6N135TSDVM [ONSEMI]
Logic IC Output Optocoupler, 1-Element, 5000V Isolation, 1MBps;
| 型号： | 6N135TSDVM |
| 厂家： | 
ONSEMI |
| 描述： | Logic IC Output Optocoupler, 1-Element, 5000V Isolation, 1MBps 输出元件 光电 |
| 文件： | 总15页 (文件大小：424K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
January 2010
Single-Channel: 6N135M, 6N136M, HCPL4503M
Dual-Channel: HCPL2530M, HCPL2531M (Preliminary)
High Speed Transistor Optocouplers
Features
Description
■ High speed –1 MBit/s
The HCPL4503M, 6N135M, 6N136M, HCPL2530M and
HCPL2531M optocouplers consist of an AlGaAs LED
optically coupled to a high speed photodetector transis-
tor.
■ Superior CMR – 10kV/µs
■ Dual-Channel HCPL2530M, HCPL2531M
(Preliminary)
A separate connection for the bias of the photodiode
improves the speed by several orders of magnitude over
conventional phototransistor optocouplers by reducing
the base-collector capacitance of the input transistor.
■ CTR guaranteed 0–70°C
■ U.L. recognized (File # E90700, Vol. 2)
■ VDE recognition (pending)
– Ordering option ‘V’, e.g., 6N135VM
■ 5,000Vrms (1 minute) isolation rating
■ Superior CMR of 15,000V/µs min. (HCPL4503M)
The HCPL4503M has no internal connection to the pho-
totransistor base for improved noise immunity.
An internal noise shield provides superior common
mode rejection of up to 50,000V/µs.
■ No base connection for improved noise immunity
(HCPL4503M)
Related Resources
Applications
■ www.fairchildsemi.com/products/opto/
■ Line receivers
■ www.fairchildsemi.com/pf/HC/HCPL0500.html
■ www.fairchildsemi.com/pf/FO/FODM452.html
■ www.fairchildsemi.com/pf/FO/FOD050L.html
■ Pulse transformer replacement
■ Output interface to CMOS-LSTTL-TTL
■ Wide bandwidth analog coupling
Schematics
Package Outlines
8
VCC
8
+
VCC
1
N/C
1
8
1
VF1
_
V01
7
VB
+
2
2
3
4
7
6
5
VF
_
8
8
_
1
V02
3
6
5
VO
1
VF2
+
N/C
GND
GND
4
HCPL2530M/HCPL2531M
6N135M, 6N136M, HCPL4503M
Pin 7 is not connected in the
HCPL4503M
©2008 Fairchild Semiconductor Corporation
6N13XM, HCPLXXXM Rev. 1.0.6
www.fairchildsemi.com
Absolute Maximum Ratings (T = 25°C unless otherwise specified)
A
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Symbol
Parameter
Storage Temperature
Operating Temperature
Condition
Value
Units
°C
T
-40 to +125
-40 to +100
260 for 10 sec
STG
T
°C
OPR
T
Lead Solder Temperature
(Wave)
°C
SOL
EMITTER
I (avg) DC/Average Forward Input
25
50
1.0
5
mA
mA
A
F
(1)
Current Each Channel
I (pk)
Peak Forward Input Current
Each Channel
50% duty cycle, 1ms P.W.
F
(2)
I (trans) Peak Transient Input Current
≤1µs P.W., 300pps
F
Each Channel
V
P
Reverse Input Voltage Each
Channel
V
R
D
Input Power Dissipation Each 6N135M, 6N136M, HCPL4503M
45
mW
(3)
Channel
HCPL2530M, HCPL2531M
DETECTOR
I
(avg) Average Output Current Each
Channel
8
mA
mA
O
I
(pk)
Peak Output Current Each
Channel
16
O
V
Emitter-Base Reverse Voltage 6N135M and 6N136M only
5
-0.5 to 30
-0.5 to 20
5
V
V
EBR
V
Supply Voltage
Output Voltage
CC
V
V
O
I
Base Current
6N135M and 6N136M only
6N135M, 6N136M, HCPL4503M
HCPL2530M, HCPL2531M
mA
mW
mW
B
PD
Output Power Dissipation
Each Channel
100
(4)
35
Notes:
1. Derate linearly above 70°C free-air temperature at a rate of 0.8mA/°C.
2. Derate linearly above 70°C free-air temperature at a rate of 1.6mA/°C.
3. Derate linearly above 70°C free-air temperature at a rate of 0.9 mW/°C.
4. Derate linearly above 70°C free-air temperature at a rate of 2.0 mW/°C.
©2008 Fairchild Semiconductor Corporation
6N13XM, HCPLXXXM Rev. 1.0.6
www.fairchildsemi.com
2
Electrical Characteristics
(T = 0 to 70°C unless otherwise specified. Typical value is measured at T = 25ºC and V = 5.0V.)
A
A
CC
Individual Component Characteristics
Symbol
Parameter
Test Conditions
Device
Min. Typ. Max. Unit
EMITTER
V
Input Forward Voltage
I = 16mA, T =25°C
All
All
All
1.45
1.7
1.8
V
F
F
A
I = 16mA
F
B
Input Reverse
I = 10 µA
5.0
21
V
VR
R
Breakdown Voltage
∆V /∆T Temperature Coefficient I = 16mA
All
All
-1.7
mV/°C
F
A
F
of Forward Voltage
DETECTOR
I
Logic High Output
Current
I = 0mA, V = V = 5.5V,
0.0007 0.5
µA
OH
F
O
CC
T =25°C
A
I = 0mA, V = V = 15V,
6N135M
6N136M
0.0019
1
F
O
CC
T =25°C
A
HCPL4503M
I = 0mA, V = V = 15V
All
50
F
O
CC
I
Logic Low Supply
Current
I = 16mA, V = Open,
6N135M
6N136M
HCPL4503M
163
200
µA
µA
CCL
F
O
V
= 15V
CC
I
= I = 16mA,
HCPL2530M
HCPL2531M
400
1
F1
F2
V = Open, V = 15V
O
CC
I
Logic High Supply
Current
I = 0mA, V = Open,
6N135M
6N136M
HCPL4503M
0.0002
0.0004
CCH
F
O
V
= 15V, T =25°C
CC
A
I = 0mA, V = Open,
6N135M
6N136M
HCPL4503M
2
4
F
O
V
= 15V
CC
I = 0mA, V = Open,
HCPL2530M
HCPL2531M
F
O
V
= 15V
CC
©2008 Fairchild Semiconductor Corporation
6N13XM, HCPLXXXM Rev. 1.0.6
www.fairchildsemi.com
3
Electrical Characteristics (Continued)
(T = 0 to 70°C unless otherwise specified. Typical value is measured at T = 25ºC and V = 5.0V.)
A
A
CC
Transfer Characteristics
Symbol
COUPLED
CTR
Parameter
Test Conditions
Device
Min. Typ. Max. Unit
Current Transfer
I = 16mA, V = 0.4 V,
6N135M
7
38
38
50
50
%
%
F
V
O
(5)
Ratio
= 4.5V, T =25°C
CC A
HCPL2530M
6N136M
19
HCPL4503M
HCPL2531M
6N135M
I = 16mA,
V
V
V
= 0.4V
= 0.5V
= 0.4V
5
%
%
F
OL
OL
OL
V
= 4.5V
CC
HCPL2530M
6N136M
15
HCPL4503M
V
= 0.5V
HCPL2531M
6N135M
OL
V
Logic LOW Output
Voltage
I = 16mA, I = 1.1mA,
0.12
0.20
0.4
0.5
0.4
V
OL
F
O
V
= 4.5V, T =25°C
CC
A
HCPL2530M
I = 16mA, I = 3mA,
6N136M
F
O
V
= 4.5V, T =25°C
HCPL4503M
CC
A
HCPL2531M
6N135M
0.5
0.5
I = 16mA, I = 0.8mA,
0.11
0.18
F
O
V
= 4.5V
CC
HCPL2530M
HCPL4503M
HCPL2531M
I = 16mA, I = 2.4mA,
0.5
F
O
V
= 4.5V
CC
Note:
5. Current Transfer Ratio is defined as a ratio of output collector current, I , to the forward LED input current, I ,
O
F
times 100%.
©2008 Fairchild Semiconductor Corporation
6N13XM, HCPLXXXM Rev. 1.0.6
www.fairchildsemi.com
4
Electrical Characteristics (Continued)
(T = 0 to 70°C unless otherwise specified. Typical values are measured at T = 25°C and V = 5V.)
A
A
CC
Switching Characteristics (V = 5V)
CC
Symbol Parameter
Test Conditions
Device
6N135M
Min.
Typ. Max. Unit
t
Propagation Delay
T = 25°C, R = 4.1kΩ,
0.23
1.5
µs
PHL
A
L
(6)
Time to Logic LOW I = 16mA (Fig. 7)
F
HCPL2530M
R = 1.9kΩ, I = 16mA,
6N136M
HCPL4503M
0.25
0.8
µs
L
F
(7)
T = 25°C (Fig. 7)
A
HCPL2531M
(6)
R = 4.1kΩ, I = 16mA (Fig. 7)
6N135M
HCPL2530M
2.0
1.0
µs
µs
L
F
(7)
R = 1.9kΩ, I = 16mA (Fig. 7)
6N136M
L
F
HCPL4503M
HCPL2531M
t
Propagation Delay
Time to Logic HIGH I = 16mA (Fig. 7)
T = 25°C, (R = 4.1kΩ,
6N135M
0.45
0.26
1.5
0.8
µs
µs
PLH
A
L
(6)
F
HCPL2530M
(7)
R = 1.9kΩ, I = 16mA (Fig. 7)
6N136M
L
F
T = 25°C
HCPL4503M
A
HCPL2531M
(6)
R = 4.1kΩ, I = 16mA (Fig. 7)
6N135M
HCPL2530M
2.0
1.0
µs
µs
L
F
(7)
R = 1.9kΩ, I = 16mA (Fig. 7)
6N136M
L
F
HCPL4503M
HCPL2531M
|CM | Common Mode
I = 0mA, V
= 10V
,
6N135M
HCPL2530M
10,000
10,000
V/µs
V/µs
H
F
CM
P-P
(8)
Transient
Immunity at
Logic High
R = 4.1kΩ, T = 25°C (Fig. 8)
L
A
I = 0mA, V
= 10V
,
6N136M
HCPL2531M
F
CM
P-P
(8)
R = 1.9kΩ, T = 25°C (Fig. 8)
L
A
I = 0mA, V
= 1,500V
,
F
CM
P-P
(8)
HCPL4503M 15,000 50,000
R = 1.9kΩ, T = 25°C (Fig. 8)
L
A
|CM |
Common Mode
Transient
Immunity at
Logic Low
I = 16mA, V
= 10V
,
6N135M
HCPL2530M
10,000
10,000
V/µs
V/µs
L
F
CM
P-P
(8)
R = 4.1kΩ, T = 25°C (Fig. 8)
L
A
I = 16mA, V
= 10V ,
P-P
6N136M
HCPL2531M
F
CM
(8)
R = 1.9kΩ (Fig. 8)
L
I = 0mA, V
= 1,500V
,
F
CM
P-P
(8)
HCPL4503M 15,000 50,000
R = 1.9kΩ, T = 25°C (Fig. 8)
L
A
Notes:
6. The 4.1kΩ load represents 1 LSTTL unit load of 0.36mA and 6.1kΩ pull-up resistor.
7. The 1.9kΩ load represents 1 TTL unit load of 1.6mA and 5.6kΩ pull-up resistor.
8. Common mode transient immunity in logic high level is the maximum tolerable (positive) dV /dt on the leading edge
cm
of the common mode pulse signal V , to assure that the output will remain in a logic high state (i.e., V > 2.0V).
CM
O
Common mode transient immunity in logic low level is the maximum tolerable (negative) dV /dt on the trailing edge
cm
of the common mode pulse signal, V , to assure that the output will remain in a logic low state (i.e., V < 0.8V).
CM
O
©2008 Fairchild Semiconductor Corporation
6N13XM, HCPLXXXM Rev. 1.0.6
www.fairchildsemi.com
5
Electrical Characteristics (Continued)
(T = 0 to 70°C unless otherwise specified. Typical values are measured at T = 25°C and V = 5V.)
A
A
CC
Isolation Characteristics (T = 0 to 70°C Unless otherwise specified)
A
Symbol
Characteristics
Test Conditions
Min.
Typ.
Max.
Unit
V
Withstand Insulation Test
Voltage
RH ≤ 50%, T = 25°C, I ≤ 10µA,
t = 1 min., f = 50Hz
5,000
V
RMS
ISO
A
I-O
(9)(11)
(9)
11
R
C
I
Resistance (Input to Output)
V
= 500VDC
10
Ω
I-O
I-O
I-I
I-O
(9)
Capacitance (Input to Output) f = 1MHz, V = 0V
1
pF
I-O
(10)
Input-Input Insulation
Leakage Current
RH ≤ 45%, V = 500VDC
t = 5 s, (HCPL2530M/2531M only)
µA
I-I
(10)
R
Input-Input Resistance
V = 500 VDC
I-I
Ω
I-I
I-I
(HCPL2530M/2531M only)
(10)
C
Input-Input Capacitance
f = 1MHz
pF
(HCPL2530M/2531M only)
Notes:
9. Device is considered a two terminal device: Pins 1, 2, 3 and 4 are shorted together and Pins 5, 6, 7 and 8 are
shorted together.
10. Measured between pins 1 and 2 shorted together, and pins 3 and 4 shorted together.
11. 5,000Vrms for 1 minute duration is equivalent to 6,000Vrms for 1 second duration.
©2008 Fairchild Semiconductor Corporation
6N13XM, HCPLXXXM Rev. 1.0.6
www.fairchildsemi.com
6
Typical Performance Curves
Fig. 1 Normalized CTR vs. Forward Current
Fig. 2 Normalized CTR vs.Temperature
1.6
1.2
1.0
0.8
0.6
0.4
0.2
0.0
1.4
1.2
1.0
0.8
0.6
V
V
= 0.4 V
O
I
V
V
= 16mA
F
Normalized to:
= 16 mA
Normalized to:
T = 25°C
A
0.4
0.2
0.0
= 5 V
CC
= 4.5V
CC
I
F
T
= 25°C
A
= 0.4V
O
0.1
1
10
100
-40
-20
0
20
40
60
80
100
120
I
- FORWARD CURRENT (mA)
T - TEMPERATURE (°C)
A
F
Fig. 4 Logic High Output Current
vs.Temperature
Fig. 3 Output Current vs. Output Voltage
25
20
15
10
5
1000
100
10
TA = 25°C
CC = 5 V
I
V
V
= 0 mA
F
V
= 5.5V
CC
= 5.5V
IF = 40mA
O
35mA
30mA
25mA
20mA
15mA
10mA
1
5mA
0
0.1
-40
-20
0
20
40
60
80
100
120
0
2
4
6
8
10
12
14
16
18
20
T
– TEMPERATURE (°C)
V
– OUTPUT VOLTAGE (V)
A
O
Fig. 5 Propagation Delay vs.Temperature
Fig. 6 Propagation Delay vs. Load Resistance
800
700
600
500
400
300
200
100
0
Frequency = 10kHz
Duty Cycle = 10%
Frequency = 10kHz
Duty Cycle = 10%
V
= 5 V
CC
V
= 5V
= 4.1kΩ (t
)
RL
CC
PLH
1000
I
= 16mA (t
)
PLH
F
I
= 10mA (t
)
PLH
F
RL = 1.9kΩ (t
)
PLH
I
= 10mA (t
)
PHL
F
RL = 1.9kΩ (t
)
PHL
RL = 4.1kΩ (t
)
PHL
I
= 16mA (t
)
PHL
F
100
-40
-20
0
20
40
60
80
100
120
1
10
T
– TEMPERATURE (°C)
R – LOAD RESISTANCE (kΩ)
L
A
©2008 Fairchild Semiconductor Corporation
6N13XM, HCPLXXXM Rev. 1.0.6
www.fairchildsemi.com
7
Test Circuits
Noise
Shield
Noise
Shield
Pulse
+
VCC
I
F
V
CC
Generator
tr = 5ns
+5 V
+5 V
1
2
3
4
8
7
6
5
1
2
3
4
8
7
6
5
Pulse
ZO = 50
Ω
R
L
Generator
V
F1
IF
+
VB
tr = 5ns
ZO= 50
10% D.C.
I/f< 100µs
V01
-
10% DUTY CYCLE
I/f < 100µS
VO
RL
Ω
VF
-
C
L
= 15 pF
VO
V02
-
VO
I
F
V
F2
0.1 µF
MONITOR
+
0.1 µF
IF Monitor
GND
Rm
Rm
C
L = 15 pF
GND
Test Circuit for HCPL2530M and HCPL2531M
Test Circuit for 6N135M, 6N136M, and HCPL4503M
IF
0
5 V
VO
1.5 V
1.5 V
VOL
TPHL
TPLH
Fig. 7 Switching Time Test Circuit
IF
Noise
Shield
Noise
Shield
VCC
V
CC
+
+5 V
+5 V
VO
1
2
3
4
8
7
6
5
1
8
7
6
5
IF
R
L
V
F1
+
VB
V01
-
RL
2
3
4
A
VF
-
A
VO
V02
B
-
0.1 µF
VO
0.1 µF
B
VFF
V
F2
VFF
+
GND
GND
–
VCM
+
-
VCM
-
+
Pulse Gen
Pulse Gen
Test Circuit for HCPL2530M and HCPL2531M
Test Circuit for 6N135M, 6N136M, and HCPL4503M
VCM 10 V
0 V
90% 90%
10%
tr
10%
tf
VO
5 V
Switch at A : IF = 0 mA
VO
VOL
Switch at A : IF = 16 mA
Fig. 8 Common Mode Immunity Test Circuit
©2008 Fairchild Semiconductor Corporation
6N13XM, HCPLXXXM Rev. 1.0.6
www.fairchildsemi.com
8
Package Dimensions
Through Hole
0.4" Lead Spacing (Option T)
PIN 1
ID.
PIN 1
ID.
1
0.270 (6.86)
0.250 (6.35)
0.270 (6.86)
0.250 (6.35)
0.390 (9.91)
0.370 (9.40)
0.156 (3.94)
0.144 (3.68)
0.070 (1.78)
0.045 (1.14)
0.390 (9.91)
0.370 (9.40)
0.020 (0.51)
MIN
0.200 (5.08)
MAX
0.156 (3.94)
0.144 (3.68)
0.070 (1.78)
0.045 (1.14)
0.020 (0.51)
MIN
0.154 (3.90)
0.120 (3.05)
0.200 (5.08)
MAX
15° MAX
0.022 (0.56)
0.016 (0.41)
0.016 (0.40)
0.008 (0.20)
0.154 (3.90)
0.120 (3.05)
0.300 (7.62)
TYP
0.100 (2.54) TYP
0.022 (0.56)
0.016 (0.41)
0° to 15°
0.016 (0.40)
0.008 (0.20)
0.400 (10.16)
TYP
0.100 (2.54) TYP
0.031 (0.78)
Surface Mount – 0.3" Lead Spacing (Option S)
8-Pin Surface Mount DIP – Land Pattern
(Option S)
0.390 (9.91)
0.370 (9.40)
PIN 1
0.070 (1.78)
ID.
0.060 (1.52)
0.270 (6.86)
0.250 (6.35)
0.100 (2.54)
0.295 (7.49)
0.415 (10.54)
0.030 (0.76)
0.156 (3.94)
0.144 (3.68)
0.300 (7.62)
TYP
0.070 (1.78)
0.045 (1.14)
0.020 (0.51)
MIN
0.016 (0.40)
0.008 (0.20)
0.015 (0.40) MIN
Both Sides
0.200 (5.08)
MAX
0.022 (0.56)
0.016 (0.41)
0.100 (2.54)
TYP
0.315 (8.00)
MIN
0.405 (10.30)
MAX.
Note:
All dimensions are in inches (millimeters)
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
©2008 Fairchild Semiconductor Corporation
6N13XM, HCPLXXXM Rev. 1.0.6
www.fairchildsemi.com
9
Package Dimensions (Continued)
Surface Mount – 0.4" Lead Spacing
(Option TS) (Pending)
8-Pin Surface Mount DIP – Land Pattern
(Option TS)
0.390 (9.91)
0.370 (9.40)
PIN 1
0.070 (1.78)
ID.
0.060 (1.52)
0.270 (6.86)
0.250 (6.35)
0.100 (2.54)
0.392 (9.96)
0.030 (0.76)
0.511 (13.0)
0.156 (3.94)
0.144 (3.68)
0.300 (7.62)
TYP
0.070 (1.78)
0.045 (1.14)
0.020 (0.51)
MIN
0.016 (0.40)
0.008 (0.20)
0.015 (0.40) MIN
Both Sides
0.031 (0.775)
0.200 (5.08)
MAX
0.022 (0.56)
0.016 (0.41)
0.400 (10.16)
0.100 (2.54)
TYP
0.497 (12.6)
MAX.
Note:
All dimensions are in inches (millimeters)
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
©2008 Fairchild Semiconductor Corporation
6N13XM, HCPLXXXM Rev. 1.0.6
www.fairchildsemi.com
10
Ordering Information
Option
No option
S
Example Part Number
6N135M
Description
Standard through hole lead form (50 units per tube)
Surface mount lead bend
6N135SM
SD
6N135SDM
Surface mount; tape and reel
V
6N135VM
IEC60747-5-2 (approval pending)
IEC60747-5-2 (approval pending); surface mount
TSV
6N135TSVM
6N135TSDVM
TSDV
IEC60747-5-2 (approval pending); surface mount;
tape and reel
TV
SV
6N135TVM
6N135SVM
6N135SDVM
IEC60747-5-2 (approval pending); 0.4" lead spacing
IEC60747-5-2 (approval pending); surface mount
SDV
IEC60747-5-2 (approval pending); surface mount;
tape and reel
Marking Information
1
2
6N135
6
V XX YY B
5
3
4
Definitions
1
Fairchild logo
(1)
2
Device number
3
IEC60747-5-2 mark (Note: Only appears on parts ordered
with this option – See order entry table)
4
5
Two digit year code, e.g., ‘08’
Two digit work week ranging from ‘01’ to ‘53’
Assembly package code
6
Note:
1. ‘HCPL’ devices are marked with only the numeric characters
(for example, HCPL4503M is marked as ‘4503’).
2. The ‘M’ suffix is an ordering identifier only. It is used to indicated the
white package version. The ‘M’ does no appear in the top mark.
©2008 Fairchild Semiconductor Corporation
6N13XM, HCPLXXXM Rev. 1.0.6
www.fairchildsemi.com
11
Carrier Tape Specifications (Option SD)
D0
P0
P2
t
E
K0
F
W
W1
P
User Direction of Feed
d
D1
Symbol
Description
Dimension in mm
16.0 ± 0.3
0.30 ± 0.05
4.0 ± 0.1
W
t
Tape Width
Tape Thickness
P
Sprocket Hole Pitch
Sprocket Hole Diameter
Sprocket Hole Location
Pocket Location
0
D
1.55 ± 0.05
1.75 ± 0.10
7.5 ± 0.1
0
E
F
P
2.0 ± 0.1
2
P
Pocket Pitch
12.0 ± 0.1
10.30 ±0.20
10.30 ±0.20
4.90 ±0.20
13.2 ± 0.2
0.1 max
A
Pocket Dimensions
0
0
0
B
K
W
Cover Tape Width
1
d
Cover Tape Thickness
Max. Component Rotation or Tilt
Min. Bending Radius
10°
R
30
©2008 Fairchild Semiconductor Corporation
6N13XM, HCPLXXXM Rev. 1.0.6
www.fairchildsemi.com
12
Carrier Tape Specifications (Option TSR2) (Pending)
D0
P0
P2
t
E
K0
F
W
W1
P
User Direction of Feed
d
D1
Symbol
Description
Dimension in mm
24.0 ± 0.3
0.40 ± 0.1
4.0 ± 0.1
W
t
Tape Width
Tape Thickness
P
Sprocket Hole Pitch
Sprocket Hole Diameter
Sprocket Hole Location
Pocket Location
0
D
1.55 ± 0.05
1.75 ± 0.10
11.5 ± 0.1
2.0 ± 0.1
0
E
F
P
2
P
Pocket Pitch
16.0 ± 0.1
12.80 ± 0.1
10.35 ± 0.1
5.7 ±0.1
A
Pocket Dimensions
0
0
0
B
K
W
Cover Tape Width
21.0 ± 0.1
0.1 max
1
d
Cover Tape Thickness
Max. Component Rotation or Tilt
Min. Bending Radius
10°
R
30
©2008 Fairchild Semiconductor Corporation
6N13XM, HCPLXXXM Rev. 1.0.6
www.fairchildsemi.com
13
Reflow Profile
Max. Ramp-up Rate = 3°C/S
Max. Ramp-down Rate = 6°C/S
T
P
260
240
220
200
180
160
140
120
100
80
t
P
T
L
Tsmax
t
L
Preheat Area
Tsmin
t
s
60
40
20
0
120
Time 25°C to Peak
240
360
Time (seconds)
Profile Freature
Pb-Free Assembly Profile
150°C
Temperature Min. (Tsmin)
Temperature Max. (Tsmax)
200°C
Time (t ) from (Tsmin to Tsmax)
60–120 seconds
3°C/second max.
217°C
S
Ramp-up Rate (t to t )
L
P
Liquidous Temperature (T )
L
Time (t ) Maintained Above (T )
60–150 seconds
260°C +0°C / –5°C
30 seconds
L
L
Peak Body Package Temperature
Time (t ) within 5°C of 260°C
P
Ramp-down Rate (T to T )
6°C/second max.
8 minutes max.
P
L
Time 25°C to Peak Temperature
©2008 Fairchild Semiconductor Corporation
6N13XM, HCPLXXXM Rev. 1.0.6
www.fairchildsemi.com
14
TRADEMARKS
The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not
intended to be an exhaustive list of all such trademarks.
FRFET®
PowerTrench®
PowerXS™
The Power Franchise®
AccuPower
Auto-SPM
Build it Now
CorePLUS
CorePOWER
CROSSVOLT
CTL
Current Transfer Logic
DEUXPEED®
Dual Cool™
EcoSPARK®
Global Power ResourceSM
Green FPS
Green FPS e-Series
Gmax
Programmable Active Droop
QFET®
TinyBoost
TinyBuck
QS
Quiet Series
RapidConfigure
GTO
IntelliMAX
ISOPLANAR
MegaBuck
MICROCOUPLER
MicroFET
MicroPak
MicroPak2
MillerDrive
MotionMax
TinyCalc
TinyLogic®
TINYOPTO
TinyPower
TinyPWM
TinyWire
Saving our world, 1mW/W/kW at a time™
SignalWise
SmartMax
EfficientMax
TriFault Detect
SMART START
®
SPM®
TRUECURRENT
SerDes
*
Fairchild®
STEALTH
SuperFET
SuperSOT -3
SuperSOT -6
SuperSOT -8
SupreMOS
Fairchild Semiconductor®
FACT Quiet Series
FACT®
Motion-SPM
OptoHiT™
UHC®
Ultra FRFET
UniFET
VCX
VisualMax
XS™
OPTOLOGIC®
FAST®
OPTOPLANAR®
FastvCore
®
SyncFET
FETBench
FlashWriter®
Sync-Lock™
*
PDP SPM™
Power-SPM
®
*
FPS
F-PFS
* Trademarks of System General Corporation, used under license by Fairchild Semiconductor.
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR
CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE
SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN,
WHICH COVERS THESE PRODUCTS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE
EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems which, (a) are
intended for surgical implant into the body or (b) support or sustain life,
and (c) whose failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be reasonably
expected to result in a significant injury of the user.
2. A critical component in any component of a life support, device, or
system whose failure to perform can be reasonably expected to
cause the failure of the life support device or system, or to affect its
safety or effectiveness.
ANTI-COUNTERFEITING POLICY
Fairchild Semiconductor Corporation's Anti-Counterfeiting Policy. Fairchild's Anti-Counterfeiting Policy is also stated on our external website, www.fairchildsemi.com,
under Sales Support.
Counterfeiting of semiconductor parts is a growing problem in the industry. All manufacturers of semiconductor products are experiencing counterfeiting of their parts.
Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed applications,
and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the proliferation of
counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild Distributors who are
listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors are genuine parts, have
full traceability, meet Fairchild's quality standards for handling and storage and provide access to Fairchild's full range of up-to-date technical and product information.
Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address any warranty issues that may arise. Fairchild will not provide
any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global problem and encourage our
customers to do their part in stopping this practice by buying direct or from authorized distributors.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification Product Status
Definition
Datasheet contains the design specifications for product development. Specifications may change in
any manner without notice.
Advance Information
Preliminary
Formative / In Design
Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild
Semiconductor reserves the right to make changes at any time without notice to improve design.
First Production
Full Production
Not In Production
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes
at any time without notice to improve the design.
No Identification Needed
Obsolete
Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor.
The datasheet is for reference information only.
Rev. I47
©2008 Fairchild Semiconductor Corporation
6N13XM, HCPLXXXM Rev. 1.0.6
www.fairchildsemi.com
15
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