MSM64162D-XXX [OKI]
Microcontroller, 4-Bit, MROM, CMOS, DIE;
| 型号： | MSM64162D-XXX |
| 厂家： | 
OKI ELECTRONIC COMPONETS |
| 描述： | Microcontroller, 4-Bit, MROM, CMOS, DIE 驱动器 转换器 微控制器 CD |
| 文件： | 总39页 (文件大小：310K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
E2E0033-38-93
This version: Sep. 1998
Previous version: Mar. 1996
¡ Semiconductor
MSM64162
4-Bit Microcontroller with Built-in RC Oscillation Type A/D Converter and LCD Driver
GENERAL DESCRIPTION
The MSM64162 is a low power 4-bit microcontroller that employs Oki's original CPU core nX-
4/20.
The MSM64162 has 2-channel RC oscillation type A/D converter, LCD driver for up to 80
segments, and buzzer output port. It is best suited for applications such as low power, high
precision thermometers and hygrometers.
FEATURES
• Operating range
Operating frequencies
Operating voltage
:
:
32.768 kHz, 400 kHz
1.25 to 1.7 V (1.5 V spec.)
2.0 to 3.5 V (3 V spec.)
2.2 to 3.5 V (3 V spec., 1/2 duty)
–40 to +85°C
Operating temperature
:
• Memory space
Internal program memory
Internal data memory
• Minimum instruction execution time
:
:
:
2016 bytes
128 nibbles
7.5 ms @ 400 kHz
91.6 ms @ 32.768 kHz
• RC oscillation type A/D converter
• LCD driver
(1) At 1/4 duty and 1/3 bias
(2) At 1/3 duty and 1/3 bias
(3) At 1/2 duty and 1/2 bias
• Buzzer driver
:
:
:
:
:
:
:
2 channels
24 outputs; duty ratio switchable by software
80 segments (max)
63 segments (max)
44 segments (max)
1 output (4 output modes selectable)
2 channels
• Capture circuit
• Watchdog timer
• Clock
:
32.768 kHz crystal oscillator and 400 kHz RC
oscillator (with an external resistor)
32.768 kHz/400 kHz (switchable by software)
32.768 kHz
CPU clock
:
:
:
Time base clock
• Power supply voltage
• I/O port
1.5 V/3 V (selectable by mask option)
Input-output port
Input port
Output port
:
:
:
2 ports ¥ 4 bits
1 port ¥ 4 bits
1 port ¥ 4 bits
(8 out of the 24 LCD driver outputs can be used
as output-only ports by mask option.)
• Interrupt sources
External interrupt
Internal interrupt
• Battery check circuit
:
:
:
2 sources
7 sources
1 (incorporated into the input-only port)
1/39
¡ Semiconductor
MSM64162
• Package options:
64-pin plastic QFP (QFP64-P-1420-1.00-BK) : (Product name : MSM64162-¥¥¥GS-BK)
80-pin plastic QFP (QFP80-P-1420-0.80-BK) : (Product name : MSM64162-¥¥¥GS-BK-F)
Chip
: (Product name : MSM64162-¥¥¥)
¥¥¥ indicates a code number.
2/39
¡ Semiconductor
MSM64162
BLOCK DIAGRAM
CPU CORE: nX-4/20
BSR
TR1
TR2
TR0
(4)
ROM
2016B
PCH
PCM PCL
A11 to A8
A7 to A0
ALU
HALT
MIEF
C
(4)
(4)
B
A
H
L
X
Y
RAM
128N
DB7 to DB0
ROMR
(8)
SP
TIMING
CONTROLLER
(8)
OSC2
OSC1
XT
2CLK
RSTG
TBC
INTC
WDT
XT
INT
P3.3
P3.2
P3.1
P3.0
PORT3
RESET
INT
TST1
TST2
P2.3
P2.2
P2.1
P2.0
5
INT
TST
VR
INT
PORT2
BC
VSSL
L0
L1
P1.3
P1.2
P1.1
P1.0
LCD
CAPR
PORT1
L23
INT
VSS1
VSS2
VSS3
C1
P0.3
P0.2
P0.1
P0.0
PORT0
BIAS
PORT ADDRESS
DB7 to DB0
C2
INT
VDD
BD
ADC
3/39
¡ Semiconductor
MSM64162
PIN CONFIGURATION (TOP VIEW)
1
2
3
4
5
6
7
8
9
P3.1
L0
L1
L2
L3
L4
L5
L6
L7
L8
51
50 P3.0
P2.3
49
48 P2.2
47
46
45
P2.1
P2.0
RT1
44 RS1
CS1
43
L9 10
L10 11
L11 12
L12 13
L13 14
L14 15
L15 16
42 IN1
41 IN0
40 CS0
39 RS0
38 CRT0
37 RT0
36 P0.3
35 P0.2
34 P0.1
L16/P5.0 17
L17/P5.1 18
19
P0.0
L18/P5.2
33
64-Pin Plastic QFP
4/39
¡ Semiconductor
MSM64162
PIN CONFIGURATION (TOP VIEW) (continued)
64
63
62
61
1
TST2
P0.0
P0.1
P0.2
P0.3
RT0
(NC)
CRT0
RS0
CS0
IN0
L19/P5.3
2
L18/P5.2
L17/P5.1
L16/P5.0
3
4
5
60 L15
59
6
(NC)
7
58 L14
57
8
L13
9
56 L12
55
L11
54 L10
53
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
IN1
(NC)
L9
52
CS1
(NC)
RS1
RT1
P2.0
P2.1
P2.2
P2.3
P3.0
(NC)
P3.1
(NC)
51 L8
50
49
48
47
L7
L6
L5
L4
46 L3
45
L2
L1
L0
C2
44
43
42
41
C1
80-Pin Plastic QFP
Notes: 1. Pins marked as (NC) are no-connection pins which are left open.
2. V should be supplied from pin 74. Pin 32 is internally connected to V
.
DD
DD
5/39
¡ Semiconductor
MSM64162
PAD CONFIGURATION
Pad Layout
50 49 48 47 46 45444342 4140 39 38 37 36 35 34 33
51
52
53
32
31
30
29
28
54
55
56
57
58
27
26
25
24
23
22
21
20
59
60
61
62
63
64
19
y
1
2 3 4 5 6 7 8 9 10 111213 14 15 16 17 18
x
Chip Size
: 4.69 mm ¥ 4.41 mm
: 350 mm (typ.)
: Chip center
: 110 mm ¥ 110 mm
: 130 mm ¥ 130 mm
: 180 mm
Chip Thickness
Coordinate Origin
Pad Hole Size
Pad Size
Minimum Pad Pitch
Note: The chip substrate voltage is V
.
DD
6/39
¡ Semiconductor
MSM64162
Pad Coordinates
Pad No.
1
Pad Name
L0
X (µm)
–2168
–1918
–1669
–1426
–1170
–934
–727
–519
–312
–104
104
Y (µm)
–2042
–2042
–2042
–2042
–2042
–2042
–2042
–2042
–2042
–2042
–2042
–2042
–2042
–2042
–2042
–2042
–2042
–2042
–2042
–1714
–1424
–1134
–844
Pad No.
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
Pad Name
P0.0
P0.1
P0.2
P0.3
RT0
X (µm)
2168
Y (µm)
2042
2042
2042
2042
2042
2042
2042
2042
2042
2042
2042
2042
2042
2042
2042
2042
2042
2042
1829
1563
1382
1017
688
2
L1
1899
3
L2
1628
4
L3
1364
5
L4
1100
6
L5
CRT0
RS0
CS0
829
7
L6
565
8
L7
349
9
L8
IN0
141
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
L9
IN1
–67
L10
CS1
–274
L11
311
RS1
RT1
–482
L12
527
–689
L13
791
P2.0
P2.1
P2.2
P2.3
P3.0
P3.1
P3.2
P3.3
BD
–911
L14
1062
1340
1618
1897
2168
2168
2168
2168
2168
2168
2168
2168
2168
2168
2168
2168
2168
2168
–1160
–1416
–1666
–1916
–2168
–2168
–2168
–2168
–2168
–2168
–2168
–2168
–2168
–2168
–2168
–2168
–2168
–2168
L15
L16/P5.0
L17/P5.1
L18/P5.2
L19/P5.3
L20/P6.0
L21/P6.1
L22/P6.2
L23/P6.3
OSC1
OSC2
VDD
P1.0
P1.1
P1.2
P1.3
VSS1
VSS2
VSSL
VSS3
C1
–554
328
–264
6
26
–353
–645
–826
–1254
–1435
–1616
–1796
316
XT
606
XT
896
RESET
TST1
TST2
1186
1476
1766
C2
7/39
¡ Semiconductor
MSM64162
PIN DESCRIPTIONS
The following tables describe the pin basic functions and secondary functions of the MSM64162.
For pin, "64QFP" and "80QFP" denote 64-pin flat package and 80-pin flat package respectively.
Basic Functions
Pin
Function Symbol
Pad
27
Type
—
Description
64QFP 80QFP
VDD
27
74
0 V power supply
Negative power supply (for 1.5 V spec.)
Bias output for drivig LCD (–1.5 V) (for 3.0 V spec.)
Negative power supply (for 3.0 V spec.)
Bias output for driving LCD (–3.0 V) (for 1.5 V spec.)
Bias output for driving LCD (–4.5 V).
VSS1
59
36
59
—
60
37
VSS2
60
—
Power
VSS3
—
—
—
62
63
64
40
41
42
62
63
64
Supply
C1
Pins for connecting a capacitor for generating LCD
driving bias
C2
VSSL
XT
Negative power supply for internal logic
(An internally generated constant voltage is present at
this pin.)
61
39
61
—
28
29
25
26
31
32
28
29
25
26
31
32
76
77
71
72
80
1
I
O
I
Low-speed clock oscillation input and output pins:
Connect to a crystal (32.768 kHz).
XT
Oscillation
OSC1
High-speed clock oscillation input and output pins:
Connect to an external resistor for oscillation (ROS).
Input pins for testing.
O
I
OSC2
TST1
Test
I
A pull-up resistor is internally connected to these pins.
System reset input pin.
TST2
Setting this pin to "L" level puts this device into a reset state.
Then, setting this pin to "H" level starts executing an
instruction from address 000H.
RESET
30
Reset
30
79
I
A pull-up resistor is internally connected to this pin.
8/39
¡ Semiconductor
MSM64162
Basic Functions (continued)
Pin
Function Symbol
64QFP 80QFP
Pad
33
Type
Description
4-bit input port (P0):
P0.0
P0.1
P0.2
P0.3
33
34
35
36
2
3
4
5
I
I
I
I
Selectable as pull-up resistor input, pull-down resistor
input, or high impedance input by the port 01 control
register (P01CON).
34
As secondary functions, P0.0 to P0.3 are assigned
external interrupt functions, P0.0 and P0.1 are assigned
a capture trigger function, and P0.3 is assigned an
analog comparator input for battery check.
35
36
P1.0
P1.1
P1.2
P1.3
55
56
57
58
29
31
34
35
55
56
57
58
O
O
O
O
4-bit output port (P1):
Selectable as NMOS open drain output or CMOS output
by the port 01 control register (P01CON). P1.0 is a
high current drive output port.
4-bit input-output port (P2):
P2.0
P2.1
P2.2
P2.3
P3.0
P3.1
P3.2
46
47
48
49
50
51
52
17
18
19
20
21
23
25
46
47
48
49
50
51
52
I/O
I/O
I/O
I/O
I/O
I/O
I/O
Following can be specified for each bit by the port 2
control registers 0 to 3 (P20CON to P23CON): (1) input
or output, (2) pull-up/pull-down resistor input or high
impedance input, and (3) NMOS open drain output or
CMOS output.
Ports
As secondary functions, P2.0 to P2.3 are assigned
external interrupt functions.
4-bit input-output port (P3):
Following can be specified for each bit by the port 3
control registers 0 to 3 (P30CON to P33CON): (1) input
or output, (2) pull-up/pull-down resistor input or high
impedance input, and (3) NMOS open drain output or
CMOS output.
As secondary functions, P3.0 to P3.3 are assigned
external interrupt functions, P3.3 is assigned a function
that monitors the RC oscillation clock for A/D converter.
P3.3/MON 53
26
27
53
54
I/O
O
Buzzer
BD
54
37
Output pin for the buzzer driver
Resistance temperature sensor connection pin
(for channel 0)
RT0
6
8
37
38
O
O
Resistance/capacitance temperature sensor connection
pin (for channel 0)
CRT0
38
RS0
CS0
IN0
39
40
41
9
39
40
41
O
O
I
Reference resistor connection pin (for channel 0)
Reference capacitor connection pin (for channel 0)
Input pin for RC oscillator circuit (for channel 0)
Resistance temperature sensor connection pin
(for channel 1)
A/D
10
11
Converter
RT1
45
16
45
O
RS1
CS1
IN1
44
43
42
15
13
12
44
43
42
O
O
I
Reference resistor connection pin (for channel 1)
Reference capacitor connection pin (for channel 1)
Input pin for RC oscillator circuit (for channel 1)
9/39
¡ Semiconductor
MSM64162
Basic Functions (continued)
Pin
Function Symbol
64QFP 80QFP
Pad
Type
Description
L0
L1
L2
L3
1
2
3
4
43
44
45
46
1
2
3
4
O
O
O
O
LCD segment and common signals output pins.
L4
L5
L6
L7
L8
L9
5
6
47
48
49
50
51
52
5
6
O
O
O
O
O
O
7
7
8
8
9
9
10
10
L10
L11
L12
L13
L14
L15
11
12
13
14
15
16
54
55
56
57
58
60
11
12
13
14
15
16
O
O
O
O
O
O
LCD
Driver
L16/P5.0
L17/P5.1
L18/P5.2
L19/P5.3
L20/P6.0
L21/P6.1
17
18
19
20
21
22
61
62
63
64
65
66
17
18
19
20
21
22
O
O
O
O
O
O
LCD segment and common signals output pins.
Functions as output ports by mask option.
L22/P6.2
L23/P6.3
23
24
68
69
23
24
O
O
10/39
¡ Semiconductor
MSM64162
Secondary Functions
Pin
64QFP 80QFP
Function Symbol
Pad
Type
Description
P0.0
P0.1
P0.2
P0.3
P2.0
P2.1
P2.2
P2.3
P3.0
P3.1
P3.2
P3.3
P0.0
P0.1
33
34
35
36
46
47
48
49
50
51
52
53
33
34
2
3
33
34
35
36
46
47
48
49
50
51
52
53
33
34
Secondary functions of P0.0 to P0.3:
Level-triggered external interrupt input pins.
The change of input signal level causes an interrupt to
occur.
I
4
5
17
18
19
20
21
23
25
26
2
Secondary functions of P2.0 to P2.3 and P3.0 to P3.3:
Level-triggered external interrupt input pins.
The change of input signal level causes an interrupt to
occur.
External
Interrupt
I
Capture
Trigger
Secondary functions of P0.0 and P0.1:
Capture circuit trigger input pins.
I
O
I
3
Secondary function of P3.3:
Monitor output pin for an RC oscillation clock for A/D
converter and a 400 kHz RC oscillation clock for the
system clock.
RC Oscillation
Monitor
P3.3
P0.3
53
36
26
5
53
36
Battery
Check
Secondary function of P0.3:
Analog comparator input pin for battery check.
11/39
¡ Semiconductor
MSM64162
MEMORY MAPS
Program Memory
Test program area
07FFH
07E0H
32 bytes
Contents of interrupt area
03BH
038H
032H
02FH
02CH
029H
026H
023H
020H
Watchdog interrupt
External interrupt (0)
External interrupt (1)
ADC interrupt
2016 bytes
256 Hz interrupt
32 Hz interrupt
03EH
16 Hz interrupt
1 Hz interrupt
Interrupt area
020H
4 Hz interrupt
CZP area
010H
Start address
000H
8 bits
Program Memory Map
Address 000H is the instruction execution start address by the system reset.
The CZP area from address 010H to address 01FH is the start address for the CZP subroutine of
1-byte call instruction.
The start address of interrupt subroutine is assigned to the interrupt address from address 020H
to 03DH.
The user area has 2016 bytes of address 000H to address 07DFH. No program can be stored in
the test program area.
12/39
¡ Semiconductor
MSM64162
Data Memory
The data memory area consists of 8 banks and each bank has 256 nibbles (256 ¥ 4 bits).
The data RAM is assigned to BANK 7 and peripheral ports are assigned to BANK 0.
7FFH
BANK 7
Data/Stack area (128 nibbles)
Data RAM area
780H
77FH
Unused area
700H
Contents of 000H to 07FH
07FH
Inaccessible area
SFR area
100H
0FFH
Unused area
BANK 0
080H
07FH
000H
000H
4 bits
Data Memory Map
The data RAM area (128 nibbles) is shared by the stack area. The stack is a memory starting from
address 7FFH toward the low-order addresses where 4 nibbles are used by Subroutine Call
Instruction and 8 nibbles are used by an interrupt.
The addresses 080H to 0FFH of BANK 0 and the addresses 700H to 77FH of BANK 7 are not
assigned as the data memory, so access to these addresses has no effect. Moreover, it is
impossible to access BANK 1 to BANK 6.
13/39
¡ Semiconductor
MSM64162
ABSOLUTE MAXIMUM RATINGS (1.5 V Spec.)
(VDD = 0 V)
Parameter
Power Supply Voltage 1
Power Supply Voltage 2
Power Supply Voltage 3
Power Supply Voltage 4
Input Voltage 1
Symbol
VSS1
Condition
Ta = 25°C
Rating
Unit
V
–2.0 to +0.3
VSS2
Ta = 25°C
–4.0 to +0.3
V
VSS3
Ta = 25°C
–5.5 to +0.3
V
VSSL
Ta = 25°C
–2.0 to +0.3
V
VIN1
VSS1 Input, Ta = 25°C
VSSL Input, Ta = 25°C
VSS1 Output, Ta = 25°C
VSS2 Output, Ta = 25°C
VSS3 Output, Ta = 25°C
VSSL Output, Ta = 25°C
—
VSS1 – 0.3 to +0.3
VSSL – 0.3 to +0.3
VSS1 – 0.3 to +0.3
VSS2 – 0.3 to +0.3
VSS3 – 0.3 to +0.3
VSSL – 0.3 to +0.3
–55 to +150
V
Input Voltage 2
VIN2
V
Output Voltage 1
VOUT1
VOUT2
VOUT3
VOUT4
TSTG
V
Output Voltage 2
V
Output Voltage 3
V
Output Voltage 4
V
Storage Temperature
°C
RECOMMENDED OPERATING CONDITIONS (1.5 V Spec.)
(VDD = 0 V)
Parameter
Operating Temperature
Operating Voltage
Symbol
Top
Condition
Range
–40 to +85
–1.7 to –1.25
Unit
°C
—
—
VSS1
V
External 400 kHz RC Oscillator
Resistance
ROS
fXT
—
—
250 to 500
30 to 35
kW
Crystal Oscillation Frequency
kHz
14/39
¡ Semiconductor
MSM64162
ELECTRICAL CHARACTERISTICS (1.5 V Spec.)
DC Characteristics
(VDD = 0 V, VSS1 = –1.5 V, Ta = –40 to +85°C unless otherwise specified)
Measuring
Parameter
Symbol
Condition
Min. Typ. Max. Unit
Circuit
+100%
–50%
VSS2 Voltage
VSS2 Ca, Cb, C12 = 0.1 mF
VSS3 Ca, Cb, C12 = 0.1 mF
–3.2
–3.0
–2.8
V
+100%
–50%
V
V
SS3 Voltage
SSL Voltage
–4.7
–1.5
—
–4.5
–1.3
—
–4.3
–0.6
V
V
V
VSSL
VSTA
—
Oscillation start time:
within 5 seconds
Crystal Oscillation
Start Voltage
–1.45
Crystal Oscillation
Hold Voltage
VHOLD
TSTOP
CG
—
—
—
—
0.1
10
—
—
15
—
15
12
220
—
—
–1.25
1000
20
V
ms
pF
Crystal Oscillation
Stop Detection Time
Internal Crystal
Oscillator Capacitance
External Crystal
Oscillator Capacitance
Internal Crystal
Oscillator Capacitance
Internal 400k RC
Oscillator Capacitance
400k RC Oscillation
Frequency
1
CGEX When external CG used
10
30
pF
CD
—
—
10
20
pF
COS
8
16
pF
External resistor ROS = 300 kW
SS1 = –1.25 to –1.7 V
fOSC
80
350
0
kHz
V
V
POR Generation
Voltage
When VSS1 is between VPOR1
and –1.5 V
VPOR1
VPOR2
VRB
–0.4
–1.5
POR Non-generation
Voltage
No POR when VSS1 is between
–1.2
V
V
POR2 and –1.5 V
Battery Check
Ta = 25°C
–0.73 –0.63 –0.53
–2.0
V
Reference Voltage
2
V
RB Temperature
DVRB
—
—
—
mV/°C
Variation
Notes: 1. "POR" denotes Power On Reset.
2. "T " indicates that if the crystal oscillator stops over the value of T
, the
STOP
STOP
system reset occurs.
15/39
¡ Semiconductor
MSM64162
DC Characteristics (continued)
(VDD = 0 V, VSS1 = –1.5 V, Ta = –40 to +85°C unless otherwise specified)
Measuring
Parameter
Symbol
Condition
Min. Typ. Max. Unit
Circuit
CPU in halt state
(400k RC oscillation halt)
Ta = –40 to +40°C
Ta = +40 to +85°C
—
—
—
—
2
2
5
5
5
mA
mA
mA
mA
Supply Current 1
Supply Current 2
IDD1
IDD2
30
15
40
CPU in operating state Ta = –40 to +40°C
(400k RC oscillation halt)
Ta = +40 to +85°C
CPU in operating state
(400k RC oscillation in operation)
Supply Current 3
Supply Current 4
Supply Current 5
IDD3
IDD4
IDD5
—
40
80
mA
ROS = 300 kW
CPU in halt state
1
RT0 = 10 kW
RT0 = 2 kW
—
—
150
600
230
900
mA
mA
(400k RC oscillation
halt), RC oscillator for
A/D converter is in
operating state
Battery check circuit in operating
state, CPU in operating state
(400k RC oscillation halt)
—
25
125
mA
16/39
¡ Semiconductor
MSM64162
DC Characteristics (continued)
(VDD = 0 V, VSS1 = VSSL = –1.5 V, VSS2 = –3.0 V, VSS3 = –4.5 V,
Ta = –40 to +85°C unless otherwise specified)
Measuring
Circuit
Parameter
(Pin Name)
Min.
Typ. Max.
Symbol
Condition
VOH1 = –0.5 V
Unit
Output Current 1
(P1.0)
IOH1
IOL1
–2.1
1.0
–0.7
3.0
–0.2
9.0
mA
mA
VOL1 = VSS1 + 0.5 V
Output Current 2
(P1.1 to P1.3)
(P2.0 to P2.3)
(P3.0 to P3.3)
IOH2
IOL2
VOH2 = –0.5 V
–2.1
0.2
–0.7
0.7
–0.2
2.1
mA
mA
VOL2 = VSS1 + 0.5 V
IOH3
IOL3
IOH4
IOL4
VOH3 = –0.7 V
–1.8
0.2
–0.6
0.6
–0.2
1.8
mA
mA
mA
mA
Output Current 3
(BD)
VOL3 = VSS1 + 0.7 V
VOH4 = –0.1 V
Output Current 4
(RT0, RT1, RS0, RS1,
CRT0, CS0, CS1)
–1.1
0.3
–0.6
0.6
–0.3
1.1
VOL4 = VSS1 + 0.1 V
Output Current 5
(When L16 to L23 are
configured as output
ports)
IOH5
IOL5
VOH5 = –0.5 V
–1.5
0.1
–0.5
0.5
–0.1
1.5
mA
mA
VOL5 = VSS1 + 0.5 V
2
Output Current 6
(OSC2)
IOH6
IOL6
IOH7
VOH6 = –0.5 V
–2.1
0.2
—
–0.7
0.7
—
–0.2
2.1
mA
mA
mA
mA
mA
mA
mA
mA
VOL6 = VSS1 + 0.5 V
VOH7 = –0.2 V
(VDD level)
–4.0
—
IOMH7 VOMH7 = VSS1 + 0.2 V (VSS1 level) 4.0
IOMH7S VOMH7S = VSS1 – 0.2 V (VSS1 level)
IOML7 VOML7 = VSS2 + 0.2 V (VSS2 level) 4.0
IOML7S VOML7S = VSS2 – 0.2 V (VSS2 level)
—
Output Current 7
(L0 to L23)
—
—
–4.0
—
—
—
—
–4.0
—
IOL7
VOL7 = VSS3 + 0.2 V (VSS3 level) 4.0
—
Output Leakage Current
(P1.0 to P1.3)
(P2.0 to P2.3)
(P3.0 to P3.3)
(RT0, RT1, RS0, RS1,
CRT0, CS0, CS1)
IOOH
VOH = VDD
—
—
—
0.3
—
mA
mA
IOOL
VOL = VSS1
–0.3
17/39
¡ Semiconductor
MSM64162
DC Characteristics (continued)
(VDD = 0 V, VSS1 = VSSL = –1.5 V, VSS2 = –3.0 V, VSS3 = –4.5 V,
Ta = –40 to +85°C unless otherwise specified)
Measuring
Circuit
Parameter
(Pin Name)
Min.
Typ. Max.
Symbol
Condition
Unit
IIH1
IIL1
VIH1 = VDD (when pulled down)
VIL1 = VSS1 (when pulled up)
VIH1 = VDD (in a high impedance state)
5
–60
0
18
–18
—
60
–5
1.0
0
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
Input Current 1
(P0.0 to P0.3)
(P2.0 to P2.3)
(P3.0 to P3.3)
IIH1Z
IIL1Z
IIH2
VIL1 = VSS1 (in a high impedance state) –1.0
—
VIH2 = VDD (when pulled down)
VIH2 = VDD (in a high impedance state)
5
0
18
60
1.0
0
Input Current 2
(IN0, IN1)
IIH2Z
IIL2Z
IIL3
—
3
VIL2 = VSS1 (in a high impedance state) –1.0
—
VIL3 = VSS1 (when pulled up)
–60
0
–22
—
–6
1.0
0
Input Current 3
(OSC1)
IIH3Z
IIL3Z
IIH4
VIH3 = VDD (in a high impedance state)
VIL3 = VSS1 (in a high impedance state) –1.0
—
VIH4 = VDD
VIL4 = VSS1
0
—
1.0
Input Current 4
(RESET, TST1, TST2)
IIL4
–1.5
–0.75 –0.3
VIH1
—
—
–0.3
–1.5
—
—
0
V
V
Input Voltage 1
(P0.0 to P0.3)
(P2.0 to P2.3)
(P3.0 to P3.3)
VIL1
–1.2
4
VIH2
VIL2
VIH3
VIL3
—
—
—
—
–0.3
–1.5
–0.3
–1.5
—
—
—
—
0
V
V
V
V
Input Voltage 2
(IN0, IN1, OSC1)
–1.2
0
Input Voltage 3
(RESET, TST1, TST2)
–1.2
18/39
¡ Semiconductor
MSM64162
DC Characteristics (continued)
(VDD = 0 V, VSS1 = VSSL = –1.5 V, VSS2 = –3.0 V, VSS3 = –4.5 V,
Ta = –40 to +85°C unless otherwise specified)
Measuring
Circuit
Parameter
(Pin Name)
Min.
Typ. Max.
Symbol
Condition
Unit
Hysteresis Width
(P0.0 to P0.3)
(P2.0 to P2.3)
DVT1
—
—
—
0.05
0.05
—
0.1
0.1
—
0.3
0.3
5.0
V
V
(P3.0 to P3.3)
4
1
Hysteresis Width
(RESET, TST1, TST2)
DVT2
Input Pin Capacitance
(P0.0 to P0.3)
(P2.0 to P2.3)
CIN
pF
(P3.0 to P3.3)
19/39
¡ Semiconductor
MSM64162
Measuring circuit 1
CS0
RT0
RI0
RT0
CS0
IN0
XT
Crystal
OSC1
32.768 kHz
ROS
XT
C1
C2
OSC2
VSSL
C12
VDD
VSS1 VSS2
VSS3
Cl
: 0.47 mF
A
Ca
Cb
Ca, Cb, C12 : 0.1 mF
Cl
ROS
RT0
CS0
RI0
: 300 kW
: 10 kW/2 kW
: 820 pF
V
V
V
: 10 kW
Measuring circuit 2
(*2)
VIH
A
(*1)
VIL
VDD
VSS1 VSS2
VSS3
VSSL
20/39
¡ Semiconductor
MSM64162
Measuring circuit 3
(*3)
A
VDD
VSS1 VSS2
VSS3 VSSL
Measuring circuit 4
VIH
Waveform
Monitoring
(*3)
VIL
VDD
VSS1 VSS2 VSS3 VSSL
*1 Input logic circuit to determine the specified measuring conditions.
*2 Measured at the specified output pins.
*3 Measured at the specified input pins.
21/39
¡ Semiconductor
MSM64162
A/D Converter Characteristics
(VDD = 0 V, VSS1 = –1.5 V, Ta = –40 to +85°C unless otherwise specified)
Measur-
ing
Circuit
Min. Typ. Max.
Parameter
Symbol
Condition
Unit
RS0, RS1,
RT0,
RT0-1,
RT1
Resistor
for Oscillation
—
—
2.0
1.0
kW
CS0, CT0, CS1 ≥ 740 pF
Input Current
Limiting Resistor
—
RI0, RI1
10
kW
—
5
fOSC1
fOSC2
fOSC3
Kf1
Resistor for oscillation = 2 kW
Resistor for oscillation = 10 kW
Resistor for oscillation = 200 kW
RT0, RT0-1, RT1 = 2 kW
165
41.8
2.55
3.89
0.990
221
52.2
3.04
4.18
1.0
256
60.6
3.53
4.35
1.010
kHz
kHz
kHz
—
Oscillation
Frequency
RS•RT Oscillation
Frequency Ratio (*)
Kf2
RT0, RT0-1, RT1 = 10 kW
—
Kf3
RT0, RT0-1, RT1 = 200 kW
0.0561 0.0584 0.0637
—
*
Kfx is the ratio of the oscillation frequency by a sensor resistor to the oscillation frequency
by a reference resistor in the same condition.
fOSCX (RT0–CS0 Oscillation)
fOSCX (RT0-1–CS0 Oscillation) fOSCX (RT1–CS1 Oscillation)
Kfx =
,
,
fOSCX (RS1–CS1 Oscillation)
fOSCX (RS0–CS0 Oscillation)
fOSCX (RS0–CS0 Oscillation)
(x = 1, 2, 3)
22/39
¡ Semiconductor
MSM64162
Measuring circuit 5
(CROSC1)
(CROSC0)
RT1 RS1 CS1 IN1
IN0 CS0 RS0 CRT0 RT0
RESET
TST1
TST2
P0.0
P0.1
P3.3
Frequency
Measurement
(fOSCX
)
D. U. T.
P0.2
P0.3
VDD
VSSL
VSS1
Cl
RT0, RT0-1, RT1 = 2 kW/10 kW/200 kW
RS0, RS1 = 10 kW
RI0, RI1 = 10 kW
CS0, CT0, CS1 = 820 pF
Cl = 0.1 mF
23/39
¡ Semiconductor
MSM64162
ABSOLUTE MAXIMUM RATINGS (3.0 V Spec.)
(VDD = 0 V)
Parameter
Power Supply Voltage 1
Power Supply Voltage 2
Power Supply Voltage 3
Power Supply Voltage 4
Input Voltage 1
Symbol
VSS1
Condition
Ta = 25°C
Rating
Unit
V
–2.0 to +0.3
VSS2
Ta = 25°C
–4.0 to +0.3
V
VSS3
Ta = 25°C
–5.5 to +0.3
V
VSSL
Ta = 25°C
–4.0 to +0.3
V
VIN1
VSS2 Input, Ta = 25°C
VSSL Input, Ta = 25°C
VSS1 Output, Ta = 25°C
VSS2 Output, Ta = 25°C
VSS3 Output, Ta = 25°C
VSSL Output, Ta = 25°C
—
VSS2 – 0.3 to +0.3
VSSL – 0.3 to +0.3
VSS1 – 0.3 to +0.3
VSS2 – 0.3 to +0.3
VSSL – 0.3 to +0.3
VSSL – 0.3 to +0.3
–55 to +150
V
Input Voltage 2
VIN2
V
Output Voltage 1
VOUT1
VOUT2
VOUT3
VOUT4
TSTG
V
Output Voltage 2
V
Output Voltage 3
V
Output Voltage 4
V
Storage Temperature
°C
RECOMMENDED OPERATING CONDITIONS (3.0 V Spec.)
(VDD = 0 V)
Unit
Parameter
Symbol
Condition
—
Range
Operating Temperature
Top
–40 to +85
°C
Using LCD driver with
"duty 1/2"
–3.5 to –2.2
–3.5 to –2.0
Operating Voltage
VSS2
V
Except using LCD driver
with "duty 1/2"
External 400 kHz RC Oscillator
Resistance
ROS
fXT
—
—
90 to 500
30 to 66
kW
Crystal Oscillation Frequency
kHz
24/39
¡ Semiconductor
MSM64162
ELECTRICAL CHARACTERISTICS (3.0 V Spec.)
DC Characteristics
(VDD = 0 V, VSS2 = –3.0 V, Ta = –40 to +85°C unless otherwise specified)
Measuring
Parameter
Symbol
Condition
Min. Typ. Max. Unit
Circuit
+100%
–50%
VSS1 Voltage
VSS1 Ca, Cb, C12 = 0.1 mF
VSS3 Ca, Cb, C12 = 0.1 mF
–1.7
–1.5
–1.3
V
+100%
–50%
VSS3 Voltage
–4.7
–1.9
—
–4.5
–1.3
—
–4.3
–0.6
–2.0
V
V
V
VSSL Voltage
VSSL
VSTA
—
Oscillation start time:
within 5 seconds
Crystal Oscillation
Start Voltage
Crystal Oscillation
Hold Voltage
VHOLD
TSTOP
CG
—
—
—
—
0.1
10
—
—
15
—
15
12
400
—
—
–2.0
1000
20
V
ms
pF
Crystal Oscillation
Stop Detection Time
Internal Crystal
Oscillator Capacitance
External Crystal
Oscillator Capacitance
Internal Crystal
Oscillator Capacitance
Internal 400k RC
Oscillator Capacitance
400k RC Oscillation
Frequency
1
CGEX When external CG used
10
30
pF
CD
—
—
10
20
pF
COS
8
16
pF
External resistor ROS = 100 kW
VSS2 = –2.0 to –3.5 V
When VSS2 is between VPOR1
and –3.0 V
fOSC
300
–0.7
–3.0
620
0
kHz
V
POR Generation
Voltage
VPOR1
VPOR2
VRB
POR Non-generation
Voltage
No POR when VSS2 is between
VPOR2 and –3.0 V
–2.0
V
Battery Check
Ta = 25°C
–0.73 –0.63 –0.53
–2.0
V
Reference Voltage
VRB Temperature
Variation
2
DVRB
—
—
—
mV/°C
Notes: 1. "POR" denotes Power On Reset.
2. "T " indicates that if the crystal oscillator stops over the value of T
, the
STOP
STOP
system reset occurs.
25/39
¡ Semiconductor
MSM64162
DC Characteristics (continued)
(VDD = 0 V, VSS2 = –3.0 V, Ta = –40 to +85°C unless otherwise specified)
Measuring
Parameter
Symbol
Condition
Min. Typ. Max. Unit
Circuit
CPU in halt state
(400k RC oscillation halt)
Ta = –40 to +40°C
Ta = +40 to +85°C
—
—
—
—
1.5
1.5
5.0
5.0
4.5
30
15
40
mA
mA
mA
mA
Supply Current 1
Supply Current 2
IDD1
IDD2
CPU in operating state Ta = –40 to +40°C
(400k RC oscillation halt)
Ta = +40 to +85°C
CPU in operating state
(400k RC oscillation in operation)
ROS = 100kW
Supply Current 3
Supply Current 4
Supply Current 5
IDD3
IDD4
IDD5
—
220
300
450
450
mA
CPU in halt state
1
RT0 = 10 kW
—
—
mA
mA
(400k RC oscillation
halt), RC oscillator for
A/D converter is in
RT0 = 2 kW
1300 2000
operating state
Battery check circuit in operating
state, CPU in operating state
(400k RC oscillation halt)
—
55
150
mA
26/39
¡ Semiconductor
MSM64162
DC Characteristics (continued)
(VDD = 0 V, VSS1 = VSSL = –1.5 V, VSS2 = –3.0 V, VSS3 = –4.5 V,
Ta = –40 to +85°C unless otherwise specified)
Measuring
Circuit
Parameter
(Pin Name)
Min.
Typ. Max.
Symbol
Condition
Unit
Output Current 1
(P1.0)
IOH1
IOL1
VOH1 = –0.5 V
–6.0
3.0
–2.0
8.0
–0.7
25
mA
mA
VOL1 = VSS2 + 0.5 V
VOH2 = –0.5 V
Output Current 2
(P1.1 to P1.3)
(P2.0 to P2.3)
(P3.0 to P3.3)
IOH2
IOL2
–6.0
0.7
–2.0
2.0
–0.7
6.0
mA
mA
VOL2 = VSS2 + 0.5 V
IOH3
IOL3
IOH4
IOL4
VOH3 = –0.7 V
–6.0
0.7
–2.0
2.0
–0.7
6.0
mA
mA
mA
mA
Output Current 3
(BD)
VOL3 = VSS2 + 0.7 V
VOH4 = –0.1 V
Output Current 4
(RT0, RT1, RS0, RS1,
CRT0, CS0, CS1)
–2.5
0.7
–1.3
1.3
–0.7
2.5
VOL4 = VSS2 + 0.1 V
Output Current 5
(When L16 to L23 are
configured as output
ports)
IOH5
IOL5
VOH5 = –0.5 V
–1.5
0.15
–0.6 –0.15 mA
VOL5 = VSS2 + 0.5 V
0.6
1.5
mA
2
IOH6
IOL6
IOH7
VOH6 = –0.5 V
–6.0
0.7
—
–2.0
2.0
—
–0.7
6.0
mA
mA
mA
mA
mA
mA
mA
mA
Output Current 6
(OSC2)
VOL6 = VSS2 + 0.5 V
VOH7 = –0.2 V
(VDD level)
–4.0
—
IOMH7 VOMH7 = VSS1 + 0.2 V (VSS1 level) 4.0
IOMH7S VOMH7S = VSS1 – 0.2 V (VSS1 level)
IOML7 VOML7 = VSS2 + 0.2 V (VSS2 level) 4.0
IOML7S VOML7S = VSS2 – 0.2 V (VSS2 level)
—
—
—
–4.0
—
Output Current 7
(L0 to L23)
—
—
—
–4.0
—
IOL7
VOL7 = VSS3 + 0.2 V (VSS3 level) 4.0
—
Output Leakage Current
(P1.0 to P1.3)
(P2.0 to P2.3)
(P3.0 to P3.3)
(RT0, RT1, RS0, RS1,
CRT0, CS0, CS1)
IOOH
VOH = VDD
—
—
—
0.3
—
mA
mA
IOOL
VOL = VSS2
–0.3
27/39
¡ Semiconductor
MSM64162
DC Characteristics (continued)
(VDD = 0 V, VSS1 = VSSL = –1.5 V, VSS2 = –3.0 V, VSS3 = –4.5 V,
Ta = –40 to +85°C unless otherwise specified)
Measuring
Circuit
Parameter
(Pin Name)
Min.
Typ. Max.
Symbol
Condition
Unit
IIH1
IIL1
VIH1 = VDD (when pulled down)
VIL1 = VSS2 (when pulled up)
VIH1 = VDD (in a high impedance state)
30
–300
0
90
–90
—
300
–30
1.0
0
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
Input Current 1
(P0.0 to P0.3)
(P2.0 to P2.3)
(P3.0 to P3.3)
IIH1Z
IIL1Z
IIH2
VIL1 = VSS2 (in a high impedance state) –1.0
—
VIH2 = VDD (when pulled down)
VIH2 = VDD (in a high impedance state)
30
0
90
300
1.0
0
Input Current 2
(IN0, IN1)
IIH2Z
IIL2Z
IIL3
—
3
VIL2 = VSS2 (in a high impedance state) –1.0
—
VIL3 = VSS2 (when pulled up)
–300
0
–110
—
–10
1.0
0
Input Current 3
(OSC1)
IIH3Z
IIL3Z
IIH4
VIH3 = VDD (in a high impedance state)
VIL3 = VSS2 (in a high impedance state) –1.0
—
VIH4 = VDD
VIL4 = VSS2
0
—
1.0
Input Current 4
(RESET, TST1, TST2)
IIL4
–3.0
–1.5 –0.75 mA
Input Voltage 1
(P0.0 to P0.3)
(P2.0 to P2.3)
(P3.0 to P3.3)
VIH1
VIL1
—
—
–0.6
–3.0
—
—
0
V
V
–2.4
VIH2
VIL2
VIH3
VIL3
—
—
—
—
–0.6
–3.0
–0.6
–3.0
—
—
—
—
0
V
V
V
V
4
Input Voltage 2
(IN0, IN1, OSC1)
–2.4
0
Input Voltage 3
(RESET, TST1, TST2)
–2.4
28/39
¡ Semiconductor
MSM64162
DC Characteristics (continued)
(VDD = 0 V, VSS1 = VSSL = –1.5 V, VSS2 = –3.0 V, VSS3 = –4.5 V,
Ta = –40 to +85°C unless otherwise specified)
Measuring
Circuit
Parameter
(Pin Name)
Min.
Typ. Max.
Symbol
Condition
Unit
Hysteresis Width
(P0.0 to P0.3)
(P2.0 to P2.3)
(P3.0 to P3.3)
DVT1
—
—
—
0.2
0.2
—
0.5
0.5
—
1.0
1.0
5.0
V
V
4
1
Hysteresis Width
(RESET, TST1, TST2)
DVT2
Input Pin Capacitance
(P0.0 to P0.3)
(P2.0 to P2.3)
CIN
pF
(P3.0 to P3.3)
29/39
¡ Semiconductor
MSM64162
Measuring circuit 1
CS0
RT0
RI0
RT0
CS0
IN0
XT
Crystal
OSC1
32.768 kHz
ROS
XT
C1
C2
OSC2
VSSL
C12
VDD
VSS2 VSS1
VSS3
Cl
: 0.47 mF
: 0.1 mF
: 100 kW
: 10 kW/2 kW
: 820 pF
A
Ca
Cb
Ca, Cb, C12
ROS
RT0
Cl
V
V
V
CS0
RI0
: 10 kW
Measuring circuit 2
(*2)
VIH
A
(*1)
VIL
VDD
VSS1 VSS2 VSS3 VSSL
30/39
¡ Semiconductor
MSM64162
Measuring circuit 3
(*3)
A
VDD
VSS1 VSS2 VSS3 VSSL
Measuring circuit 4
VIH
Waveform
Monitoring
(*3)
VIL
VDD
VSS1 VSS2 VSS3 VSSL
*1 Input logic circuit to determine the specified measuring conditions.
*2 Measured at the specified output pins.
*3 Measured at the specified input pins.
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¡ Semiconductor
MSM64162
A/D Converter Characteristics
(VDD = 0 V, VSS2 = –3.0 V, Ta = –40 to +85°C unless otherwise specified)
Measur-
Parameter
Symbol
Condition
Min. Typ. Max. Unit
ing
Circuit
RS0, RS1,
RT0,
RT0-1,
RT1
Resistor
for Oscillation
—
—
1.0
kW
kW
CS0, CT0, CS1 ≥ 740 pF
Input Current
Limiting Resistor
—
RI0, RI1
1.0
10
—
5
fOSC1
fOSC2
fOSC3
Kf1
Resistor for oscillation = 2 kW
Resistor for oscillation = 10 kW
Resistor for oscillation = 200 kW
RT0, RT0-1, RT1 = 2 kW
200
46.5
2.79
239
55.4
3.32
277
64.3
3.85
kHz
kHz
kHz
—
Oscillation
Frequency
4.115 4.22 4.326
0.990 1.0 1.010
0.0573 0.0616 0.0659
RS•RT Oscillation
Frequency Ratio(*)
Kf2
RT0, RT0-1, RT1 = 10 kW
—
Kf3
RT0, RT0-1, RT1 = 200 kW
—
*
Kfx is the ratio of the oscillation frequency by a sensor resistor to the oscillation frequency
by a reference resistor in the same condition.
f
f
OSCX (RT0–CS0 Oscillation)
fOSCX (RT0-1–CS0 Oscillation) fOSCX (RT1–CS1 Oscillation)
Kfx =
,
,
fOSCX (RS1–CS1 Oscillation)
OSCX (RS0–CS0 Oscillation)
(x = 1, 2, 3)
fOSCX (RS0–CS0 Oscillation)
32/39
¡ Semiconductor
MSM64162
Measuring circuit 5
(CROSC1)
(CROSC0)
RT1 RS1 CS1 IN1
IN0 CS0 RS0 CRT0 RT0
RESET
TST1
TST2
P0.0
P0.1
P3.3
Frequency
Measurement
(fOSCX
)
D. U. T.
P0.2
P0.3
VDD
VSSL
VSS2
Cl
RT0, RT0-1, RT1 = 2 kW/10 kW/200 kW
RS0, RS1 = 10 kW
RI0, RI1 = 10 kW
CS0, CT0, CS1 = 820 pF
Cl = 0.47 mF
33/39
¡ Semiconductor
MSM64162
FUNCTIONAL DESCRIPTION
• A/D converter (ADC)
The MSM64162 has a built-in 2-channel RC oscillation type A/D converter. The A/D converter
is composed of a 2-channel oscillation circuit, Counter A (CNTA0-4, a 4.8-digit decade counter),
Counter B (CNTB0-3, a 14-bit binary counter), and A/D Converter Control Registers 0 and 1
(ADCON0, ADCON1).
By counting oscillation frequencies that vary depending on a resistor or capacitor connected to
the RC oscillation circuit, the A/D converter converts resistance values or capacitance values to
corresponding digital values. By using a thermistor or humidity sensor as a resistance, a
thermometer or a hygrometer can be constructed. By applying a separate sensor to each channel
of the 2-channel RC oscillation circuit, it is also possible to extend measure ranges or measure at
two places.
• LCD driver (LCD)
The MSM64162 has a built-in LCD driver for 24 outputs.
The LCD driver consists of 21 ¥ 4-bit display registers (DSPR0-20), the Display Control Register
(DSPCON), a 24-output LCD driver circuit, and a bias generation circuit (BIAS).
There are three types of driving methods: 1/4 duty, 1/3 duty and 1/2 duty. Software selects the
duty mode.
A mask option can select either a common driver or a segment driver for each LCD driver pin.
A mask option can also specify assignment of each bit of the display register to each segment.
All the display registers must be selected by a mask option.
L16 to L23 of the LCD driver can be configured to be output ports by a mask option.
Therelationshipbetweentheduty,thebiasmethod,andthemaximumsegmentnumberfollows:
1/4 duty 1/3 bias method ------- 80 segments
1/3 duty 1/3 bias method ------- 63 segments
1/2 duty 1/2 bias method ------- 44 segments
• Buzzer driver (BD)
TheMSM64162hasabuilt-inbuzzerdriverwith2buzzeroutputfrequenciesand4buzzeroutput
modes. Each buzzer output is selected by the Buzzer Control Register (BDCON) and the Buzzer
Frequency Control Register (BFCON).
• Capture circuit (CAPR)
The MSM64162 captures 32 Hz to 256 Hz output of the time base counter at the falling of Port 0.0
or 0.1 (P0.0 or P0.1) to "L" level when the pull-up resistor input is chosen, or at the rising to "H"
levelwhenthepull-downresistorinputischosen. ThecapturecircuitiscomposedoftheCapture
Control Register (CAPCON) and the Capture Registers (CAPR0, CAPR1) that fetch output from
the time base counter.
• Watchdog timer (WDT)
The MSM64162 has a built-in watchdog timer to detect CPU malfunction. The watchdog timer
is composed of a 6-bit watchdog timer counter (WDTC) to count a 16 Hz output and a watchdog
timer control register (WDTCON) to reset WDTC.
34/39
¡ Semiconductor
MSM64162
• Clock generation circuit (2CLK)
The clock generation circuit (2CLK) in the MSM64162 contains a 32.768 kHz crystal oscillation
circuit, a400kHzRCoscillationcircuit, andaclockcontrolport. Thiscircuitgeneratesthesystem
clock (CLK) and the time base clock (32.768 kHz).
The system clock drives the CPU while the time base clock drives the time base counter and the
buzzer driver.
Via the contents of the frequency Control Register (FCON), the system clock can be switched
between 32.768 kHz (the output of the crystal oscillation circuit) and 400 kHz (the output of the
RC oscillation circuit).
Note: The oscillation frequency of the RC oscillation circuit varies depending on the value of
an external resistor (R ), operating power supply voltage (V ), and ambient
OS
DD
temperatures (Ta).
• Time base counter (TBC)
The MSM64162 has a built-in time base counter (TBC) that generates clocks to be supplied to
internal peripheral circuits. The time base counter is composed of 15 binary counters. The count
clock of the time base is driven by the oscillation clock (32.768 kHz) of the crystal oscillation
circuit. The output of the time base counter is used for the buzzer driver, the system reset circuit,
the watchdog timer, the time base interrupt, the sampling clocks of each port, and the capture
circuit.
• I/O port
Input-output ports (P2, P3) (8 bits)
: Pull-up (pull-down) resistor input or high-
impedance input, CMOS output or NMOS
open drain output: these can be specified for
each bit; external 0 interrupt
Input port (P0) (4 bits)
Output port (P1) (4 bits)
: Pull-up (pull-down) resistor input or high-
impedance input; external 1 interrupt
: CMOS output or NMOS open drain output
• Interrupt (INTC)
The MSM64162 has 9 interrupt sources (9 vector addresses), of which two are external interrupts
from ports and seven are internal interrupts.
Of the nine interrupt sources, only the watchdog interrupt cannot be disabled (non-maskable
interrupt). The other eight interrupts are controlled by the master interrupt enable flag (MI) and
the interrupt enable registers (IE0, IE1 and IE2). When an interrupt condition is met, the CPU
branches to a vector address corresponding to the interrupt source.
• Battery check circuit (BC)
The battery check circuit (BC) detects the level of the supply voltage by comparing the voltage
generated by an external supply-voltage dividing resistor (RBLD) with the internal reference
voltage (Vrb).
35/39
L C D
ROS
OSC2
OSC1
L23
L0
Crystal
32.768 kHz
VDD
C2
C1
XT
XT
C1
MSM64162-xxx
(1.5 V spec.)
RESET
P1.0
P1.1
P1.2
P1.3
P0.0
P0.1
P0.2
P0.3
C12
1.5 V
VSS3
Cb
Ca
VSS2
VSS1
VSSL
TST2
TST1
Cl
• Temperature
measurement
by two thermistors
• CG of crystal
oscillator : Internal
Switch matrix (4 ¥ 4)
RT0
RS0
RI0
CS0
RT1 RS1 CS1 RI1
Buzzer
OSC monitor
L C D
ROS
OSC2
OSC1
L23
L0
Crystal
32.768 kHz
VDD
C2
XT
XT
C2
MSM64162-xxx
(3.0 V spec.)
C1
VSS3
CGEX
RESET
P1.0
P1.1
C12
3 V
Cb
VSS2
P1.2
P1.3
P0.0
P0.1
P0.2
P0.3
VSS1
VSSL
TST2
TST1
Ca
Cl
• Temperature
measurement
by two thermistors
• Battery check
circuit is used
RT0
Switch matrix (4 ¥ 4)
• CGEX of crystal
oscillator : External
RS0
RI0
RT1 RS1 CS1 RI1
CS0
RBLD
Buzzer
OSC monitor
¡ Semiconductor
MSM64162
PACKAGE DIMENSIONS
(Unit : mm)
QFP64-P-1420-1.00-BK
Mirror finish
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
1.25 TYP.
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
38/39
¡ Semiconductor
MSM64162
(Unit : mm)
QFP80-P-1420-0.80-BK
Mirror finish
Package material
Lead frame material
Pin treatment
Epoxy resin
42 alloy
Solder plating
5 mm or more
Solder plate thickness
Package weight (g)
1.27 TYP.
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
39/39
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