6N137SM [ONSEMI]
高速 10MB/s 逻辑门极光耦合器;
| 型号： | 6N137SM |
| 厂家： | 
ONSEMI |
| 描述： | 高速 10MB/s 逻辑门极光耦合器 PC 光电二极管 输出元件 |
| 文件： | 总18页 (文件大小：640K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
8-Pin DIP High-Speed
10 MBit/s Logic Gate
Optocouplers
Single-Channel: 6N137M,
HCPL2601M, HCPL2611M
Dual-Channel: HCPL2630M,
HCPL2631M
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PDIP8 6.6x3.81, 2.54P
Description
CASE 646BW
8
The 6N137M, HCPL2601M, HCPL2611M single−channel and
HCPL2630M, HCPL2631M dual−channel optocouplers consist of a
850 nm AlGaAs LED, optically coupled to a very high speed
integrated photo−detector logic gate with a strobable output. This
output features an open collector, thereby permitting wired OR
outputs. The switching parameters are guaranteed over the
temperature range of −40°C to +85°C. A maximum input signal of
5 mA will provide a minimum output sink current of 13 mA (fan out
of 8).
An internal noise shield provides superior common mode rejection
of typically 10 kV/ms. The HCPL2601M and HCPL2631M has a
minimum CMR of 5 kV/ms. The HCPL2611M has a minimum CMR
of 10 kV/ms.
1
PDIP8 9.655x6.6, 2.54P
CASE 646CQ
8
8
1
1
PDIP8 GW
CASE 709AC
Features
PDIP8 GW
CASE 709AD
• Very High Speed – 10 MBit/s
• Superior CMR – 10 kV/ms
• Fan−out of 8 Over −40°C to +85°C
• Logic Gate Output
8
1
MARKING DIAGRAM
• Strobable Output
• Wired OR−open Collector
• Safety and Regulatory Approvals
ON
6N137
VXXYYB
♦ UL1577, 5,000 VAC
for 1 Minute
RMS
♦ DIN EN/IEC60747−5−5
• These are Pb−Free Devices
6N137
V
= Device Number
= DIN EN/IEC60747−5−5 Option (only
appears on component ordered with
this option)
= Two−Digit Year Code, e.g., ‘16’
= Two−Digit Work Week, Ranging from
‘01’ to ‘53’
Applications
• Ground Loop Elimination
XX
YY
• LSTTL to TTL, LSTTL or 5 V CMOS
• Line Receiver, Data Transmission
• Data Multiplexing
B
= Assembly Package Code
• Switching Power Supplies
• Pulse Transformer Replacement
• Computer−peripheral Interface
ORDERING INFORMATION
See detailed ordering and shipping information on page 14 of
this data sheet.
© Semiconductor Components Industries, LLC, 2009
1
Publication Order Number:
June, 2021 − Rev. 2
HCPL2631M/D
Single−Channel: 6N137M, HCPL2601M, HCPL2611M Dual−Channel: HCPL2630M,
HCPL2631M
SCHEMATICS
VCC
N/C
+
+
1
8
1
8
VCC
VF1
_
VE
V01
2
3
4
7
6
5
2
3
4
7
6
5
VF
_
_
VO
V02
VF2
+
N/C
GND
GND
6N137M, HCPL2601M,
HCPL2611M
HCPL2630M,
HCPL2631M
A 0.1 mF bypass capacitor must be connected between pins 8 and 5 (Note 1).
Figure 1. Schematics
TRUTH TABLE (Positive Logic)
Input
Enable
Output
H
L
H
H
L
H
H
H
L
H
L
L
L
H
L
NC
NC
H
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2
Single−Channel: 6N137M, HCPL2601M, HCPL2611M Dual−Channel: HCPL2630M,
HCPL2631M
SAFETY AND INSULATION RATINGS (As per DIN EN/IEC 60747−5−5, this optocoupler is suitable for “safe electrical insulation”
only within the safety limit data. Compliance with the safety ratings shall be ensured by means of protective circuits.)
Parameter
Characteristics
Installation Classifications per DIN VDE 0110/1.89 Table 1, For Rated Mains Voltage
<150 V
<300 V
<450 V
<600 V
I–IV
I–IV
RMS
RMS
RMS
RMS
I–III
I–III
Climatic Classification
40/100/21
2
Pollution Degree (DIN VDE 0110/1.89)
Comparative Tracking Index
175
Symbol
Parameter
Input−to−Output Test Voltage, Method A, V x 1.6 = V
Value
Unit
V
PR
,
1,335
V
peak
IORM
PR
Type and Sample Test with t = 10 s, Partial Discharge < 5 pC
m
Input−to−Output Test Voltage, Method B, V
x 1.875 = V
,
1,669
V
peak
IORM
PR
100% Production Test with t = 1 s, Partial Discharge < 5 pC
m
V
Maximum Working Insulation Voltage
Highest Allowable Over−Voltage
External Creepage
890
6,000
≥8.0
≥7.4
≥10.16
≥0.5
150
V
V
IORM
peak
V
IOTM
peak
mm
mm
mm
mm
°C
External Clearance
External Clearance (for Option TV, 0.4” Lead Spacing)
Distance Through Insulation (Insulation Thickness)
Case Temperature (Note 2)
DTI
T
S
I
Input Current (Note 2)
200
mA
mW
W
S,INPUT
P
Output Power (Duty Factor ≤ 2.7%) (Note 2)
300
S,OUTPUT
9
R
Insulation Resistance at T , V = 500 V (Note 2)
>10
IO
S
IO
1. The V supply to each optoisolator must be bypassed by a 0.1mF capacitor or larger. This can be either a ceramic or solid tantalum capacitor
CC
with good high frequency characteristic and should be connected as close as possible to the package V and GND pins of each device.
CC
2. Safety limit value − maximum values allowed in the event of a failure.
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3
Single−Channel: 6N137M, HCPL2601M, HCPL2611M Dual−Channel: HCPL2630M,
HCPL2631M
ABSOLUTE MAXIMUM RATINGS (T = 25°C unless otherwise noted)
A
Symbol
Parameter
Device
Value
Unit
°C
T
Storage Temperature
Operating Temperature
Junction Temperature
Lead Solder Temperature
−40 to +125
−40 to +100
−40 to +125
260 for 10 s
STG
OPR
T
°C
T
J
°C
T
SOL
°C
EMITTER
I (avg)
DC/Average Forward Input Current Per Channel
Single Channel
Dual Channel
Single Channel
All
50
30
mA
F
V
V
Enable Input Voltage Not to Exceed V by More than 500 mV
5.5
5.0
100
45
V
V
E
CC
Reverse Input Voltage Per Channel
Input Power Dissipation Per Channel
R
P
I
Single Channel
Dual Channel
mW
DETECTOR
V
Supply Voltage
All
−0.5 to 7.0
V
mA
mA
V
CC
I
(avg)
Average Output Current Per Channel
Peak Output Current Per Channel
Output Voltage Per Channel
Output Power Dissipation Per Channel
All
All
25
O
I
(pk)
50
−0.5 to 7.0
85
O
V
All
O
O
P
Single Channel
Dual Channel
mW
60
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
5.5
Unit
V
V
Supply Voltage
4.5
CC
FL
I
Input Current, Low Level
Input Current, High Level
Enable Voltage, Low Level
Enable Voltage, High Level
0
250
20.0
0.8
mA
mA
V
I
FH
6.3 (Note 3)
V
EL
0
2.0
−40
−
V
EH
V
CC
V
T
A
Ambient Operating Temperature
Fan Out (TTL Load)
+85
8
°C
N
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
3. 6.3 mA is a guard banded value which allows for at least 20% CTR degradation. Initial input current threshold value is 5.0 mA or less.
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Single−Channel: 6N137M, HCPL2601M, HCPL2611M Dual−Channel: HCPL2630M,
HCPL2631M
ELECTRICAL CHARACTERISTICS
Symbol
Parameter
Test Conditions
Device
Min
Typ
Max
Unit
INDIVIDUAL COMPONENT CHARACTERISTICS (V = 5.5 V, T = 0°C to 70°C unless otherwise specified)
CC
A
EMITTER
V
Input Forward Voltage
I = 10 mA, T = 25°C
All
All
−
−
1.45
−
1.70
1.80
−
V
V
F
F
A
I = 10 mA
F
B
VR
Input Reverse Breakdown
Voltage
I
R
= 10 mA
5.0
−
C
Input Capacitance
V = 0, f = 1 MHz
All
All
−
−
60
−
−
pF
IN
F
DV / DT
Temperature Coefficient of
Forward Voltage
I = 10 mA
F
−1.4
mV/°C
F
A
DETECTOR
I
Logic Low Supply Current
I = 10 mA, V = Open, V = 0.5 V
Single Channel
Dual Channel
Single Channel
Dual Channel
Single Channel
Single Channel
Single Channel
Single Channel
−
−
8
14
6
13
21
mA
mA
CCL
F
O
E
I
F1
= I = 10 mA, V = Open
F2 O
I
Logic High Supply Current
I = 0 mA, V = Open, V = 0.5 V
−
10
CCH
F
O
E
I = 0 mA, V = Open
−
10
−0.7
−0.5
−
15
F
O
I
EL
Low Level Enable Current
High Level Enable Current
Low Level Enable Voltage
High Level Enable Voltage
V = 0.5 V
E
−
−1.6
−1.6
0.8
−
mA
mA
V
I
V = 2.0 V
E
−
EH
V
I = 10 mA (Note 4)
F
−
EL
V
I = 10 mA
F
2.0
−
V
EH
TRANSFER CHARACTERISTICS (V = 5.5 V, T = −40°C to +85°C unless otherwise specified)
CC
A
I
Input Threshold Current
V
V
= 0.6 V, V = 2.0 V, I = 13 mA
All
All
All
−
−
−
3
−
5
mA
mA
V
FT
O
E
OL
I
HIGH Level Output Current
LOW Level Output Voltage
= 5.5 V, I = 250 mA, V = 2.0 V
100
0.6
OH
O
F
E
V
I = 5 mA, V = 2.0 V, I = 13 mA
F
0.4
OL
E
OL
SWITCHING CHARACTERISTICS (V = 5 V, I = 7.5 mA, T = −40°C to +85°C unless otherwise specified)
CC
F
A
t
Propagation Delay Time to
All
25
40
−
75
100
75
ns
ns
R = 350 W, C = 15 pF, T = 25°C
PHL
PLH
L
L
A
Logic LOW
(Note 5) (Figure 23)
R = 350 W, C = 15 pF (Note 5)
−
L
L
(Figure 23)
,
t
Propagation Delay Time to
Logic HIGH
All
20
−
40
−
R = 350 W, C = 15 pF T = 25°C
L
L
A
(Note 6) (Figure 23)
R = 350 W, C = 15 pF (Note 6)
100
L
L
(Figure 23)
|t
–t
|
Pulse Width Distortion
R = 350 W, C = 15 pF (Figure 23)
All
All
−
−
1
35
ns
ns
PHL PLH
L
L
t
R
Output Rise Time
(10% to 90%)
R = 350 W, C = 15 pF (Note 7)
30
−
L
L
(Figure 23)
t
Output Fall Time
(90% to 10%)
R = 350 W, C = 15 pF(Note 8)
All
−
−
10
15
−
−
−
−
−
−
ns
ns
F
L
L
(Figure 23)
t
t
Enable Propagation Delay
Time to Output LOW Level
V
= 3.5 V, R = 350 W, C = 15 pF Single Channel
EHL
EH L L
(Note 9) (Figure 24)
Enable Propagation Delay
Time to Output HIGH Level
V
EH
= 3.5 V, R = 350 W, C = 15 pF Single Channel
−
15
ns
ELH
L
L
(Note 10) (Figure 24)
I = 0 mA, V = 50 V ,
PEAK
|CM |
Common Mode Transient
Immunity at Logic High
6N137M,
HCPL2630M
−
10,000
10,000
V/ms
H
F
CM
R = 350 W, T = 25°C (Note 11)
L
A
(Figure 25)
HCPL2601M,
HCPL2631M
5000
I = 0 mA, V = 400 V ,
PEAK
10,000 15,000
F
CM
R = 350 W, T = 25°C (Note 11)
L
A
HCPL2611M
(Figure 25)
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Single−Channel: 6N137M, HCPL2601M, HCPL2611M Dual−Channel: HCPL2630M,
HCPL2631M
ELECTRICAL CHARACTERISTICS (continued)
Symbol
Parameter
Test Conditions
Device
Min
Typ
Max
Unit
SWITCHING CHARACTERISTICS (V = 5 V, I = 7.5 mA, T = −40°C to +85°C unless otherwise specified)
CC
F
A
|CM |
Common Mode Transient
Immunity at Logic Low
V
A
= 50 V
, R = 350 W,
6N137M,
−
10,000
10,000
−
−
−
V/ms
L
CM
PEAK
L
T = 25°C (Note 11) (Figure 25)
HCPL2630M
HCPL2601M,
HCPL2631M
5000
V
CM
= 400 V
, R = 350 W,
HCPL2611M
10,000 15,000
PEAK
L
T = 25°C (Note 11) (Figure 25)
A
ISOLATION CHARACTERISTICS (T = 25°C, unless otherwise noted)
A
V
ISO
Withstand Insulation Test
Voltage
Relative Humidity ≤ 50%,
≤ 10 mA, t = 1 min, f = 50 Hz
All
5,000
−
−
VAC
RMS
I
I−O
(Note 12) (Note 13)
11
R
C
Resistance (Input to Output)
V
= 500 V (Note 12)
All
All
−
−
10
−
−
W
I−O
I−O
I−O
DC
Capacitance (Input to
Output)
f = 1 MHz, V
= 0 V (Note 12)
1
pF
I−O
DC
I
Input−Output Insulation
Leakage Current
Relative Humidity ≤ 45%,
V = 3000 V , t = 5 s (Note 12)
I−I
All
−
−
1.0
mA
I−O
DC
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
4. Enable Input – No pull up resistor required as the device has an internal pull up resistor.
5. t
– Propagation delay is measured from the 3.75 mA level on the LOW to HIGH transition of the input current pulse to the 1.5 V level on
PHL
the HIGH to LOW transition of the output voltage pulse.
6. t – Propagation delay is measured from the 3.75 mA level on the HIGH to LOW transition of the input current pulse to the 1.5 V level on
PLH
the LOW to HIGH transition of the output voltage pulse.
7. t – Rise time is measured from the 10% to the 90% levels on the LOW to HIGH transition of the output pulse.
R
8. t – Fall time is measured from the 90% to the 10% levels on the HIGH to LOW transition of the output pulse.
F
EHL
9. t
– Enable input propagation delay is measured from the 1.5 V level on the LOW to HIGH transition of the input voltage pulse to the 1.5 V
level on the HIGH to LOW transition of the output voltage pulse.
10.t – Enable input propagation delay is measured from the 1.5 V level on the HIGH to LOW transition of the input voltage pulse to the 1.5 V
ELH
level on the LOW to HIGH transition of the output voltage pulse.
11. Common mode transient immunity in logic high level is the maximum tolerable (positive) dV /dt on the leading edge of the common mode
cm
pulse signal, V , to assure that the output will remain in a logic high state (i.e., V > 2.0 V). Common mode transient immunity in logic low
CM
O
level is the maximum tolerable (negative) dV /dt on the trailing edge of the common mode pulse signal, V , to assure that the output will
cm
CM
remain in a logic low state (i.e., V < 0.8 V).
O
12.Device is considered a two terminal device: pins 1, 2, 3 and 4 are shorted together and pins 5, 6, 7 and 8 are shorted together.
13.5000 VAC for 1 minute duration is equivalent to 6000 VAC for 1 second duration
RMS
RMS
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Single−Channel: 6N137M, HCPL2601M, HCPL2611M Dual−Channel: HCPL2630M,
HCPL2631M
TYPICAL PERFORMANCE CURVES
(For Single−Channel Devices: 6N137M, HCPL2601M, and HCPL2611M)
0.8
I = 5 mA
F
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
V
V
= 2 V
E
10
= 5.5 V
CC
I
= 12.8 mA
OL
1
0.100
0.010
0.001
I
= 16 mA
OL
I
= 6.4 mA
OL
I
OL
= 9.6 mA
−40
−20
0
20
40
60
80
100
0.9
1.0
1.1
1.2
1.3
1.4
1.5
1.6
100
6
T , AMBIENT TEMPERATURE (°C)
A
V , FORWARD VOLTAGE (V)
F
Figure 2. Low Level Output Voltage vs.
Ambient Temperature
Figure 3. Input Diode Forward Voltage vs.
Forward Current
50
120
100
80
V
CC
= 5 V
T = 25°C
A
45
40
I = 15 mA
F
R = 4 kW (t
L
)
PLH
I = 10 mA
F
R = 350 W (t
L
)
PLH
35
60
R = 1 kW (t
)
L
PLH
I = 5 mA
F
40
20
0
30
25
20
R = 4 kW (t
)
)
L
PHL
V
V
V
= 5 V
CC
R = 1 kW (t
L
PHL
= 2 V
E
R = 350 W (t
L
)
PHL
= 0.6 V
OL
5
7
9
11
13
15
−40
−20
0
20
40
60
80
I , FORWARD CURRENT (mA)
F
T , AMBIENT TEMPERATURE (°C)
A
Figure 5. Low Level Output vs.
Ambient Temperature
Figure 4. Switching Time vs. Forward Current
6
5
4
3
2
4.0
V
V
V
= 5 V
= 2 V
= 0.6 V
CC
E
3.5
3.0
2.5
2.0
1.5
1.0
OL
R = 350 W
L
R = 1 kW
L
R = 1 kW
L
R = 350 W
L
R = 4 kW
L
R = 4 kW
L
1
0
−40
−20
0
20
40
60
80
100
0
1
2
3
4
5
T , AMBIENT TEMPERATURE (°C)
A
I , FORWARD CURRENT (mA)
F
Figure 6. Input Threshold Current vs.
Ambient Temperature
Figure 7. Output Voltage vs. Input Forward Current
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Single−Channel: 6N137M, HCPL2601M, HCPL2611M Dual−Channel: HCPL2630M,
HCPL2631M
TYPICAL PERFORMANCE CURVES (Continued)
(For Single−Channel Devices: 6N137M, HCPL2601M, HCPL2611M)
60
50
40
30
20
10
0
500
400
300
200
100
0
I = 7.5 mA
I = 7.5 mA
F
F
V
CC
= 5 V
V
CC
= 5 V
R = 4 kW (t )
L
R
R = 4 kW
L
R = 4 kW (t )
L
F
R = 1 kW (t )
L
F
R = 350 W (t )
L
F
R = 1 kW (t )
L
R
R = 350 W (t )
R = 1 kW
L
L
R
R = 350 W
L
−100
−10
−40
−20
0
20
40
60
80
100
−40
−20
0
20
40
60
80
100
T , AMBIENT TEMPERATURE (°C)
A
T , AMBIENT TEMPERATURE (°C)
A
Figure 8. Pulse Width Distortion vs. Temperature
Figure 9. Rise and Fall Time vs. Temperature
100
100
I = 7.5 mA
I = 7.5 mA
F
F
90
80
70
60
50
40
30
20
V
CC
= 5 V
V
CC
= 5 V
R = 4 kW (t
)
80
60
40
20
0
L
PLH
R = 4 kW (t
)
L
ELH
R = 350 W (t
)
L
PLH
R = 350 W (t
L
)
ELH
R = 1 kW (t
L
)
PLH
R = 1 kW (t
L
)
ELH
R = 4 kW (t
R = 1 kW (t
R = 350 W (t
)
)
L
PHL
L
PHL
R = 4 kW / 1 kW / 360 W (t
L
)
EHL
)
L
PHL
−40
−20
0
20
40
60
80
100
−40
−20
0
20
40
60
80
100
T , AMBIENT TEMPERATURE (°C)
A
T , AMBIENT TEMPERATURE (°C)
A
Figure 10. Enable Propagation Delay vs. Temperature
Figure 11. Switching Time vs. Temperature
1.6
V
V
V
= 5 V
= 5.5 V
= 2 V
CC
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
O
E
I = 250 mA
F
−40
−20
0
20
40
60
80
100
T , AMBIENT TEMPERATURE (°C)
A
Figure 12. High Level Output Current vs. Temperature
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Single−Channel: 6N137M, HCPL2601M, HCPL2611M Dual−Channel: HCPL2630M,
HCPL2631M
TYPICAL PERFORMANCE CURVES (Continued)
(For Dual−Channel Devices: HCPL2630M and HCPL2631M)
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
100
10
I = 5 mA
F
V
CC
= 5.5 V
I
= 16 mA
OL
I
OL
= 12.8 mA
1
I
= 6.4 mA
OL
0.1
I
OL
= 9.6 mA
0.01
0.001
−40
−20
0
20
40
60
80
100
0.9
1.0
1.1
1.2
1.3
1.4
1.5
1.6
100
6
T , AMBIENT TEMPERATURE (°C)
A
V , FORWARD VOLTAGE (V)
F
Figure 13. Low Level Output Voltage vs.
Ambient Temperature
Figure 14. Input Diode Forward Voltage vs.
Forward Current
50
120
100
80
60
40
20
0
V
CC
= 5 V
T = 25°C
A
45
I = 15 mA
F
R = 4 kW (T
)
)
L
PLH
40
35
30
25
20
I = 10 mA
F
I = 5 mA
F
R = 1 kW (T
L
PLH
R = 350 W (T
L
)
PLH
R = 1 kW
R = 4 kW (T
R = 350 W
L
)
L
PHL
V
V
= 5 V
= 0.6 V
CC
OL
L
5
7
9
11
13
15
−40
−20
0
20
40
60
80
I , FORWARD CURRENT (mA)
F
T , AMBIENT TEMPERATURE (°C)
A
Figure 15. Switching Time vs. Forward Current
Figure 16. Low Level Output Current vs.
Ambient Temperature
6
4
V
CC
V
OL
= 5 V
= 0.6 V
5
4
3
2
1
0
R = 350 W
L
3
2
1
R = 1 kW
R = 1 kW
L
L
R = 4 kW
L
R = 350 W
L
R = 4 kW
L
−40
−20
0
20
40
60
80
100
0
1
2
3
4
5
T , AMBIENT TEMPERATURE (°C)
A
I , FORWARD CURRENT (mA)
F
Figure 17. Input Threshold Current vs.
Ambient Temperature
Figure 18. Output Voltage vs. Input Forward Current
www.onsemi.com
9
Single−Channel: 6N137M, HCPL2601M, HCPL2611M Dual−Channel: HCPL2630M,
HCPL2631M
TYPICAL PERFORMANCE CURVES (Continued)
(For Dual−Channel Devices: HCPL2630M and HCPL2631M)
80
60
40
20
0
600
500
400
300
200
100
0
I = 7.5 mA
F
V
CC
= 5 V
R = 4 kW
L
R = 4 kW (tr)
L
I = 7.5 mA
F
V
CC
= 5 V
R = 1 kW
L
R = 4 kW (tf)
L
R = 350 W
L
R = 1 kW
L
R = 1 kW (tr)
L
R = 350 W (tr)
L
R = 350 W
L
−60 −40 −20
0
20
40
60
80 100
−60 −40 −20
0
20
40
60
80 100
T , TEMPERATURE (°C)
A
T , TEMPERATURE (°C)
A
Figure 19. Pulse Width Distortion vs. Temperature
Figure 20. Rise and Fall Time vs. Temperature
120
1.8
R = 4 kW (T
)
V
V
= 5.5 V
= 5.5 V
L
PLH
CC
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
O
100
80
60
40
20
I = 250 mA
F
I = 7.5 mA
F
V
CC
= 5 V
R = 1 kW (T
)
L
PLH
R = 350 W (T
)
L
PLH
R = 1 kW
L
L
L
R = 4 kW (T
)
PHL
R = 350 W
−60 −40 −20
0
20
40
60
80 100
−60 −40 −20
0
20
40
60
80 100
T , TEMPERATURE (°C)
A
T , TEMPERATURE (°C)
A
Figure 21. Switching Time vs. Temperature
Figure 22. High Level Output Current vs. Temperature
www.onsemi.com
10
Single−Channel: 6N137M, HCPL2601M, HCPL2611M Dual−Channel: HCPL2630M,
HCPL2631M
TEST CIRCUITS
Pulse
Generator
tr = 5 ns
+5 V
Z
O
= 50 W
IF = 7.5 mA
VCC
IF = 3.75 mA
Input
(IF)
1
2
3
4
8
7
6
5
tPHL
tPLH
Output
(VO)
.1 mF
bypass
RL
CL
1.5 V
Output
(VO)
Input
90%
10%
Monitor
(IF)
Output
(VO)
47
GND
tf
tr
Figure 23. Test Circuit and Waveforms for tPLH, tPHL, tr and tf
Pulse
Generator
tr = 5 ns
Input
Monitor
(V )
E
Z
O
= 50 W
+5 V
3.0 V
1.5 V
Input
(VE)
VCC
1
2
8
7
tEHL
tELH
7.5 mA
Output
(VO)
RL
CL
.1 mF
bypass
1.5 V
Output
(VO)
3
4
6
5
GND
Figure 24. Test Circuit tEHL and tELH
www.onsemi.com
11
Single−Channel: 6N137M, HCPL2601M, HCPL2611M Dual−Channel: HCPL2630M,
HCPL2631M
TEST CIRCUITS (Continued)
VCC
1
2
3
4
8
7
6
5
+5 V
IF
.1 mF
bypass
350 W
A
B
Output
(VO)
VFF
GND
VCM
Pulse Gen
Peak
VCM
0 V
5 V
VO
CMH
Switching Pos. (A), IF = 0
VO (Min)
V (Max)
O
Switching Pos. (B), IF = 7.5 mA
VO
CML
0.5 V
Figure 25. Test Circuit Common Mode Transient Immunity
www.onsemi.com
12
Single−Channel: 6N137M, HCPL2601M, HCPL2611M Dual−Channel: HCPL2630M,
HCPL2631M
REFLOW PROFILE
Max. Ramp−up Rate = 3°C/S
Max. Ramp−down Rate = 6°C/S
TP
TL
260
240
220
200
180
160
140
120
100
80
tP
Tsmax
tL
Preheat Area
Tsmin
ts
60
40
20
0
120
240
360
Time 25°C to Peak
Time (seconds)
Profile Freature
Pb−Free Assembly Profile
150°C
Temperature Minimum (Tsmin)
Temperature Maximum (Tsmax)
200°C
Time (t ) from (Tsmin to Tsmax)
60 to 120 s
S
Ramp−up Rate (t to t )
3°C/second maximum
217°C
L
P
Liquidous Temperature (T )
L
Time (t ) Maintained Above (T )
60 to 150 s
L
L
Peak Body Package Temperature
Time (t ) within 5°C of 260°C
260°C +0°C / –5°C
30 s
P
Ramp−down Rate (T to T )
6°C/s maximum
8 minutes maximum
P
L
Time 25°C to Peak Temperature
Figure 26. Reflow Profile
www.onsemi.com
13
Single−Channel: 6N137M, HCPL2601M, HCPL2611M Dual−Channel: HCPL2630M,
HCPL2631M
ORDERING INFORMATION (Note 14)
†
Part Number
Package
Shipping
6N137M
PDIP8 9.655x6.6, 2.54P, CASE 646CQ
50 Units / Tube
DIP8−Pin
(Pb−Free)
6N137SM
PDIP8 GW, CASE 709AC
SMT 8−Pin (Lead Bend)
(Pb−Free)
50 Units / Tube
1000 / Tape & Reel
50 Units / Tube
6N137SDM
6N137VM
PDIP8 GW, CASE 709AC
SMT 8−Pin (Lead Bend)
(Pb−Free)
PDIP8 9.655x6.6, 2.54P, CASE 646CQ
DIP 8−Pin, DIN EN/IEC 60747−5−5 Option
(Pb−Free)
6N137SVM
6N137SDVM
6N137TVM
6N137TSVM
6N137TSR2VM
PDIP8 GW, CASE 709AC
SMT 8−Pin (Lead Bend), DIN EN/IEC 60747−5−5 Option
(Pb−Free)
50 Units / Tube
PDIP8 GW, CASE 709AC
SMT 8−Pin (Lead Bend), DIN EN/IEC 60747−5−5 Option
(Pb−Free)
1000 / Tape & Reel
50 Units / Tube
PDIP8 6.6x3.81, 2.54P, CASE 646BW
DIP 8−Pin, 0.4” Lead Spacing, DIN EN/IEC60747−5−5 Option
(Pb−Free)
PDIP8 GW, CASE 709AD
SMT 8−Pin, 0.4” Lead Spacing, DIN EN/IEC60747−5−5 Option
(Pb−Free)
50 Units / Tube
PDIP8 GW, CASE 709AD
SMT 8−Pin, 0.4” Lead Spacing, DIN EN/IEC60747−5−5 Option
(Pb−Free)
1000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
14.The product orderable part number system listed in this table also applies to the HCPL2601M, HCPL2611M, HCPL2630M and HCPL2631M
product families.
www.onsemi.com
14
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
PDIP8 6.6x3.81, 2.54P
CASE 646BW
ISSUE O
DATE 31 JUL 2016
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON13445G
PDIP8 6.6X3.81, 2.54P
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
PDIP8 9.655x6.6, 2.54P
CASE 646CQ
ISSUE O
DATE 18 SEP 2017
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON13446G
PDIP8 9.655X6.6, 2.54P
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
PDIP8 GW
CASE 709AC
ISSUE O
DATE 31 JUL 2016
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON13447G
PDIP8 GW
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
onsemi,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any
products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products
and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license
under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems
or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should
Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
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Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
ADDITIONAL INFORMATION
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