74LCX16245MTD [ONSEMI]

带5V容差输入和输出的低电压16-位双向收发器;
74LCX16245MTD
型号: 74LCX16245MTD
厂家: ONSEMI    ONSEMI
描述:

带5V容差输入和输出的低电压16-位双向收发器

PC 输入元件 光电二极管 输出元件 逻辑集成电路
文件: 总11页 (文件大小:240K)
中文:  中文翻译
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February 1994  
Revised May 2005  
74LCX16245  
Low Voltage 16-Bit Bidirectional Transceiver  
with 5V Tolerant Inputs and Outputs  
General Description  
Features  
5V tolerant inputs and outputs  
The LCX16245 contains sixteen non-inverting bidirectional  
buffers with 3-STATE outputs and is intended for bus ori-  
ented applications. The device is designed for low voltage  
(2.5V or 3.3V) VCC applications with capability of interfac-  
2.3V–3.6V VCC specifications provided  
4.5 ns tPD max (VCC 3.3V), 20 A ICC max  
Power down high impedance inputs and outputs  
Supports live insertion/withdrawal (Note 1)  
ing to a 5V signal environment. The device is byte con-  
trolled. Each byte has separate control inputs which could  
be shorted together for full 16-bit operation. The T/R inputs  
determine the direction of data flow through the device.  
The OE inputs disable both the A and B ports by placing  
them in a high impedance state.  
24 mA output drive (VCC 3.0V)  
Uses patented noise/EMI reduction circuitry  
Latch-up performance exceeds 500 mA  
ESD performance:  
The LCX16245 is fabricated with an advanced CMOS tech-  
nology to achieve high speed operation while maintaining  
CMOS low power dissipation.  
Human body model 2000V  
Machine model 200V  
Also packaged in plastic Fine-Pitch Ball Grid Array  
(FBGA)  
Note 1: To ensure the high-impedance state during power up or down, OE  
should be tied to V  
through a pull-up resistor: the minimum value or the  
CC  
resistor is determined by the current-sourcing capability of the driver.  
Ordering Code:  
Order Number Package Number  
Package Description  
74LCX16245G  
(Note 2)(Note 3)  
BGA54A  
MS48A  
MTD48  
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide  
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide  
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide  
74LCX16245MEA  
(Note 3)  
74LCX16245MTD  
(Note 3)  
Note 2: Ordering code Gindicates Trays.  
Note 3: Devices also available in Tape and Reel. Specify by appending the suffix letter Xto the ordering code.  
Logic Symbol  
© 2005 Fairchild Semiconductor Corporation  
DS012001  
www.fairchildsemi.com  
Connection Diagrams  
Pin Descriptions  
Pin Names  
Description  
Output Enable Input  
Transmit/Receive Input  
Pin Assignment for SSOP and TSSOP  
OEn  
T/Rn  
A0A15  
B0B15  
NC  
Side A Inputs or 3-STATE Outputs  
Side B Inputs or 3-STATE Outputs  
No Connect  
FBGA Pin Assignments  
1
2
3
4
5
6
A
B
C
D
E
F
B0  
B2  
NC  
B1  
T/R1  
NC  
OE1  
NC  
NC  
A1  
A0  
A2  
B4  
B3  
VCC  
GND  
GND  
GND  
VCC  
NC  
VCC  
GND  
GND  
GND  
VCC  
NC  
A3  
A4  
B6  
B5  
A5  
A6  
B8  
B7  
A7  
A8  
B10  
B12  
B14  
B9  
A9  
A10  
A12  
A14  
G
H
B11  
B13  
A11  
A13  
J
B15  
NC  
T/R2  
OE2  
NC  
A15  
Truth Tables  
Inputs  
Pin Assignment for FBGA  
Outputs  
OE1  
T/R1  
L
L
L
H
X
Bus B0B7 Data to Bus A0A7  
Bus A0A7 Data to Bus B0B7  
HIGH Z State on A0A7, B0B7  
H
Inputs  
Outputs  
OE2  
T/R2  
L
L
L
H
X
Bus B8B15 Data to Bus A8A15  
Bus A8A15 Data to Bus B8B15  
H
HIGH Z State on A8A15, B8B15  
H
L
X
Z
HIGH Voltage Level  
LOW Voltage Level  
Immaterial  
(Top Thru View)  
High Impedance  
Logic Diagrams  
Note: Please note that these diagrams are provided only for the understanding of logic operations and should not be used to estimate propagation delays.  
www.fairchildsemi.com  
2
Absolute Maximum Ratings(Note 4)  
Symbol  
VCC  
Parameter  
Supply Voltage  
Value  
Conditions  
Units  
0.5 to 7.0  
0.5 to 7.0  
0.5 to 7.0  
V
V
VI  
DC Input Voltage  
VO  
DC Output Voltage  
Output in 3-STATE  
V
0.5 to VCC 0.5 Output in HIGH or LOW State (Note 5)  
IIK  
DC Input Diode Current  
DC Output Diode Current  
50  
50  
VI GND  
VO GND  
VO VCC  
mA  
mA  
IOK  
50  
IO  
DC Output Source/Sink Current  
DC Supply Current per Supply Pin  
DC Ground Current per Ground Pin  
Storage Temperature  
50  
mA  
mA  
mA  
C
ICC  
100  
IGND  
TSTG  
100  
65 to 150  
Recommended Operating Conditions (Note 6)  
Symbol  
Parameter  
Min  
2.0  
1.5  
0
Max  
3.6  
3.6  
5.5  
VCC  
5.5  
24  
Units  
VCC  
Supply Voltage  
Operating  
V
V
V
Data Retention  
VI  
Input Voltage  
VO  
Output Voltage  
HIGH or LOW State  
3-STATE  
0
0
IOH/IOL  
Output Current  
VCC 3.0V 3.6V  
VCC 2.7V 3.0V  
VCC 2.3V 2.7V  
12  
mA  
8
TA  
Free-Air Operating Temperature  
40  
0
85  
C
t/ V  
Input Edge Rate, VIN 0.8V2.0V, VCC 3.0V  
10  
ns/V  
Note 4: The Absolute Maximum Ratings are those values beyond which the safety of the device cannot be guaranteed. The device should not be operated  
at these limits. The parametric values defined in the Electrical Characteristics tables are not guaranteed at the Absolute Maximum Ratings. The Recom-  
mended Operating Conditionstable will define the conditions for actual device operation.  
Note 5: I Absolute Maximum Rating must be observed.  
O
Note 6: Unused inputs or I/O's must be held HIGH or LOW. They may not float.  
DC Electrical Characteristics  
V
T
40 C to 85 C  
Min Max  
CC  
A
Symbol  
Parameter  
Conditions  
Units  
(V)  
2.3 2.7  
2.7 3.6  
2.3 2.7  
2.7 3.6  
2.3 3.6  
2.3  
V
V
V
HIGH Level Input Voltage  
1.7  
2.0  
IH  
V
V
LOW Level Input Voltage  
HIGH Level Output Voltage  
0.7  
IL  
0.8  
I
I
I
I
I
I
I
I
I
I
100  
A
V
CC  
0.2  
OH  
OH  
OH  
OH  
OH  
OH  
OL  
OL  
OL  
OL  
OL  
8 mA  
1.8  
2.2  
2.4  
2.2  
12 mA  
18 mA  
24 mA  
2.7  
V
V
3.0  
3.0  
V
LOW Level Output Voltage  
100  
8mA  
A
2.3 3.6  
2.3  
0.2  
0.6  
0.4  
0.4  
0.55  
5.0  
5.0  
OL  
12 mA  
16 mA  
24 mA  
2.7  
3.0  
3.0  
I
I
Input Leakage Current  
3-STATE I/O Leakage  
0
0
V
V
V
5.5V  
5.5V  
2.3 3.6  
2.3 3.6  
A
A
A
I
I
OZ  
O
V
or V  
IL  
I
IH  
I
Power-Off Leakage Current  
V or V  
O
5.5V  
0
10  
OFF  
I
3
www.fairchildsemi.com  
DC Electrical Characteristics (Continued)  
V
T
40 C to 85 C  
CC  
A
Symbol  
Parameter  
Conditions  
V or GND  
CC  
Units  
(V)  
Min  
Max  
20  
I
Quiescent Supply Current  
V
2.33.6  
2.33.6  
2.33.6  
CC  
I
A
A
3.6V V , V  
5.5V (Note 7)  
20  
I
O
I
Increase in I per Input  
V
V 0.6V  
CC  
500  
CC  
CC  
IH  
Note 7: Outputs disabled or 3-STATE only.  
AC Electrical Characteristics  
T
40 C to 85 C, R  
500  
A
L
V
3.3V 0.3V  
50 pF  
V
2.7V  
V
CC  
2.5V 0.2V  
CC  
CC  
Symbol  
Parameter  
Units  
C
C
50 pF  
C
L
30 pF  
Max  
L
L
Min  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
Max  
4.5  
4.5  
6.5  
6.5  
6.4  
6.4  
1.0  
1.0  
Min  
Max  
5.2  
5.2  
7.2  
7.2  
6.9  
6.9  
Min  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
t
Propagation Delay  
A to B or B to A  
n
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
5.4  
5.4  
8.5  
8.5  
7.7  
7.7  
PHL  
ns  
ns  
ns  
ns  
t
t
t
t
t
t
t
PLH  
n
n
n
Output Enable Time  
PZL  
PZH  
PLZ  
Output Disable Time  
PHZ  
OSHL  
OSLH  
Output to Output Skew  
(Note 8)  
Note 8: Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The  
specification applies to any outputs switching in the same direction, either HIGH-to-LOW (t  
) or LOW-to-HIGH (t  
). Parameter guaranteed by design.  
OSLH  
OSHL  
Dynamic Switching Characteristics  
V
T
25 C  
CC  
A
Symbol  
Parameter  
Conditions  
Units  
(V)  
3.3  
2.5  
3.3  
2.5  
Typical  
0.8  
V
Quiet Output Dynamic Peak V  
C
C
C
C
50 pF, V  
30 pF, V  
50 pF, V  
30 pF, V  
3.3V, V  
2.5V, V  
3.3V, V  
2.5V, V  
0V  
0V  
0V  
0V  
OLP  
OL  
L
L
L
L
IH  
IH  
IH  
IH  
IL  
IL  
IL  
IL  
V
V
0.6  
V
Quiet Output Dynamic Valley V  
0.8  
OLV  
OL  
0.6  
Capacitance  
Symbol  
Parameter  
Conditions  
Typical  
Units  
pF  
C
Input Capacitance  
Input/Output Capacitance  
Power Dissipation Capacitance  
V
V
V
Open, V 0V or V  
CC  
7
8
IN  
CC  
CC  
CC  
I
C
C
3.3V, V 0V or V  
CC  
pF  
I/O  
PD  
I
3.3V, V 0V or V , f 10 MHz  
20  
pF  
I
CC  
www.fairchildsemi.com  
4
AC LOADING and WAVEFORMS Generic for LCX Family  
FIGURE 1. AC Test Circuit (CL includes probe and jig capacitance)  
Test  
PLH, tPHL  
PZL, tPLZ  
Switch  
Open  
t
t
6V at VCC 3.3 0.3V  
VCC x 2 at VCC 2.5 0.2V  
tPZH,tPHZ  
GND  
3-STATE Output High Enable and  
Waveform for Inverting and Non-Inverting Functions  
Disable Times for Logic  
Setup Time, Hold Time and Recovery Time for Logic  
Propagation Delay. Pulse Width and trec Waveforms  
trise and tfall  
3-STATE Output Low Enable and  
Disable Times for Logic  
FIGURE 2. Waveforms  
(Input Characteristics; f =1MHz, tr = tf = 3ns)  
VCC  
Symbol  
3.3V 0.3V  
1.5V  
2.7V  
1.5V  
2.5V 0.2V  
VCC/2  
Vmi  
Vmo  
Vx  
1.5V  
1.5V  
VCC/2  
VOL 0.3V  
VOH 0.3V  
VOL 0.3V  
VOH 0.3V  
VOL 0.15V  
VOH 0.15V  
Vy  
5
www.fairchildsemi.com  
Schematic Diagram Generic for LCX Family  
www.fairchildsemi.com  
6
Physical Dimensions inches (millimeters) unless otherwise noted  
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide  
Package Number BGA54A  
7
www.fairchildsemi.com  
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)  
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide  
Package Number MS48A  
www.fairchildsemi.com  
8
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)  
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide  
Package Number MTD48  
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and  
Fairchild reserves the right at any time without notice to change said circuitry and specifications.  
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FAIRCHILDS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT  
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD  
SEMICONDUCTOR CORPORATION. As used herein:  
1. Life support devices or systems are devices or systems  
which, (a) are intended for surgical implant into the  
body, or (b) support or sustain life, and (c) whose failure  
to perform when properly used in accordance with  
instructions for use provided in the labeling, can be rea-  
sonably expected to result in a significant injury to the  
user.  
2. A critical component in any component of a life support  
device or system whose failure to perform can be rea-  
sonably expected to cause the failure of the life support  
device or system, or to affect its safety or effectiveness.  
www.fairchildsemi.com  
9
www.fairchildsemi.com  
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