74LCX16543MTDX [ONSEMI]

低压16位寄存收发器(5V容许输入和输出电压);
74LCX16543MTDX
型号: 74LCX16543MTDX
厂家: ONSEMI    ONSEMI
描述:

低压16位寄存收发器(5V容许输入和输出电压)

光电二极管 输出元件 逻辑集成电路
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May 1995  
Revised April 2001  
74LCX16543  
Low Voltage 16-Bit Registered Transceiver  
with 5V Tolerant Inputs and Outputs  
General Description  
Features  
5V tolerant inputs and outputs  
The LCX16543 contains sixteen non-inverting transceivers  
containing two sets of D-type registers for temporary stor-  
age of data flowing in either direction. Each byte has sepa-  
rate control inputs which can be shorted together for full  
16-bit operation. Separate Latch Enable and Output  
Enable inputs are provided for each register to permit inde-  
pendent input and output control in either direction of data  
flow.  
2.3V–3.6V VCC specifications provided  
5.2 ns tPD max (VCC = 3.3V), 20 µA ICC max  
Power down high impedance inputs and outputs  
Supports live insertion/withdrawal (Note 1)  
±24 mA Output Drive (VCC = 3.0V)  
Implements patented noise/EMI reduction circuitry  
Latch-up performance exceeds 500 mA  
ESD performance:  
The LCX16543 is designed for low voltage (2.5V or 3.3V)  
VCC applications with capability of interfacing to a 5V signal  
environment.  
Human Body Model > 2000V  
The LCX16543 is fabricated with an advanced CMOS tech-  
nology to achieve high speed operation while maintaining  
CMOS low power dissipation.  
Machine Model > 200V  
Note 1: To ensure the high-impedance state during power up or down, OE  
should be tied to VCC through a pull-up resistor: the minimum value or the  
resistor is determined by the current-sourcing capability of the driver.  
Ordering Code:  
Order Number Package Number  
Package Description  
74LCX16543MEA  
74LCX16543MTD  
MS56A  
MTD56  
56-Lead Shrink Small Outline Package (SSOP), JEDEC MO-118, 0.300 Wide  
56-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide  
Devices also available in Tape and Reel. Specify by appending the suffix letter Xto the ordering code.  
Connection Diagram  
Logic Symbol  
© 2001 Fairchild Semiconductor Corporation  
DS012464  
www.fairchildsemi.com  
Pin Descriptions  
Pin Names  
Description  
OEABn  
OEBAn  
CEABn  
CEBAn  
LEABn  
LEBAn  
A0A15  
B0B15  
A-to-B Output Enable Input (Active LOW)  
B-to-A Output Enable Input (Active LOW)  
A-to-B Enable Input (Active LOW)  
B-to-A Enable Input (Active LOW)  
A-to-B Latch Enable Input (Active LOW)  
B-to-A Latch Enable Input (Active LOW)  
A-to-B Data Inputs or B-to-A 3-STATE Outputs  
B-to-A Data Inputs or A-to-B 3-STATE Outputs  
Data I/O Control Table  
Inputs  
CEABn LEABn OEABn  
Latch Status Output Buffers  
(Byte n)  
(Byte n)  
H
X
L
X
H
L
X
X
X
H
L
Latched  
Latched  
Transparent  
High Z  
X
L
X
X
High Z  
Driving  
H = HIGH Voltage Level  
L = LOW Voltage Level  
X = Immaterial  
A-to-B data flow shown; B-to-A flow control is the same, except using CEBAn, LEBAn and OEBAn  
Functional Description  
The LCX16543 contains sixteen non-inverting transceivers  
with 3-STATE outputs. The device is byte controlled with  
each byte functioning identically, but independent of the  
other. The control pins may be shorted together to obtain  
full 16-bit operation. The following description applies to  
each byte. For data flow from A to B, for example, the  
A-to-B Enable (CEABn) input must be LOW in order to  
makes the A-to-B latches transparent; a subsequent LOW-  
to-HIGH transition of the LEABn signal puts the A latches in  
the storage mode and their outputs no longer change with  
the A inputs. With CEABn and OEABn both LOW, the  
3-STATE B output buffers are active and reflect the data  
present at the output of the A latches. Control of data flow  
from B to A is similar, but using the CEBAn, LEBAn and  
enter data from A0A15 or take data from B0B15, as indi-  
cated in the Data I/O Control Table. With CEABn LOW, a  
LOW signal on the A-to-B Latch Enable (LEABn) input  
OEBAn inputs.  
www.fairchildsemi.com  
2
Logic Diagrams  
Byte 1 (0:7)  
Byte 2 (8:15)  
Please note that these diagrams are provided only for the understanding of logic operations and should not be used to estimate propagation delays.  
3
www.fairchildsemi.com  
Absolute Maximum Ratings(Note 2)  
Symbol  
VCC  
Parameter  
Supply Voltage  
Value  
Conditions  
Units  
0.5 to +7.0  
0.5 to +7.0  
0.5 to +7.0  
V
V
VI  
DC Input Voltage  
VO  
DC Output Voltage  
Output in 3-STATE  
V
0.5 to VCC + 0.5 Output in HIGH or LOW State (Note 3)  
IIK  
DC Input Diode Current  
DC Output Diode Current  
50  
50  
VI < GND  
mA  
mA  
IOK  
V
V
O < GND  
O > VCC  
+50  
IO  
DC Output Source/Sink Current  
DC Supply Current per Supply Pin  
DC Ground Current per Ground Pin  
Storage Temperature  
±50  
mA  
mA  
mA  
°C  
ICC  
±100  
IGND  
TSTG  
±100  
65 to +150  
Recommended Operating Conditions (Note 4)  
Symbol  
Parameter  
Min  
2.0  
1.5  
0
Max  
3.6  
3.6  
5.5  
VCC  
5.5  
±24  
±12  
±8  
Units  
VCC  
Supply Voltage  
Operating  
Data Retention  
V
V
V
VI  
Input Voltage  
VO  
Output Voltage  
HIGH or LOW State  
3-STATE  
0
0
IOH/IOL  
Output Current  
V
V
V
CC = 3.0V 3.6V  
CC = 2.7V 3.0V  
CC = 2.3V 2.7V  
mA  
TA  
Free-Air Operating Temperature  
40  
85  
°C  
t/V  
Input Edge Rate, VIN = 0.8V2.0V, VCC = 3.0V  
0
10  
ns/V  
Note 2: The Absolute Maximum Ratings are those values beyond which the safety of the device cannot be guaranteed. The device should not be operated  
at these limits. The parametric values defined in the Electrical Characteristics tables are not guaranteed at the Absolute Maximum Ratings. The Recom-  
mended Operating Conditionstable will define the conditions for actual device operation.  
Note 3: IO Absolute Maximum Rating must be observed.  
Note 4: Unused (inputs or I/Os) must be held HIGH or LOW. They may not float.  
DC Electrical Characteristics  
VCC  
TA = −40°C to +85°C  
Symbol  
VIH  
Parameter  
Conditions  
Units  
(V)  
2.3 2.7  
2.7 3.6  
2.3 2.7  
2.7 3.6  
2.3 3.6  
2.3  
Min  
1.7  
2.0  
Max  
HIGH Level Input Voltage  
V
V
VIL  
LOW Level Input Voltage  
HIGH Level Output Voltage  
0.7  
0.8  
VOH  
I
OH = −100 µA  
OH = −8 mA  
OH = −12 mA  
OH = −18 mA  
OH = −24 mA  
OL = 100 µA  
OL = 8 mA  
OL = 12 mA  
OL = 16 mA  
OL = 24 mA  
VCC 0.2  
I
1.8  
I
2.7  
2.2  
V
V
I
3.0  
2.4  
I
3.0  
2.2  
VOL  
LOW Level Output Voltage  
I
2.3 3.6  
2.3  
0.2  
0.6  
I
I
2.7  
0.4  
I
3.0  
0.4  
I
3.0  
0.55  
±5.0  
II  
Input Leakage Current  
3-STATE I/O Leakage  
0 VI 5.5V  
0 VO 5.5V  
VI = VIH or VIL  
2.3 3.6  
µA  
µA  
µA  
IOZ  
2.3 3.6  
±5.0  
IOFF  
Power-Off Leakage Current  
VI or VO = 5.5V  
0
10  
www.fairchildsemi.com  
4
DC Electrical Characteristics (Continued)  
VCC  
TA = −40°C to +85°C  
Symbol  
ICC  
Parameter  
Conditions  
Units  
(V)  
Min  
Max  
20  
Quiescent Supply Current  
VI = VCC or GND  
3.6V VI, VO 5.5V (Note 5)  
VIH = VCC 0.6V  
2.3 3.6  
2.3 3.6  
2.3 3.6  
µA  
µA  
±20  
500  
ICC  
Increase in ICC per Input  
Note 5: Outputs in disabled or 3-STATE only.  
AC Electrical Characteristics  
T
A = −40°C to +85°C, RL = 500 Ω  
V
CC = 3.3V ± 0.3V  
L = 50 pF  
Max  
V
CC = 2.7V  
L = 50 pF  
Max  
V
CC = 2.5V ± 0.2V  
L = 30 pF  
Min Max  
Symbol  
Parameter  
Units  
C
C
C
Min  
Min  
tPHL  
Propagation Delay  
1.5  
1.5  
1.5  
1.5  
5.2  
5.2  
6.5  
6.5  
1.5  
1.5  
1.5  
1.5  
6.0  
6.0  
7.5  
7.5  
1.5  
1.5  
1.5  
1.5  
6.2  
6.2  
7.8  
7.8  
ns  
ns  
tPLH  
tPHL  
tPLH  
tPZL  
tPZH  
An to Bn or Bn to An  
Propagation Delay  
LEBAn to An or LEABn to Bn  
Output Enable Time  
OEBAn or OEABn to An or Bn  
CEBAn or CEABn to An or Bn  
Output Disable Time  
1.5  
1.5  
6.5  
6.5  
1.5  
1.5  
7.0  
7.0  
1.5  
1.5  
8.5  
8.5  
ns  
tPLZ  
tPHZ  
OEBAn or OEABn to An or Bn  
CEBAn or CEABn to An or Bn  
Setup Time, HIGH or LOW,  
Data to LEXXn  
1.5  
1.5  
2.5  
6.5  
6.5  
1.5  
1.5  
2.5  
7.0  
7.0  
1.5  
1.5  
3.0  
7.8  
7.8  
ns  
ns  
tS  
tH  
Hold Time, HIGH or LOW,  
Data to LEXXn  
1.5  
3.0  
1.5  
3.0  
2.0  
3.5  
ns  
ns  
ns  
tW  
Pulse Width, Latch Enable, LOW  
Output to Output Skew (Note 6)  
tOSHL  
tOSLH  
1.0  
1.0  
Note 6: Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The  
specification applies to any outputs switching in the same direction, either HIGH-to-LOW (tOSHL) or LOW-to-HIGH (tOSLH). Parameter guaranteed by design.  
Dynamic Switching Characteristics  
VCC  
TA = 25°C  
Symbol  
VOLP  
Parameter  
Conditions  
Units  
(V)  
3.3  
2.5  
3.3  
2.5  
Typical  
0.8  
Quiet Output Dynamic Peak VOL  
C
C
C
C
L = 50 pF, VIH = 3.3V, VIL = 0V  
L = 30 pF, VIH = 2.5V, VIL = 0V  
L = 50 pF, VIH = 3.3V, VIL = 0V  
L = 30 pF, VIH = 2.5V, VIL = 0V  
V
V
0.6  
VOLV  
Quiet Output Dynamic Valley VOL  
0.8  
0.6  
Capacitance  
Symbol  
Parameter  
Conditions  
CC = Open, VI = 0V or VCC  
Typical  
Units  
pF  
CIN  
Input Capacitance  
Input/Output Capacitance  
Power Dissipation Capacitance  
V
V
V
7
8
CI/O  
CPD  
CC = 3.3V, VI = 0V or VCC  
pF  
CC = 3.3V, VI = 0V or VCC, f = 10 MHz  
20  
pF  
5
www.fairchildsemi.com  
AC LOADING and WAVEFORMS Generic for LCX Family  
FIGURE 1. AC Test Circuit (CL includes probe and jig capacitance)  
Test  
tPLH, tPHL  
PZL, tPLZ  
Switch  
Open  
t
6V at VCC = 3.3 ± 0.3V  
VCC x 2 at VCC = 2.5 ± 0.2V  
tPZH,tPHZ  
GND  
3-STATE Output High Enable and  
Waveform for Inverting and Non-Inverting Functions  
Disable Times for Logic  
Setup Time, Hold Time and Recovery Time for Logic  
Propagation Delay. Pulse Width and trec Waveforms  
trise and tfall  
3-STATE Output Low Enable and  
Disable Times for Logic  
FIGURE 2. Waveforms  
(Input Characteristics; f =1MHz, tr = tf = 3ns)  
VCC  
Symbol  
3.3V ± 0.3V  
1.5V  
2.7V  
1.5V  
2.5V ± 0.2V  
VCC/2  
Vmi  
Vmo  
Vx  
1.5V  
1.5V  
VCC/2  
VOL + 0.3V  
V
OL + 0.3V  
V
OL + 0.15V  
Vy  
V
OH 0.3V  
V
OH 0.3V  
VOH 0.15V  
www.fairchildsemi.com  
6
Schematic Diagram Generic for LCX Family  
7
www.fairchildsemi.com  
Physical Dimensions inches (millimeters) unless otherwise noted  
56-Lead Shrink Small Outline Package (SSOP), JEDEC MO-118, 0.300 Wide  
Package Number MS56A  
www.fairchildsemi.com  
8
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)  
56-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide  
Package Number MTD56  
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and  
Fairchild reserves the right at any time without notice to change said circuitry and specifications.  
LIFE SUPPORT POLICY  
FAIRCHILDS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT  
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD  
SEMICONDUCTOR CORPORATION. As used herein:  
1. Life support devices or systems are devices or systems  
which, (a) are intended for surgical implant into the  
body, or (b) support or sustain life, and (c) whose failure  
to perform when properly used in accordance with  
instructions for use provided in the labeling, can be rea-  
sonably expected to result in a significant injury to the  
user.  
2. A critical component in any component of a life support  
device or system whose failure to perform can be rea-  
sonably expected to cause the failure of the life support  
device or system, or to affect its safety or effectiveness.  
www.fairchildsemi.com  
9
www.fairchildsemi.com  
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regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or  
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer  
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not  
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification  
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized  
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expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such  
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