by design.
[7] The test circuit used to measure the bus output voltage symmetry (which includes CSPLIT) is shown in Figure 8.
11. Dynamic characteristics
Table 8.
Dynamic characteristics
Tvj = 40 C to +150 C; VCC = 4.5 V to 5.5 V; VIO = 2.8 V to 5.5 V[1]; RL = 60 unless specified otherwise. All voltages are
defined with respect to ground. Positive currents flow into the IC.[2]
Symbol
Parameter
Conditions
Min
Typ Max
Unit
Transceiver timing; pins CANH, CANL, TXD and RXD; see Figure 7 and Figure 3
td(TXD-busdom) delay time from TXD to bus dominant
td(TXD-busrec) delay time from TXD to bus recessive
td(busdom-RXD) delay time from bus dominant to RXD
td(busrec-RXD) delay time from bus recessive to RXD
td(TXDL-RXDL) delay time from TXD LOW to RXD LOW
Normal mode
-
65
90
60
65
-
-
ns
ns
ns
ns
ns
Normal mode
-
-
Normal/Silent mode
Normal/Silent mode
-
-
-
-
Normal mode: versions
with VIO pin
40
250
Normal mode: other
versions
40
40
40
-
-
-
220
250
220
ns
ns
ns
td(TXDH-RXDH) delay time from TXD HIGH to RXD HIGH Normal mode: versions
with VIO pin
Normal mode: other
versions
[3]
[3]
[3]
[3]
tbit(bus)
transmitted recessive bit width
bit time on pin RXD
tbit(TXD) = 500 ns
tbit(TXD) = 200 ns
tbit(TXD) = 500 ns
tbit(TXD) = 200 ns
tbit(TXD) = 500 ns
tbit(TXD) = 200 ns
VTXD = 0 V; Normal mode
435
155
400
120
65
45
0.3
-
-
-
-
-
-
1
530
210
550
220
+40
+15
5
ns
ns
ns
ns
ns
ns
ms
tbit(RXD)
trec
receiver timing symmetry
TXD dominant time-out time
[4]
tto(dom)TXD
[1] Only TJA1051T/3 and TJA1051TK/3 have a VIO pin. In transceivers without a VIO pin, the VIO input is internally connected to VCC
.
[2] All parameters are guaranteed over the virtual junction temperature range by design. Factory testing uses correlated test conditions to
cover the specified temperature and power supply voltage range.
TJA1051
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Product data sheet
Rev. 9 — 28 November 2017
10 of 25
TJA1051
NXP Semiconductors
High-speed CAN transceiver
[3] See Figure 4.
[4] Minimum value of 0.8ms required according to SAE J2284; 0.3ms is allowed according to ISO11898-2:2016 for legacy devices.
+,*+
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Fig 3. CAN transceiver timing diagram
TJA1051
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Product data sheet
Rev. 9 — 28 November 2017
11 of 25
TJA1051
NXP Semiconductors
High-speed CAN transceiver
ꢈꢍꢉꢏ
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Fig 4. CAN FD timing definitions according to ISO 11898-2:2016
12. Application information
12.1 Application diagrams
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(1) Optional, depends on regulator.
Fig 5. Typical application of the TJA1051T/E
TJA1051
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Product data sheet
Rev. 9 — 28 November 2017
12 of 25
TJA1051
NXP Semiconductors
High-speed CAN transceiver
%$7
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(1) Optional, depends on regulator.
Fig 6. Typical application of the TJA1051T/3 or TJA1051TK/3.
12.2 Application hints
Further information on the application of the TJA1051 can be found in NXP application
hints AH1014 Application Hints - Standalone high speed CAN transceiver
TJA1042/TJA1043/TJA1048/TJA1051.
13. Test information
+5 V
47 μF
100 nF
(1)
V
/EN
V
CC
IO
TXD
CANH
TJA1051
R
L
100 pF
RXD
CANL
GND
S
15 pF
015aaa040
(1) For versions with a VIO pin (TJA1051T/3 and TJA1051TK/3) or an EN pin (TJA1051T/E), these
inputs are connected to pin VCC
.
Fig 7. Timing test circuit for CAN transceiver
TJA1051
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© NXP N.V. 2017. All rights reserved.
Product data sheet
Rev. 9 — 28 November 2017
13 of 25
TJA1051
NXP Semiconductors
High-speed CAN transceiver
9
9
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Fig 8. Test circuit for measuring transceiver driver symmetry
13.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q100 Rev-G - Failure mechanism based stress test qualification for
integrated circuits, and is suitable for use in automotive applications.
TJA1051
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Product data sheet
Rev. 9 — 28 November 2017
14 of 25
TJA1051
NXP Semiconductors
High-speed CAN transceiver
14. Package outline
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Fig 9. Package outline SOT96-1 (SO8)
TJA1051
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© NXP N.V. 2017. All rights reserved.
Product data sheet
Rev. 9 — 28 November 2017
15 of 25
TJA1051
NXP Semiconductors
High-speed CAN transceiver
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TJA1051
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Product data sheet
Rev. 9 — 28 November 2017
16 of 25
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NXP Semiconductors
High-speed CAN transceiver
15. Handling information
All input and output pins are protected against ElectroStatic Discharge (ESD) under
normal handling. When handling ensure that the appropriate precautions are taken as
described in JESD625-A or equivalent standards.
16. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
16.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
16.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
• Board specifications, including the board finish, solder masks and vias
• Package footprints, including solder thieves and orientation
• The moisture sensitivity level of the packages
• Package placement
• Inspection and repair
• Lead-free soldering versus SnPb soldering
16.3 Wave soldering
Key characteristics in wave soldering are:
TJA1051
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Product data sheet
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17 of 25
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NXP Semiconductors
High-speed CAN transceiver
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
16.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 11) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 9 and 10
Table 9.
SnPb eutectic process (from J-STD-020D)
Package thickness (mm) Package reflow temperature (C)
Volume (mm3)
< 350
350
220
< 2.5
235
220
2.5
220
Table 10. Lead-free process (from J-STD-020D)
Package thickness (mm) Package reflow temperature (C)
Volume (mm3)
< 350
260
350 to 2000
> 2000
260
< 1.6
260
250
245
1.6 to 2.5
> 2.5
260
245
250
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 11.
TJA1051
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Product data sheet
Rev. 9 — 28 November 2017
18 of 25
TJA1051
NXP Semiconductors
High-speed CAN transceiver
maximum peak temperature
= MSL limit, damage level
temperature
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 11. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
17. Soldering of HVSON packages
Section 17 contains a brief introduction to the techniques most commonly used to solder
Surface Mounted Devices (SMD). A more detailed discussion on soldering HVSON
leadless package ICs can found in the following application notes:
• AN10365 ‘Surface mount reflow soldering description”
• AN10366 “HVQFN application information”
TJA1051
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© NXP N.V. 2017. All rights reserved.
Product data sheet
Rev. 9 — 28 November 2017
19 of 25
TJA1051
NXP Semiconductors
High-speed CAN transceiver
18. Appendix: ISO 11898-2:2016 parameter cross-reference list
Table 11. ISO 11898-2:2016 to NXP data sheet parameter conversion
ISO 11898-2:2016
NXP data sheet
Notation Symbol Parameter
Parameter
HS-PMA dominant output characteristics
Single ended voltage on CAN_H
Single ended voltage on CAN_L
Differential voltage on normal bus load
Differential voltage on effective resistance during arbitration
Optional: Differential voltage on extended bus load range
HS-PMA driver symmetry
VCAN_H
VCAN_L
VDiff
VO(dom)
dominant output voltage
differential output voltage
VO(dif)
Driver symmetry
VSYM
VTXsym
transmitter voltage symmetry
Maximum HS-PMA driver output current
Absolute current on CAN_H
ICAN_H
ICAN_L
IO(sc)dom
dominant short-circuit output
current
Absolute current on CAN_L
HS-PMA recessive output characteristics, bus biasing active/inactive
Single ended output voltage on CAN_H
Single ended output voltage on CAN_L
Differential output voltage
VCAN_H
VCAN_L
VDiff
VO(rec)
recessive output voltage
differential output voltage
TXD dominant time-out time
VO(dif)
Optional HS-PMA transmit dominant timeout
Transmit dominant timeout, long
tdom
tto(dom)TXD
Transmit dominant timeout, short
HS-PMA static receiver input characteristics, bus biasing active/inactive
Recessive state differential input voltage range
Dominant state differential input voltage range
VDiff
Vth(RX)dif
differential receiver threshold
voltage
Vrec(RX)
receiver recessive voltage
receiver dominant voltage
Vdom(RX)
HS-PMA receiver input resistance (matching)
Differential internal resistance
RDiff
Ri(dif)
Ri
differential input resistance
input resistance
Single ended internal resistance
RCAN_H
RCAN_L
Matching of internal resistance
HS-PMA implementation loop delay requirement
Loop delay
MR
Ri
input resistance deviation
tLoop
td(TXDH-RXDH) delay time from TXD HIGH to
RXD HIGH
td(TXDL-RXDL)
delay time from TXD LOW to RXD
LOW
Optional HS-PMA implementation data signal timing requirements for use with bit rates above 1 Mbit/s up to
2 Mbit/s and above 2 Mbit/s up to 5 Mbit/s
Transmitted recessive bit width @ 2 Mbit/s / @ 5 Mbit/s,
intended
tBit(Bus)
tbit(bus)
transmitted recessive bit width
Received recessive bit width @ 2 Mbit/s / @ 5 Mbit/s
Receiver timing symmetry @ 2 Mbit/s / @ 5 Mbit/s
tBit(RXD)
tbit(RXD)
bit time on pin RXD
tRec
trec
receiver timing symmetry
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Table 11. ISO 11898-2:2016 to NXP data sheet parameter conversion …continued
ISO 11898-2:2016
NXP data sheet
Parameter
Notation Symbol
Parameter
HS-PMA maximum ratings of VCAN_H, VCAN_L and VDiff
Maximum rating VDiff
VDiff
V(CANH-CANL) voltage between pin CANH and
pin CANL
General maximum rating VCAN_H and VCAN_L
VCAN_H
VCAN_L
Vx
voltage on pin x
Optional: Extended maximum rating VCAN_H and VCAN_L
HS-PMA maximum leakage currents on CAN_H and CAN_L, unpowered
Leakage current on CAN_H, CAN_L
ICAN_H
ICAN_L
IL
leakage current
HS-PMA bus biasing control timings
CAN activity filter time, long
CAN activity filter time, short
Wake-up timeout, short
[1]
tFilter
twake(busdom)
bus dominant wake-up time
bus recessive wake-up time
bus wake-up time-out time
[1]
twake(busrec)
tto(wake)bus
tWake
Wake-up timeout, long
Timeout for bus inactivity
Bus Bias reaction time
tSilence
tBias
tto(silence)
bus silence time-out time
td(busact-bias)
delay time from bus active to bias
[1] tfltr(wake)bus - bus wake-up filter time, in devices with basic wake-up functionality
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19. Revision history
Table 12. Revision history
Document ID
TJA1051 v.9
Modifications:
Release date
Data sheet status
Change notice
Supersedes
20171128
Product data sheet
-
TJA1051 v.8.1
• Updated to comply with ISO 11898-2:2016 and SAE J22884-1 through SAE J2284-5 specifications:
–
–
–
Section 1: text amended (2nd last paragraph)
Section 2.1: text amended (1st entry)
Table 7: values changed and/or measurements conditions amended/added for parameters ICC
,
Vdom(TX)sym, VTXsym, VO(dif), Vrec(RX), Vdom(RX), IO(sc)dom, Ri, Ri and Ri(dif)
–
–
–
Table 8: Table note 4 added
Figure 3: thresholds clarified
Figure 4: title changed
• Figure 5, Figure 6, Figure 8: amended
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TJA1051
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High-speed CAN transceiver
20. Legal information
20.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
Suitability for use in automotive applications — This NXP
20.2 Definitions
Semiconductors product has been qualified for use in automotive
applications. Unless otherwise agreed in writing, the product is not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer's own
risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
20.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
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No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
20.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
21. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
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22. Contents
1
General description. . . . . . . . . . . . . . . . . . . . . . 1
20.2
20.3
20.4
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 23
2
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
General. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Low-power management . . . . . . . . . . . . . . . . . 2
Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
2.1
2.2
2.3
21
22
Contact information . . . . . . . . . . . . . . . . . . . . 23
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
3
4
5
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
Ordering information. . . . . . . . . . . . . . . . . . . . . 3
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
6
6.1
6.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
7
7.1
Functional description . . . . . . . . . . . . . . . . . . . 5
Operating modes . . . . . . . . . . . . . . . . . . . . . . . 5
Normal mode . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Silent mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Off mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Fail-safe features . . . . . . . . . . . . . . . . . . . . . . . 6
TXD dominant time-out function. . . . . . . . . . . . 6
Internal biasing of TXD, S and EN input pins . . 6
Undervoltage detection on pins VCC and VIO . . 6
Overtemperature protection . . . . . . . . . . . . . . . 6
VIO supply pin . . . . . . . . . . . . . . . . . . . . . . . . . . 6
7.1.1
7.1.2
7.1.3
7.2
7.2.1
7.2.2
7.2.3
7.2.4
7.3
8
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 7
Thermal characteristics . . . . . . . . . . . . . . . . . . 7
Static characteristics. . . . . . . . . . . . . . . . . . . . . 8
Dynamic characteristics . . . . . . . . . . . . . . . . . 10
9
10
11
12
12.1
12.2
Application information. . . . . . . . . . . . . . . . . . 12
Application diagrams . . . . . . . . . . . . . . . . . . . 12
Application hints . . . . . . . . . . . . . . . . . . . . . . . 12
13
13.1
14
Test information. . . . . . . . . . . . . . . . . . . . . . . . 13
Quality information . . . . . . . . . . . . . . . . . . . . . 13
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 14
Handling information. . . . . . . . . . . . . . . . . . . . 16
15
16
Soldering of SMD packages . . . . . . . . . . . . . . 16
Introduction to soldering . . . . . . . . . . . . . . . . . 16
Wave and reflow soldering . . . . . . . . . . . . . . . 16
Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 16
Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 17
16.1
16.2
16.3
16.4
17
18
Soldering of HVSON packages. . . . . . . . . . . . 18
Appendix: ISO 11898-2:2016 parameter
cross-reference list . . . . . . . . . . . . . . . . . . . . . 19
19
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 21
Legal information. . . . . . . . . . . . . . . . . . . . . . . 22
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 22
20
20.1
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP N.V. 2017.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 28 November 2017
Document identifier: TJA1051
相关型号:
TJA1051T/3/CM
IC DATACOM, INTERFACE CIRCUIT, PDSO8, 3.90 MM, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, MS-012, SOT96-1, SOP-8, Network Interface
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TJA1051T/CM
IC DATACOM, INTERFACE CIRCUIT, PDSO8, 3.90 MM, GREEN, PLASTIC, MS-012, SOT96-1, SOP-8, Network Interface
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