MSM64158AL-XXX [OKI]
Microcontroller, 4-Bit, MROM, 0.075MHz, CMOS, 3.63 X 3.99 MM, DIE-64;型号: | MSM64158AL-XXX |
厂家: | OKI ELECTRONIC COMPONETS |
描述: | Microcontroller, 4-Bit, MROM, 0.075MHz, CMOS, 3.63 X 3.99 MM, DIE-64 微控制器 |
文件: | 总25页 (文件大小:142K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
E2E0031-38-95
This version: Sep. 1998
Previous version: Mar. 1996
¡ Semiconductor
MSM64158A/64158AL
4-Bit Microcontroller with Built-in LCD Driver and Melody Circuit
GENERAL DESCRIPTION
The MSM64158A (1.5 V)/64158AL (3.0 V) is a high-performance 4-bit microcontroller that
incroporates Oki-original CPU core nX-4/20.
The MSM64158A/64158AL has an LCD driver for up to 144 segments, an event counter, and a
melody circuit. It is best suited for applications such as clocks and LCD games.
FEATURES
• Operating range
Operating voltage
: 1.5 V/3.0 V
Operating temperature
Operating frequency
: –40 to +70°C
: 32.768 kHz crystal oscillation
Approx. 32 kHz RC oscillation
: 0.9 µA (3.0 V at HALT mode)
Supply current (Typ.)
• Minimum instruction execution time : 91 µs
• General memory space
• Local memory space
• LCD drivers
: 2528 bytes
: 128 nibbles
: 40
Common driver ¥ 4
Segment driver ¥ 36
1/4 duty, 1/3 bias; 144 segments (36 ¥ 4)
1/3 duty, 1/3 bias; 108 segments (36 ¥ 3)
• I/O port
Input-output port
: 1 port ¥ 4 bits (open drain output/CMOS output
selectable; pull-down resistor input/high-
impedance input selectable)
Input port
: 1 port ¥ 2 bits (pull-down resistor input /high-
impedance input selectable)
1 port ¥ 4 bits (pull-down resistor input/high-
impedance input selectable)
• Event counter
• Melody output
• Interrupts
: 1
: 1
: 7 sources (external 3, time base 3, melody 1)
• Package:
64-pin plastic QFP (QFP64-P-1414-0.80-BK): (Product name : MSM64158A-¥¥¥GS-BK,
MSM64158AL-¥¥¥GS-BK)
: MSM64158A-¥¥¥, MSM64158AL-¥¥¥
¥¥¥ indicates a code number.
Chip
• OTP version (for program evaluation) : MSM64P155/64P155L
(The packages, power polarity, and operating voltage of the MSM64P155/64P155L are
different from the MSM64158A/64158AL. For details, refer to the "MSM64P155 User's
Manual".)
1/25
¡ Semiconductor
MSM64158A/64158AL
BLOCK DIAGRAM
BIAS
COM1
COM2
COM3
COM4
TR2
C
TR0
(4)
TR1
ROM
2528B
PCM PCL
PCH
ALU
(4)
SEG0
LCD
A8 to A11
A7 to A0
RAM
128N
(4)
SP
B
A
H
L
X
Y
SEG35
(8)
DB7 to DB0
TIMING
ROMR
OSC0
INTC
CONTROLLER
OSC
MD0
MD0
OSC1
MD0
3
(8)
TBC
INT
RESET
RST
TST
VR
INT
TST1
TST2
PORT ADDRESS
DB7 to DB0
INT
VSSL
INT
INT
BUP
CAPR
PORT2
EVENT
PORT3
PORT6
VDD
is the CPU core (nX-4/20).
2/25
¡ Semiconductor
MSM64158A/64158AL
PIN CONFIGURATION (TOP VIEW)
SEG23
SEG22
SEG21
SEG20
SEG19
SEG18
SEG17
SEG16
SEG15
1
2
3
4
5
6
7
8
9
48 P6.0
47 P6.1
46 P6.2
45 P6.3
44 VDD
43 P2.0
42 P2.1
41 P2.2
40 P2.3
39 P3.0
38 P3.1
37 RESET
36 VSSL
35 OSC1
34 OSC0
33 VSS1
SEG14 10
SEG13 11
SEG12 12
SEG11 13
SEG10 14
SEG9 15
SEG8 16
64-Pin Plastic QFP
3/25
¡ Semiconductor
MSM64158A/64158AL
PAD CONFIGURATION
Pad Layout
46
33
47
32
Y
X
64
15
1
14
Chip Size
: 3.63 mm ¥ 3.99 mm
: 350 mm (typ.)
: Chip center
: 110 mm ¥ 110 mm
: 120 mm ¥ 120 mm
: 180 mm
Chip Thickness
Coordinate Origin
Pad Hole Size
Pad Size
Minimum Pad Pitch
Note: The chip substrate voltage is V
.
DD
4/25
¡ Semiconductor
MSM64158A/64158AL
Pad Coordinates
Pad No.
1
Pad Name
MD0
X (µm)
–1344
–1008
–824
–639
–453
–267
–82
Y (µm)
–1794
–1794
–1794
–1794
–1794
–1794
–1794
–1794
–1794
–1794
–1794
–1794
–1794
–1794
–1689
–1491
–1293
–1095
–891
–699
–501
–303
–105
93
Pad No.
41
Pad Name
COM2
COM1
C2
X (µm)
–88
Y (µm)
1794
1794
1794
1794
1794
1794
1671
1473
1275
1077
879
2
MD0
42
–274
3
SEG35
SEG34
SEG33
SEG32
SEG31
SEG30
SEG29
SEG28
SEG27
SEG26
SEG25
SEG24
SEG23
SEG22
SEG21
SEG20
SEG19
SEG18
SEG17
SEG16
SEG15
SEG14
SEG13
SEG12
SEG11
SEG10
SEG9
43
–461
4
44
C1
–647
5
45
VSS3
–1019
–1496
–1664
–1664
–1664
–1664
–1664
–1664
–1664
–1664
–1664
–1664
–1664
–1664
–1664
–1664
–1664
–1664
–1664
–1664
6
46
VSS2
7
47
VSS1
8
104
48
OSC0
OSC1
VSSL
9
289
49
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
475
50
660
51
RESET
P3.1
846
52
681
1031
1216
1664
1664
1664
1664
1664
1664
1664
1664
1664
1664
1664
1664
1664
1664
1664
1664
1664
1664
1395
1216
1030
844
53
P3.0
475
54
P2.3
285
55
P2.2
87
56
P2.1
–111
–309
–507
–705
–903
–1101
–1299
–1497
–1703
57
P2.0
58
VDD
59
P6.3
60
P6.2
61
P6.1
62
P6.0
63
TST2
TST1
64
291
489
687
885
1083
1281
1479
1677
1794
1794
1794
1794
1794
1794
1794
1794
SEG8
SEG7
SEG6
SEG5
SEG4
SEG3
SEG2
SEG1
657
SEG0
471
COM4
COM3
285
98
5/25
¡ Semiconductor
MSM64158A/64158AL
PIN DESCRIPTIONS
Basic Functions
Function
Pin
Pad
Symbol
Type
Description
Digital power supply (0 V)
44
58
VDD
—
33
47
VSS1
—
Digital negative power supply (for 1.5 V spec.)
Bias output for LCD drive (for 3.0 V spec.)
32
46
VSS2
—
Digital negative power supply (for 3.0 V spec.)
Bias output for LCD drive (for 1.5 V spec.)
Power
Supply
31
30
29
36
45
44
43
50
VSS3
C1
—
—
—
—
Bias output for LCD drive (–4.5 V)
Capacitor connection pins for LCD drive bias generation.
C2
Negative power supply pin for internal logic
(An internally generated constant voltage is present at this pin.)
VSSL
34
48
OSC0
I
Clock oscillation input and output pins:
Either a crystal (32.768 kHz) and a capacitor (10 to 30 pF)
are connected to these pins or a resistor (1 MW) is.
Oscillation
Test
35
50
49
64
OSC1
O
I
TST1
Input pins for test.
49
37
63
51
TST2
I
I
RESET
System reset input pin:
Setting this pin to "H" level puts this device into a reset state.
Then, setting this pin to "L" level starts executing an instruction
from address 000H.
Reset
This pin is internally connected to VSS1 or VSS2 through a pull-
down resistor.
6/25
¡ Semiconductor
MSM64158A/64158AL
Basic Functions (continued)
Function
Pin
43
Pad
57
Symbol
P2.0
Type
Description
I
4-bit input port (port 2): Select between pull-down resistor
input and high impedance input for each bit with the port 2 control
register (P2CON). When configured for secondary function,
an external interrupt and capture circuit trigger input are allocated.
If P2.0 to P2.3 are all set to a "H" level, the device enters system
reset mode.
42
56
P2.1
41
40
55
54
P2.2
P2.3
39
38
53
52
P3.0
P3.1
I
2-bit input port (port 3): Select between pull-down resistor input and
high impedance input with the port 3 control register (P3CON).
When configured for secondary function, an external interrupt is
allocated to P3.0 and an event counter input is allocated to P3.1.
Ports
48
47
62
61
P6.0
P6.1
I/O
4-bit I/O port (port 6): Select between input and output, between
pull-down resistor input and high impedance input, and between
open drain output and CMOS output with the port 6 control
register (P6CON).
When configured for secondary function, an external interrupt
is allocated to these pins.
46
45
60
59
P6.2
P6.3
Output pin of melody driver 0.
51
52
1
2
MD0
O
O
Melody
Drivers
MD0
Inverted output pin of MD0 output.
LCD common signal output pins.
28
27
26
25
42
41
40
39
COM1
COM2
COM3
COM4
O
O
O
O
LCD
Drivers
7/25
¡ Semiconductor
MSM64158A/64158AL
Basic Functions (continued)
Function
Pin
Pad
Symbol
Type
Description
LCD segment signal output pins.
24
38
SEG0
O
23
22
21
20
37
36
35
34
SEG1
SEG2
SEG3
SEG4
O
O
O
O
19
18
33
32
SEG5
SEG6
O
O
17
16
15
14
31
30
29
28
SEG7
SEG8
SEG9
SEG10
O
O
O
O
13
12
27
26
SEG11
SEG12
O
O
11
10
9
25
24
23
22
SEG13
SEG14
SEG15
SEG16
O
O
O
O
8
LCD
Drivers
7
6
21
20
19
18
17
16
15
14
13
SEG17
SEG18
SEG19
O
O
O
O
O
O
O
O
O
5
4
SEG20
SEG21
SEG22
SEG23
SEG24
SEG25
3
2
1
64
63
62
61
60
59
58
57
56
12
11
10
9
SEG26
SEG27
SEG28
SEG29
SEG30
SEG31
SEG32
O
O
O
O
O
O
O
8
7
6
55
54
5
4
SEG33
SEG34
O
O
53
3
SEG35
O
8/25
¡ Semiconductor
MSM64158A/64158AL
Secondary Functions
Function
Pin
Pad
Symbol
Type
Description
43
57
P2.0
I
P2.0 to P2.3 secondary functions :
These are level-triggered external interrupt input pins.
Select interrupt enable/disable for each bit with the
P2 interrupt enable register (P2IE).
If P2.0 to P2.3 pins are set to "H" level for a minimum
of 2 seconds, the device enters system reset mode.
P2.0, P2.1 secondary functions :
42
41
56
55
P2.1
P2.2
40
39
54
53
P2.3
P3.0
trigger input pins for capture circuit.
External
Interrupts
I
I
P3.0 secondary function :
This is an input pin for external interrupt. This pin can
receive an interrupt at a rising edge, a falling edge, or at
both rising and falling edges.
P6.0 to P6.3 secondary functions :
These are level-triggered external interrupt input pins.
48
47
46
62
61
60
P6.0
P6.1
P6.2
45
38
59
52
P6.3
P3.1
Event
Counter
Input
I
P3.1 secondary function :
Input port for event counter
9/25
¡ Semiconductor
MSM64158A/64158AL
Handling When Specific Pins Are Not Used
Recommended Pin Connection
Symbol
TST1 to TST2
P2.0 to P2.3
P3.0, P3.1
Open
"L" level or open
"L" level or open
In input mode : "L" level or open (Initial setting: input mode)
In output mode : Open
P6.0 to P6.3
Open
Open
Open
MD0, MD0
COM1 to COM4
SEG0 to SEG35
10/25
¡ Semiconductor
MSM64158A/64158AL
ABSOLUTE MAXIMUM RATINGS
1.5 V Spec. (MSM64158A)
(VDD = 0 V)
Parameter
Symbol
Condition
Rating
Unit
Power Supply Voltage 1
VSS1
Ta = 25°C
–2.0 to +0.3
V
Power Supply Voltage 2
Power Supply Voltage 3
Power Supply Voltage 4
Input Voltage 1
VSS2
VSS3
VSSL
VIN1
Ta = 25°C
Ta = 25°C
–4.0 to +0.3
–5.5 to +0.3
V
V
Ta = 25°C
–2.0 to +0.3
V
V
VSS1 input, Ta = 25°C
VSSL input, Ta = 25°C
VSS1 – 0.3 to +0.3
VSSL – 0.3 to +0.3
Input Voltage 2
VIN2
V
Output Voltage 1
VOUT1
VOUT2
VOUT3
VOUT4
TSTG
V
SS1 output, Ta = 25°C
VSS2 output, Ta = 25°C
VSS3 output, Ta = 25°C
VSSL output, Ta = 25°C
—
V
SS1 – 0.3 to +0.3
V
Output Voltage 2
VSS2 – 0.3 to +0.3
VSS3 – 0.3 to +0.3
VSSL – 0.3 to +0.3
–55 to +150
V
Output Voltage 3
V
Output Voltage 4
V
Storage Temperature
°C
RECOMMENDED OPERATING CONDITIONS
1.5 V Spec. (MSM64158A)
(VDD = 0 V)
Unit
Parameter
Symbol
Condition
Range
Operating Temperature
Top
—
–40 to +70
°C
BUPF = "0"
BUPF = "1"
—
–1.7 to –1.25
–1.7 to –1.15
30 to 35
Operating Voltage
VSS1
V
fXT
kHz
Crystal Oscillation Frequency
External RC Oscillator Resistance
ROS
—
1 M 10ꢀ
W
11/25
¡ Semiconductor
MSM64158A/64158AL
ELECTRICAL CHARACTERISTICS
1.5 V Spec. (MSM64158A)
DC Characteristics
(VDD = 0 V, VSS1 = –1.5 V, Ta = –40 to +70°C unless otherwise specified.)
Measuring
Parameter
Symbol
Condition
Min. Typ. Max. Unit
Circuit
+100ꢀ
Ca, Cb, C12 = 0.1 mF
Ta = –40 to +60°C
BUPF = "0"
–20ꢀ
–3.2 –3.0 –2.8
+100ꢀ
–20ꢀ
Ca, Cb, C12 = 0.1 mF
Ta = –40 to +70°C
BUPF = "0"
–3.2 –3.0 –2.7
V
VSS2 Voltage
VSS2
+100ꢀ
–20ꢀ
Ca, Cb, C12 = 0.1 mF
Ta = –40 to +60°C
BUPF = "1"
–3.2 –3.0 –2.5
+100ꢀ
–20ꢀ
Ca, Cb, C12 = 0.2 mF
Ta = –40 to +70°C
BUPF = "1"
–3.2 –3.0 –2.3
–4.7 –4.5 –4.2
1, 1'
+100ꢀ
–20ꢀ
Ca, Cb, C12 = 0.1 mF
Ta = –40 to +60°C
BUPF = "0"
+100ꢀ
–20ꢀ
Ca, Cb, C12 = 0.1 mF
Ta = –40 to +70°C
BUPF = "0"
–4.7 –4.5 –4.0
V
VSS3 Voltage
VSS3
+100ꢀ
–20ꢀ
Ca, Cb, C12 = 0.1 mF
Ta = –40 to +60°C
BUPF = "1"
–4.7 –4.5 –3.9
+100ꢀ
–20ꢀ
Ca, Cb, C12 = 0.2 mF
Ta = –40 to +70°C
BUPF = "1"
–4.7 –4.5 –3.7
BUPF = "0"
BUPF = "1"
–1.5 –1.3 –0.6
V
V
SSL Voltage
VSSL
VSTA
–1.9 –1.3 –0.6
Crystal Oscillation
Start Voltage
Oscillation start time: within 5 seconds
—
—
—
–1.45
–1.15
V
V
Crystal Oscillation
Hold Voltage
VHOLD
CG
—
—
10
10
15
1
External Crystal
Oscillator Capacitance
Internal Crystal
OscillatorCapacitance
RC Oscillation
—
—
15
30
20
pF
pF
CD
—
fCR
ROS = 1 MW
40
75 kHz
1'
Frequency
12/25
¡ Semiconductor
MSM64158A/64158AL
DC Characteristics (continued)
• 32.768 kHz crystal oscillation
(VDD = 0 V, VSS1 = –1.5 V, Ta = –40 to +70°C unless otherwise specified.)
Measuring
Parameter
Supply Current 1
Supply Current 1
Supply Current 2
Supply Current 2
Symbol
IDD1
Condition
Min. Typ. Max. Unit
Circuit
CPU in halt state
Ta = –40 to +40°C
Ta = +40 to +70°C
Ta = –40 to +40°C
Ta = +40 to +70°C
Ta = –40 to +40°C
Ta = +40 to +70°C
Ta = –40 to +40°C
Ta = +40 to +70°C
—
—
—
—
—
—
—
—
2.0 6.0 mA
BUPF = "0"
2.0
3.0
3.0
6.0
6.0
10
40
10
50
15
50
25
60
mA
mA
mA
mA
mA
mA
mA
CPU in halt state
BUPF = "1"
IDD1
1
CPU in operation
BUPF = "0"
IDD2
CPU in operation
BUPF = "1"
IDD2
10
• RC oscillation
(VDD = 0 V, VSS1 = –1.5 V, ROS = 1 MW, Ta = –40 to +70°C unless otherwise specified.)
Measuring
Parameter
Supply Current 1
Supply Current 1
Supply Current 2
Supply Current 2
Symbol
IDD1
Condition
Min. Typ. Max. Unit
Circuit
CPU in halt state
Ta = –40 to +40°C
Ta = +40 to +70°C
Ta = –40 to +40°C
Ta = +40 to +70°C
Ta = –40 to +40°C
Ta = +40 to +70°C
Ta = –40 to +40°C
Ta = +40 to +70°C
—
—
—
—
—
—
—
—
3.0
3.0
6.0
6.0
7.0
7.0
15
10
45
15
50
20
50
30
70
mA
mA
mA
mA
mA
mA
mA
mA
BUPF = "0"
CPU in halt state
BUPF = "1"
IDD1
1'
CPU in operation
BUPF = "0"
IDD2
CPU in operation
BUPF = "1"
IDD2
15
13/25
¡ Semiconductor
MSM64158A/64158AL
DC Characteristics (continued)
(VDD = 0 V, VSS1 = VSSL = –1.5 V, VSS2 = –3.0 V, VSS3 = –4.5 V, Ta = –40 to +70°C unless otherwise specified.)
Parameter
(Pin Name)
Measuring
Circuit
Symbol
Condition
Min. Typ. Max. Unit
IOH1
IOL1
IOH2
VOH1 = –0.5 V
–2.0 –0.6 –0.1 mA
0.1 0.6 2.0 mA
Output Current 1
(MD0, MD0)
VOL1 = VSS1 + 0.5 V
VOH2 = –0.2 V
(VDD level)
(VSS1 level)
(VSS1 level)
(VSS2 level)
(VSS2 level)
(VSS3 level)
—
4.0
—
—
—
—
—
—
—
–4.0 mA
mA
–4.0 mA
mA
–4.0 mA
mA
Output Current 2
(SEG0 to SEG35)
(COM1 to COM4)
IOMH2 VOMH2 = VSS1 + 0.2 V
IOMH2S OMH2S = VSS1 – 0.2 V
—
V
IOML2 VOML2 = VSS2 + 0.2 V
IOML2S VOML2S = VSS2 – 0.2 V
4.0
—
—
2
IOL2
IOH3
IOL3
VOL2 = VSS3 + 0.2 V
VOH3 = –0.5 V
4.0
—
–5.0 –2.1 –0.3 mA
0.1 0.7 2.0 mA
Output Current 3
(P6.0 to P6.3)
VOL3 = VSS1 + 0.5 V
Output Leakage
Current
(P6.0 to P6.3)
IOOH
IOOL
IIH1
VOH = VDD
VOL = VSS1
—
–0.3
1.0
0
—
—
0.3 mA
mA
—
Input Current 1
(P2.0 to P2.3)
(P3.0, P3.1)
VIH1 = VDD
VIH1 = VDD
VIL1 = VSS1
(when pulled down)
20 100 mA
IIH1Z
IIL1
(in a high-impedance state)
—
—
1.0 mA
mA
(P6.0 to P6.3)
–1.0
0
3
4
Input Current 2
(TST1, TST2)
IIH2
IIL2
IIH3
IIL3
VIH2 = VDD
VIL2 = VSS1
VIH3 = VDD
VIL3 = VSS1
0.3 0.75 1.5 mA
–1.0
1.0
—
0
mA
Input Current 3
(RESET)
10 100 mA
–1.0
—
—
0
0
mA
Input Voltage 1
(P2.0 to P2.3)
(P3.0, P3.1)
(P6.0 to P6.3)
(TST1, TST2)
(RESET)
VIH1
—
—
–0.3
–1.5
V
VIL1
—
–1.2
V
14/25
¡ Semiconductor
MSM64158A/64158AL
Measuring circuit 1
OSC1
VDD
Crystal
CG
32.768 kHz
OSC0
C1
MSM64158A
C12
C2
VSSL
VDD VSS1 VSS2
VSS3
Ca, Cb, C12
CL
CG
: 0.1 to 0.2 mF
: 0.1 mF
: 15 pF
Ca
Cb
CL
V
A
V
V
Measuring circuit 1'
OSC1
ROS
OSC0
C1
MSM64158A
C12
C2
VSSL
VDD VSS1 VSS2
VSS3
Ca, Cb, C12
CL
ROS
: 0.1 to 0.2 mF
: 0.1 mF
: 1 MW
Ca
Cb
CL
V
A
V
V
15/25
¡ Semiconductor
MSM64158A/64158AL
Measuring circuit 2
(*2)
VIH
A
MSM64158A
(*1)
VIL
VDD VSS1 VSS2 VSS3 VSSL
Measuring circuit 3
(*3)
A
MSM64158A
VDD VSS1 VSS2 VSS3 VSSL
16/25
¡ Semiconductor
MSM64158A/64158AL
Measuring circuit 4
VIH
Waveform
Monitoring
MSM64158A
(*3)
VIL
VDD VSS1 VSS2 VSS3 VSSL
*1 Input logic circuit to determine the specified measuring conditions.
*2 Measured at the specified output pins.
*3 Measured at the specified input pins.
17/25
¡ Semiconductor
MSM64158A/64158AL
ABSOLUTE MAXIMUM RATINGS
3.0 V Spec. (MSM64158AL)
(VDD = 0 V)
Parameter
Power Supply Voltage 1
Power Supply Voltage 2
Power Supply Voltage 3
Power Supply Voltage 4
Input Voltage 1
Symbol
VSS1
Condition
Ta = 25°C
Rating
–2.0 to +0.3
–4.0 to +0.3
–5.5 to +0.3
–4.0 to +0.3
VSS2 – 0.3 to +0.3
Unit
V
VSS2
Ta = 25°C
V
VSS3
Ta = 25°C
V
VSSL
Ta = 25°C
V
VIN1
VSS2 input, Ta = 25°C
V
Input Voltage 2
VIN2
V
SSL input, Ta = 25°C
V
SSL – 0.3 to +0.3
V
Output Voltage 1
VOUT1
VOUT2
VOUT3
TSTG
VSS2 output, Ta = 25°C
VSS3 output, Ta = 25°C
VSSL output, Ta = 25°C
—
VSS2 – 0.3 to +0.3
VSS3 – 0.3 to +0.3
VSSL – 0.3 to +0.3
–55 to +150
V
Output Voltage 2
V
Output Voltage 3
V
Storage Temperature
°C
RECOMMENDED OPERATING CONDITIONS
3.0 V Spec. (MSM64158AL)
(VDD = 0 V)
Unit
Parameter
Symbol
Condition
—
Range
Operating Temperature
Top
–40 to +70
–3.5 to –2.5
–3.5 to –2.0
°C
BUPF = "0"
BUPF = "1"
Operating Voltage
VSS2
V
Crystal Oscillation Frequency
fXT
30 to 66
kHz
—
—
External RC Oscillator Resistance
ROS
1 M 10ꢀ
W
18/25
¡ Semiconductor
MSM64158A/64158AL
ELECTRICAL CHARACTERISTICS
3.0 V Spec. (MSM64158AL)
DC Characteristics
(VDD = 0 V, VSS2 = –3.0 V, Ta = –40 to +70°C unless otherwise specified.)
Measuring
Parameter
VSS1 Voltage
Symbol
VSS1
VSS3
VSSL
VSTA
VHOLD
CG
Condition
Min. Typ. Max. Unit
Circuit
+100ꢀ
Ca, Cb, C12 = 0.1 mF
–1.7 –1.5 –1.3
–4.7 –4.5 –4.2
V
V
–20ꢀ
1
+100ꢀ
–20ꢀ
VSS3 Voltage
VSSL Voltage
Ca, Cb, C12 = 0.1 mF
1'
BUPF = "0"
BUPF = "1"
–1.5 –1.3 –0.6
–1.9 –1.3 –0.6
V
Crystal Oscillation
Start Voltage
Oscillation start time: within 5 seconds
—
—
10
10
15
—
—
—
15
40
–2.5
–2.0
30
V
Crystal Oscillation
Hold Voltage
—
V
1
External Crystal
Oscillator Capacitance
Internal Crystal
Oscillator Capacitance
RC Oscillation
—
pF
pF
CD
—
20
fCR
ROS = 1 MW
75 kHz
1'
Frequency
19/25
¡ Semiconductor
MSM64158A/64158AL
DC Characteristics (continued)
• 32.768 kHz crystal oscillation
(VDD = 0 V, VSS2 = –3.0 V, Ta = –40 to +70°C unless otherwise specified.)
Measuring
Parameter
Supply Current 1
Supply Current 1
Supply Current 2
Supply Current 2
Symbol
IDD1
Condition
Min. Typ. Max. Unit
Circuit
CPU in halt state
Ta = –40 to +40°C
Ta = +40 to +70°C
Ta = –40 to +40°C
Ta = +40 to +70°C
Ta = –40 to +40°C
Ta = +40 to +70°C
Ta = –40 to +40°C
Ta = +40 to +70°C
—
—
—
—
—
—
—
—
0.9 4.5 mA
0.9 30 mA
1.5 6.0 mA
BUPF = "0"
CPU in halt state
BUPF = "1"
IDD1
1.5
3.0
3.0
5.0
5.0
40
10
40
15
50
mA
mA
mA
mA
mA
1
CPU in operation
BUPF = "0"
IDD2
CPU in operation
BUPF = "1"
IDD2
• RC oscillation
(VDD = 0 V, VSS2 = –3.0 V, ROS = 1 MW, Ta = –40 to +70°C unless otherwise specified.)
Measuring
Parameter
Supply Current 1
Supply Current 1
Supply Current 2
Supply Current 2
Symbol
IDD1
Condition
Min. Typ. Max. Unit
Circuit
CPU in halt state
Ta = –40 to +40°C
Ta = +40 to +70°C
Ta = –40 to +40°C
Ta = +40 to +70°C
Ta = –40 to +40°C
Ta = +40 to +70°C
Ta = –40 to +40°C
Ta = +40 to +70°C
—
—
—
—
—
—
—
—
1.5 6.0 mA
BUPF = "0"
1.5
3.0
3.0
4.0
4.0
8.0
8.0
40
10
50
12
50
25
60
mA
mA
mA
mA
mA
mA
mA
CPU in halt state
BUPF = "1"
IDD1
1
CPU in operation
BUPF = "0"
IDD2
CPU in operation
BUPF = "1"
IDD2
20/25
¡ Semiconductor
MSM64158A/64158AL
DC Characteristics (continued)
(VDD = 0 V, VSS1 = VSSL = –1.5 V, VSS2 = –3.0 V, VSS3 = –4.5 V, Ta = –40 to +70°C unless otherwise specified.)
Parameter
(Pin Name)
Measuring
Circuit
Symbol
Condition
Min. Typ. Max. Unit
IOH1
IOL1
IOH2
VOH1 = –0.5 V
–6.0 –1.8 –0.7 mA
0.7 1.8 6.0 mA
Output Current 1
(MD0, MD0)
Output Current 2
(SEG0 to SEG35)
(COM1 to COM4)
VOL1 = VSS2 + 0.5 V
VOH2 = –0.2 V
(VDD level)
(VSS1 level)
(VSS1 level)
(VSS2 level)
(VSS2 level)
(VSS3 level)
—
4.0
—
—
—
—
—
—
—
–.04 mA
mA
–4.0 mA
mA
–4.0 mA
mA
IOMH2 VOMH2 = VSS1 + 0.2 V
IOMH2S OMH2S = VSS1 – 0.2 V
—
V
IOML2 VOML2 = VSS2 + 0.2 V
IOML2S VOML2S = VSS2 – 0.2 V
4.0
—
—
2
IOL2
IOH3
IOL3
VOL2 = VSS3 + 0.2 V
VOH3 = –0.5 V
4.0
—
–18 –6.0 –2.0 mA
0.7 1.6 6.0 mA
Output Current 3
(P6.0 to P6.3)
VOL3 = VSS2 + 0.5 V
Output Leakage
Current
(P6.0 to P6.3)
IOOH
IOOL
IIH1
VOH = VDD
VOL = VSS2
—
—
—
0.3 mA
mA
–0.3
—
Input Current 1
(P2.0 to P2.3)
(P3.0, P3.1)
VIH1 = VDD
IH1 = VDD
(when pulled down)
50 100 300 mA
IIH1Z
IIL1
V
(in a high-impedance state)
0
—
—
1.0 mA
mA
(P6.0 to P6.3)
VIL1 = VSS2
–1.0
0
3
4
Input Current 2
(TST1, TST2)
IIH2
IIL2
IIH3
IIL3
VIH2 = VDD
VIL2 = VSS2
VIH3 = VDD
VIL3 = VSS2
0.75 1.5 3.0 mA
–1.0
20
—
0
mA
40 200 mA
Input Current 3
(RESET)
–1.0
—
—
0
0
mA
Input Voltage 3
(P2.0 to P2.3)
(P3.0, P3.1)
(P6.0 to P6.3)
(TST1, TST2)
(RESET)
VIH1
—
—
–0.6
–3.0
V
VIL1
—
–2.4
V
21/25
¡ Semiconductor
MSM64158A/64158AL
Measuring circuit 1
OSC1
VDD
Crystal
CG
32.768 kHz
OSC0
C1
MSM64158AL
C12
C2
VSSL
VDD VSS2 VSS1
VSS3
Ca, Cb, C12, CL : 0.1 µF
CG
: 15 pF
Ca
Cb
CL
V
A
V
V
Measuring circuit 1'
OSC1
ROS
OSC0
C1
MSM64158AL
C12
C2
VSSL
VDD VSS2 VSS1
VSS3
Ca, Cb, C12, CL
ROS
: 0.1 mF
: 1 MW
Ca
Cb
CL
V
A
V
V
22/25
¡ Semiconductor
MSM64158A/64158AL
Measuring circuit 2
(*2)
VIH
A
MSM64158AL
(*1)
VIL
VDD VSS1 VSS2 VSS3 VSSL
Measuring circuit 3
(*3)
A
MSM64158AL
VDD VSS1 VSS2 VSS3 VSSL
23/25
¡ Semiconductor
MSM64158A/64158AL
Measuring circuit 4
VIH
Waveform
Monitoring
MSM64158AL
(*3)
VIL
VDD VSS1 VSS2 VSS3 VSSL
*1 Input logic circuit to determine the specified measuring conditions.
*2 Measured at the specified output pins.
*3 Measured at the specified input pins.
24/25
¡ Semiconductor
PACKAGE DIMENSIONS
QFP64-P-1414-0.80-BK
MSM64158A/64158AL
(Unit : mm)
Mirror finish
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
0.87 TYP.
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
25/25
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