MSM6408-XXXRS [OKI]
Microcontroller, 4-Bit, MROM, 4MHz, CMOS, PDIP42, 0.600 INCH, 2.54 MM PITCH, PLASTIC, DIP-42;型号: | MSM6408-XXXRS |
厂家: | OKI ELECTRONIC COMPONETS |
描述: | Microcontroller, 4-Bit, MROM, 4MHz, CMOS, PDIP42, 0.600 INCH, 2.54 MM PITCH, PLASTIC, DIP-42 微控制器 |
文件: | 总19页 (文件大小:148K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
E2E0014-38-93
This version: Sep. 1998
Previous version: Mar. 1996
¡ Semiconductor
MSM6408
High speed and High performance 4-Bit Microcontroller
GENERAL DESCRIPTION
TheMSM6408microcontrollerisalow-power,single-chipdeviceimplementedincomplementary
metal-oxide semiconductor technology.
The MSM6408 is optimized for high-speed processing and complicated-control applications, in
which conventional microcontrollers are difficult to use.
FEATURES
• Mask ROM
• RAM (including the stack area)
• I/O port
: 8096 words ¥ 8 bits
: 256 words ¥ 4 bits
Input-output port
Input port
: 8 ports ¥ 4 bits
: 1 port ¥ 4 bits
4 bits are for input ports having a latch; the other 32 bits are for input/output ports that
allow bit manipulation
• Three built-in counters
: 12-bit time-base counter
12-bit programmable timer
8-bit high-speed programmable timer/event
counter
• Built-in 8-bit serial I/O register (with 3-bit counter)
• Five interrupts with five priority levels (4 internal, 1 external)
• 32 stack levels (in RAM)
• Power down features
• Minimum instruction execution time : 1.0 ms @ 4.0 MHz clock
• Instruction systems suitable for control
• Fully static operation
• Low power consumption
• Single 5 V power supply
• Package options:
42-pin plastic DIP (DIP42-P-600-2.54)
44-pin plastic QFP (QFP44-P-910-0.80-K)
44-pin plastic QFP (QFP44-P-910-0.80-2K) (Product name : MSM6408-¥¥¥GS-2K)
(Product name : MSM6408-¥¥¥RS)
(Product name : MSM6408-¥¥¥GS-K)
¥¥¥ indicates a code number.
1/19
¡ Semiconductor
MSM6408
BLOCK DIAGRAM
RAM
16 ¥ 16 ¥ 4 bits
ROM
8096 ¥ 8 bits
INSTR
DEC
ACC
ALU
DEC
DEC
C
SP
H
L
F
12 PC
0
PC INTE PB
PD IRQ
Interrupt
Control
OSC0
OSC
TEST
RESET
VDD
12-bit Timer P9 8-bit T/C PA 8-bit SR
Timing
1
&
Control
12-bit TBC
GND
P8
P7
P6
P5
P4
P3
P2
P1
P0
3210 3210 3210 3210 3210 3210 3210 3210 3210
INT
SCK, CTO, CLK
SO
SI
CIN
TMO
TCK
2/19
¡ Semiconductor
MSM6408
PIN CONFIGURATION (TOP VIEW)
P4.0
P4.1
P4.2
P4.3
P3.0
P3.1
P3.2
P3.3
OSC0
1
2
3
4
5
6
7
8
9
42 VDD
41 P5.3
40 P5.2
39 P5.1
38 P5.0
37 P6.3
36 P6.2
35 P6.1
34 P6.0
33 P7.3
32 P7.2
31 P7.1
30 P7.0
29 P8.3
28 P8.2
27 P8.1
26 P8.0
25 P1.3
24 P1.2
23 P1.1
22 P1.0
OSC1 10
RESET 11
TEST 12
P2.0 13
P2.1 14
P2.2 15
P2.3 16
P0.0 17
P0.1 18
P0.2 19
P0.3 20
GND 21
42-Pin Plastic DIP
3/19
¡ Semiconductor
MSM6408
PIN CONFIGURATION (TOP VIEW) (continued)
P3.1
P3.2
1
2
3
4
5
6
7
8
9
33 P6.2
32 P6.1
31 P6.0
30 NC
P3.3
OSC0
OSC1
RESET
TEST
P2.0
29 P7.3
28 P7.2
27 P7.1
26 P7.0
25 P8.3
24 P8.2
23 P8.1
P2.1
P2.2 10
P2.3 11
NC : No-connection pin
44-Pin Plastic QFP
4/19
¡ Semiconductor
MSM6408
PIN DESCRIPTIONS
Symbol
P0.0
Type
Description
During reset
P0.1/SCK
P0.2/SO
P0.3/SI
P0.1 is shared with serial clock (SLK) input/output.
P0.2 is shared with serial data (SO) output.
P0.3 is shared with serial data (SI) input.
P1.0 is shared with counter input (CIN).
P1.1 is shared with timer output (TMO).
P1.2 is shared with timer clock input (TCK).
I/O
"1"
P1.0/CIN
P1.1/TMO
P1.2/TCK
P1.3
I/O
"1"
P2.0/INT
P2.1
P2.0 is shared with external interrupt input (INT).
The latch is
reset.
I
P2.2
Input ports with a latch, with built-in pull-up resistor.
P2.3
P3.0 to 3.3
P4.0 to 4.3
P5.0 to 5.3
P6.0 to 6.3
P7.0 to 7.3
P8.0 to 8.3
OSC0
I/O
I/O
I/O
I/O
I/O
I/O
I
—
—
—
—
—
—
"1"
"0"
"0"
"0"
"0"
"0"
Oscillation
waveform
Crystal connection pins for clock oscillation.
(Test pin for manufacturer)
OSC1
O
TEST
O
I
Pulse output
RESET
Input pin for system reset.
—
—
VDD
—
Power supply voltage pins.
GND
Note: 1. The pins except for pins P2.0 to P2.3 are pseudo bidirectional ports.
2. When each port is used for output, the MSM6408 can drive one TTL (one input).
5/19
¡ Semiconductor
MSM6408
INSTRUCTION LIST
Mnemonic
LAI n
Code
9n
Byte
1
1
2
2
1
1
1
1
1
1
1
1
1
1
1
2
2
2
2
2
2
2
2
1
1
1
1
1
1
1
1
1
Cycle
Description
1
1
2
2
1
1
1
1
1
1
1
1
1
1
1
2
2
3
2
2
2
2
2
3
3
1
1
1
1
1
1
1
A¨n
LLI n
8n
L¨n
LHLI nn
LMI nn
LAL
15nn
14nn
21
HL¨nn
M(w)¨nn
A¨L
LLA
2D
L¨A
LAH
22
A¨H
LHA
2E
H¨A
LAM
38
A¨M
M¨A
LMA
2F
LAM+
LAM–
LMA+
LMA–
LAMM n2
LAMD mm
LMAD mm
LMTD mm
LMCT
LCTM
LMSR
LSRM
LTMM
PUSH
POP
24
A¨M, L¨L + 1,Skip if L = 0
A¨M, L¨L – 1,Skip if L = F
M¨A, L¨L + 1,Skip if L = 0
M¨A, L¨L – 1,Skip if L = F
A¨M, H¨H n2
25
26
27
39-3B
10mm
11mm
19mm
3E59
3E51
3E5A
3E52
3E50
1C
A¨Md
Md¨A
Md(w)¨T (M(w), A), T = ROM table
M(w)¨CT
CT¨M(w)
M(w)¨SR
SR¨M(w)
TM¨(M(w), A)
ST¨C, A, H, L, SP¨SP – 4
C, A, H, L, ¨ST SP¨SP + 4
A´M
1D
X
28
XM n2
X+
29-2B
3C
A´M, H¨H n2
A´M, L¨L+1, Skip if L = 0
A´M, L¨L–1, Skip if L = F
A¨A + 1, Skip if A = 0
A¨M + 1, Skip if M = 0
L¨L + 1, Skip if L = 0
X–
2C
INA
30
INM
33
INL
31
6/19
¡ Semiconductor
MSM6408
INSTRUCTION LIST (continued)
Mnemonic
INH
Code
32
Byte
1
2
1
1
1
1
2
1
1
1
2
1
1
1
1
1
1
1
1
1
1
1
1
2
2
2
2
1
1
1
1
1
1
Cycle
1
Description
H¨H + 1, Skip if M = 0
INMD mm
DCA
12mm
34
2
Md¨Md + 1, Skip if Md = 0
A¨A – 1, Skip if A = F
M¨M – 1, Skip if M = F
L¨L – 1, Skip if L = F
1
DCM
DCL
37
1
35
1
DCH
36
1
H¨H – 1, Skip if H = F
Md¨Md – 1, Skip if Md = F
A¨A + M, Skip if Cy = 1
DCMD mm
ADS
13mm
02
2
1
ADCS
ADC
01
1
A, C¨A + M + C, Skip if Cy =1
A, C¨A + M + C
A¨A + n, Skip if Cy = 1
A¨A + 6
03
1
AIS n
DAA
3E4n
06
2
1
DAS
0A
1
A¨A + 10
AND
0D
1
A¨A M
OR
05
1
A¨A M
EOR
04
1
A¨A M
CMA
0B
1
A¨A
CIA
0C
1
A¨A + 1
RAL
0E
1
Rotate left with C
Rotate right with C
Skip if C = 1
C¨1
RAR
0F
1
TC
09
1
SC
07
1
RC
08
1
C¨0
CAI n
CLI n
CPI p, n
CMI n
CAM
3E0n
3E2n
17pn
3E1n
16
2
Skip if A = n
Skip if L = n
2
2
Skip if Pp = n
Skip if M = n
Skip if A = M
Skip if Abit (n2) = 1
Abit (n2)¨0
Abit (n2)¨1
Skip if Mbit (n2) = 1
Mbit (n2)¨0
2
1
TAB n2
RAB n2
SAB n2
TMB n2
RMB n2
54-57
64-67
74-77
58-5B
68-6B
1
1
1
1
1
7/19
¡ Semiconductor
MSM6408
INSTRUCTION LIST (continued)
Mnemonic
SMB n
Code
78-7B
5C-5F
6C-6F
7C-7F
50-53
60-63
70-73
30 p0-3
3D p4-7
3D p8-B
3E60
Byte
1
1
1
1
1
1
1
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
Cycle
1
Description
Mbit (n2)¨1
TFB n2
RFB n2
SFB n2
TPB n2
RPB n2
SPB n2
TPBD pn2
RPBD pn2
SPBD pn2
MEI
1
Skip if Fbit (n2) = 1
Fbit (n2)¨0
1
1
Fbit (n2)¨1
1
Skip if Pbit (n2) = 1
Pbit (n2)¨0
Pbit (n2)¨1
Skip if Ppbit (n2) = 1
Ppbit (n2) = 0
Ppbit (n2) = 1
MEIF¨1
1
1
2
2
2
2
MDI
3E61
2
MEIF¨0
EITB
3DC9
3DCA
3DCB
3DC8
3DC5
3DC6
3DC7
3DC4
3DC1
3DC2
3DC3
3DC0
3D20
3DD0
3DD1
3DD2
3DD3
3D24
3DD4
3DD5
3DD6
3DD7
2
EITBF¨1
EITM
2
EITMF¨1
EICT
2
EICTF¨1
EIEX
2
EIEXF¨1
DITB
2
EITBF¨0
DITM
DICT
2
EITMF¨0
2
EICTF¨0
DIEX
2
EIEXF¨0
TITB
2
Skip if EITBF = 1
Skip if EITMF = 1
Skip if EICTF = 1
Skip if EIEXF = 1
Skip if IRQEX = 1
Skip if IRQTB = 1
Skip if IRQTM = 1
Skip if IRQCT = 1
Skip if IRQSR = 1
IRQ EX¨0
TITM
2
TICT
2
TIEX
2
TQEX
TQTB
TQTM
TQCT
TQSR
RQEX
RQTB
RQTM
RQCT
RQSR
2
2
2
2
2
2
2
IRQ TB¨0
2
IRQ TM¨0
2
IRQ CT¨0
2
IRQ SR¨0
8/19
¡ Semiconductor
MSM6408
INSTRUCTION LIST (continued)
Mnemonic
ECT
Code
3DBB
3DBA
3DB7
3DB6
3DB3
3DB2
C0-FF
4a12
3F
Byte
2
Cycle
Description
CTF¨1 (start)
2
2
2
2
2
2
1
2
4
4
4
4
4
1
2
1
2
1
2
1
2
2
ESR
2
SRF¨1 (start)
CTF¨0 (stop)
SRF¨0 (stop)
Skip if CTF = 1
Skip if SRF = 1
PC¨a6
DCT
2
DSR
TCT
2
2
TSR
2
JCP a6
JP a12
LJP a13
CZP a
CAL a12
RT
1
2
PC¨a12
3
PC¨a13
Ba
1
ST¨PC + 1, PC¨2a, SP¨SP – 4
Aa12
IE
2
ST¨PC + 2, PC¨a12, SP¨SP – 4
1
PC¨ST, SP¨SP + 4
RTS
IF
1
PC¨ST, SP¨SP + 4, Unconditional skip
JA
IA
1
PC¨(PC¨A) + 1
PC¨(M(w), A)
A¨P
JM
IB
1
IP
20
1
IPD p
OP
3DpD
23
2
A¨Pp
1
P¨A
OPD p
NOP
HALT
STOP
3DpC
00
2
Pp¨A
1
No operation
Halt CPU
3DB8
3DB9
2
2
Stop clock
Notes: a
: ROM address data
m : RAM address data
n : Immediate data
p : Port address data
9/19
¡ Semiconductor
MSM6408
ABSOLUTE MAXIMUM RATINGS
Parameter
Power Supply Voltage
Input Voltage
Symbol
VDD
Condition
Rating
–0.3 to +7
–0.3 to VDD
–0.3 to VDD
200
Unit
V
VI
Ta = 25°C
V
Output Voltage
VO
V
Ta = 25°C per package
Ta = 25°C per output
—
mW
mW
°C
Power Dissipation
PD
50
Storage Temperature
TSTG
–55 to +150
RECOMMENDED OPERATING CONDITIONS
Parameter
Symbol
Condition
fOSC £ 1 MHz
fOSC £ 4.0 MHz
Range
3 to 6
Unit
V
Power Supply Voltage
VDD
4.5 to 5.5
2 to 6
V
Data-Hold Voltage
VDDH
Top
fOSC = 0 Hz
V
Operating Temperature
—
–40 to +85
15
°C
MOS load
TTL load
Fan Out
N
—
1
10/19
¡ Semiconductor
MSM6408
ELECTRICAL CHARACTERISTICS
DC Characteristics
(VDD = 5 V 10ꢀ, Ta = –40 to +85°C)
Parameter
"H" Input Voltage
Symbol
VIH
Condition
—
Min.
2.4
3.6
–0.3
4.2
—
Typ.
—
—
—
—
—
—
—
—
—
—
5
Max.
VDD
VDD
+0.8
—
Unit
V
*1,*2
*3,*4
"H" Input Voltage
"L" Input Voltage
"H" Output Voltage
"L" Output Voltage
"L" Output Voltage
Input Current
VIH
—
V
VIL
—
V
*1,*5
*1
VOH
VOL
VOL
IIH/IIL
IIH/IIL
IOH
IO = –15 mA
IO = 1.6 mA
IO = 15 mA
VI = VDD/0 V
VI = VDD/0 V
VO = 2.4 V
VO = 0.4 V
V
0.4
V
*5
—
0.4
V
*3
—
15/–15
1/–30
—
mA
mA
mA
mA
*2,*4
*1
Input Current
—
"H" Output Current
"H" Output Current
Input Capacitance
Output Capacitance
Power Supply Current
(In Stopped State)
–0.1
—
*1
IOH
–1.2
—
CI
—
f = 1 MHz, Ta = 25°C
pF
CO
—
7
—
VDD = 2 V, no load, Ta = 25°C
No load
—
0.2
1
5
mA
mA
IDDS
IDD
—
100
Crystal oscillation
f = 4 MHz, no load
Power Supply Current
—
6
12
mA
*1 Applied to P0, P1, P3, P4, P5, P6, P7 and P8
*2 Applied to P2
*3 Applied to OSC
0
*4 Applied to RESET
*5 Applied to OSC
1
11/19
¡ Semiconductor
MSM6408
AC Characteristics
(VDD = 5 V 10ꢀ, Ta = –40 to +85°C)
Parameter
Clock (OSC0) Pulse Width
Cycle Time
Symbol
tfW
Condition
Min.
125
1
Typ.
—
Max.
—
Unit
ns
—
—
—
—
—
tCY
—
—
ms
Input Data Setup Time
Input Data Hold Time
SR/TM Clock Pulse Width
tDS
120
120
120
2/8 tCY
+ 120
120
120
120
—
—
—
ns
tDH
—
—
ns
tWS/tWT
—
—
ns
CT Clock Pulse Width
tWC
—
—
—
ns
P2 Input Data Clock Pulse Width
SR Data Setup Time
SR Data Hold Time
Data Delay Time
tWP
tSS
tSH
tDR
—
—
—
—
—
—
—
—
ns
ns
ns
ns
—
—
CL = 15 pF
tCY + 300
7/8 tCY
+ 300
6/8 tCY
+ 300
7/8 tCY
+ 300
2/8 tCY
+ 360
Data Delay Time at Mode
Switching
tDCR
tDI1
tDI2
CL = 15 pF
CL = 15 pF
CL = 15 pF
CL = 15 pF
CL = 15 pF
CL = 15 pF
CL = 15 pF
CL = 15 pF
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
ns
ns
ns
ns
ns
ns
ns
ns
Data Delay Time at OPT
Instruction
Data Delay Time at OPT
Instruction
CT/TM Data Delay Time Using
TBC Clock
t
CT/tTT
SR/tTR
tCR
SR/TM Data Delay Time Using
PORT Clock
t
tCY + 480
CT Data Delay Time Using
PORT Clock
10/8 tCY
+ 480
CT Data Delay Time Using
External Clock
2/8 tCY
+ 360
tCP
SR/TM Data Delay Time Using
External Clock
tSP/tTP
360
SR Clock Invalid Time
INT Invalid Time
tSINH
tIINH
—
—
2/8 tCY
1/8 tCY
—
—
—
—
ns
ns
12/19
¡ Semiconductor
MSM6408
Timing Diagrams
Output Conditions
1MC
OSC0
0, 1, 3
tCY
P0, P1, P3
P4, P5, P6 PA = 4, 5, 6
P7, P8
7 or 8
tDR
P0.1
P0.2
P1.1
PA = 9 or A
tDCR
P4
P5
OPT INST.
tDI1
OPT INST.
CT
tDI2
P0.1
P1.1
TBC clock
TM
tCT
tTT
P0.2 P0.1 clock*SR
P1.1 P1.2 clock*TM
tSR
tTR
P0.1 P1.0 clock*CT
tCR
P0.1
EXT clock
P1.0 P1.2 EXT clock
P0.1 CT
tCP
P0.2 SR
P1.1 TM
tSP
tTP
*
Output data to port is clock for SR, TM or CT.
13/19
¡ Semiconductor
MSM6408
Input Conditions
1MC
OSC0
tfW tfW
P0, P1, P2
P3, P4, P5
P6, P7, P8
INPUT
DATA
tDS tDH
P0.1 SR clock
P1.2 TM clock
P2
tDW1
P1.0 CT clock
tDW2
P0.1 SR clock
P0.3 SI
INPUT
DATA
tSS tSH
1MC
OSC0
tIINH
tSINH
t
t
: P0.1 (SR clock) INH period during LMSR INST.
(Note: P0.1 is used for clock of SR.)
: P2.0 (interrupt) INH period during RPB and RPBD INST.
SINH
IINH
14/19
¡ Semiconductor
MSM6408
Operating Characteristics
Typ. Current (I ) vs Voltage (V ) for Low
Typ. Current (I ) vs Voltage (V ) for High
OL
OL
OH
OH
State Output
State Output
Ta = 25°C
Ta = 25°C
–1.0
–0.9
–0.8
–0.7
–0.6
–0.5
–0.4
–0.3
–0.2
–0.1
20
18
VDD = 5 V
4 V
6 V
16
14
12
10
8
6
4
2
VDD = 6 V
5 V
4 V
3 V
3 V
0
0
0
1
2
3
4
5
6
7
8
9 10
0 1 2 3 4 5 6 7 8 9 10
VOH (V)
VOL (V)
Typ. Maximum Oscillator Frequnecy (f
)
Typ. Maximum Oscillator Frequnecy (f
vs Temperature (Ta)
)
OSC
OSC
vs Supply Voltage (V
)
DD
Ta = 25°C, C = 15 pF
C = 15 pF
L
L
10
9
8
7
6
5
4
3
2
1
0
10
9
8
7
6
5
4
3
2
1
0
VDD = 5 V
0
1
2
3
4
5
6
7
8
9 10
–40 –20 0 20 40 60 80 100 120
Ta (°C)
VDD (V)
15/19
¡ Semiconductor
MSM6408
Operating Characteristics (continued)
Typ. Supply Current (I ) vs Supply Voltage (V
)
DD
DD
Ta = 25°C, no load
10 m
fOSC = 4 MHz
2 MHz
1 MHz
500 kHz
100 kHz
1 m
100 m
10 m
0 Hz
1 m
100 n
0
1
2
3
4
5 6 7 8 9 10
V
DD (V)
16/19
¡ Semiconductor
PACKAGE DIMENSIONS
DIP42-P-600-2.54
MSM6408
(Unit : mm)
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
6.20 TYP.
17/19
¡ Semiconductor
MSM6408
(Unit : mm)
QFP44-P-910-0.80-K
Mirror finish
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
0.35 TYP.
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
18/19
¡ Semiconductor
MSM6408
(Unit : mm)
QFP44-P-910-0.80-2K
Mirror finish
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
0.41 TYP.
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
19/19
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