MSC7166GS-K [OKI]

Vacuum Fluorescent Driver, 16-Segment, PDSO24, PLASTC, SOP-24;
MSC7166GS-K
型号: MSC7166GS-K
厂家: OKI ELECTRONIC COMPONETS    OKI ELECTRONIC COMPONETS
描述:

Vacuum Fluorescent Driver, 16-Segment, PDSO24, PLASTC, SOP-24

光电二极管
文件: 总8页 (文件大小:112K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
E2C0032-27-Y2  
This version: Nov. 1997  
Previous version: Jul. 1996  
¡ Semiconductor  
MSC7166  
16-Bit Grid Driver with 4 to 16-Decoder  
GENERAL DESCRIPTION  
The MSC7166 is a driver IC designed to directly drive the grids of a vacuum fluorescent display  
tube.  
Since this IC has a built-in 4 to 16-line decoder and 16 output circuits, a signal device of MSC7166  
can replace a set of the following three: two devices of either MSL912 or MSL918 and one device  
of either MSM4514 or MSM74HC4514.  
Setting the DUTY pin to the "L" level makes all driver outputs go "L". Blanking can be set using  
this function.  
FEATURES  
• Logic supply voltage  
• Driver supply voltage  
• Driver output current I  
I
: 5V  
: 65V  
: –40 mA  
: 1 mA  
OH  
OL  
• Can be directly connected to VF display tube without pull-down resistor  
• Built-in 4- to 16-line decoder  
• Brightness can be adjusted by DUTY pin  
• Package  
24-pin plastic SOP (SOP24-P-430-1.27-K) (Product name: MSC7166GS-K)  
1/8  
¡ Semiconductor  
MSC7166  
BLOCK DIAGRAM  
VDISP(+)  
VDD  
S 1  
S 2  
S 3  
S 4  
S 5  
S 6  
S 7  
S 8  
S 9  
S10  
S11  
GRID 1  
GRID 2  
GRID 3  
SEL0  
GRID 4  
GRID 5  
SEL1  
SEL2  
GRID 6  
GRID 7  
GRID 8  
GRID 9  
GRID10  
GRID11  
GRID12  
GRID13  
GRID14  
GRID15  
GRID16  
4 to 16  
DECODER  
SEL3  
S12  
S13  
S14  
S15  
S16  
DUTY  
VSS  
2/8  
¡ Semiconductor  
MSC7166  
INPUT AND OUTPUT CONFIGURATION  
Schematic Diagram of Logic Input Circuit  
VDD  
VDD  
Input  
VSS  
VSS  
VSS  
Schematic Diagram of Driver Output Citcuit  
VDISP(+) VDISP(+)  
Output  
VSS  
VSS  
3/8  
¡ Semiconductor  
MSC7166  
PIN CONFIGURATION (TOP VIEW)  
GRID 1  
GRID 2  
GRID 3  
GRID 4  
GRID 5  
GRID 6  
GRID 7  
GRID 8  
GRID 9  
GRID10  
GRID11  
1
2
VSS  
24  
23  
SEL 0  
3
22 SEL 1  
SEL 2  
20 SEL 3  
21  
4
5
DUTY  
VDD  
6
19  
18  
17  
7
VDISP(+)  
8
16 GRID 13  
9
GRID 14  
GRID 15  
15  
14  
10  
11  
GRID12 12  
13 GRID 16  
24-pin Plastic SOP  
PIN DESCRIPTIONS  
Symbol  
Type  
Description  
SEL0-3  
I
4- to 16-line decoder input pins.  
The input 4-bit binary signals are converted into hexadecimal signals, then output through  
driver output pins.  
DUTY  
I
Duty control signal input pin.  
Setting this pin to "L" makes all driver outputs go "L", so this pin can be used for brightness  
control.  
GRID1-16  
O
High withstand voltage driver output pins for driving fluorescent display tube.  
These pins can directly be connected to the grid of fluorescent display tude without  
pull-down resistor.  
VDISP(+)  
VDD  
Power supply pin for the fluorescent display tube driver circuit.  
Logic power supply pin.  
VSS  
Ground pin.  
4/8  
¡ Semiconductor  
MSC7166  
ABSOLUTE MAXIMUM RATINGS  
Parameter  
Logic Supply Voltage  
Driver Supply Voltage  
Input Voltage  
Symbol  
VDD  
Condition  
Rating  
–0.3 to +6.5  
–0.3 to +70  
–0.3 to VDD+0.3  
790  
Unit  
Applied to logic supply pin  
Applied to driver supply pin  
Applied to all input pins  
V
V
*1  
VDISP(+)  
VIN  
*1,2  
*1  
V
<
Power Dissipation  
PD  
Ta 25°C  
=
mW  
Thermal Resistance of Package  
Storage Temperature  
Rj-a  
158  
*3 °C/W  
°C  
TSTG  
–55 to +150  
*1 The maximum supply voltage for V .  
SS  
*2 Permanentdamagetothedevicemaybecausedifthevoltageissuppliedoverthetheabsolute  
maximum rating value.  
*3 Thermal resistance of the package (between junction and atmosphere).  
Thejunctiontemperature(Tj)givenbytheequationindicatedbelowshouldnotexceed150°C.  
Tj=P ¥ R + Ta (P: maximum power consumption of IC)  
j-a  
RECOMMENDED OPERATING CONDITIONS  
Parameter  
Logic Supply Voltage  
Driver Supply Voltage  
High Level Input Voltage  
Low Level Input Voltage  
High Level Output Current  
Low Level Output Current  
Operating Temperature  
Input Pulse Rise Time  
Input Pulse Fall Time  
Symbol  
VDD  
VDISP(+)  
VIH  
Condition  
Applied to logic supply pin  
Applied to driver supply pin  
Applied to all input pins  
Applied to all input pins  
Applied to all driver output pins  
Applied to all driver output pins  
Min.  
4.5  
8
Max.  
5.5  
65  
Unit  
V
V
3.1  
V
VIL  
1.7  
–40  
1.0  
85  
V
IOH  
mA  
mA  
°C  
ms  
ms  
IOL  
Top  
–40  
Applied to all input pins  
Applied to all input pins  
tr  
1.0  
1.0  
tf  
5/8  
¡ Semiconductor  
MSC7166  
ELECTRICAL CHARACTERISTICS  
DC Characteristics  
(VDD=4.5 to 5.5V,VDISP(+)=8 to 65V,Ta=–40 to +85°C)  
Parameter  
Symbol  
IDD1  
Condition  
No load, 1 output H  
No load, DUTY=L  
No load, 1 output H  
No load, DUTY=L  
Min.  
Typ.  
Max. Unit  
Logic Supply Current  
4.8  
5.0  
0.3  
1.0  
1
mA  
mA  
mA  
mA  
mA  
mA  
V
IDD2  
Driver Supply Current  
IDISP1  
IDISP2  
IIH  
High Level Input Current  
Low Level Input Current  
High Level Output Voltage  
IIL  
1
VOH  
IOH=–40mA  
VDISP(+)  
–4  
Low Level Output Voltage  
VOL  
IOL=1mA  
2.5  
V
AC Characteristics  
(VDD=4.5 to 5.5V,VDISP(+)=8 to 65V,Ta=–40 to +85°C)  
Parameter  
Delay Time L to H  
Symbol  
Condition  
Min.  
Typ.  
0.3  
Max. Unit  
tDLH  
tTLH  
tDHL  
tTHL  
CL=10pF, See figure below  
CL=10pF, See figure below  
CL=10pF, See figure below  
CL=10pF, See figure below  
1.0  
4.0  
1.0  
4.0  
ms  
ms  
ms  
ms  
Transient Time L to H  
Delay Time H to L  
2.0  
0.3  
Transient Time H to L  
2.0  
tr  
tf  
90%  
50%  
90%  
50%  
DUTY  
SELn  
10%  
10%  
tDLH  
tDHL  
90%  
90%  
10%  
10%  
GRIDn  
tTLH  
tTHL  
6/8  
¡ Semiconductor  
MSC7166  
FUNCTION DESCRIPTION  
Functional Table  
SEL  
GRID  
DUTY  
0
X
L
1
X
L
2
X
L
L
L
L
3
X
L
L
L
L
1
L
H
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
2
L
L
H
L
L
L
L
L
L
L
L
L
L
L
L
L
L
3
L
L
L
H
L
L
L
L
L
L
L
L
L
L
L
L
L
4
L
L
L
L
H
L
L
L
L
L
L
L
L
L
L
L
L
5
L
L
L
L
L
H
L
L
L
L
L
L
L
L
L
L
L
6
L
L
L
L
L
L
H
L
L
L
L
L
L
L
L
L
L
7
L
L
L
L
L
L
L
H
L
L
L
L
L
L
L
L
L
8
L
L
L
L
L
L
L
L
H
L
L
L
L
L
L
L
L
9
10 11 12 13 14 15 16  
L
L
L
L
L
L
L
L
L
L
H
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
H
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
H
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
H
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
H
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
H
L
L
L
L
L
L
L
L
L
L
L
L
H
L
L
H
H
H
L
H
L
L
L
H
H
H
H
L
L
L
L
L
L
L
L
L
L
L
L
L
H
L
L
L
L
L
L
L
L
L
L
L
L
H
H
H
L
L
H
H
L
L
H
H
H
H
H
H
H
H
H
L
L
L
H
H
L
L
H
L
L
H
H
H
H
H
L
L
H
H
H
7/8  
¡ Semiconductor  
MSC7166  
PACKAGE DIMENSIONS  
(Unit : mm)  
SOP24-P-430-1.27-K  
Mirror finish  
Package material  
Lead frame material  
Pin treatment  
Solder plate thickness  
Package weight (g)  
Epoxy resin  
42 alloy  
Solder plating  
5 mm or more  
0.58 TYP.  
Notes for Mounting the Surface Mount Type Package  
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which  
are very susceptible to heat in reflow mounting and humidity absorbed in storage.  
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the  
product name, package name, pin number, package code and desired mounting conditions  
(reflow method, temperature and times).  
8/8  

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