UM10512 [NXP]
GreenChip controller for LED lighting; 的GreenChip控制器，用于LED照明
| 型号： | UM10512 |
| 厂家： | 
NXP |
| 描述： | GreenChip controller for LED lighting |
| 文件： | 总20页 (文件大小：583K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SSL2109 series
GreenChip controller for LED lighting
Rev. 3 — 4 June 2012
Product data sheet
1. General description
The SSL2109 series is a range of high-voltage Integrated Circuits (IC) for driving LED
lamps in general lighting applications.
The main benefits of this IC include:
• Small Printed-Circuit Board (PCB) footprint, and compact solution
• High efficiency (up to 95 %)
• Ease of integration and many protection features
• Low electronic Bill Of Material (BOM)
The IC is supplementary to the SSL2108 series but without an internal switch. The IC
range has been designed to start up directly from the HV supply by an internal
high-voltage current source. Thereafter, the dV/dt supply is used with capacitive coupling
from the drain, or any other auxiliary supply. This functionality provides full flexibility in the
application design. An internal clamp limits the supply voltage.
The IC provides accurate output current control to within 5 % LED current accuracy. The
IC can be operated using Pulse-Width Modulation (PWM) dimming and has many
protection features including easy LED temperature feedback.
2. Features and benefits
LED controller IC for driving strings of LEDs or high-voltage LED modules from a
rectified mains supply
Part of a high-efficiency switch mode buck driver product family
Controller that has power-efficient boundary conduction mode of operation with:
No reverse recovery losses in freewheel diode
Zero Current Switching (ZCS) for switch turn-on
Zero voltage or valley switching for switch turn-off
Minimal required inductance value and size
Direct PWM dimming possible
Fast transient response through cycle-by-cycle current control:
Negligible AC mains ripple in LED current and minimal total capacitor value
No over or undershoots in the LED current
No binning on the LED forward voltage required
Internal Protections:
UnderVoltage LockOut (UVLO)
SSL2109 series
NXP Semiconductors
GreenChip controller for LED lighting
Leading-Edge Blanking (LEB)
OverCurrent Protection (OCP)
Short-Winding Protection (SWP); SSL2109T only
Internal OverTemperature Protection (OTP)
Brownout protection
Output Short Protection (OSP)
Low component count (see Figure 4) LED driver solution:
No dim switch and high-side driver required for PWM dimming
Easy external temperature protection with a single NTC
Option for soft-start function
Compatible with wall switches with built-in indication light during standby
IC lifetime easily matches or surpasses LED lamp lifetime
3. Applications
The SSL2109 series is intended for compact LED lamps with accurate fixed current output
for single mains input voltages. Mains input voltages include 100 V, 120 V and 230 V
(AC). The output signal can be modulated using a PWM signal. The power range is
determined by external components.
4. Quick reference data
Table 1.
Quick reference data
Symbol
VCC
Parameter
Conditions
Min
Typ
Max
14
Unit
V
supply voltage
operating range
normal operation
8
-
ICC(INT)
VHV
internal supply current
voltage on pin HV
voltage on pin DRAIN
-
1.3
-
mA
V
-
-
-
600
600
VDRAIN
−0.4
V
fconv
conversion frequency
-
-
200
12
kHz
V
Vo(DRIVER)max maximum output voltage VCC > VCC(startup)
on pin DRIVER
9
10.5
5. Ordering information
Table 2.
Ordering information
Type number Package
Name
Description
Version
SSL2109AT
SSL2109T
SO8
plastic small package outline body; 8 leads; body width SOT96-1
3.9 mm
SSL2109_SER
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 3 — 4 June 2012
2 of 20
SSL2109 series
NXP Semiconductors
GreenChip controller for LED lighting
6. Block diagram
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Fig 1. SSL2109AT block diagram
SSL2109_SER
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 3 — 4 June 2012
3 of 20
SSL2109 series
NXP Semiconductors
GreenChip controller for LED lighting
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Fig 2. SSL2109T block diagram
SSL2109_SER
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 3 — 4 June 2012
4 of 20
SSL2109 series
NXP Semiconductors
GreenChip controller for LED lighting
7. Pinning information
7.1 Pinning
1
2
3
4
8
7
6
5
HV
VCC
DRAIN
GND
SSL2109
NTC
DVDT
DRIVER
SOURCE
aaa-001742
Fig 3. Pin configuration
7.2 Pin description
Table 3.
Symbol
HV
Pin description
Pin
1
Description
high-voltage supply pin
supply voltage
VCC
2
NTC
3
temperature protection input
low-side external switch
driver output
SOURCE
DRIVER
DVDT
GND
4
5
6
AC supply pin
7
ground
DRAIN
8
high-side external switch
SSL2109_SER
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 3 — 4 June 2012
5 of 20
SSL2109 series
NXP Semiconductors
GreenChip controller for LED lighting
8. Functional description
8.1 Introduction
The SSL2109 series is a range of products for small form factor retrofit SSL lamps and
separate LED drivers.
8.2 Converter operation
The converter in the SSL2109 series is a Boundary Conduction Mode (BCM), peak
current controlled system. For the basic application diagram see Figure 4, for the
waveforms see Figure 5. This converter type operates at the boundary between
continuous and discontinuous mode. Energy is stored in inductor L each period that the
switch is on. The inductor current IL is zero when the MOSFET is switched on. Thereafter,
the amplitude of the current build-up in L is proportional to VIN −VOUT and the time that the
MOSFET switch is on. When the MOSFET switch is switched off, the current continues to
flow through the freewheel diode and the output capacitor. The current then falls at a rate
proportional to the value of VOUT. The LED current ILED is almost equal to half the peak
switch current. A new cycle is started, as soon as the inductor current IL is zero.
R
inrush
V
sec
LEDs
HV
VCC
NTC
GND
DVDT
6
8
5
4
1
2
3
7
DRAIN
SSL2109
DRIVER
SOURCE
NTC
R
sense
aaa-001743
Fig 4. Basic application diagram SSL2109 series
8.3 Conversion frequency
The conversion frequency must be limited to below 200 kHz. Therefore, select an
inductance value so that the conversion frequency is always within limits, given the supply
voltage, LED voltage and component spread.
8.4 Driver pin
The SSL2109 series is equipped with an external driver that can control an external
switch. The voltage on the driver output pin is increased towards Vo(DRIVER)max to open the
switch during the first cycle (t0 to t1). The voltage on the driver output pin is pulled down
towards Vo(DRIVER)min from the start of the secondary stroke until the next cycle starts (t0 to
t00). During transition from low to high and back, there is a controlled switching slope
steepness. This controlled condition limits the high frequency radiation from the circuit to
the surrounding area.
SSL2109_SER
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 3 — 4 June 2012
6 of 20
SSL2109 series
NXP Semiconductors
GreenChip controller for LED lighting
8.5 Valley detection
A new cycle is started when the primary switch is switched on (see Figure 5). In the
following sections, “on” represents the conductive state and off the non-conductive state.
Following time t1, when the peak current is detected on the SOURCE pin, the switch is
turned off and the secondary stroke starts at t2. When the secondary stroke is completed
with the coil current at t3 equaling zero, the drain voltage starts to oscillate at
approximately VIN − VOUT level. The peak to peak amplitude equals 2 × VOUT. A special
feature, called valley detection is an integrated part of the SSL2109 series circuitry.
Dedicated built-in circuitry connected to the DRAIN pin, senses when the voltage on the
drain of the switch has reached its lowest value. The next cycle is then started at t00 and
as a result the capacitive switching losses are reduced. A valley is detected and accepted
if both the frequency of the oscillations and the voltage swing are within the range
specified (fring and ∆Vvrec(min)) for detection. ∆Vvrec(min) is the voltage differential between
the HV (pin) in and the DRAIN pin. If a valid valley is not detected, the secondary stroke is
continued until the maximum off-time (toff(high)) is reached, then the next cycle is started.
V
GATE
V
OUT
V
DRAIN
V
IN
valley
0
magnetization
demagnetization
I
L
0
2
1
3
4
t
00
t
0
t
t
2
t
3
1
T
aaa-001744
Fig 5. Buck waveforms and valley detection
SSL2109_SER
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 3 — 4 June 2012
7 of 20
SSL2109 series
NXP Semiconductors
GreenChip controller for LED lighting
8.6 Protective features
The IC has the following protections:
• UnderVoltage LockOut (UVLO)
• Leading-Edge Blanking (LEB)
• OverCurrent Protection (OCP)
• Internal OverTemperature Protection (OTP)
• Brownout protection
• Short-Winding Protection (SWP) on SSL2109T only
• Output Short Protection (OSP)
• LED overtemperature control and protection
The SWP and the OSP are latched protections. These protections cause the IC to halt
until a reset (a result of power cycling) is executed. When VCC drops lower than VCC(rst)
the IC resets the latch protection mode. The internal OTP and LED over temperature
protections are safe-restart protections. The IC halts, causing VCC to fall lower than
,
V
CC(stop), and instigates start-up. Switching starts only when no fault condition exists.
8.6.1 UnderVoltage LockOut (UVLO)
When the voltage on the VCC pin drops lower than VCC(stop), the IC stops switching. An
attempt is then made to restart by supplying VCC from the HV pin voltage.
8.6.2 Leading-Edge Blanking (LEB)
To prevent false detection of the short-winding or overcurrent, a blanking time following
switch-on is implemented. When the MOSFET switch turns on there can be a short
current spike due to capacitive discharge of voltage over the drain and source. During the
LEB time (tleb), the spike is disregarded.
8.6.3 OverCurrent Protection (OCP)
The SSL2109 series contains a highly accurate peak current detector. It triggers when the
voltage at the SOURCE pin reaches the peak-level Vth(ocp)SOURCE. The current through
the switch is sensed using a resistor connected to the SOURCE pin. The sense circuit is
activated following LEB time tleb. As the LED current is half the peak current (by design), it
automatically provides protection for maximum LED current during operation. There is a
propagation delay between overcurrent detection and the actual closure of the switch
td(ocp-swoff). Due to the delay, the actual peak current is slightly higher than the OCP level
set by the resistor in series to the SOURCE pin.
8.6.4 OverTemperature Protection (OTP)
When the internal OTP function is triggered at a certain IC temperature (Tth(act)otp), the
converter stops operating. The OTP safe-restart protection and the IC restarts again with
switching resuming when the IC temperature drops lower than Tth(rel)otp
.
8.6.5 Brownout protection
Brownout protection is designed to limit the lamp power when the input voltage drops
close to the output voltage level. Since the input power has to remain constant, the input
current would otherwise increase to a level that is too large for the input circuitry. For the
SSL2109 series, there is a maximum limit on the on-time of switch ton(high)
.
SSL2109_SER
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 3 — 4 June 2012
8 of 20
SSL2109 series
NXP Semiconductors
GreenChip controller for LED lighting
The rate of current rise in the coil during the on-phase is proportional to the difference
between input voltage and output voltage. Therefore, the peak current cannot be reached
before ton(high) and as a result the average output current to the LEDs is reduced.
8.6.6 Short-Winding Protection (SWP); SSL2109T only
SWP activates if there is a steep rising current through the MOSFET and thus the external
resistor connected to the SOURCE pin. This current can occur when there is a short from
the freewheel diode. Additionally, it occurs due to a small/shorted inductor between the
input voltage and the DRAIN pin. If the voltage on the SOURCE pin is greater than 1.5 V,
latched protection is triggered following LEB time tleb. In addition, if VCC drops lower than
V
CC(rst) the IC resets the latched protection mode.
8.6.7 Output Short Protection (OSP)
During the second stroke (switch-off time), if a valley is not detected within the off-time
limit (toff(high)), then typically the output voltage is less than the minimum limit allowed in
the application. This condition can occur either during starting up or due to a short. A timer
is started when toff(high) is detected, and is stopped only if a valid valley-detection occurs in
one of the subsequent cycles. If no valley is detected for tdet(sc), it is concluded that a real
short-circuit exists and not start-up. The IC enters latched protection. If VCC drops lower
than VCC(rst), the IC resets the latched protection mode. During PWM dimming, the OSP
timer is paused during the off-cycle.
8.7 VCC supply
The SSL2109 series can be supplied using three methods:
• Under normal operation, the voltage swing on the DVDT pin is rectified within the IC
providing current towards the VCC pin
• At start-up, there is an internal current source connected to the HV pin. The current
source provides internal power until either the dV/dt supply or an external current on
the VCC pin provides the supply
• An external voltage source can be connected to the VCC pin
The IC starts up when the voltage at the VCC pin is higher than VCC(startup). The IC locks
out (stops switching) when the voltage at the VCC pin is lower than VCC(stop). The
hysteresis between the start and stop levels allows the IC to be supplied by a buffer
capacitor until the dV/dt supply is settled. The SSL2109 series has an internal VCC clamp,
which is an internal active Zener (or shunt regulator). This internal active Zener limits the
voltage on the supply VCC pin to the maximum value of VCC. If the maximum current of
the dV/dt supply minus the current consumption of the IC (determined by the load on the
gate drivers), is lower than the maximum value of IDD no external Zener diode is needed in
the dV/dt supply circuit.
8.8 DVDT supply
The DVDT pin is connected to an internal single-sided rectification stage. When an
alternating voltage with sufficient amplitude is supplied to the pin, the IC can be powered
without any other external power connection. This solution provides an effective method
to prevent the additional high-power losses, which would result if a regulator were used for
continuously powering the IC. Unlike an auxiliary supply, additional inductor windings are
not needed.
SSL2109_SER
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 3 — 4 June 2012
9 of 20
SSL2109 series
NXP Semiconductors
GreenChip controller for LED lighting
8.9 VCC regulator
During supply dips, the input voltage can drop too low to supply the required IC current
through the DVDT pin. Under these conditions, if the VCC voltage drops lower than
V
CC(swon)reg level, another regulator with a current capability of up to IHVhigh(oper) is started.
The job of the regulator is to fill in the required supply current, which the DVDT supply
does not deliver preventing the IC going into UVLO. When the VCC voltage is higher than
V
CC(swon)reg level, the regulator is turned off.
8.10 NTC functionality and PWM dimming
The NTC pin can be used as a control method for LED thermal protection. Alternatively,
the pin can be used as an input to disable/enable light output using a digital signal (PWM
dimming). The pin has an internal current source that generates the current of Ioffset(NTC)
An NTC resistor to monitor the LED temperature can be directly connected to the NTC
pin. Depending on the resistance value and the corresponding voltage on the NTC pin,
the converter reacts as shown in Figure 6.
.
Peak current
I
V
= 500 mV
= 250 mV
pk
th(ocp)SOURCE
th(ocp)SOURCE
V
I
pk
/ 2
1
2
3
4
5
V
NTC
001aan700
Fig 6. NTC control curve
When the voltage on the NTC pin is higher than Vth(high)NTC see Figure 6 (4), the converter
delivers nominal output current. When the voltage is lower than this level, the peak current
is gradually reduced until Vth(low)NTC is reached, see Figure 6 (3). The peak current is now
half the peak current of nominal operation. When Vact(tmr)NTC is passed, see Figure 6 (2) a
timer starts to run to distinguish between the following situations:
• If the low-level Vdeact(tmr)NTC is not reached within time tto(deact)NTC, Figure 6 (1) LED
overtemperature is detected. The IC stops switching and attempts to restart from the
HV pin voltage. Restart takes place when the voltage on NTC pin is higher than
V
th(high)NTC, see Figure 6 (4). It is assumed that the reduction in peak current did not
result in a lower NTC temperature and LED OTP is activated.
• If the low-level Vdeact(tmr)NTC is reached within the time tto(deact)NTC, Figure 6 (1) it is
assumed that the pin is pulled down externally. The restart function is not triggered.
Instead, the output current is reduced to zero. PWM dimming can be implemented this
way. The output current rises again when the voltage is higher than Vdeact(tmr)NTC
.
SSL2109_SER
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 3 — 4 June 2012
10 of 20
SSL2109 series
NXP Semiconductors
GreenChip controller for LED lighting
8.10.1 Soft-start function
The NTC pin can be used to make a soft start function. During switch-on, the level on the
NTC pin is low. By connecting a capacitor (in parallel with the NTC resistor), a time
constant can be defined. The time constant causes the level on the NTC pin to increase
slowly. When passing level Vth(low)NTC Figure 6 (3), the convertor starts with half of the
maximum current. The output current slowly increases to maximum when Vth(high)NTC
Figure 6 (4) is reached.
9. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
General
SR
Parameter
Conditions
Min
Max
Unit
slew rate
on pin DRAIN
SO8 package
−5
-
+5
V/ns
kHz
W
fconv
conversion frequency
total power dissipation
ambient temperature
junction temperature
storage temperature
200
0.6
Ptot
-
Tamb
−40
−40
−55
+125
+150
+150
°C
Tj
°C
Tstg
°C
Voltages
VCC
supply voltage
continuous [1]
600 V version
current limited
current limited
current limited
−0.4
−0.4
−0.4
−0.4
−0.4
+14
V
V
V
V
V
VDRAIN
VHV
voltage on pin DRAIN
voltage on pin HV
voltage on pin SENSE
voltage on pin NTC
+600
+600
+5.2
+5.2
VSENSE
VNTC
Currents
IDD
supply current
at pin VCC
-
-
20
mA
A
IDVDT
current on pin DVDT
duration 20 μs
maximum
1.3
[2]
VESD
electrostatic discharge
voltage
human body
model; (for all pins
except DRAIN and
HV)
−2
+2
kV
human body
model for DRAIN
and HV
−1
+1
kV
V
[3]
charged device
−500
+500
[1] An internal clamp sets the supply voltage and current limits.
[2] Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor.
[3] Charged device model: equivalent to charging the IC up to 1 kV and the subsequent discharging of each
pin down to 0 V over a 1 Ω resistor.
SSL2109_SER
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 3 — 4 June 2012
11 of 20
SSL2109 series
NXP Semiconductors
GreenChip controller for LED lighting
10. Thermal characteristics
Table 5.
Symbol
Rth(j-a)
Thermal characteristics
Parameter
Conditions
Typ
Unit
thermal resistance from junction in free air; PCB: 2 cm × 3 cm; 2-layer;
to ambient
159
K/W
35 μm Cu per layer
in free air; PCB: JEDEC 2s2p
89
K/W
K/W
Ψj-top
thermal resistance from junction top package temperature measured at
0.49
to top
the warmest point on top of the case
11. Characteristics
Table 6.
Symbol
Characteristics
Parameter
Conditions
Min
Typ
Max Unit
High-voltage
Ileak(DRAIN)
Ileak(HV)
leakage current on pin DRAIN
leakage current on pin HV
VDRAIN = 600 V
VHV = 600 V
-
-
-
-
10
30
μA
μA
Supply
[1]
VCC
supply voltage
operating range
8
-
14
13
10
4.5
5.5
9.75
10.5
-
V
V
V
V
V
V
V
V
V
VCC(startup)
VCC(stop)
VCC(hys)
start-up supply voltage
stop supply voltage
hysteresis of supply voltage
reset supply voltage
11
8
12
9
between VCC(startup) and VCC(stop)
2
-
VCC(rst)
4.5
8.75
9.5
0.3
0.3
5
VCC(swon)reg
VCC(swoff)reg
VCC(reg)hys
regulator switch-on supply voltage insufficient dV/dt supply
regulator switch-off supply voltage insufficient dV/dt supply
regulator supply voltage hysteresis VCC(swoff)reg − VCC(swon)reg
9.25
10
-
VCC(regswon-stop) supply voltage difference between VCC(swon)reg − VCC(stop)
-
-
regulator switch-on and stop
Consumption
Istb(HV)
standby current on pin HV
internal supply current
during start-up or in protection;
VHV = 100 V
300
-
350
1.3
400
-
μA
ICC(INT)
normal operation
mA
Capability
Isup(high)HV
high supply current on pin HV
Standby: VHV = 40 V;
VCC < VCC(stop)
1
2
1.3
2.3
1.6
2.6
mA
mA
Regulator On: VHV = 40 V;
VCC < VCC(swon)reg after start-up
Current and SWP
Vth(ocp)SOURCE overcurrent protection threshold
voltage on pin SOURCE
ΔV/Δt = 0.1 V/μs
480
230
-
500
250
75
520
270
100
mV
mV
ns
ΔV/Δt = 0.1 V/μs; VNTC = 0.325 V
ΔV/Δt = 0.1 V/μs
td(ocp-swoff)
tleb
delay time from overcurrent
protection to switch-off
leading edge blanking time
overcurrent protection
short-winding protection
260
210
300
250
340
290
ns
ns
SSL2109_SER
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Product data sheet
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SSL2109 series
NXP Semiconductors
GreenChip controller for LED lighting
Table 6.
Symbol
Δtleb
Characteristics …continued
Parameter
Conditions
Min
Typ
Max Unit
leading edge blanking time
difference
between tleb for overcurrent
protection and short-winding
protection
30
50
-
ns
Vth(swp)SOURCE short-winding protection threshold SSL2109T only
voltage on pin SOURCE
1.4
1.5
1.6
V
Valley detection
(ΔV/Δt)vrec
valley recognition voltage change on pin DRAIN
with time
−30
−20
−10
V/μs
[2]
fring
ringing frequency
200
15
550
20
1000 kHz
ΔVvrec(min)
minimum valley recognition
voltage difference
voltage drop on pin DRAIN
25
V
td(vrec-swon)
valley recognition to switch-on
delay time
-
100
15
-
ns
Brownout detection
ton(high)
high on-time
12.5
17.5 μs
Driver (pin DRIVER)
Isource(DRIVER)
Isink(DRIVER)
source current on pin DRIVER
1.5 ms maximum; VDRIVER = 2 V
20 μs maximum; VDRIVER = 2 V
20 μs maximum; VDRIVER = 10 V
VCC > VCC(startup)
-
−0.195
0.28
-
A
A
A
V
sink current on pin DRIVER
-
-
-
0.46
-
Vo(DRIVER)max
Vo(DRIVER)min
maximum output voltage on pin
DRIVER
9
10.5
12
minimum output voltage on pin
DRIVER
VCC = VCC(stop)
6.5
7.5
8.5
V
NTC functionality
Vth(high)NTC high threshold voltage on pin NTC
Vth(low)NTC
Vact(tmr)NTC
Vdeact(tmr)NTC
0.47
0.5
0.53
V
V
V
V
low threshold voltage on pin NTC
timer activation voltage on pin NTC
0.325 0.35
0.375
0.325
0.23
0.26
0.17
0.3
0.2
timer deactivation voltage on pin
NTC
tto(deact)NTC
deactivation time-out time on pin
NTC
33
-
46
59
-
μs
Ioffset(NTC)
OSP
offset current on pin NTC
−47
μA
tdet(sc)
short-circuit detection time
high off-time
16
30
20
36
24
42
ms
toff(high)
μs
Temperature protection
Tth(act)otp overtemperature protection
160
90
170
100
180
110
°C
°C
activation threshold temperature
Tth(rel)otp
overtemperature protection
release threshold temperature
[1] The maximum operating voltage at VCC can exceed 14 V when determined by the IC using the dV/dt supply.
[2] This parameter is not tested during production, by design it is guaranteed
SSL2109_SER
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Product data sheet
Rev. 3 — 4 June 2012
13 of 20
SSL2109 series
NXP Semiconductors
GreenChip controller for LED lighting
12. Application information
A LED driver with the SSL2109 series is a buck converter operating in BCM, see Figure 7.
Capacitor C3 buffers the IC supply voltage, which is powered via the HV pin at start-up
and via C5 during normal operation. Sense resistors R4 and R5 converts the current
through MOSFET Q1 into a voltage on pin Source. The value of these resistors defines
the maximum primary peak current on MOSFET Q1, and thus the LED current. Resistor
R6 reduces the reverse current into the DRIVER pin. The DRAIN pin is connected with the
drain of Q1 for valley detection.
In the example shown in Figure 7, the NTC pin is used for temperature protection. The
temperature level is set by Negative Temperature Coefficient (NTC) resistor R3 and
capacitor C4 reduces noise on the NTC pin. Further information can be found in the
SSL2109 series application note.
LED+
L1
1 mH
1
LED+
J5-1
D1
R1
fuse
1
L
DBLS105G
C6
10 μF
160 V
L
1
2
D2
3
C1
2.2 μF
385 V
C2
3.3 μF
400 V
BYV25G-600
J6-1
500 mA SL
RV1
U1
LED-
4
L2
HV
VCC
DRAIN
1
8
LED-
J5-2
1
2
3
4
varistor 275 V
2.1 mH
1000 mA
U
N
GND
7
6
R2
N
1
SSL2109
C5
NTC
DVDT
J6-2
10 Ω
120 pF
1 kV
SOURCE
DRIVER
5
Q1
MOSFET N
R6
100 Ω,1206
C4
1 nF
C3
1 μF
16 V
R3
NTC
R4
2.2, 1 %
R5
1.5, 1 %
100 kΩ
aaa-001746
Fig 7. A typical SSL2109 series application
SSL2109_SER
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Product data sheet
Rev. 3 — 4 June 2012
14 of 20
SSL2109 series
NXP Semiconductors
GreenChip controller for LED lighting
13. Package outline
SO8: plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
D
E
A
X
c
y
H
v
M
A
E
Z
5
8
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
4
e
w
M
detail X
b
p
0
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
(1)
(1)
(2)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.
0.25
0.10
1.45
1.25
0.49
0.36
0.25
0.19
5.0
4.8
4.0
3.8
6.2
5.8
1.0
0.4
0.7
0.6
0.7
0.3
mm
1.27
0.05
1.05
0.041
1.75
0.25
0.01
0.25
0.01
0.25
0.1
8o
0o
0.010 0.057
0.004 0.049
0.019 0.0100 0.20
0.014 0.0075 0.19
0.16
0.15
0.244
0.228
0.039 0.028
0.016 0.024
0.028
0.012
inches 0.069
0.01 0.004
Notes
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-18
SOT96-1
076E03
MS-012
Fig 8. Package outline SOT96-1 (SOT8)
SSL2109_SER
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Product data sheet
Rev. 3 — 4 June 2012
15 of 20
SSL2109 series
NXP Semiconductors
GreenChip controller for LED lighting
14. Abbreviations
Table 7.
Abbreviations
Description
Acronym
BCM
Boundary Conduction Mode
Bill Of Materials
BOM
LEB
Leading-Edge Blanking
Light Emitting Diode
LED
MOSFET
OCP
Metal-Oxide Semiconductor Field-Effect Transistor
OverCurrent Protection
OSP
Output Short Protection
OTP
OverTemperature Protection
Printed-Circuit Board
PCB
PWM
SWP
UVLO
ZCS
Pulse-Width Modulation
Short-Winding Protection
UnderVoltage LockOut
Zero-Current Switching
15. References
[1] SSL2108 series — Data sheet: Drivers for LED lighting
[2] AN11041 — Application Note: SSL2108X driver for SSL applications
[3] AN10876 — Application Note: Buck converter for SSL applications
[4] UM10512 — User manual: GreenChip controller for LED lighting
[5] AN11136 — Application note: Buck convertor driver for SSL applications
SSL2109_SER
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Product data sheet
Rev. 3 — 4 June 2012
16 of 20
SSL2109 series
NXP Semiconductors
GreenChip controller for LED lighting
16. Revision history
Table 8.
Revision history
Document ID
SSL2109_SER v.3
Modifications
Release date
Data sheet status
Change notice
Supersedes
20120604
Product data sheet
-
SSL2109T v.2
• SSL2109AT added to the data sheet
• Figure 1 “SSL2109AT block diagram” on page 3 added
SSL2109T v.2
SSL2109 v.1.1
SSL2109 v.1
20120426
20120410
20120330
Product data sheet
-
-
-
SSL2109 v.1.1
Preliminary data sheet
Preliminary data sheet
SSL2109 v.1
-
SSL2109_SER
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Product data sheet
Rev. 3 — 4 June 2012
17 of 20
SSL2109 series
NXP Semiconductors
GreenChip controller for LED lighting
17. Legal information
17.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
Suitability for use — NXP Semiconductors products are not designed,
17.2 Definitions
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
17.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
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Product data sheet
Rev. 3 — 4 June 2012
18 of 20
SSL2109 series
NXP Semiconductors
GreenChip controller for LED lighting
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
17.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
non-automotive qualified products in automotive equipment or applications.
GreenChip — is a trademark of NXP B.V.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
18. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
SSL2109_SER
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Product data sheet
Rev. 3 — 4 June 2012
19 of 20
SSL2109 series
NXP Semiconductors
GreenChip controller for LED lighting
19. Contents
1
2
3
4
5
6
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
7
7.1
7.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 5
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5
8
8.1
8.2
8.3
8.4
8.5
8.6
8.6.1
8.6.2
8.6.3
8.6.4
8.6.5
8.6.6
Functional description . . . . . . . . . . . . . . . . . . . 6
Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Converter operation . . . . . . . . . . . . . . . . . . . . . 6
Conversion frequency. . . . . . . . . . . . . . . . . . . . 6
Driver pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Valley detection. . . . . . . . . . . . . . . . . . . . . . . . . 7
Protective features . . . . . . . . . . . . . . . . . . . . . . 8
UnderVoltage LockOut (UVLO) . . . . . . . . . . . . 8
Leading-Edge Blanking (LEB) . . . . . . . . . . . . . 8
OverCurrent Protection (OCP) . . . . . . . . . . . . . 8
OverTemperature Protection (OTP) . . . . . . . . . 8
Brownout protection . . . . . . . . . . . . . . . . . . . . . 8
Short-Winding Protection (SWP);
SSL2109T only . . . . . . . . . . . . . . . . . . . . . . . . . 9
Output Short Protection (OSP). . . . . . . . . . . . . 9
VCC supply. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
DVDT supply . . . . . . . . . . . . . . . . . . . . . . . . . . 9
VCC regulator. . . . . . . . . . . . . . . . . . . . . . . . . 10
NTC functionality and PWM dimming. . . . . . . 10
Soft-start function . . . . . . . . . . . . . . . . . . . . . . 11
8.6.7
8.7
8.8
8.9
8.10
8.10.1
9
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 11
Thermal characteristics . . . . . . . . . . . . . . . . . 12
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 12
Application information. . . . . . . . . . . . . . . . . . 14
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 15
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 16
References . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 17
10
11
12
13
14
15
16
17
Legal information. . . . . . . . . . . . . . . . . . . . . . . 18
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 18
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 19
17.1
17.2
17.3
17.4
18
19
Contact information. . . . . . . . . . . . . . . . . . . . . 19
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2012.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 4 June 2012
Document identifier: SSL2109_SER
相关型号：
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