MSM7540GS-K [OKI]

ADPCM Codec, A-Law, 1-Func, PDSO28, PLASTIC, SOP-28;
MSM7540GS-K
型号: MSM7540GS-K
厂家: OKI ELECTRONIC COMPONETS    OKI ELECTRONIC COMPONETS
描述:

ADPCM Codec, A-Law, 1-Func, PDSO28, PLASTIC, SOP-28

PC 光电二极管
文件: 总16页 (文件大小:156K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
FEDL7540-03  
This version: Nov. 1999  
Previous version: Aug. 1998  
¡ Semiconductor  
MSM7540/7560  
Single Rail ADPCM CODEC  
GENERAL DESCRIPTION  
TheMSM7540/7560aresinglechannelADPCMCODECICswhichperformmutualtranscoding  
between an analog voice band signal 300 to 3400 Hz and 32 kbps ADPCM serial data.  
Using advanced circuit technology, these devices operate using a single 5 V power supply and  
have low power consumption.  
The MSM7540/7560 are optimized for advanced digital cordless telephone system applications.  
FEATURES  
• Single 5 V Power Supply Operation  
• ADPCM Algorithm :  
Complies completely with 1988's version ITU-T  
G.721 (32 kbps)  
• Transmit/Receive Full-Duplex Operation  
• Transmit/Receive Synchronous Mode Only  
• Serial ADPCM Transmission Data Rate :  
• Serial PCM Transmission Data Rate :  
• PCM Interface Coding Format  
MSM7540 :  
32 kbps to 2048 kbps  
64 kbps to 2048 kbps  
A-laworLinear(14-bit,2'scompliment)Selectable  
m-laworLinear(14-bit,2'scompliment)Selectable  
MSM7560 :  
• Low Power Consumption  
Operating Mode :  
Power-Down Mode :  
60 mW Typ.  
1.0 mW Typ.  
• Two Analog Input Amplifier Stages :  
• Analog Output Stage :  
Externally Adjustable Gain  
Push-pull Drive (direct drive of 350 W + 120 nF)  
• Built-in Crystal Oscillator (10.368 MHz)  
• Built-in Reference Voltage Supply  
• Option Reset Specified by ITU-T G. 721/ADPCM  
• Package:  
28-pin plastic SOP  
(SOP28-P-430-1.27-K) (Product name: MSM7540GS-K)  
(Product name: MSM7560GS-K)  
1/16  
VDD AG DG  
X1  
X2  
+
AIN1  
GSX1  
AIN2  
XSYNC  
IS  
BCLKA  
0
1
1
0
P
/
+
A/D  
Conv.  
COM-  
PANDER  
RC-  
LPF  
ADPCM  
CODER  
BPF  
S
GSX2  
SG  
0
1
P
/
VREF  
PCMSO  
S
PDN  
S
/
CLOCK/  
TIMING  
PCMSI  
BCLKB  
PCMRI  
MCK  
P
RES  
LPS  
S
/
AOUT+  
–1  
P
1
0
P
/
PCMRO  
AOUT–  
PWI  
+
S
1
0
0
1
S
/
D/A  
Conv.  
EX-  
PANDER  
RC-  
LPF  
ADPCM  
DECODER  
LPF  
IR  
RSYNC  
VFRO  
P
FEDL7540-03  
MSM7540/7560  
¡ Semiconductor  
PIN CONFIGURATION (TOP VIEW)  
RES 1  
PCMRI 2  
PCMRO 3  
28 BCLKB  
27 BCLKA  
26 XSYNC  
25 RSYNC  
24 MCK  
23 X2  
4
5
IR  
IS  
6
PCMSI  
PCMSO  
LPS  
7
22 X1  
8
21 PDN  
9
20  
19  
18  
17  
16  
15  
DG  
VDD  
10  
11  
12  
13  
14  
AG  
AOUT+  
AOUT–  
PWI  
SG  
AIN1  
GSX1  
AIN2  
VFRO  
GSX2  
28-Pin Plastic SOP  
3/16  
FEDL7540-03  
MSM7540/7560  
¡ Semiconductor  
PIN AND FUNCTIONAL DESCRIPTIONS  
AIN1, AIN2, GSX1, GSX2  
Transmit analog inputs and the output for transmit gain adjustment.  
AIN1 (AIN2) connects to the inverting input of the internal transmit amplifier. GSX1 (GSX2)  
connects to the internal transmit amplifier output. Refer to Fig. 1 for gain adjustment.  
VFRO, AOUT+, AOUT–, PWI  
Receive analog output and the output for receive gain adjustment.  
VFRO is the receive filter output. AOUT+ and AOUT– are differential analog signal outputs  
which can directly drive Z = 350 W + 120 nF. Refer to Fig. 1 for gain adjustment.  
L
Analog Input  
C1  
C2  
R1  
R3  
AIN1  
+
R2  
R4  
GSX1  
AIN2  
+
to ENCODER  
GSX2  
Transmit Gain:  
= (R2/R1) ¥ (R4/R3)  
VFRO  
PWI  
from DECODER  
RS*  
Receive Gain:  
= (R6/R5)  
R5  
R6  
AOUT–  
+
ZL=120 nF  
V0  
Analog Output  
+ 350 W  
–1  
AOUT+  
* : Side Tone Pass (Gain = R6/RS)  
Figure 1 Analog Input/Output Interface  
4/16  
FEDL7540-03  
MSM7540/7560  
¡ Semiconductor  
SG  
Analog signal ground voltage output.  
The output voltage of this pin is approximately 2.4 V. Put bypass capacitors between this pin  
and the AG pin. During power-down this output voltage is 0 V. The external SG voltage, if  
necessary, should be used via a buffer.  
AG  
Analog ground.  
DG  
Digital ground.  
This ground is separated internally from the analog signal ground pin (AG). The DG pin must  
be kept as close as possible to AG on the PCB.  
VDD  
+5 V power supply.  
LPS  
PCM coding law selection.  
MSM7540 only ; if this pin goes to a "0" level, PCMSO, PCMSI, PCMRO, and PCMRI become the  
A-law character signal, and if these pins goes to a "1" level, the signal becomes a linear value  
character signal (2's complement).  
MSM7560 only ; if this pin goes to a "0" level, PCMSO, PCMSI, PCMRO, and PCMRI become the  
m-law character signal, and if these pins goes to a "1" level, the signal becomes a linear value  
character signal (2's complement).  
PDN  
Power down control input.  
If this pin is "0", this device is in the power-down state.  
Normally, this pin is set to "1".  
RES  
Optional reset input specified by ITU-T Recommendation G. 721.  
If this pin is "0", the device is in the reset state. The reset width (during "L") should be 125ms or  
more.  
MCK  
Master clock input.  
The frequency must be 10.368 MHz. The master clock signal may be asynchronous to BCLKA,  
BCLKB, XSYNC, and RSYNC.  
PCMSO  
Transmit PCM data output.  
PCM is output from MSB in synchronization with the rising edge of BCLKB and XSYNC.  
5/16  
FEDL7540-03  
MSM7540/7560  
¡ Semiconductor  
PCMSI  
Transmit PCM data input.  
This signal is converted to the transmit ADPCM data. PCM is shifted in synchronization with  
the falling edge of BCLKB. Normally, this pin is connected to PCMSO.  
PCMRO  
Receive PCM data output.  
PCM is the output signal after ADPCM decoder processing. This signal is output serially from  
MSB in synchronization with the rising edge of BCLKB and RSYNC.  
PCMRI  
Receive PCM data input.  
PCM is shifted on the falling edge of the BCLKB and input from MSB. Normally, this pin is  
connected to PCMRO.  
IS  
Transmit ADPCM signal output.  
After having encoded PCM with ADPCM, this signal is output from MSB in synchronization  
with the rising edge of BCLKA and XSYNC . This pin is an open drain output and remains in a  
high impedance state during power-down. IS requires a pull-up resistor.  
IR  
Receive ADPCM signal input.  
The ADPCM signal is shifted in series and synchronization with the falling edge of BCLKA and  
RSYNC, starting with MSB.  
BCLKB  
Shift clock input for the PCM data (PCMSO, PCMSI, PCMRO, PCMRI).  
The frequency is set in the 64 kHz to 2048 kHz range.  
XSYNC  
8 kHz synchronous signal input for transmit PCM and ADPCM data.  
Synchronize this signal with BCLKA and BCLKB signal. XSYNC is used to indicate the MSB of  
the serial PCM and ADPCM data stream.  
Be sure to input the XSYNC signal because it is also used as the input of the timing generator.  
RSYNC  
8 kHz synchronous signal input for receive PCM and ADPCM data.  
Synchronize this signal with BCLKA and BCLKB signal. RSYNC is used to indicate the MSB of  
the serial PCM and ADPCM data stream.  
BCLKA  
Shift clock input for the ADPCM data (IS, IR).  
The frequency is set in the range of 32 kHz to 2048 kHz.  
6/16  
FEDL7540-03  
MSM7540/7560  
¡ Semiconductor  
X1, X2  
Crystal oscillator (10.368 MHz) connection.  
Connect X2, the clock output pin, directly to the MCK pin.  
When using a conventional external clock of 10.368 MHz, X1 should be connected to the ground,  
leave X2 open, and provide the external clock through the MCK pin.  
<Using a self-oscilation circuit>  
MSM7540/60  
<Using an external clock>  
MSM7540/60  
X1  
X2 MCK  
X1  
X2 MCK  
10.368 MHz  
10.368 MHz  
7/16  
FEDL7540-03  
MSM7540/7560  
¡ Semiconductor  
ABSOLUTE MAXIMUM RATINGS  
Parameter  
Power Supply Voltage  
Analog Input Voltage  
Digital Input Voltage  
Storage Temperature  
Symbol  
VDD  
Condition  
Rating  
Unit  
–0.3 to +7  
–0.3 to VDD + 0.3  
–0.3 to VDD + 0.3  
–55 to +150  
V
V
VAIN  
VDIN  
V
TSTG  
°C  
RECOMMENDED OPERATING CONDITIONS  
Parameter  
Power Supply Voltage  
Operating Temperature  
Symbol  
VDD  
Condition  
Voltage must be fixed  
Min.  
Typ.  
Max.  
Unit  
V
4.5  
5.5  
Ta  
–25  
+25  
+70  
°C  
MCK, XSYNC, RSYNC, PCMRI,  
PCMSI, BCLKA, BCLKB, IR,  
LPS, PDN, RES  
VIH  
Input High Voltage  
Input Low Voltage  
2.2  
0
VDD  
0.6  
V
V
MCK, XSYNC, RSYNC, PCMRI,  
PCMSI, BCLKA, BCLKB, IR,  
LPS, PDN, RES  
VIL  
fMCK  
fBCKA  
fBCKB  
fSYMC  
DC  
Master Clock Frequency  
Bit Clock Freqency  
MCK  
0.01% 10.368  
+0.01% MHz  
BCLKA  
32  
64  
30  
8.0  
50  
2048  
kHz  
kHz  
kHz  
%
BCLKB  
2048  
Synchronous Signal Frequency  
Clock Duty Ratio  
XSYNC, RSYNC  
MCK, BCLKA, BCLKB  
MCK, XSYNC, RSYNC, PCMRI,  
PCMSI, BCLKA, BCLKB, IR,  
LPS, PDN, RES  
70  
tIr  
Digital Input Rise Time  
Digital Input Fall Time  
50  
50  
ns  
ns  
MCK, XSYNC, RSYNC, PCMRI,  
PCMSI, BCLKA, BCLKB, IR,  
LPS, PDN, RES  
tIf  
tXS  
tXS  
BCLKA, BCLKB to XSYNC  
XSYNC to BCLKA, BCLKB  
BCLKA, BCLKB to RSYNC  
RSYNC to BCLKA, BCLKB  
XSYNC, RSYNC  
100  
100  
100  
100  
ns  
ns  
ns  
ns  
ms  
ns  
ns  
W
Transmit Sync Signal Setting Time  
Receive Sync Signal Setting Time  
tRS  
tSR  
tWS  
tDS  
tDH  
RDL  
CDL  
CSG  
Synchronous Signal Width  
PCM, ADPCM Set-up Time  
PCM, ADPCM Hold Time  
1 BCLK  
100  
100  
500  
100  
IS (Pull-up Resistor)  
IS, PCMSO, PCMRO  
SG´GND  
Digital Output Load  
100  
pF  
mF  
Bypass Capacitor for SG  
10 + 0.1  
8/16  
FEDL7540-03  
MSM7540/7560  
¡ Semiconductor  
ELECTRICAL CHARACTERISTICS  
DC and Digital Interface Characteristics  
(VDD = 4.5 V to 5.5 V, Ta = –25°C to +70°C)  
Parameter  
Symbol  
Condition  
Operating Mode,  
Min.  
Typ.  
Max.  
Unit  
IDD1  
12  
24  
mA  
(When no signal, and  
Power Down Mode  
= 5.0 V)  
VDD  
Power Supply Current  
IDD2  
0.2  
0.5  
mA  
(When  
= 5.0 V)  
VDD  
Input High Voltage  
Input Low Voltage  
VIH  
VIL  
IIH  
IIL  
2.2  
0.0  
0.2  
5
VDD  
0.6  
2.0  
0.5  
0.4  
10  
V
V
VI = VDD  
VI = 0 V  
mA  
mA  
V
Input Leakage Current  
Output Low Voltage  
Output Leakage Current  
Input Capacitance  
VOL 1 LSTTL, Pull-up: 500 W  
0.0  
IO  
IS  
mA  
pF  
CIN  
Transmit Analog Interface Characteristics  
Parameter  
Input Resistance  
Symbol  
Condition  
Min.  
10  
Typ.  
Max.  
Unit  
MW  
kW  
pF  
RINX AIN1, AIN2  
Output Load Resistance  
Output Load Capacitance  
Output Amplitude  
RLGX GSX1, GSX2  
50  
CLGX GSX1, GSX2  
100  
*2.226  
+20  
VOGX GSX1, GSX2, RL = 50 kW  
VOFGX Pre–OPAMPs  
VPP  
mV  
V
Input Offset Voltage  
SG Output Voltage  
–20  
VSG  
RSG  
2.4  
40  
SG Output Impedance  
80  
kW  
SG´GND 10 mF + 0.1 mF  
(Rise time to 90% of max. level)  
SG Rise Time  
TSG  
700  
ms  
*
–3 dBm (600 W) = 0 dBm0, + 3.14 dBm0 = 2.226 V (MSM7540)  
PP  
–3 dBm (600 W) = 0 dBm0, + 3.17 dBm0 = 2.226 V (MSM7560)  
PP  
9/16  
FEDL7540-03  
MSM7540/7560  
¡ Semiconductor  
Receive Analog Interface Characteristics  
Parameter  
Input Resistance  
Symbol  
Condition  
Min.  
10  
Typ.  
Max.  
Unit  
MW  
kW  
kW  
pF  
RINPW PWI  
RLVF VFRO  
50  
Output Load Resistance  
Output Capacitance  
RLAO AOUT+, AOUT–  
CLVF VFRO  
1.2  
100  
CLAO AOUT+, AOUT–  
100  
pF  
VOVF VFRO  
RL = 50 kW  
*2.226  
*2.226  
VPP  
VPP  
RL = 1.2 kW  
Output Voltage Level  
AOUT+,  
VOAO  
ZL = 350 W  
AOUT–  
*2.226  
+100  
+20  
VPP  
mV  
mV  
+ 120 nF(See Fig.1)  
VOFVF VFRO  
–100  
–20  
Offset Voltage  
AOUT+, AOUT– (GAIN = 0 dB),  
Power amp only  
VOFAO  
GDB  
Power amp (0.3 to 3.4 kHz,  
ZL = 350 W + 120 nF)(See Fig.1)  
Open Loop Gain  
40  
dB  
*
–3 dBm (600 W) = 0 dBm0, + 3.14 dBm0 = 2.226 V (MSM7540)  
PP  
–3 dBm (600 W) = 0 dBm0, + 3.17 dBm0 = 2.226 V (MSM7560)  
PP  
10/16  
FEDL7540-03  
MSM7540/7560  
¡ Semiconductor  
AC Chracteristics  
(VDD = 4.5 V to 5.5 V, Ta = –25°C to +70°C)  
Condition  
Level  
Parameter  
Symbol  
Freq.  
(Hz)  
Min.  
Typ.  
Max.  
Unit  
Others  
(dBm0)  
LOSS T1  
0 to 60  
25  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
LOSS T2 300 to 3000  
–0.15  
+0.20  
Transmit Frequency  
Response  
LOSS T3  
LOSS T4  
LOSS T5  
LOSS T6  
1020  
3300  
Reference  
0
0
–0.15  
0
+0.80  
0.80  
3400  
3968.75  
14  
LOSS R1 0 to 3000  
–0.15  
+0.20  
LOSS R2  
LOSS R3  
LOSS R4  
LOSS R5  
SD T1  
SD T2  
SD T3  
SD T4  
SD T5  
SD R1  
SD R2  
SD R3  
SD R4  
SD R5  
GT T1  
GT T2  
GT T3  
GT T4  
GT T5  
GT R1  
GT R2  
GT R3  
GT R4  
GT R5  
1020  
3300  
Reference  
Receive Frequency  
Response  
(*1)  
(*1)  
–0.15  
0
+0.80  
0.80  
3400  
3968.75  
14  
3
35  
0
35  
Transmit Signal  
1020  
1020  
1020  
1020  
–30  
–40  
–45  
3
35  
to Distortion Ratio  
28  
23  
35  
0
35  
Receive Signal  
–30  
–40  
–45  
3
35  
to Distortion Ratio  
28  
23  
–0.2  
+0.2  
–10  
–40  
–50  
–55  
3
Reference  
Transmit Gain  
Tracking  
–0.2  
–0.5  
–1.2  
–0.2  
+0.2  
+0.5  
+1.2  
+0.2  
–10  
–40  
–50  
–55  
Reference  
Receive Gain  
Tracking  
–0.2  
–0.5  
–1.2  
+0.2  
+0.5  
+1.2  
*1 Use the P-message weighted filter  
11/16  
FEDL7540-03  
MSM7540/7560  
¡ Semiconductor  
AC Characteristics (Continued)  
(VDD = 4.5 V to 5.5 V, Ta = –25°C to +70°C)  
Condition  
Level  
Parameter  
Symbol  
Freq.  
(Hz)  
Min.  
Typ.  
Max.  
Unit  
Others  
(dBm0)  
–69  
(–72)  
–72  
NIDLT  
NIDLR  
AVT  
AIN = SG  
(*1)  
dBm0p  
(dBmp)  
Idle Channel Noise  
(*1)  
(*2)  
(–75)  
0.548  
(*3)  
0.548  
(*3)  
GSX2 0.488  
VFRO 0.488  
0.615 Vrms  
0.615 Vrms  
Absolute Signal  
Amplitude  
1020  
0
AVR  
PSRRT Noise Freq.  
Noise Level  
: 50 mVPP  
30  
dB  
dB  
ns  
ns  
ns  
ns  
ns  
Power Supply Noise  
Rejection Ratio  
30  
PSRRR : 0 to 50 kHz  
tSDX  
tSDR  
50  
50  
200  
200  
200  
200  
200  
Digital Output  
Delay Time  
1 LSTTL + 100 pF,  
tXD1, tRD1  
tXD2, tRD2  
tXD3, tRD3  
50  
50  
50  
Pull-up: 500 W  
*1 Use the P-message weighted filter  
*2 PCMRI input code "11010101"(MSM7540)  
"11111111"(MSM7560)  
*3 0.548 Vrms = 0 dBm0= –3 dBm  
Note: All ADPCM coder and decoder characteristics comply with ITU-T Recommendation  
G.721.  
12/16  
FEDL7540-03  
MSM7540/7560  
¡ Semiconductor  
TIMING DIAGRAM  
Transmit Side PCM/ADPCM Data Interface  
0
txs  
t1sx  
2
tws  
3
4
5
6
7
8
9
10  
11  
12  
13  
14  
BCLKB  
XSYNC  
PCMSO  
txd1  
txd2  
txd3  
MSB  
MSB  
LSB  
txd3  
tsdx  
LSB  
PCMSO  
(during linear)  
BCLKA  
0
t1sx  
2
3
4
5
6
7
8
9
10  
txs  
txd1  
txd2  
XSYNC  
IS  
txd3  
MSB  
LSB  
tsdx  
Receive Side PCM/ADPCM Data Interface  
BCLKA  
0
1
2
3
4
5
6
7
8
9
10  
10  
11  
12  
13  
14  
tsr  
trs  
tws  
RSYNC  
IR  
tds  
txd3  
txd3  
tdh  
MSB  
LSB  
4
0
trs  
1
2
3
5
6
7
8
9
BCLKB  
RSYNC  
PCMRO  
tsr  
trd1  
trd2  
MSB  
LSB  
trd3  
tsdx  
MSB  
LSB  
PCMRO  
(during linear)  
Note: Linear format  
A code of an input/output level is determined by the 14-bit 2'compliment.  
Refer to the table below for code format.  
Input/Output level  
MSB to LSB  
01111111111111  
00000000000000  
10000000000000  
+Full-scall  
0
–Full-scall  
13/16  
FEDL7540-03  
MSM7540/7560  
¡ Semiconductor  
APPLICATION CIRCUIT  
VDD  
MSM7540/7560GS  
ADPCM Algorithm  
Reset Input  
1
2
28  
27  
VDD  
RES  
BCLKB  
BCLKA  
Shift Clock Input for  
PCM, ADPCM Data  
(64 kHz to 2048 kHz)  
PCMRI  
Receive  
PCM Output  
3
4
26  
25  
PCMRO  
IR  
XSYNC  
RSYNC  
8 kHz Sync Signal Input  
Receive ADPCM Input  
5
24  
Transmit ADPCM Output  
IS  
MCK  
X2  
6
7
23  
22  
21  
20  
19  
PCMSI  
PCMSO  
LPS  
Transmit  
PCM Output  
10.368 MHz  
X1  
PDN  
VDD  
8
Power Down Input  
9
DG  
10  
AG  
AOUT+  
AOUT–  
PWI  
11  
12  
13  
18  
17  
16  
15  
SG  
AIN1  
GSX1  
AIN2  
Transmit Analog Input  
VFRO  
GSX2  
14  
Receive Analog Output  
(Push-Pull)  
14/16  
FEDL7540-03  
MSM7540/7560  
¡ Semiconductor  
PACKAGE DIMENSIONS  
SOP28-P-430-1.27-K  
(Unit : mm)  
Mirror finish  
Package material  
Lead frame material  
Pin treatment  
Epoxy resin  
42 alloy  
Solder plating  
Solder plate thickness  
Package weight (g)  
5 mm or more  
0.75 TYP.  
Notes for Mounting the Surface Mount Type Package  
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which  
are very susceptible to heat in reflow mounting and humidity absorbed in storage.  
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the  
product name, package name, pin number, package code and desired mounting conditions  
(reflow method, temperature and times).  
15/16  
FEDL7540-03  
NOTICE  
1.  
The information contained herein can change without notice owing to product and/or  
technical improvements. Before using the product, please make sure that the information  
being referred to is up-to-date.  
2.  
The outline of action and examples for application circuits described herein have been  
chosen as an explanation for the standard action and performance of the product. When  
planning to use the product, please ensure that the external conditions are reflected in the  
actual circuit, assembly, and program designs.  
3.  
4.  
When designing your product, please use our product below the specified maximum  
ratings and within the specified operating ranges including, but not limited to, operating  
voltage, power dissipation, and operating temperature.  
Oki assumes no responsibility or liability whatsoever for any failure or unusual or  
unexpected operation resulting from misuse, neglect, improper installation, repair, alteration  
or accident, improper handling, or unusual physical or electrical stress including, but not  
limited to, exposure to parameters beyond the specified maximum ratings or operation  
outside the specified operating range.  
5.  
6.  
Neither indemnity against nor license of a third party’s industrial and intellectual property  
right, etc. is granted by us in connection with the use of the product and/or the information  
and drawings contained herein. No responsibility is assumed by us for any infringement  
of a third party’s right which may result from the use thereof.  
The products listed in this document are intended for use in general electronics equipment  
for commercial applications (e.g., office automation, communication equipment,  
measurement equipment, consumer electronics, etc.). These products are not authorized  
for use in any system or application that requires special or enhanced quality and reliability  
characteristics nor in any system or application where the failure of such system or  
application may result in the loss or damage of property, or death or injury to humans.  
Such applications include, but are not limited to, traffic and automotive equipment, safety  
devices, aerospace equipment, nuclear power control, medical equipment, and life-support  
systems.  
7.  
Certain products in this document may need government approval before they can be  
exported to particular countries. The purchaser assumes the responsibility of determining  
thelegalityofexportoftheseproductsandwilltakeappropriateandnecessarystepsattheir  
own expense for these.  
8.  
9.  
No part of the contents contained herein may be reprinted or reproduced without our prior  
permission.  
MS-DOS is a registered trademark of Microsoft Corporation.  
Copyright 1999 Oki Electric Industry Co., Ltd.  
Printed in Japan  
16/16  

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