2N6399 [ONSEMI]

Silicon Controlled Rectifiers; 可控硅整流器器
2N6399
型号: 2N6399
厂家: ONSEMI    ONSEMI
描述:

Silicon Controlled Rectifiers
可控硅整流器器

触发装置 可控硅整流器 局域网
文件: 总8页 (文件大小:79K)
中文:  中文翻译
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2N6394 Series  
Preferred Device  
Silicon Controlled Rectifiers  
Reverse Blocking Thyristors  
Designed primarily for half-wave ac control applications, such as  
motor controls, heating controls and power supplies.  
Glass Passivated Junctions with Center Gate Geometry for Greater  
Parameter Uniformity and Stability  
http://onsemi.com  
Small, Rugged, Thermowatt Construction for Low Thermal  
Resistance, High Heat Dissipation and Durability  
Blocking Voltage to 800 Volts  
SCRs  
12 AMPERES RMS  
50 thru 800 VOLTS  
Device Marking: Logo, Device Type, e.g., 2N6394, Date Code  
G
*MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
A
K
Rating  
Symbol  
Value  
Unit  
Peak Repetitive Off–State Voltage (Note 1.)  
V
DRM,  
Volts  
(T = –40 to 125°C, Sine Wave,  
50 to 60 Hz, Gate Open)  
V
RRM  
J
MARKING  
2N6394  
50  
DIAGRAM  
2N6395  
2N6397  
2N6399  
100  
400  
800  
4
On-State RMS Current  
(180° Conduction Angles; T = 90°C)  
I
12  
A
A
T(RMS)  
TO–220AB  
CASE 221A  
STYLE 3  
YY WW  
639x  
C
Peak Non-Repetitive Surge Current  
I
100  
TSM  
(1/2 Cycle, Sine Wave, 60 Hz, T = 90°C)  
J
1
2
2
Circuit Fusing (t = 8.3 ms)  
Forward Peak Gate Power  
I t  
40  
20  
A s  
2
x
= 4, 5, 7 or 9  
3
YY = Year  
P
Watts  
Watts  
A
GM  
WW = Work Week  
(Pulse Width 1.0 µs, T = 90°C)  
C
Forward Average Gate Power  
P
0.5  
2.0  
G(AV)  
PIN ASSIGNMENT  
Cathode  
(t = 8.3 ms, T = 90°C)  
C
1
2
3
4
Forward Peak Gate Current  
I
GM  
Anode  
(Pulse Width 1.0 µs, T = 90°C)  
C
Gate  
Operating Junction Temperature Range  
T
J
–40 to  
+125  
°C  
Anode  
Storage Temperature Range  
T
stg  
–40 to  
+150  
°C  
ORDERING INFORMATION  
*Indicates JEDEC Registered Data  
1. V  
and V  
for all types can be applied on a continuous basis. Ratings  
Device  
Package  
TO220AB  
TO220AB  
TO220AB  
TO220AB  
Shipping  
500/Box  
500/Box  
500/Box  
500/Box  
DRM  
RRM  
apply for zero or negative gate voltage; however, positive gate voltage shall  
not be applied concurrent with negative potential on the anode. Blocking  
voltages shall not be tested with a constant current source such that the  
voltage ratings of the devices are exceeded.  
2N6394  
2N6395  
2N6397  
2N6399  
Preferred devices are recommended choices for future use  
and best overall value.  
Semiconductor Components Industries, LLC, 2001  
1
Publication Order Number:  
April, 2001 – Rev. 3  
2N6394/D  
2N6394 Series  
THERMAL CHARACTERISTICS  
Characteristic  
Thermal Resistance, Junction to Case  
Symbol  
Max  
2.0  
Unit  
°C/W  
°C  
R
θ
JC  
L
Maximum Lead Temperature for Soldering Purposes 1/8from Case for 10 Seconds  
T
260  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted.)  
C
Characteristic  
Symbol  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
*Peak Repetitive Forward or Reverse Blocking Current  
(V = Rated V or V , Gate Open) T = 25°C  
I
, I  
DRM RRM  
10  
2.0  
µA  
mA  
AK  
DRM  
RRM  
J
T = 125°C  
J
ON CHARACTERISTICS  
*Peak Forward On–State Voltage (Note 2.)  
(I = 24 A Peak)  
TM  
V
1.7  
5.0  
0.7  
2.2  
30  
1.5  
Volts  
mA  
TM  
*Gate Trigger Current (Continuous dc)  
I
GT  
(V = 12 Vdc, R = 100 Ohms)  
D
L
*Gate Trigger Voltage (Continuous dc)  
(V = 12 Vdc, R = 100 Ohms)  
V
Volts  
Volts  
mA  
GT  
D
L
Gate Non–Trigger Voltage  
V
GD  
0.2  
(V = 12 Vdc, R = 100 Ohms, T = 125°C)  
D
L
J
*Holding Current  
(V = 12 Vdc, Initiating Current = 200 mA, Gate Open)  
D
I
6.0  
1.0  
50  
2.0  
H
Turn-On Time  
t
µs  
gt  
(I = 12 A, I = 40 mAdc, V = Rated V )  
DRM  
TM  
GT  
D
Turn-Off Time (V = Rated V  
)
t
q
µs  
D
DRM  
(I = 12 A, I = 12 A)  
15  
35  
TM  
R
(I = 12 A, I = 12 A, T = 125°C)  
TM  
R
J
DYNAMIC CHARACTERISTICS  
Critical Rate–of–Rise of Off-State Voltage Exponential  
(V = Rated V , T = 125°C)  
dv/dt  
50  
V/µs  
D
DRM  
J
*Indicates JEDEC Registered Data  
2. Pulse Test: Pulse Width 300 µsec, Duty Cycle 2%.  
http://onsemi.com  
2
2N6394 Series  
Voltage Current Characteristic of SCR  
+ Current  
Anode +  
V
TM  
Symbol  
Parameter  
V
Peak Repetitive Off State Forward Voltage  
Peak Forward Blocking Current  
Peak Repetitive Off State Reverse Voltage  
Peak Reverse Blocking Current  
Peak On State Voltage  
DRM  
DRM  
on state  
I
I
H
I
at V  
RRM  
RRM  
V
RRM  
RRM  
I
V
TM  
+ Voltage  
I
H
Holding Current  
I
at V  
DRM  
Reverse Blocking Region  
(off state)  
DRM  
Forward Blocking Region  
(off state)  
Reverse Avalanche Region  
Anode –  
20  
18  
130  
125  
120  
115  
110  
105  
100  
16  
α
α
180°  
dc  
α = CONDUCTION ANGLE  
α = CONDUCTION ANGLE  
14  
12  
90°  
60°  
α = 30°  
10  
8.0  
6.0  
4.0  
dc  
T 125°C  
J
60°  
α = 30°  
95  
90  
2.0  
0
90°  
180°  
7.0  
0
1.0  
2.0  
3.0  
4.0  
5.0  
6.0  
8.0  
0
1.0  
2.0  
3.0  
4.0  
5.0  
6.0  
7.0  
8.0  
I
, AVERAGE ONĆSTATE FORWARD CURRENT (AMPS)  
I
T(AV)  
, AVERAGE ONĆSTATE CURRENT (AMPS)  
T(AV)  
Figure 1. Current Derating  
Figure 2. Maximum On–State Power Dissipation  
http://onsemi.com  
3
2N6394 Series  
100  
T = 25°C  
J
70  
50  
125°C  
30  
20  
10  
7.0  
5.0  
3.0  
2.0  
100  
1 CYCLE  
95  
90  
1.0  
0.7  
0.5  
85  
80  
75  
70  
65  
60  
0.3  
0.2  
T = 125°C  
J
f = 60 Hz  
SURGE IS PRECEDED AND  
55  
50  
FOLLOWED BY RATED CURRENT  
0.1  
1.0  
2.0  
3.0  
4.0  
6.0  
8.0 10  
0.4  
1.2  
2.0  
2.8  
3.6  
4.4  
5.2  
6.0  
v
, INSTANTANEOUS ON-STATE VOLTAGE (VOLTS)  
NUMBER OF CYCLES  
TH  
Figure 3. On–State Characteristics  
Figure 4. Maximum Non–Repetitive Surge Current  
1.0  
0.7  
0.5  
0.3  
0.2  
Z
= R JC r(t)  
θ
θ
JC(t)  
0.1  
0.07  
0.05  
0.03  
0.02  
0.01  
0.1  
0.2 0.3 0.5  
1.0  
2.0 3.0  
5.0  
10  
20 30  
50  
100  
200 300 500  
1.0 k  
2.0 k 3.0 k 5.0 k  
10 k  
t, TIME (ms)  
Figure 5. Thermal Response  
http://onsemi.com  
4
2N6394 Series  
TYPICAL CHARACTERISTICS  
300  
200  
3.0  
OFFĆSTATE VOLTAGE = 12 V  
OFFĆSTATE VOLTAGE = 12 V  
2.0  
100  
70  
50  
1.0  
0.7  
0.5  
30  
20  
T = -40°C  
J
25°C  
10  
7.0  
5.0  
100°C  
3.0  
0.3  
0.2  
0.5 1.0  
2.0  
5.0  
10  
20  
50 100  
200  
-40 -20  
0
20  
40  
60  
80  
100 120 140 160  
PULSE WIDTH (ms)  
T , JUNCTION TEMPERATURE (°C)  
J
Figure 6. Typical Gate Trigger Current  
versus Pulse Width  
Figure 7. Typical Gate Trigger Current  
versus Temperature  
1.1  
1.0  
0.9  
0.8  
0.7  
0.6  
30  
20  
OFFĆSTATE VOLTAGE = 12 V  
OFFĆSTATE VOLTAGE = 12 V  
10  
7.0  
5.0  
0.5  
0.4  
3.0  
-60 -40 -20  
0
20  
40  
60  
80  
100 120 140  
-60 -40 -20  
0
20  
40  
60  
80  
100 120 140  
T , JUNCTION TEMPERATURE (°C)  
J
T , JUNCTION TEMPERATURE (°C)  
J
Figure 8. Typical Gate Trigger Voltage  
versus Temperature  
Figure 9. Typical Holding Current  
versus Temperature  
http://onsemi.com  
5
2N6394 Series  
PACKAGE DIMENSIONS  
TO–220AB  
CASE 221A–07  
ISSUE AA  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
SEATING  
PLANE  
–T–  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION Z DEFINES A ZONE WHERE ALL  
BODY AND LEAD IRREGULARITIES ARE  
ALLOWED.  
B
F
C
T
S
INCHES  
DIM MIN MAX  
MILLIMETERS  
MIN  
14.48  
9.66  
4.07  
0.64  
3.61  
2.42  
2.80  
0.36  
12.70  
1.15  
4.83  
2.54  
2.04  
1.15  
5.97  
0.00  
1.15  
---  
MAX  
15.75  
10.28  
4.82  
0.88  
3.73  
2.66  
3.93  
0.55  
14.27  
1.52  
5.33  
3.04  
2.79  
1.39  
6.47  
1.27  
---  
4
3
A
B
C
D
F
0.570  
0.380  
0.160  
0.025  
0.142  
0.095  
0.110  
0.014  
0.500  
0.045  
0.190  
0.100  
0.080  
0.045  
0.235  
0.000  
0.045  
---  
0.620  
0.405  
0.190  
0.035  
0.147  
0.105  
0.155  
0.022  
0.562  
0.060  
0.210  
0.120  
0.110  
0.055  
0.255  
0.050  
---  
Q
A
K
1
2
U
H
G
H
J
Z
K
L
N
Q
R
S
T
R
L
V
J
G
U
V
Z
D
0.080  
2.04  
N
STYLE 3:  
PIN 1. CATHODE  
2. ANODE  
3. GATE  
4. ANODE  
http://onsemi.com  
6
2N6394 Series  
Notes  
http://onsemi.com  
7
2N6394 Series  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes  
without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular  
purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability,  
including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or  
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be  
validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others.  
SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or  
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alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.  
PUBLICATION ORDERING INFORMATION  
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CENTRAL/SOUTH AMERICA:  
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P.O. Box 5163, Denver, Colorado 80217 USA  
Spanish Phone: 303–308–7143 (Mon–Fri 8:00am to 5:00pm MST)  
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Phone: 81–3–5740–2700  
Email: r14525@onsemi.com  
English Phone: (+1) 303–308–7142 (Mon–Fri 12:00pm to 5:00pm GMT)  
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EUROPEAN TOLL–FREE ACCESS*: 00–800–4422–3781  
For additional information, please contact your local  
Sales Representative.  
*Available from Germany, France, Italy, UK, Ireland  
2N6394/D  

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