TJA1054AT [NXP]
Fault-tolerant CAN transceiver; 容错CAN收发器
| 型号： | TJA1054AT |
| 厂家： | 
NXP |
| 描述： | Fault-tolerant CAN transceiver |
| 文件： | 总25页 (文件大小：140K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
TJA1054A
Fault-tolerant CAN transceiver
Product specification
2004 Mar 23
Supersedes data of 2002 Feb 11
Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1054A
FEATURES
GENERAL DESCRIPTION
Optimized for in-car low-speed communication
The TJA1054A is the interface between the protocol
controller and the physical bus wires in a Controller Area
Network (CAN). It is primarily intended for low-speed
applications up to 125 kBaud in passenger cars. The
device provides differential receive and transmit capability
but will switch to single-wire transmitter and/or receiver in
error conditions.
• Baud rate up to 125 kBaud
• Up to 32 nodes can be connected
• Supports unshielded bus wires
• Very low ElectroMagnetic Emission (EME) due to
built-in slope control function and a very good matching
of the CANL and CANH bus outputs
The TJA1054A is the ESD improved version of the
TJA1054. For an overview of the differences between the
TJA1054 and the TJA1054A, please refer to “Appendix A”.
• Good ElectroMagnetic Immunity (EMI) in normal
operating mode and in low power modes
• Fully integrated receiver filters
The TJA1054AT is, as the TJA1054T, pin and downwards
compatible with the PCA82C252T and the TJA1053T. This
means that these two devices can be replaced by the
TJA1054AT or the TJA1054T with retention of all
functions.
• Transmit Data (TxD) dominant time-out function.
Bus failure management
• Supports single-wire transmission modes with ground
offset voltages up to 1.5 V
The most important improvements of the TJA1054 and the
TJA1054A with respect to the PCA82C252 and the
TJA1053 are:
• Automatic switching to single-wire mode in the event of
bus failures, even when the CANH bus wire is
short-circuited to VCC
• Very low EME due to a very good matching of the CANL
and CANH output signals
• Automatic reset to differential mode if bus failure is
removed
• Good EMI, especially in low power modes
• Full wake-up capability during bus failures
• Full wake-up capability during failure modes.
• Extended bus failure management including
Protections
short-circuit of the CANH bus line to VCC
• Support for easy system fault diagnosis
• Bus pins short-circuit safe to battery and to ground
• Thermally protected
• Two-edge sensitive wake-up input signal via pin WAKE.
• Bus lines protected against transients in an automotive
environment
• An unpowered node does not disturb the bus lines.
Support for low power modes
• Low current sleep and standby mode with wake-up via
the bus lines
• Power-on reset flag on the output.
ORDERING INFORMATION
TYPE
PACKAGE
NUMBER
NAME
DESCRIPTION
VERSION
TJA1054AT
TJA1054AU
SO14
plastic small outline package; 14 leads; body width 3.9 mm
SOT108-1
−
bare die; 1990 × 2730 × 375 µm
−
2004 Mar 23
2
Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1054A
QUICK REFERENCE DATA
SYMBOL
PARAMETER
CONDITIONS
MIN.
4.75
TYP.
MAX.
5.25
UNIT
VCC
supply voltage on pin VCC
battery voltage on pin BAT
−
−
−
−
V
V
V
V
VBAT
no time limit
−0.3
5.0
−
+40
27
operating mode; note 1
load dump
40
IBAT
battery current on pin BAT
CANH bus line voltage
CANL bus line voltage
sleep mode; VCC = 0 V;
VBAT = 12 V
−
30
50
µA
VCANH
VCANL
∆VCANH
∆VCANL
tPD(L)
tr
VCC = 0 to 5.0 V; VBAT ≥ 0 V;
no time limit
−27
−27
−
−
+40
+40
1.4
1.4
−
V
VCC = 0 to 5.0 V; VBAT ≥ 0 V;
no time limit
−
V
CANH bus line transmitter
voltage drop
ICANH = −40 mA
−
V
CANL bus line transmitter
voltage drop
ICANL = 40 mA
−
−
V
propagation delay TXD (LOW)
to RXD (LOW)
−
1
µs
µs
µs
°C
bus line output rise time
bus line output fall time
virtual junction temperature
between 10% and 90%;
C1 = 10 nF; see Fig.5
−
0.6
0.3
−
−
tf
between 10% and 90%;
C1 = 1 nF; see Fig.5
−
−
Tvj
−40
+150
Note
1. A local or remote wake-up event will be signalled at the transceiver pins RXD and NERR if VBAT = 5.3 V to 27 V
(see Table 2).
2004 Mar 23
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Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1054A
BLOCK DIAGRAM
V
BAT
14
CC
10
1
INH
TEMPERATURE
PROTECTION
7
5
6
WAKE-UP
STANDBY
CONTROL
WAKE
STB
EN
9
RTL
11
CANH
CANL
RTH
V
12
8
CC
2
DRIVER
TXD
ERR
TIMER
TJA1054A
V
V
CC
CC
FAILURE DETECTOR
PLUS WAKE-UP
PLUS TIME-OUT
4
FILTER
FILTER
RECEIVER
3
RXD
13
GND
MGU383
Fig.1 Block diagram.
4
2004 Mar 23
Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1054A
PINNING
SYMBOL PIN
DESCRIPTION
INH
1
2
3
4
inhibit output for switching an external voltage regulator if a wake-up signal occurs
transmit data input for activating the driver to the bus lines
TXD
RXD
ERR
receive data output for reading out the data from the bus lines
error, wake-up and power-on indication output; active LOW in normal operating mode when the bus
has a failure, and in low power modes (wake-up signal or in power-on standby)
STB
EN
5
6
standby digital control signal input (active LOW); together with the input signal on pin EN this input
determines the state of the transceiver (in normal and low power modes); see Table 2 and Fig.3
enable digital control signal input; together with the input signal on pin STB this input determines
the state of the transceiver (in normal and low power modes); see Table 2 and Fig.3
WAKE
RTH
7
8
local wake-up signal input (active LOW); both falling and rising edges are detected
termination resistor connection; in case of a CANH bus wire error the line is terminated with a
predefined impedance
RTL
9
termination resistor connection; in case of a CANL bus wire the line is terminated with a predefined
impedance
VCC
10 supply voltage
CANH
CANL
GND
BAT
11 HIGH-level CAN bus line
12 LOW-level CAN bus line
13 ground
14 battery supply voltage
handbook, halfpage
INH
TXD
RXD
1
2
3
4
5
6
7
14 BAT
13
GND
12 CANL
11
TJA1054AT
ERR
STB
CANH
10
9
V
CC
EN
RTL
RTH
WAKE
8
MGU379
Fig.2 Pin configuration.
5
2004 Mar 23
Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1054A
FUNCTIONAL DESCRIPTION
If the duration of the LOW level on pin TXD exceeds a
certain time, the transmitter will be disabled. The timer will
be reset by a HIGH level on pin TXD.
The TJA1054A is the interface between the CAN protocol
controller and the physical wires of the CAN bus (see
Fig.7). It is primarily intended for low-speed applications,
up to 125 kBaud, in passenger cars. The device provides
differential transmit capability to the CAN bus and
differential receive capability to the CAN controller.
Failure detector
The failure detector is fully active in the normal operating
mode. After the detection of a single bus failure the
detector switches to the appropriate mode (see Table 1).
The differential receiver threshold voltage is set at −3.2 V
typical (VCC = 5 V). This ensures correct reception with a
noise margin as high as possible in the normal operating
mode and in the event of failures 1, 2, 5 and 6a. These
failures, or recovery from them, do not destroy ongoing
transmissions. The output drivers remain active, the
termination does not change and the receiver remains in
differential mode (see Table 1).
To reduce EME, the rise and fall slopes are limited. This
allows the use of an unshielded twisted pair or a parallel
pair of wires for the bus lines. Moreover, the device
supports transmission capability on either bus line if one of
the wires is corrupted. The failure detection logic
automatically selects a suitable transmission mode.
In normal operating mode (no wiring failures) the
differential receiver is output on pin RXD (see Fig.1).
The differential receiver inputs are connected to
pins CANH and CANL through integrated filters.
The filtered input signals are also used for the single-wire
receivers. The receivers connected to pins CANH
and CANL have threshold voltages that ensure a
maximum noise margin in single-wire mode.
Failures 3, 3a and 6 are detected by comparators
connected to the CANH and CANL bus lines.
Failures 3 and 3a are detected in a two-step approach.
If the CANH bus line exceeds a certain voltage level, the
differential comparator signals a continuous dominant
condition. Because of inter operability reasons with the
predecessor products PCA82C252 and TJA1053, after a
first time-out the transceiver switches to single-wire
operation through CANH. If the CANH bus line is still
exceeding the CANH detection voltage for a second
time-out, the TJA1054A switches to CANL operation; the
CANH driver is switched off and the RTH bias changes to
the pull-down current source. The time-outs (delays) are
needed to avoid false triggering by external RF fields.
A timer function (TxD dominant time-out function) has
been integrated to prevent the bus lines from being driven
into a permanent dominant state (thus blocking the entire
network communication) due to a situation in which
pin TXD is permanently forced to a LOW level, caused by
a hardware and/or software application failure.
Table 1 Bus failures
TERMINATION TERMINATION CANH
CANL
RECEIVER
MODE
FAILURE
DESCRIPTION
CANH (RTH)
CANL (RTL) DRIVER DRIVER
1
2
CANH wire interrupted
on
on
on
on
off
off
on
on
on
on
on
on
on
on
on
off
on
off
on
off
differential
differential
CANL
CANL wire interrupted
on
on
3
CANH short-circuited to battery
CANH short-circuited to VCC
CANL short-circuited to ground
CANH short-circuited to ground
CANL short-circuited to battery
CANL short-circuited to VCC
weak; note 1
on
on
3a
4
weak; note 1
CANL
on
on
on
on
on
weak; note 2
on
CANH
5
differential
CANH
6
weak; note 2
on
6a
7
differential
CANH
CANL and CANH mutually
short-circuited
weak; note 2
Notes
1. A weak termination implies a pull-down current source behaviour of 75 µA typical.
2. A weak termination implies a pull-up current source behaviour of 75 µA typical.
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Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1054A
Failure 6 is detected if the CANL bus line exceeds its
comparator threshold for a certain period of time. This
delay is needed to avoid false triggering by external RF
fields. After detection of failure 6, the reception is switched
to the single-wire mode through CANH; the CANL driver is
switched off and the RTL bias changes to the pull-up
current source.
During all single-wire transmissions, EMC performance
(both immunity and emission) is worse than in the
differential mode. The integrated receiver filters suppress
any HF noise induced into the bus wires. The cut-off
frequency of these filters is a compromise between
propagation delay and HF suppression. In single-wire
mode, LF noise cannot be distinguished from the required
signal.
Recovery from failures 3, 3a and 6 is detected
automatically after reading a consecutive recessive level
by corresponding comparators for a certain period of time.
Low power modes
The transceiver provides three low power modes which
can be entered and exited via STB and EN (see Table 2
and Fig.3).
Failures 4 and 7 initially result in a permanent dominant
level on pin RXD. After a time-out the CANL driver is
switched off and the RTL bias changes to the pull-up
current source. Reception continues by switching to the
single-wire mode via pins CANH or CANL. When
failures 4 or 7 are removed, the recessive bus levels are
restored. If the differential voltage remains below the
recessive threshold level for a certain period of time,
reception and transmission switch back to the differential
mode.
The sleep mode is the mode with the lowest power
consumption. Pin INH is switched to HIGH-impedance for
deactivation of the external voltage regulator. Pin CANL is
biased to the battery voltage via pin RTL. If the supply
voltage is provided, pins RXD and ERR will signal the
wake-up interrupt.
The standby mode operates in the same way as the sleep
mode but with a HIGH level on pin INH.
If any of the wiring failure occurs, the output signal on
pin ERR will be set to LOW. On error recovery, the output
signal on pin ERR will be set to HIGH again. In case of an
interrupted open bus wire, this failure will be detected and
signalled only if there is an open wire between the
transmitting and receiving node(s). Thus, during open wire
failures, pin ERR typically toggles.
The power-on standby mode is the same as the standby
mode, however, in this mode the battery power-on flag is
shown on pin ERR instead of the wake-up interrupt signal.
The output on pin RXD will show the wake-up interrupt.
This mode is only for reading out the power-on flag.
Table 2 Normal operating and low power modes
PIN ERR
PIN
PIN RXD
PIN RTL
SWITCHED
TO
MODE
PIN EN
STB
LOW
HIGH
LOW
wake-up
HIGH
Goto-sleep LOW
command
HIGH
wake-up
interruptsignal;
notes 1 2 and 3
VBAT
interruptsignal;
notes 1 2 and 3
Sleep
LOW
LOW
HIGH
LOW(4)
LOW
Standby
Power-on
standby
LOW
VBAT power-on
flag;
wake-up
VBAT
interruptsignal;
notes 1 2 and 3
notes 1 and 5
Normal
HIGH
HIGH
error flag
no error flag
dominant
recessive
VCC
operating
received data
received data
Notes
1. If the supply voltage VCC is present.
2. Wake-up interrupts are released when entering normal operating mode.
2004 Mar 23
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Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1054A
3. A local or remote wake-up event will be signalled at the transceiver pins RXD and NERR if VBAT = 5.3 V to 27 V.
4. In case the goto-sleep command was used before. When VCC drops, pin EN will become LOW, but due to the
fail-safe functionality this does not effect the internal functions.
5. VBAT power-on flag will be reset when entering normal operating mode.
Wake-up requests are recognized by the transceiver
through two possible channels:
Pin INH will be set to a HIGH level again by the following
events only:
• VBAT power-on (cold start)
• The bus lines for remote wake-up
• Pin WAKE for local wake-up.
• Rising or falling edge on pin WAKE
• A message frame with a dominant phase of at least the
maximum specified tCANH or tCANL, while pin EN or
pin STB is at a LOW level
In order to wake-up the transceiver remotely through the
bus lines, a filter mechanism is integrated. This
mechanism makes sure that noise and any present bus
failure conditions do not result into an erroneous wake-up.
Because of this mechanism it is not sufficient to simply pull
the CANH or CANL bus lines to a dominant level for a
certain time. To guarantee a successful remote wake-up
under all conditions, a message frame with a dominant
phase of at least the maximum specified tCANH or tCANL in
it is required.
• Pin STB goes to a HIGH level with VCC active.
To provide fail-safe functionality, the signals on pins STB
and EN will internally be set to LOW when VCC is below a
certain threshold voltage (VCC(stb)).
Power-on
After power-on (VBAT switched on) the signal on pin INH
will become HIGH and an internal power-on flag will be set.
This flag can be read in the power-on standby mode
through pin ERR (STB = 1; EN = 0) and will be reset by
entering the normal operating mode.
A local wake-up through pin WAKE is detected by a rising
or falling edge with a consecutive level with the maximum
specified tWAKE
.
On a wake-up request the transceiver will set the output on
pin INH to HIGH which can be used to activate the external
supply voltage regulator.
Protections
A current limiting circuit protects the transmitter output
stages against short-circuit to positive and negative
battery voltage.
If VCC is provided the wake-up request can be read on the
ERR or RXD outputs, so the external microcontroller can
activate the transceiver (switch to normal operating mode)
via pins STB and EN.
If the junction temperature exceeds the typical value of
165 °C, the transmitter output stages are disabled.
Because the transmitter is responsible for the major part of
the power dissipation, this will result in a reduced power
dissipation and hence a lower chip temperature. All other
parts of the device will continue to operate.
To prevent a false remote wake-up due to transients or
RF fields, the wake-up voltage levels have to be
maintained for a certain period of time. In the low power
modes the failure detection circuit remains partly active to
prevent an increased power consumption in the event of
failures 3, 3a, 4 and 7.
The pins CANH and CANL are protected against electrical
transients which may occur in an automotive environment.
To prevent a false local wake-up during an open wire at
pin WAKE, this pin has a weak pull-up current source
towards VBAT. However, in order to prevent EMC issues, it
is recommended to connect a not used pin WAKE to pin
BAT. Pin INH is set to floating only if the goto-sleep
command is entered successfully. To enter a successful
goto-sleep command under all conditions, this command
must be kept stable for the maximum specified th(sleep)
.
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Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1054A
POWER-ON
STANDBY
10
GOTO
SLEEP
01
(4)
NORMAL
11
(5)
STANDBY
00
SLEEP
00
(1)
(2)
(3)
MBK949
Mode 10 stands for: Pin STB = HIGH and pin EN = LOW.
(1) Mode change via input pins STB and EN.
(2) Mode change via input pins STB and EN; it should be noted that in the sleep mode pin INH is inactive and possibly there is no
VCC. Mode control is only possible if VCC of the transceiver is active.
(3) Pin INH is activated after wake-up via bus or input pin WAKE.
(4) Transitions to normal mode clear the internal wake-up: interrupt and battery fail flag are cleared.
(5) Transitions to sleep mode: pin INH is deactivated.
Fig.3 Mode control.
2004 Mar 23
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Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1054A
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134); note 1.
SYMBOL
PARAMETER
supply voltage on pin VCC
battery voltage on pin BAT
CONDITIONS
MIN.
−0.3
MAX.
UNIT
VCC
VBAT
Vn
+6
V
−0.3
−0.3
+40
V
V
DC voltage on pins TXD, RXD,
ERR, STB and EN
VCC + 0.3
VCANH
VCANL
Vtrt(n)
CANH bus line voltage
CANL bus line voltage
−27
+40
V
V
V
−27
+40
transient voltage on pins CANH
and CANL
see Fig.6
note 2
−150
+100
VWAKE
IWAKE
VINH
VRTH
VRTL
RRTH
RRTL
Tvj
DC input voltage on pin WAKE
DC input current on pin WAKE
DC output voltage on pin INH
DC voltage on pin RTH
−
VBAT + 0.3
−
V
−15
−0.3
−0.3
−0.3
500
500
−40
−55
mA
V
VBAT + 0.3
VBAT + 1.2
VBAT + 1.2
16000
V
DC voltage on pin RTL
V
termination resistance on pin RTH
termination resistance on pin RTL
virtual junction temperature
storage temperature
Ω
16000
Ω
note 3
+150
°C
°C
Tstg
+150
Vesd
electrostatic discharge voltage
human body model; note 4
pins RTH, RTL, CANH and CANL −4
+4
+2
kV
kV
all other pins
machine model; note 5
any pin
−2
−300
+300
V
Notes
1. All voltages are defined with respect to pin GND. Positive current flows into the device.
2. Only relevant if VWAKE < VGND − 0.3 V; current will flow into pin GND.
3. Junction temperature in accordance with “IEC 60747-1”. An alternative definition is: Tvj = Tamb + P × Rth(vj-a) where
Rth(vj-a) is a fixed value to be used for the calculation of Tvj. The rating for Tvj limits the allowable combinations of
power dissipation (P) and operating ambient temperature (Tamb).
4. Equivalent to discharging a 100 pF capacitor through a 1.5 kΩ resistor.
5. Equivalent to discharging a 200 pF capacitor through a 10 Ω resistor and a 0.75 µH coil.
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
Rth(j-a)
Rth(j-s)
thermal resistance from junction to ambient
in free air
120
40
K/W
K/W
thermal resistance from junction to substrate bare die in free air
QUALITY SPECIFICATION
Quality specification in accordance with “AEC-Q100”.
2004 Mar 23
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Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1054A
DC CHARACTERISTICS
VCC = 4.75 to 5.25 V; VBAT = 5.0 to 27 V; VSTB = VCC; Tvj = −40 to +150 °C; all voltages are defined with respect to
ground; positive currents flow into the device; unless otherwise specified; notes 1 2 and 3
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supplies (pins VCC and BAT)
VCC
supply voltage on pin VCC
4.75
−
−
5.25
V
V
VCC(stb)
supply voltage for forced
standby mode (fail-safe)
2.75
4.5
11
27
ICC
supply current
normal operating mode;
4
7
mA
mA
VTXD = VCC (recessive)
normal operating mode;
VTXD = 0 V (dominant);
no load
10
17
low power modes;
VTXD = VCC
0
0
10
µA
VBAT
battery voltage on pin BAT
battery current on pin BAT
no time limit
operating mode
load dump
−0.3
5.0
−
−
−
−
+40
27
V
V
V
40
IBAT
all modes and in low power
modes at
VRTL = VWAKE = VINH = VBAT
VBAT = 12 V
10
5
30
30
20
0
50
µA
µA
µA
µA
VBAT = 5.0 to 27 V
VBAT = 3.5 V
125
30
5
VBAT = 1 V
0
10
VBAT(Pwon)
power-on flag voltage on
pin BAT
low power modes
power-on flag set
power-on flag not set
low power modes;
−
−
1
V
3.5
−
−
−
V
Itot
supply current plus battery
current
30
60
µA
VCC = 5 V;
VBAT = VWAKE = VINH = 12 V
Pins STB, EN and TXD
VIH
VIL
IIH
HIGH-level input voltage
0.7VCC
−
−
VCC + 0.3
0.3VCC
V
V
LOW-level input voltage
HIGH-level input current
pins STB and EN
pin TXD
−0.3
VI = 4 V
VI = 1 V
−
9
20
µA
µA
−200
−80
−25
IIL
LOW-level input current
pins STB and EN
pin TXD
4
8
−
µA
µA
−800
−320
−100
2004 Mar 23
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Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1054A
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Pins RXD and ERR
VOH
HIGH-level output voltage
on pin ERR
lO = −100 µA
V
V
0
0
CC − 0.9
−
−
−
−
VCC
V
V
V
V
on pin RXD
IO = −1 mA
IO = 1.6 mA
IO = 7.5 mA
CC − 0.9
VCC
0.4
1.5
VOL
LOW-level output voltage on
pins ERR and RXD
Pin WAKE
IIL
LOW-level input current
VWAKE = 0 V; VBAT = 27 V
VSTB = 0 V
−10
−4
−1
µA
Vth(wake)
wake-up threshold voltage
2.5
3.2
3.9
V
Pin INH
∆VH
HIGH-level voltage drop
leakage current
IINH = −0.18 mA
−
−
−
−
0.8
5
V
IL
sleep mode; VINH = 0 V
µA
Pins CANH and CANL
Vth(dif)
differential receiver threshold no failures and
voltage
bus failures 1, 2, 5 and 6a;
see Fig.4
V
CC = 5 V
−3.5
−3.2
−2.9
V
V
VCC = 4.75 to 5.25 V
VTXD = VCC
−0.70VCC −0.64VCC −0.58VCC
VO(reces)
VO(dom)
IO(CANH)
recessive output voltage
on pin CANH
RRTH < 4 kΩ
−
−
−
0.2
V
V
on pin CANL
RRTL < 4 kΩ
V
CC − 0.2
CC − 1.4
−
dominant output voltage
on pin CANH
VTXD = 0 V; VEN = VCC
ICANH = −40 mA
ICANL = 40 mA
V
−
−
V
on pin CANL
−
−
1.4
−45
V
output current on pin CANH
normal operating mode;
VCANH = 0 V; VTXD = 0 V
−110
−80
mA
low power modes;
VCANH = 0 V; VCC = 5 V
−
−0.25
70
−
µA
mA
µA
IO(CANL)
output current on pin CANL
normal operating mode;
VCANL = 14 V; VTXD = 0 V
45
−
100
−
low power modes;
0
VCANL = 12 V; VBAT = 12 V
Vd(CANH)(sc) detection voltage for
short-circuit to battery voltage
normal operating mode
low power modes
1.5
1.1
1.7
1.8
1.85
2.5
V
V
on pin CANH
Vd(CANL)(sc) detection voltage for
normal operating mode
VCC = 5 V
short-circuit to battery voltage
on pin CANL
6.6
7.2
7.8
V
V
VCC = 4.75 to 5.25 V
1.32VCC
1.44VCC
1.56VCC
Vth(wake)
wake-up threshold voltage
on pin CANL
low power modes
low power modes
2.5
1.1
3.2
1.8
3.9
2.5
V
V
on pin CANH
2004 Mar 23
12
Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1054A
SYMBOL
PARAMETER
CONDITIONS
low power modes
MIN.
0.8
TYP.
1.4
MAX.
UNIT
∆Vth(wake)
difference of wake-up
threshold voltages
−
V
Vth(CANH)(se) single-ended receiver
threshold voltage on
pin CANH
normal operating mode and
failures 4, 6 and 7
VCC = 5 V
1.5
1.7
1.85
V
V
VCC = 4.75 to 5.25 V
0.30VCC
0.34VCC
0.37VCC
Vth(CANL)(se) single-ended receiver
normal operating mode and
threshold voltage on pin CANL failures 3 and 3a
VCC = 5 V
3.15
3.3
3.45
V
VCC = 4.75 to 5.25 V
0.63VCC
110
0.66VCC
165
0.69VCC
270
V
Ri(CANH)(se) single-ended input resistance normal operating mode
on pin CANH
kΩ
Ri(CANL)(se) single-ended input resistance normal operating mode
on pin CANL
110
220
165
330
270
540
kΩ
kΩ
Ri(dif)
Pins RTH and RTL
Rsw(RTL) switch-on resistance between normal operating mode;
pin RTL and VCC IO < 10 mA
switch-on resistance between normal operating mode;
differential input resistance
normal operating mode
−
−
50
50
100
100
Ω
Ω
Rsw(RTH)
pin RTH and ground
IO < 10 mA
VO(RTH)
IO(RTL)
output voltage on pin RTH
output current on pin RTL
low power modes; IO = 1 mA
−
0.7
1.0
V
low power modes;
VRTL = 0 V
−1.25
−0.65
−0.3
mA
Ipu(RTL)
Ipd(RTH)
pull-up current on pin RTL
normal operating mode and
failures 4, 6 and 7
−
−
75
75
−
−
µA
µA
pull-down current on pin RTH normal operating mode and
failures 3 and 3a
Thermal shutdown
Tj(sd)
junction temperature for
shutdown
155
165
180
°C
Notes
1. All parameters are guaranteed over the virtual junction temperature range by design, but only 100% tested at
Tamb = 125 °C for dies on wafer level, and above this for cased products 100% tested at Tamb = 25 °C, unless
otherwise specified.
2. For bare die, all parameters are only guaranteed if the back side of the die is connected to ground.
3. A local or remote wake-up event will be signalled at the transceiver pins RXD and NERR if VBAT = 5.3 V to 27 V
(see Table 2).
2004 Mar 23
13
Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1054A
TIMING CHARACTERISTICS
VCC = 4.75 to 5.25 V; VBAT = 5.0 to 27 V; VSTB = VCC; Tvj = −40 to +150 °C; all voltages are defined with respect to
ground; unless otherwise specified; notes 1 2 and 3
SYMBOL
tt(r-d)
PARAMETER
CONDITIONS
MIN.
TYP. MAX. UNIT
CANL and CANH output transition between 10% and 90%;
0.35
0.60
−
µs
time for recessive to dominant
R1 = 100 Ω; C1 = 10 nF;
C2 = not present; see Fig.5
tt(d-r)
CANL and CANH output transition between 10% and 90%;
0.2
0.3
−
µs
time for dominant to recessive
R1 = 100 Ω; C1 = 1 nF;
C2 = not present; see Fig.5
tPD(L)
propagation delay TXD (LOW) to no failures and
RXD (LOW) failures 1, 2, 5 and 6a;
R1 = 100 Ω; see Figs 4 and 5
C1 = 1 nF; C2 = not present
C1 = C2 = 3.3 nF
−
−
0.75
1
1.5
µs
µs
1.75
failures 3, 3a, 4, 6 and 7;
R1 = 100 Ω; see Figs 4 and 5
C1 = 1 nF; C2 = not present
C1 = C2 = 3.3 nF
−
−
0.85
1.1
1.4
1.7
µs
µs
tPD(H)
propagation delay TXD (HIGH) to no failures and
RXD (HIGH)
failures 1, 2, 5 and 6a;
R1 = 100 Ω; see Figs 4 and 5
C1 = 1 nF; C2 = not present
C1 = C2 = 3.3 nF
−
−
1.2
2.5
1.9
3.3
µs
µs
failures 3, 3a, 4, 6 and 7;
R1 = 100 Ω; see Figs 4 and 5
C1 = 1 nF; C2 = not present
C1 = C2 = 3.3 nF
note 4
−
−
5
1.1
1.5
−
1.7
2.2
50
µs
µs
µs
treact(sleep)
tdis(TxD)
tCANH
reaction time of goto-sleep
command
disable time of TxD permanent
dominant timer
normal operating mode;
0.75
−
−
−
−
4
ms
µs
µs
µs
VTXD = 0 V
dominant time for remote wake-up low power modes; VBAT = 12 V;
on pin CANH note 4
dominant time for remote wake-up low power modes; VBAT = 12 V;
7
7
7
38
38
38
tCANL
on pin CANL
note 4
tWAKE
required time on pin WAKE for
local wake-up
low power modes; VBAT = 12 V;
for wake-up after receiving a
falling or rising edge; note 4
tdet
failure detection time
normal operating mode
failures 3 and 3a
1.6
0.3
−
−
8.0
1.6
ms
ms
failures 4, 6 and 7
low power modes; VBAT = 12 V
failures 3 and 3a
1.6
0.1
−
−
8.0
1.6
ms
ms
failures 4 and 7
2004 Mar 23
14
Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1054A
SYMBOL
trec
PARAMETER
failure recovery time
CONDITIONS
normal operating mode
failures 3 and 3a
MIN.
TYP. MAX. UNIT
0.3
−
−
−
1.6
38
ms
µs
µs
failures 4 and 7
7
failure 6
125
750
low power modes; VBAT = 12 V
failures 3, 3a, 4 and 7
0.3
−
1.6
ms
Ndet
pulse-count difference between
CANH and CANL for failure
detection
normal operating mode and
failures 1, 2, 5 and 6a;
pin ERR becomes LOW
−
4
−
Nrec
number of consecutive pulses on failures 1, 2, 5 and 6a
CANH and CANL simultaneously
for failure recovery
−
4
−
Notes
1. All parameters are guaranteed over the virtual junction temperature range by design, but only 100% tested at
Tamb = 125 °C for dies on wafer level, and above this for cased products 100% tested at Tamb = 25 °C, unless
otherwise specified.
2. For bare die, all parameters are only guaranteed if the back side of the die is connected to ground.
3. A local or remote wake-up event will be signalled at the transceiver pins RXD and NERR if VBAT = 5.3 V to 27 V
(see Table 2).
4. To guarantee a successful mode transition under all conditions, the maximum specified time must be applied.
V
V
CC
TXD
0 V
V
V
5 V
CANL
3.6 V
1.4 V
0 V
CANH
2.2 V
−3.2 V
−5 V
V
diff
V
RXD
0.7V
CC
0.3V
CC
t
t
PD(H)
PD(L)
MGL424
Vdiff = VCANH − VCANL
.
Fig.4 Timing diagram for dynamic characteristics.
15
2004 Mar 23
Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1054A
TEST AND APPLICATION INFORMATION
+
5 V
V
INH
BAT
CC
1
14
10
R1
C1
C2
WAKE
TXD
STB
EN
RTH
7
2
5
6
3
8
CANL
12
TJA1054A
CANH
RTL
11
9
RXD
R1
C1
13
GND
4
20 pF
ERR
MGU381
Termination resistors R1 (100 Ω) are not connected to pin RTH or pin RTL for testing purposes because the minimum load allowed on
the CAN bus lines is 500 Ω per transceiver.
The capacitive bus load of 10 nF is split into 3 equal capacitors (3.3 nF) to simulate the bus cable.
Fig.5 Test circuit for dynamic characteristics.
+
12 V
+
5 V
10 µF
V
INH
BAT
CC
1
14
10
1 nF
1 nF
125 Ω
511 Ω
WAKE
TXD
STB
EN
RTH
7
2
5
6
3
8
CANL
12
GENERATOR
TJA1054A
CANH
RTL
11
9
1 nF
1 nF
511 Ω
125 Ω
RXD
13
GND
4
20 pF
ERR
MGU382
The waveforms of the applied transients on pins CANH and CANL will be in accordance with “ISO 7637 part 1”: test pulses 1, 2, 3a and 3b.
Fig.6 Test circuit for automotive transients.
2004 Mar 23
16
Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1054A
V
BAT
BATTERY
+
5 V
V
DD
P8xC592/P8xCE598
CAN CONTROLLER
+5 V
CTX0
TXD
CRXO
Px.x
STB
Px.x
ERR
Px.x
EN
RXD
INH
2
3
5
4
6
1
BAT
WAKE
7
14
V
CC
TJA1054A
CAN TRANSCEIVER
10
13
100 nF
GND
8
11
12
CANL
9
RTH
CANH
RTL
CAN BUS LINE
MGU380
For more information: please refer to the separate FTCAN information available from our web site.
Fig.7 Application diagram.
2004 Mar 23
17
Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1054A
BONDING PAD LOCATIONS
COORDINATES(1)
SYMBOL
PAD
x
y
INH
1
2
106
111
317
168
TXD
RXD
ERR
STB
EN
3
750
111
4
1347
2248
2551
2559
2463
2389
1886
900
111
5
103
6
240
WAKE
RTH
RTL
7
381
8
1443
1840
1809
1698
1698
1356
1241
772
9
VCC
10
11
12
13a
13b
14
CANH
CANL
GND
GND
BAT
401
80
80
105
Note
1. All coordinates (µm) represent the position of the centre of each pad with respect to the bottom left-hand corner of
the top aluminium layer (see Fig.8).
9
10
12
11
8
13a
13b
1990
µm
TJA1054AU
14
7
1
2
6
3
4
5
x
0
0
y
2730 µm
MGU384
Fig.8 Bonding pad locations.
18
2004 Mar 23
Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1054A
APPENDIX A
Overview of differences between the TJA1054 and the TJA1054A
Limiting values
TJA1054
TJA1054A
UNIT
SYMBOL
PARAMETER
CONDITIONS
MIN. MAX. MIN. MAX.
VCANH
VCANL
Vesd
CANH bus line voltage
CANL bus line voltage
−40
−40
+40
+40
−27
−27
+40
+40
V
V
electrostatic discharge human body model
voltage
pins RTH, RTL, CANH, and CANL −2
+2
+2
−4
−2
+4
+2
kV
kV
all other pins
machine model
any pin
−2
−175
+175 −300
+300
V
Bare die
PARAMETER
TJA1054
TJA1054A
1990 × 2730
note 1
UNIT
µm
Dimensions
1990 × 2700
Bonding pad coordinates
note 1
Note
1. The bonding pad coordinates partly differ between the TJA1054 and the TJA1054A.
2004 Mar 23
19
Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1054A
PACKAGE OUTLINE
SO14: plastic small outline package; 14 leads; body width 3.9 mm
SOT108-1
D
E
A
X
c
y
H
v
M
A
E
Z
8
14
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
7
e
detail X
w
M
b
p
0
2.5
scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.
0.25
0.10
1.45
1.25
0.49
0.36
0.25
0.19
8.75
8.55
4.0
3.8
6.2
5.8
1.0
0.4
0.7
0.6
0.7
0.3
mm
1.75
1.27
0.05
1.05
0.25
0.01
0.25
0.1
0.25
0.01
8o
0o
0.010 0.057
0.004 0.049
0.019 0.0100 0.35
0.014 0.0075 0.34
0.16
0.15
0.244
0.228
0.039 0.028
0.016 0.024
0.028
0.012
inches
0.041
0.01 0.004
0.069
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-19
SOT108-1
076E06
MS-012
2004 Mar 23
20
Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1054A
SOLDERING
If wave soldering is used the following conditions must be
observed for optimal results:
Introduction to soldering surface mount packages
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering can still be used for
certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is
recommended.
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
Reflow soldering
The footprint must incorporate solder thieves at the
downstream end.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Driven by legislation and environmental forces the
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
worldwide use of lead-free solder pastes is increasing.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.
Typical dwell time of the leads in the wave ranges from
3 to 4 seconds at 250 °C or 265 °C, depending on solder
material applied, SnPb or Pb-free respectively.
Typical reflow peak temperatures range from
215 to 270 °C depending on solder paste material. The
top-surface temperature of the packages should
preferably be kept:
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
• below 225 °C (SnPb process) or below 245 °C (Pb-free
process)
Manual soldering
– for all BGA, HTSSON-T and SSOP-T packages
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
– for packages with a thickness ≥ 2.5 mm
– for packages with a thickness < 2.5 mm and a
volume ≥ 350 mm3 so called thick/large packages.
• below 240 °C (SnPb process) or below 260 °C (Pb-free
process) for packages with a thickness < 2.5 mm and a
volume < 350 mm3 so called small/thin packages.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
Moisture sensitivity precautions, as indicated on packing,
must be respected at all times.
Wave soldering
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering
method was specifically developed.
2004 Mar 23
21
Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1054A
Suitability of surface mount IC packages for wave and reflow soldering methods
SOLDERING METHOD
PACKAGE(1)
WAVE
not suitable
REFLOW(2)
BGA, HTSSON..T(3), LBGA, LFBGA, SQFP, SSOP..T(3), TFBGA,
USON, VFBGA
suitable
DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON,
HTQFP, HTSSOP, HVQFN, HVSON, SMS
PLCC(5), SO, SOJ
not suitable(4)
suitable
suitable
suitable
LQFP, QFP, TQFP
not recommended(5)(6) suitable
SSOP, TSSOP, VSO, VSSOP
CWQCCN..L(8), PMFP(9), WQCCN..L(8)
not recommended(7)
suitable
not suitable
not suitable
Notes
1. For more detailed information on the BGA packages refer to the “(LF)BGA Application Note” (AN01026); order a copy
from your Philips Semiconductors sales office.
2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
3. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account
be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature
exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package body peak temperature
must be kept as low as possible.
4. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
5. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
6. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
7. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
8. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted
on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar
soldering process. The appropriate soldering profile can be provided on request.
9. Hot bar or manual soldering is suitable for PMFP packages.
2004 Mar 23
22
Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1054A
REVISION HISTORY
REV
DATE
CPCN
DESCRIPTION
3
20040323
200310013C
Product specification (9397 750 11722)
Modification:
• Add VBAT = 5.3 V to 27 V condition for correct signalling of local or remote
wake-up event at transceiver pins RXD and ERR.
• Mode control diagram, Fig.3, completed.
• Recommendation added, to connect a not used pin WAKE to pin BAT.
• Reference of bond pad coordinates changed from the bottom left-hand
corner of the die, to the bottom left-hand corner of the top aluminium
layer.
• Change of bare die dimension.
• Add Chapter REVISION HISTORY.
Product specification (9397 750 08321)
2
20011120
−
DATA SHEET STATUS
DATA SHEET
LEVEL
PRODUCT
STATUS(2)(3)
DEFINITION
STATUS(1)
I
Objective data Development
This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
II
Preliminary
data
Qualification
Production
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
III
Product data
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
2004 Mar 23
23
Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1054A
DEFINITIONS
DISCLAIMERS
Short-form specification
The data in a short-form
Life support applications
These products are not
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Right to make changes
Philips Semiconductors
reserves the right to make changes in the products -
including circuits, standard cells, and/or software -
described or contained herein in order to improve design
and/or performance. When the product is in full production
(status ‘Production’), relevant changes will be
Application information
Applications that are
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these
products, conveys no licence or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
Bare die
All die are tested and are guaranteed to
comply with all data sheet limits up to the point of wafer
sawing for a period of ninety (90) days from the date of
Philips' delivery. If there are data sheet limits not
guaranteed, these will be separately indicated in the data
sheet. There are no post packing tests performed on
individual die or wafer. Philips Semiconductors has no
control of third party procedures in the sawing, handling,
packing or assembly of the die. Accordingly, Philips
Semiconductors assumes no liability for device
functionality or performance of the die or systems after
third party sawing, handling, packing or assembly of the
die. It is the responsibility of the customer to test and
qualify their application in which the die is used.
2004 Mar 23
24
Philips Semiconductors – a worldwide company
Contact information
For additional information please visit http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
© Koninklijke Philips Electronics N.V. 2004
SCA76
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
R16/03/pp25
Date of release: 2004 Mar 23
Document order number: 9397 750 11722
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