2N7002KW [ONSEMI]
N沟道增强模型场效应晶体管;型号: | 2N7002KW |
厂家: | ONSEMI |
描述: | N沟道增强模型场效应晶体管 PC 开关 光电二极管 晶体管 场效应晶体管 |
文件: | 总6页 (文件大小:259K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
2N7002KW
N-Channel Enhancement
Mode Field Effect
Transistor
Features
www.onsemi.com
• Low On−Resistance
• Low Gate Threshold Voltage
• Low Input Capacitance
D
• Fast Switching Speed
S
• Low Input/Output Leakage
• Ultra−Small Surface Mount Package
• These Devices are Pb−Free and are RoHS Compliant
• ESD HBM = 1000 V as per JESD22 A114 and ESD CDM = 1500 V
as per JESD22 C101
G
SC−70
3 LEAD
CASE 419AB
MARKING DIAGRAM
ABSOLUTE MAXIMUM RATINGS (T = 25°C unless otherwise noted)
A
Rating
Drain−Source Voltage
Symbol
Value
60
Unit
V
7KW
V
DSS
GSS
Gate−Source Voltage
V
20
V
7KW = Specific Device Marking
D
Maximum Drain Current
Continuous
I
310
195
1.2
mA
mA
A
D
T = 100°C
J
Pulsed
Operating Junction Temperature Range
Storage Temperature Range
T
−55 to
+150
°C
J
T
−55 to
+150
°C
STG
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
G
S
THERMAL CHARACTERISTICS
Parameter
Symbol
Value
Unit
ORDERING INFORMATION†
Total Device Dissipation
P
300
2.4
mW
D
Derating above T = 25°C
mW/°C
A
†
Device
2N7002KW
Package
Shipping
Thermal Resistance,
Junction to Ambient*
R
410
°C/W
q
JA
SC−70
3000 / Tape &
Reel
*Device mounted on FR−4 PCB, 1″ x 0.85″ x 0.062″. Minimum land pad size
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2011
1
Publication Order Number:
May, 2018 − Rev. 1
2N7002KW/D
2N7002KW
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)
A
Symbol
Parameter
Test Conditions
Min
Typ
Max
Unit
OFF CHARACTERISTICS
BV
Drain−Source Breakdown Voltage
V
= 0 V, I = 10 mA
60
−
−
−
V
DSS
GS
D
I
Zero Gate Voltage Drain Current
V
DS
V
DS
= 60 V, V = 0 V
−
1.0
0.5
mA
mA
DSS
GS
= 60 V, V = 0 V, T = 125°C
GS
J
I
Gate−Body Leakage
V
DS
= 0 V, V =
GS
20 V
−
−
10
mA
GSS
ON CHARACTERISTICS (Note 1)
V
Gate Threshold Voltage
V
= V , I = 250 mA
1.1
−
−
2.1
V
GS(th)
DS(on)
DS
GS
D
R
Static Drain−Source On−Resistance
V
GS
V
GS
V
GS
V
GS
= 10 V, I = 500 mA
−
1.6
2.4
2
W
D
= 10 V, I = 500 mA, T = 100°C
D
J
= 5 V, I = 50 mA
D
= 5 V, I = 50 mA, T = 100°C
3
D
J
V
DS(on)
Drain−Source On−Voltage
V
GS
V
GS
= 10 V, I = 500 mA
−
−
3.75
1.5
V
D
= 5 V, I = 50 mA
D
I
On−State Drain Current
V
GS
V
DS
= 10 V, V = 2 V
500
80
−
−
−
−
mA
mS
D(on)
DS
g
FS
Forward Transconductance
= 2 V, I = 0.2 A
D
DYNAMIC CHARACTERISTICS
C
Input Capacitance
V
DS
= 25 V, V = 0 V, f = 1.0 MHz
−
−
−
−
−
−
50
25
5
pF
pF
pF
iss
GS
C
Output Capacitance
oss
C
Reverse Transfer Capacitance
rss
SWITCHING CHARACTERISTICS
t
Turn-On Delay Time
Turn-Off Delay Time
V
D
= 30 V, R = 150 W, V = 10 V,
−
−
−
−
20
60
ns
ns
d(on)
d(off)
DD
L
GS
I
= 200 mA, R
= 25 W
GEN
t
DRAIN−SOURCE DIODE CHARACTERISTICS
I
Maximum Continuous Drain−Source Diode Forward Current
Maximum Pulsed Drain−Source Diode Forward Current
−
−
−
−
−
−
115
0.8
1.1
mA
A
S
I
SM
V
SD
Drain−Source Diode Forward Voltage
V
GS
= 0 V, I = 115 mA
V
S
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
1. Pulse Test: Pulse Width < 300 ms, Duty Cycle < 2.0%.
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2
2N7002KW
TYPICAL PERFORMANCE CHARACTERISTICS
2.2
2.4
2.1
1.8
1.5
1.2
0.9
0.6
0.3
0.0
V
GS = 10V
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
9V
8V
6V
5V
VGS
= 10V
7V
I
D = 500mA
VGS = 5V
I
D = 50mA
4V
VGS = 3V
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
−50
0
50
100
150
TJ. Junction Temperature ( oC)
VDS. Drain−Source Voltage (V)
Figure 1. On−Region Characteristics
Figure 2. On−Resistance Variation with
Temperature
3.0
2.5
2.0
1.5
1.0
0.5
5
4
3
2
1
0
VGS = 4V
4.5V
VGS = 10V
VGS = 7V
5V
6V
TA = 125oC
TA = 25oC
10V
9V
8V
TA = −55oC
0.0
0.5
1.0
1.5
2.0
0.0
0.5
1.0
1.5
2.0
ID. Drain−Source Current(A)
ID. Drain Current (A)
Figure 3. On−Resistance Variation with Gate
Figure 4. On−Resistance Variation with Drain
Voltage and Drain Current
Current and Temperature
1.10
3.5
VDS = VGS
VDS = 10V
TA = −55(oC)
1.05
1.00
0.95
0.90
0.85
0.80
0.75
3.0
2.5
2.0
1.5
1.0
0.5
0.0
TA = 25(oC)
ID = 1mA
TA = 125(oC)
ID = 0.25mA
−25
0
25
50
75
100
125
0
1
2
3
4
5
6
7
8
9
10
VGS. Gate−Source Voltage (V)
TJ. Junction Temperature ( oC)
Figure 5. Transfer Characteristics
Figure 6. Gate Threshold Variation with
Temperature
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3
2N7002KW
TYPICAL PERFORMANCE CHARACTERISTICS
10000
1.100
1.075
1.050
1.025
1.000
0.975
0.950
0.925
VGS = 0 V
ID=250uA
1000
100
TA=125oC
10
TA=25oC
1
TA=−55oC
0.1
−25
0
25
50
75
100
125
0.0
0.2
0.4
0.6
0.8
1.0
1.2
TJ, Junction Temperatture( oC)
V
. Body Diode Forward Voltage [V]
SD
Figure 7. Breakdown Voltage Variation with
Temperature
Figure 8. Body Diode Forward Voltage
Variation with Source Current and
Temperature
100
10
1
10
V
DS = 25V
8
6
4
2
0
C
ISS
ID = 500mA
COSS
CRSS
ID = 115mA
0.2
f = 1MHZ
ID = 280mA
V
GS = 0V
1
10
100
0.0
0.4
0.6
0.8
1.0
VDS. Drain to Source Voltage (V)
Qg. Gate Charge (nC)
Figure 9. Capacitance Variation
Figure 10. Gate Charge Characteristics
1
100
10−1
10−2
10−3
10−4
100ms
50%
20%
1ms
10ms
100ms
1S
Rthja(t)=r(t)*Rthja
Rthja=410 oC/W
DC
RDS(on) Limit
0.1
10%
5%
Vgs=10V
2%
Single Pulse
Rthja=410oC/W
D=1%
T = 25oC
a
Single Pulse
0.01
10−1
100
101
102
1E−4
1E−3
0.01
0.1
1
10
100
1000
t1, time(sec)
VDS, Drain−Source Voltage [V]
Figure 11. Maximum Safe Operating Area
Figure 12. Transient Thermal Response Curve
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4
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SC−70, 3 Lead, 1.25x2
CASE 419AB
ISSUE A
DATE 13 FEB 2023
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON34256E
SC−70, 3 LEAD, 1.25X2
PAGE 1 OF 1
onsemi and
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
onsemi,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any
products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products
and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license
under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems
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ADDITIONAL INFORMATION
TECHNICAL PUBLICATIONS:
Technical Library: www.onsemi.com/design/resources/technical−documentation
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ONLINE SUPPORT: www.onsemi.com/support
For additional information, please contact your local Sales Representative at
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