2N6399 [ONSEMI]
Silicon Controlled Rectifiers; 可控硅整流器器型号: | 2N6399 |
厂家: | ONSEMI |
描述: | Silicon Controlled Rectifiers |
文件: | 总8页 (文件大小:79K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
2N6394 Series
Preferred Device
Silicon Controlled Rectifiers
Reverse Blocking Thyristors
Designed primarily for half-wave ac control applications, such as
motor controls, heating controls and power supplies.
• Glass Passivated Junctions with Center Gate Geometry for Greater
Parameter Uniformity and Stability
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• Small, Rugged, Thermowatt Construction for Low Thermal
Resistance, High Heat Dissipation and Durability
• Blocking Voltage to 800 Volts
SCRs
12 AMPERES RMS
50 thru 800 VOLTS
• Device Marking: Logo, Device Type, e.g., 2N6394, Date Code
G
*MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
A
K
Rating
Symbol
Value
Unit
Peak Repetitive Off–State Voltage (Note 1.)
V
DRM,
Volts
(T = –40 to 125°C, Sine Wave,
50 to 60 Hz, Gate Open)
V
RRM
J
MARKING
2N6394
50
DIAGRAM
2N6395
2N6397
2N6399
100
400
800
4
On-State RMS Current
(180° Conduction Angles; T = 90°C)
I
12
A
A
T(RMS)
TO–220AB
CASE 221A
STYLE 3
YY WW
639x
C
Peak Non-Repetitive Surge Current
I
100
TSM
(1/2 Cycle, Sine Wave, 60 Hz, T = 90°C)
J
1
2
2
Circuit Fusing (t = 8.3 ms)
Forward Peak Gate Power
I t
40
20
A s
2
x
= 4, 5, 7 or 9
3
YY = Year
P
Watts
Watts
A
GM
WW = Work Week
(Pulse Width ≤ 1.0 µs, T = 90°C)
C
Forward Average Gate Power
P
0.5
2.0
G(AV)
PIN ASSIGNMENT
Cathode
(t = 8.3 ms, T = 90°C)
C
1
2
3
4
Forward Peak Gate Current
I
GM
Anode
(Pulse Width ≤ 1.0 µs, T = 90°C)
C
Gate
Operating Junction Temperature Range
T
J
–40 to
+125
°C
Anode
Storage Temperature Range
T
stg
–40 to
+150
°C
ORDERING INFORMATION
*Indicates JEDEC Registered Data
1. V
and V
for all types can be applied on a continuous basis. Ratings
Device
Package
TO220AB
TO220AB
TO220AB
TO220AB
Shipping
500/Box
500/Box
500/Box
500/Box
DRM
RRM
apply for zero or negative gate voltage; however, positive gate voltage shall
not be applied concurrent with negative potential on the anode. Blocking
voltages shall not be tested with a constant current source such that the
voltage ratings of the devices are exceeded.
2N6394
2N6395
2N6397
2N6399
Preferred devices are recommended choices for future use
and best overall value.
Semiconductor Components Industries, LLC, 2001
1
Publication Order Number:
April, 2001 – Rev. 3
2N6394/D
2N6394 Series
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Case
Symbol
Max
2.0
Unit
°C/W
°C
R
θ
JC
L
Maximum Lead Temperature for Soldering Purposes 1/8″ from Case for 10 Seconds
T
260
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted.)
C
Characteristic
Symbol
Min
Typ
Max
Unit
OFF CHARACTERISTICS
*Peak Repetitive Forward or Reverse Blocking Current
(V = Rated V or V , Gate Open) T = 25°C
I
, I
DRM RRM
–
–
–
–
10
2.0
µA
mA
AK
DRM
RRM
J
T = 125°C
J
ON CHARACTERISTICS
*Peak Forward On–State Voltage (Note 2.)
(I = 24 A Peak)
TM
V
–
–
1.7
5.0
0.7
–
2.2
30
1.5
–
Volts
mA
TM
*Gate Trigger Current (Continuous dc)
I
GT
(V = 12 Vdc, R = 100 Ohms)
D
L
*Gate Trigger Voltage (Continuous dc)
(V = 12 Vdc, R = 100 Ohms)
V
–
Volts
Volts
mA
GT
D
L
Gate Non–Trigger Voltage
V
GD
0.2
–
(V = 12 Vdc, R = 100 Ohms, T = 125°C)
D
L
J
*Holding Current
(V = 12 Vdc, Initiating Current = 200 mA, Gate Open)
D
I
6.0
1.0
50
2.0
H
Turn-On Time
t
–
µs
gt
(I = 12 A, I = 40 mAdc, V = Rated V )
DRM
TM
GT
D
Turn-Off Time (V = Rated V
)
t
q
µs
D
DRM
(I = 12 A, I = 12 A)
–
–
15
35
–
–
TM
R
(I = 12 A, I = 12 A, T = 125°C)
TM
R
J
DYNAMIC CHARACTERISTICS
Critical Rate–of–Rise of Off-State Voltage Exponential
(V = Rated V , T = 125°C)
dv/dt
–
50
–
V/µs
D
DRM
J
*Indicates JEDEC Registered Data
2. Pulse Test: Pulse Width ≤ 300 µsec, Duty Cycle ≤ 2%.
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2
2N6394 Series
Voltage Current Characteristic of SCR
+ Current
Anode +
V
TM
Symbol
Parameter
V
Peak Repetitive Off State Forward Voltage
Peak Forward Blocking Current
Peak Repetitive Off State Reverse Voltage
Peak Reverse Blocking Current
Peak On State Voltage
DRM
DRM
on state
I
I
H
I
at V
RRM
RRM
V
RRM
RRM
I
V
TM
+ Voltage
I
H
Holding Current
I
at V
DRM
Reverse Blocking Region
(off state)
DRM
Forward Blocking Region
(off state)
Reverse Avalanche Region
Anode –
20
18
130
125
120
115
110
105
100
16
α
α
180°
dc
α = CONDUCTION ANGLE
α = CONDUCTION ANGLE
14
12
90°
60°
α = 30°
10
8.0
6.0
4.0
dc
T ≈ 125°C
J
60°
α = 30°
95
90
2.0
0
90°
180°
7.0
0
1.0
2.0
3.0
4.0
5.0
6.0
8.0
0
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
I
, AVERAGE ONĆSTATE FORWARD CURRENT (AMPS)
I
T(AV)
, AVERAGE ONĆSTATE CURRENT (AMPS)
T(AV)
Figure 1. Current Derating
Figure 2. Maximum On–State Power Dissipation
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3
2N6394 Series
100
T = 25°C
J
70
50
125°C
30
20
10
7.0
5.0
3.0
2.0
100
1 CYCLE
95
90
1.0
0.7
0.5
85
80
75
70
65
60
0.3
0.2
T = 125°C
J
f = 60 Hz
SURGE IS PRECEDED AND
55
50
FOLLOWED BY RATED CURRENT
0.1
1.0
2.0
3.0
4.0
6.0
8.0 10
0.4
1.2
2.0
2.8
3.6
4.4
5.2
6.0
v
, INSTANTANEOUS ON-STATE VOLTAGE (VOLTS)
NUMBER OF CYCLES
TH
Figure 3. On–State Characteristics
Figure 4. Maximum Non–Repetitive Surge Current
1.0
0.7
0.5
0.3
0.2
Z
= R JC • r(t)
θ
θ
JC(t)
0.1
0.07
0.05
0.03
0.02
0.01
0.1
0.2 0.3 0.5
1.0
2.0 3.0
5.0
10
20 30
50
100
200 300 500
1.0 k
2.0 k 3.0 k 5.0 k
10 k
t, TIME (ms)
Figure 5. Thermal Response
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4
2N6394 Series
TYPICAL CHARACTERISTICS
300
200
3.0
OFFĆSTATE VOLTAGE = 12 V
OFFĆSTATE VOLTAGE = 12 V
2.0
100
70
50
1.0
0.7
0.5
30
20
T = -40°C
J
25°C
10
7.0
5.0
100°C
3.0
0.3
0.2
0.5 1.0
2.0
5.0
10
20
50 100
200
-40 -20
0
20
40
60
80
100 120 140 160
PULSE WIDTH (ms)
T , JUNCTION TEMPERATURE (°C)
J
Figure 6. Typical Gate Trigger Current
versus Pulse Width
Figure 7. Typical Gate Trigger Current
versus Temperature
1.1
1.0
0.9
0.8
0.7
0.6
30
20
OFFĆSTATE VOLTAGE = 12 V
OFFĆSTATE VOLTAGE = 12 V
10
7.0
5.0
0.5
0.4
3.0
-60 -40 -20
0
20
40
60
80
100 120 140
-60 -40 -20
0
20
40
60
80
100 120 140
T , JUNCTION TEMPERATURE (°C)
J
T , JUNCTION TEMPERATURE (°C)
J
Figure 8. Typical Gate Trigger Voltage
versus Temperature
Figure 9. Typical Holding Current
versus Temperature
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5
2N6394 Series
PACKAGE DIMENSIONS
TO–220AB
CASE 221A–07
ISSUE AA
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
SEATING
PLANE
–T–
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION Z DEFINES A ZONE WHERE ALL
BODY AND LEAD IRREGULARITIES ARE
ALLOWED.
B
F
C
T
S
INCHES
DIM MIN MAX
MILLIMETERS
MIN
14.48
9.66
4.07
0.64
3.61
2.42
2.80
0.36
12.70
1.15
4.83
2.54
2.04
1.15
5.97
0.00
1.15
---
MAX
15.75
10.28
4.82
0.88
3.73
2.66
3.93
0.55
14.27
1.52
5.33
3.04
2.79
1.39
6.47
1.27
---
4
3
A
B
C
D
F
0.570
0.380
0.160
0.025
0.142
0.095
0.110
0.014
0.500
0.045
0.190
0.100
0.080
0.045
0.235
0.000
0.045
---
0.620
0.405
0.190
0.035
0.147
0.105
0.155
0.022
0.562
0.060
0.210
0.120
0.110
0.055
0.255
0.050
---
Q
A
K
1
2
U
H
G
H
J
Z
K
L
N
Q
R
S
T
R
L
V
J
G
U
V
Z
D
0.080
2.04
N
STYLE 3:
PIN 1. CATHODE
2. ANODE
3. GATE
4. ANODE
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6
2N6394 Series
Notes
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7
2N6394 Series
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including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or
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2N6394/D
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