74ACT244SC [ONSEMI]
带 3 状态输出的八路缓冲器/线路驱动器;
| 型号： | 74ACT244SC |
| 厂家： | 
ONSEMI |
| 描述： | 带 3 状态输出的八路缓冲器/线路驱动器 PC 驱动 光电二极管 逻辑集成电路 驱动器 |
| 文件： | 总11页 (文件大小：352K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DATA SHEET
www.onsemi.com
Octal Buffer/Line Driver with
3-STATE Outputs
SOIC−20, 300 mils
CASE 751BJ−01
74AC244, 74ACT244
General Description
SOIC−20 WB
CASE 751D−05
The AC/ACT244 is an octal buffer and line driver designed to be
employed as a memory address driver, clock driver and bus−oriented
transmitter/receiver which provides improved PC board density.
Features
TSSOP−20 WB
CASE 948E
• I and I Reduced by 50%
CC
OZ
• 3−STATE Outputs Drive Bus Lines or Buffer Memory Address
Registers
• Outputs Source/Sink 24 mA
• ACT244 has TTL−Compatible Inputs
TSSOP20, 4.4 x 6.5
CASE 948AQ−01
MARKING DIAGRAMS
V
OE
I
CC
1
SOIC−20
OE
0
2
O
20
O
4
1
0
I
I
4
AC(T)244
AWLYYWWG
O
O
5
2
1
I
I
5
1
O
O
6
2
I
3
I
6
AC244, ACT244 = Specific Device Code
O
A
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
7
O
3
WL
YY
WW
G
GND
I
7
Figure 1. Connection Diagram
IEEE/IEC
TSSOP−20
OE
1
AC(T)
244
I
0
O
0
ALYWG
I
1
2
O
O
O
1
2
3
G
I
I
3
AC244, ACT244 = Specific Device Code
A
L
= Assembly Location
= Wafer Lot
OE
2
Y
W
G
= Year
= Work Week
= Pb−Free Package
I
4
O
O
O
O
4
5
6
7
I
I
5
(Note: Microdot may be in either location)
6
I
7
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
Figure 2. Logic Symbol
Publication Order Number:
© Semiconductor Components Industries, LLC, 1988
1
74ACT244/D
February, 2022 − Rev. 2
74AC244, 74ACT244
PIN DESCRIPTION
Pin Name
Description
OE , OE
3−STATE Output Enable Inputs
1
2
I −I
Inputs
0
7
O −O
Outputs
0
7
TRUTH TABLE
TRUTH TABLE (continued)
Inputs
Inputs
Outputs
Outputs
OE
L
I
(Pins 12, 14, 16, 18)
OE
L
I
n
(Pins 3, 5, 7, 9)
1
n
2
L
H
X
L
H
Z
L
H
X
L
H
Z
L
L
H
H
NOTE: X = Immaterial, Z = High Impedance
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Rating
Unit
V
Supply Voltage
V
CC
I
IK
−0.5 to +7.0
DC Input Diode Current
mA
V = −0.5 V
I
−20
V = V + 0.5
+20
I
CC
DC Input Voltage
V
I
−0.5 to V + 0.5
V
CC
DC Output Diode Current
I
mA
OK
V
= −0.5 V
−20
O
V = V + 0.5 V
+20
I
CC
DC Output Voltage
V
O
−0.5 to V + 0.5
V
CC
DC Output Source or Sink Current
I
50
50
mA
mA
°C
O
DC V or Ground Current per Output Pin
I
or I
GND
STG
CC
CC
Storage Temperature
Junction Temperature
T
−65 to +150
140
T
°C
J
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
RECOMMENDED OPERATING CONDITIONS
Parameter
Symbol
Rating
Unit
Supply Voltage
AC
V
CC
V
2.0 to 6.0
4.5 to 5.5
ACT
Input Voltage
V
0 to V
0 to V
V
V
I
CC
CC
Output Voltage
Operating Temperature
V
O
T
A
−40 to +85
°C
Minimum Input Edge Rate, AC Devices:
from 30% to 70% of V , V @ 3.3 V, 4.5 V, 5.5 V
DV / Dt
125
mV/ns
V
IN
CC
CC
Minimum Input Edge Rate, ACT Devices:
from 0.8 V to 2.0 V, V @ 4.5 V, 5.5 V
DV / Dt
125
mV/ns
V
IN
CC
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
www.onsemi.com
2
74AC244, 74ACT244
DC ELECTRICAL CHARACTERISTICS FOR AC
T
A
= +25°C
T
A
= −55°C to
+125°C
T
A
= −40°C to
+85°C
Symbol
Parameter
V
CC
(V)
Conditions
= 0.1 V or
OUT
Typ
1.5
Guaranteed Limits
Unit
V
IH
Minimum HIGH Level
Input Voltage
3.0
4.5
5.5
3.0
4.5
5.5
3.0
4.5
5.5
3.0
V
V
2.1
3.15
3.85
0.9
2.1
3.15
3.85
0.9
2.1
3.15
3.85
0.9
V
− 0.1 V
CC
2.25
2.75
1.5
V
IL
Maximum LOW Level
Input Voltage
V
V
= 0.1 V or
V
V
OUT
CC
− 0.1 V
2.25
2.75
2.99
4.49
5.49
1.35
1.65
2.9
1.35
1.65
2.9
1.35
1.65
2.9
V
OH
Minimum HIGH Level
Output Voltage
I
= −50 mA
OUT
4.4
4.4
4.4
5.4
5.4
5.4
V
OH
= V or V
,
,
,
2.56
2.40
2.46
IN
IL
IH
IH
IH
I
= 12 mA
4.5
5.5
V
IN
= V or V
3.86
4.86
3.70
4.70
3.76
4.76
IL
I
= 24 mA
OH
V
IN
= V or V
IL
= 24 mA (Note 1)
I
OH
V
Maximum LOW Level
Output Voltage
3.0
4.5
5.5
3.0
I
= 50 mA
0.002
0.001
0.001
0.1
0.1
0.1
0.1
0.1
0.1
V
OL
OUT
0.1
0.1
0.1
V
= V or V
,
,
,
0.36
0.50
0.44
IN
IL
IH
IH
IH
I
OL
= 12 mA
4.5
5.5
5.5
5.5
V
= V or V
0.36
0.36
0.1
0.50
0.50
1.0
0.44
0.44
1.0
IN
IL
I
OL
= 24 mA
V
= V or V
IL
= 24 mA (Note 1)
IN
I
OL
I
IN
Maximum Input
Leakage Current
V = V , GND
mA
mA
I
CC
(Note 2)
I
Maximum 3−STATE
Leakage Current
V (OE) = V , V ;
IH
V = V , V
0.25
5.0
2.5
OZ
I
I
O
IL
;
CC
CC
GND
V
V
V
V
= V , GND
I
Minimum Dynamic
Output Current (Note 3)
5.5
5.5
5.5
= 1.65 V Max.
= 3.85 V Min.
50
75
mA
mA
mA
OLD
OLD
OHD
I
−50
80.0
−75
40.0
OHD
I
Maximum Quiescent
Supply Current
= V or GND
4.0
CC
IN
CC
(Note 2)
1. All outputs loaded; thresholds on input associated with output under test.
2. I and I @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V V
CC
.
IN
CC
3. Maximum test duration 2.0 ms, one output loaded at a time.
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3
74AC244, 74ACT244
DC ELECTRICAL CHARACTERISTICS FOR ACT
T
A
= +25°C
T
A
= −55°C to
+125°C
T
A
= −40°C to
+85°C
Symbol
Parameter
V
CC
(V)
Conditions
= 0.1 V or
OUT
Typ
1.5
Guaranteed Limits
Unit
V
IH
Minimum HIGH Level
Input Voltage
4.5
5.5
4.5
5.5
4.5
5.5
4.5
V
V
2.0
2.0
0.8
0.8
4.4
5.4
3.86
2.0
2.0
0.8
0.8
4.4
5.4
3.70
2.0
2.0
0.8
0.8
4.4
5.4
3.76
V
− 0.1 V
CC
1.5
V
IL
Maximum LOW Level
Input Voltage
V
V
= 0.1 V or
1.5
V
V
OUT
CC
− 0.1 V
1.5
V
OH
Minimum HIGH Level
Output Voltage
I
= −50 mA
4.49
5.49
OUT
V
OH
= V or V
,
,
IN
IL
IH
I
= 24 mA
5.5
V
IN
= V or V
4.86
4.70
4.76
IL
IH
I
= 24 mA (Note 4)
OH
V
Maximum LOW Level
Output Voltage
4.5
5.5
4.5
I
= 50 mA
0.001
0.001
0.1
0.1
0.1
0.1
0.1
0.1
V
OL
OUT
V
= V or V
,
,
0.36
0.50
0.44
IN
IL
IH
I
OL
= 24 mA
5.5
5.5
5.5
V
= V or V
0.36
0.1
0.50
1.0
0.44
1.0
IN
IL
IH
I
OL
= 24 mA (Note 4)
I
IN
Maximum Input
Leakage Current
V = V , GND
mA
mA
I
CC
I
Maximum 3−STATE
Leakage Current
V = V , V
V
;
0.25
5.0
2.5
OZ
I
O
IL
IH
= V , GND
CC
I
I
Maximum I /Input
5.5
5.5
5.5
5.5
V = V − 2.1 V
0.6
1.6
50
1.5
75
mA
mA
mA
mA
CCT
CC
I
CC
Minimum Dynamic
Output Current (Note 5)
V
V
V
= 1.65 V Max.
OLD
OLD
OHD
I
= 3.85 V Min.
−50
80.0
−75
40.0
OHD
I
Maximum Quiescent
Supply Current
= V or GND
4.0
CC
IN
CC
4. All outputs loaded; thresholds on input associated with output under test.
5. Maximum test duration 2.0 ms, one output loaded at a time.
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4
74AC244, 74ACT244
AC ELECTRICAL CHARACTERISTICS FOR AC
T
= −55°C to
+125°C
T
= −40°C to
+85°C
A
A
T
= +25°C,
L
A
C = 50 pF
C = 50 pF
C = 50 pF
L
L
V
CC
(V)
Symbol
Parameter
Min
2.0
1.5
2.0
1.5
2.0
1.5
2.5
1.5
3.0
2.5
2.5
2.0
Typ
6.5
5.0
6.5
5.0
6.0
5.0
7.5
5.5
7.0
6.5
7.5
6.5
Max
9.0
Min
Max
12.5
9.5
Min
Max
10.0
7.5
Unit
(Note 6)
t
Propagation Delay,
Data to Output
3.3
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.5
1.0
2.0
1.0
1.5
1.5
2.0
1.5
1.5
1.0
2.5
2.0
ns
PLH
PHL
PZH
5.0
7.0
t
Propagation Delay,
Data to Output
3.3
9.0
12.0
9.0
10.0
7.5
ns
ns
ns
ns
ns
5.0
7.0
t
Output Enable Time
Output Enable Time
Output Disable Time
Output Disable Time
3.3
10.5
7.0
11.5
9.0
11.0
8.0
5.0
t
3.3
10.0
8.0
13.0
10.5
12.5
10.5
13.0
11.0
11.0
8.5
PZL
5.0
t
3.3
10.0
9.0
10.5
9.5
PHZ
5.0
t
3.3
10.5
9.0
11.5
9.5
PLZ
5.0
6. Voltage range 3.3 is 3.3 V 0.3 V. Voltage range 5.0 is 5.0 V 0.5 V.
AC ELECTRICAL CHARACTERISTICS FOR ACT
T
= −55°C to
+125°C
T
= −40°C to
+85°C
A
A
T
= +25°C,
L
A
C = 50 pF
C = 50 pF
C = 50 pF
L
L
V
CC
(V)
Symbol
Parameter
Min
Typ
Max
Min
Max
Min
Max
Unit
(Note 7)
t
Propagation Delay,
5.0
2.0
6.5
9.0
1.0
10.0
1.5
10.0
ns
PLH
PHL
PZH
Data to Output
t
Propagation Delay,
Data to Output
5.0
2.0
7.0
9.0
1.0
10.0
1.5
10.0
ns
t
Output Enable Time
Output Enable Time
Output Disable Time
Output Disable Time
5.0
5.0
5.0
5.0
1.5
2.0
2.0
2.5
6.0
7.0
7.0
7.5
8.5
9.5
1.0
1.0
1.0
1.0
9.5
1.0
1.5
1.5
2.0
9.5
ns
ns
ns
ns
t
11.0
11.0
11.5
10.5
10.5
10.5
PZL
PHZ
t
9.5
t
10.0
PLZ
7. Voltage range 5.0 is 5.0 V 0.5 V.
CAPACITANCE
Symbol
Parameter
Input Capacitance
Power Dissipation Capacitance
Conditions
Typ
Unit
C
V
V
= OPEN
= 5.0 V
4.5
pF
pF
IN
CC
C
45.0
PD
CC
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5
74AC244, 74ACT244
ORDERING INFORMATION
†
Shipping
(Qty / Packing)
Order Number
Package
74AC244SC
SOIC−20W
(Pb−Free)
38 / Tube
74AC244SCX
74AC244MTC
74AC244MTCX
74ACT244SC
SOIC−20W
(Pb−Free)
1000 / Tape & Reel
75 / Tube
TSSOP−20
(Pb−Free)
TSSOP−20
(Pb−Free)
2500 / Tape & Reel
38 / Tube
SOIC−20W
(Pb−Free)
74ACT244SCX
74ACT244MTC
74ACT244MTCX
SOIC−20W
(Pb−Free)
1000 / Tape & Reel
75 / Tube
TSSOP−20
(Pb−Free)
TSSOP−20
(Pb−Free)
2500 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D
NOTE: All packages are lead free per JEDEC: J−STD−020B standard.
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6
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOIC−20, 300 mils
CASE 751BJ−01
ISSUE O
DATE 19 DEC 2008
SYMBOL
MIN
NOM
MAX
2.64
0.30
2.55
0.51
0.33
13.00
10.64
7.60
2.36
2.49
A
A1
A2
b
0.10
2.05
0.31
0.41
0.27
c
0.20
E1
E
D
12.60
10.01
7.40
12.80
10.30
7.50
E
E1
e
1.27 BSC
h
0.25
0.40
0º
0.75
1.27
8º
0.81
L
b
e
θ
5º
15º
θ1
PIN#1 IDENTIFICATION
TOP VIEW
D
h
h
q1
q
A2
A
q1
L
c
A1
END VIEW
SIDE VIEW
Notes:
(1) All dimensions are in millimeters. Angles in degrees.
(2) Complies with JEDEC MS-013.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON34287E
SOIC−20, 300 MILS
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOIC−20 WB
CASE 751D−05
ISSUE H
DATE 22 APR 2015
SCALE 1:1
D
A
q
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
20
11
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
PROTRUSION.
E
B
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF B
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
1
10
MILLIMETERS
DIM MIN
MAX
2.65
0.25
0.49
0.32
12.95
7.60
20X b
A
A1
b
2.35
0.10
0.35
0.23
12.65
7.40
M
S
S
B
T
0.25
A
c
D
E
e
A
1.27 BSC
H
h
10.05
0.25
0.50
0
10.55
0.75
0.90
7
SEATING
PLANE
L
18X e
q
_
_
A1
c
T
GENERIC
MARKING DIAGRAM*
RECOMMENDED
20
SOLDERING FOOTPRINT*
20X
20X
0.52
1.30
XXXXXXXXXXX
XXXXXXXXXXX
AWLYYWWG
20
11
10
1
XXXXX = Specific Device Code
11.00
A
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
1
WL
YY
WW
G
1.27
PITCH
DIMENSIONS: MILLIMETERS
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98ASB42343B
SOIC−20 WB
PAGE 1 OF 1
onsemi and
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
TSSOP−20 WB
CASE 948E
ISSUE D
DATE 17 FEB 2016
SCALE 2:1
NOTES:
20X K REF
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
K
K1
M
S
S
0.10 (0.004)
T U
V
S
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
0.15 (0.006) T U
J J1
20
11
2X L/2
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION
SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
B
SECTION N−N
L
−U−
PIN 1
IDENT
0.25 (0.010)
N
1
10
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
M
S
0.15 (0.006) T U
A
−V−
N
MILLIMETERS
INCHES
MIN
DIM MIN
MAX
6.60
4.50
1.20
0.15
0.75
MAX
0.260
0.177
0.047
0.006
0.030
F
A
B
6.40
4.30
---
0.252
0.169
---
DETAIL E
C
D
0.05
0.50
0.002
0.020
F
G
H
0.65 BSC
0.026 BSC
−W−
0.27
0.09
0.09
0.19
0.19
0.37
0.20
0.16
0.30
0.25
0.011
0.004
0.004
0.007
0.007
0.015
0.008
0.006
0.012
0.010
C
J
J1
K
G
D
H
K1
L
DETAIL E
6.40 BSC
0.252 BSC
0
0.100 (0.004)
−T− SEATING
M
0
8
8
_
_
_
_
PLANE
GENERIC
MARKING DIAGRAM*
SOLDERING FOOTPRINT
7.06
XXXX
XXXX
ALYWG
G
1
A
L
= Assembly Location
= Wafer Lot
Y
W
G
= Year
= Work Week
= Pb−Free Package
0.65
PITCH
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
01.36X6
16X
1.26
DIMENSIONS: MILLIMETERS
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98ASH70169A
TSSOP−20 WB
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
TSSOP20, 4.4x6.5
CASE 948AQ−01
ISSUE A
DATE 19 MAR 2009
b
SYMBOL
MIN
NOM
MAX
A
A1
A2
b
1.20
0.15
1.05
0.30
0.20
6.60
6.50
4.50
0.05
0.80
0.19
0.09
6.40
6.30
4.30
E1
E
c
D
6.50
6.40
E
E1
e
4.40
0.65 BSC
0.60
L
0.45
0.75
L1
1.00 REF
0º
8º
θ
e
TOP VIEW
D
c
A2
A
θ1
L
A1
L1
SIDE VIEW
END VIEW
Notes:
(1) All dimensions are in millimeters. Angles in degrees.
(2) Complies with JEDEC MO-153.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON34453E
TSSOP20, 4.4X6.5
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
onsemi,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any
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