74LCX74MTCX [ONSEMI]

低压双通道D型正边沿触发式触发器,带5V容差输入;
74LCX74MTCX
型号: 74LCX74MTCX
厂家: ONSEMI    ONSEMI
描述:

低压双通道D型正边沿触发式触发器,带5V容差输入

光电二极管 逻辑集成电路 触发器
文件: 总13页 (文件大小:980K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
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December 2013  
74LCX74  
Low Voltage Dual D-Type Positive Edge-Triggered  
Flip-Flop with 5V Tolerant Inputs  
Features  
General Description  
5V tolerant inputs  
The LCX74 is a dual D-type flip-flop with Asynchronous  
Clear and Set inputs and complementary (Q, Q) outputs.  
Information at the input is transferred to the outputs on  
the positive edge of the clock pulse. After the Clock  
Pulse input threshold voltage has been passed, the Data  
input is locked out and information present will not be  
transferred to the outputs until the next rising edge of the  
Clock Pulse input.  
2.3V–3.6V V specifications provided  
CC  
7.0ns t max. (V = 3.3V), 10µA I max.  
PD  
CC  
CC  
Power down high impedance inputs and outputs  
24mA output drive (V = 3.0V)  
CC  
Implements proprietary noise/EMI reduction circuitry  
Latch-up performance exceeds JEDEC 78 conditions  
ESD performance:  
Asynchronous Inputs:  
– Human body model > 2000V  
LOW input to S (Set) sets Q to HIGH level  
D
– Machine model > 200V  
LOW input to C (Clear) sets Q to LOW level  
D
Leadless Pb-Free DQFN package  
Clear and Set are independent of clock  
Simultaneous LOW on C and S makes both Q  
D
D
and Q HIGH  
Ordering Information  
Package  
Order Number  
Number  
Package Description  
74LCX74M  
M14A  
14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150"  
Narrow  
74LCX74SJ  
M14D  
14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide  
(1)  
74LCX74BQX  
MLP14A  
14-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN),  
JEDEC MO-241, 2.5 x 3.0mm  
74LCX74MTC  
MTC14  
14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153,  
4.4mm Wide  
Note:  
1. DQFN package available in Tape and Reel only.  
Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering number.  
All packages are lead free per JEDEC: J-STD-020B standard.  
©1995 Fairchild Semiconductor Corporation  
74LCX74 Rev. 1.7.1  
www.fairchildsemi.com  
Connection Diagrams  
Logic Symbols  
Pin Assignments for SOIC, SOP, and TSSOP  
IEEE/IEC  
Pad Assignment for DQFN  
Truth Table  
(Each Half)  
(Bottom View)  
(Top View)  
Inputs  
Outputs  
S
C
CP  
D
Q
Q
L
D
D
L
H
X
X
X
X
X
X
H
L
H
L
Pin Description  
H
L
L
L
H
H
L
Pin Names  
Description  
H
H
L
D , D  
Data Inputs  
H
H
H
H
H
H
1
2
CP , CP  
Clock Pulse Inputs  
Direct Clear Inputs  
Direct Set Inputs  
Outputs  
H
Q
1
2
C
, C  
D2  
L
X
Q
0
D1  
0
S
, S  
D2  
D1  
H = HIGH Voltage Level  
L = LOW Voltage Level  
X = Immaterial  
Q , Q , Q , Q  
1
1
2
2
DAP  
No Connect  
Note: DAP (Die Attach Pad)  
= LOW-to-HIGH Clock Transition  
Q (Q ) = Previous Q(Q) before LOW-to-HIGH Transition  
0
0
of Clock  
©1995 Fairchild Semiconductor Corporation  
74LCX74 Rev. 1.7.1  
www.fairchildsemi.com  
2
Absolute Maximum Ratings  
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be  
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.  
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.  
The absolute maximum ratings are stress ratings only.  
Symbol  
Parameter  
Rating  
V
Supply Voltage  
–0.5V to +7.0V  
–0.5V to +7.0V  
CC  
V
DC Input Voltage  
I
(2)  
V
DC Output Voltage, Output in HIGH or LOW State  
–0.5V to V + 0.5V  
O
IK  
CC  
I
DC Input Diode Current, V < GND  
–50mA  
I
I
DC Output Diode Current  
OK  
V
< GND  
–50mA  
+50mA  
O
V
> V  
CC  
O
I
DC Output Source/Sink Current  
DC Supply Current per Supply Pin  
DC Ground Current per Ground Pin  
Storage Temperature  
50mA  
O
I
100mA  
CC  
I
100mA  
GND  
T
–65°C to +150°C  
STG  
Note:  
2. I Absolute Maximum Rating must be observed.  
O
(3)  
Recommended Operating Conditions  
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended  
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not  
recommend exceeding them or designing to absolute maximum ratings.  
Symbol  
Parameter  
Min.  
Max.  
Units  
V
Supply Voltage  
Operating  
CC  
2.0  
1.5  
0
3.6  
3.6  
5.5  
V
Data Retention  
Input Voltage  
V
V
V
I
V
Output Voltage, HIGH or LOW State  
Output Current  
0
V
CC  
O
I
/ I  
OH OL  
V
V
V
= 3.0V–3.6V  
= 2.7V–3.0V  
= 2.3V–2.7V  
24  
12  
8
mA  
CC  
CC  
CC  
T
Free-Air Operating Temperature  
Input Edge Rate, V = 0.8V–2.0V, V = 3.0V  
–40  
0
85  
10  
°C  
A
t / V  
ns/V  
IN  
CC  
Note:  
3. Unused inputs must be held HIGH or LOW. They may not float.  
©1995 Fairchild Semiconductor Corporation  
74LCX74 Rev. 1.7.1  
www.fairchildsemi.com  
3
DC Electrical Characteristics  
T = –40°C to +85°C  
A
Symbol  
Parameter  
V
(V)  
Conditions  
Min.  
1.7  
Max.  
Units  
CC  
V
HIGH Level Input Voltage  
2.3–2.7  
2.7–3.6  
2.3–2.7  
2.7–3.6  
2.3–3.6  
2.3  
V
IH  
2.0  
V
LOW Level Input Voltage  
HIGH Level Output Voltage  
0.7  
0.8  
V
V
IL  
V
I
I
I
I
I
I
I
I
I
I
= –100µA  
= –8mA  
= –12mA  
= –18mA  
= –24mA  
= 100µA  
= 8mA  
V
– 0.2  
OH  
OH  
OH  
OH  
OH  
OH  
OL  
OL  
OL  
OL  
OL  
CC  
1.8  
2.2  
2.4  
2.2  
2.7  
3.0  
V
LOW Level Output Voltage  
2.3–3.6  
2.3  
0.2  
0.6  
0.4  
0.4  
0.55  
5.0  
10  
V
OL  
2.7  
= 12mA  
= 16mA  
= 24mA  
3.0  
I
Input Leakage Current  
2.3–3.6  
0
0 V 5.5V  
µA  
µA  
µA  
I
I
I
Power-Off Leakage Current  
Quiescent Supply Current  
V or V = 5.5V  
I O  
OFF  
I
2.3–3.6  
V = V or GND  
10  
CC  
I
CC  
3.6V V 5.5V  
10  
I
I  
Increase in I per Input  
2.3–3.6  
V
= V – 0.6V  
500  
µA  
CC  
CC  
IH  
CC  
AC Electrical Characteristics  
T = –40°C to +85°C, R = 500Ω  
A
L
V
= 3.3V 0.3V,  
V
= 2.7V,  
V = 2.5V 0.2V,  
CC  
CC  
CC  
C = 50pF  
C = 50pF  
C = 30pF  
L
L
L
Symbol  
Parameter  
Maximum Clock Frequency  
Propagation Delay,  
Min.  
150  
1.5  
Max.  
Min. Max.  
Min.  
150  
1.5  
Max.  
Units  
MHz  
ns  
f
150  
MAX  
t
t
, t  
7.0  
7.0  
1.5  
8.0  
8.0  
8.4  
8.4  
PHL PLH  
CP to Q or Q  
n
n
n
, t  
Propagation Delay,  
or S to Q or Q  
n
1.5  
1.5  
1.5  
ns  
PHL PLH  
C
Dn  
Dn  
n
t
Setup Time  
Hold Time  
2.5  
1.5  
3.3  
3.3  
2.5  
2.5  
1.5  
3.3  
3.6  
3.0  
4.0  
2.0  
4.0  
4.0  
4.5  
ns  
ns  
ns  
ns  
ns  
ns  
S
t
H
t
t
Pulse Width CP  
W
W
Pulse Width and C , S  
D
D
t
Recovery Time  
REC  
(4)  
t
, t  
Output to Output Skew  
1.0  
OSHL OSLH  
Note:  
4. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate  
outputs of the same device. The specification applies to any outputs switching in the same direction, either  
HIGH-to-LOW (t  
) or LOW-to-HIGH (t  
).  
OSHL  
OSLH  
©1995 Fairchild Semiconductor Corporation  
74LCX74 Rev. 1.7.1  
www.fairchildsemi.com  
4
Dynamic Switching Characteristics  
T = 25°C  
A
Symbol  
Parameter  
V
(V)  
Conditions  
Typical  
0.8  
Unit  
CC  
V
Quiet Output Dynamic Peak V  
3.3  
C = 50pF, V = 3.3V, V = 0V  
V
OLP  
OL  
L
IH  
IL  
2.5  
3.3  
2.5  
C = 30pF, V = 2.5V, V = 0V  
0.6  
L
IH  
IL  
V
Quiet Output Dynamic Valley V  
C = 50pF, V = 3.3V, V = 0V  
–0.8  
–0.6  
V
OLV  
OL  
L
IH  
IL  
C = 30pF, V = 2.5V, V = 0V  
L
IH  
IL  
Capacitance  
Symbol  
Parameter  
Conditions  
Typical  
Units  
pF  
C
Input Capacitance  
V
= Open, V = 0V or V  
CC  
7
8
IN  
CC  
CC  
CC  
I
C
Output Capacitance  
V
V
= 3.3V, V = 0V or V  
CC  
pF  
OUT  
I
C
Power Dissipation Capacitance  
= 3.3V, V = 0V or V , f = 10MHz  
25  
pF  
PD  
I
CC  
©1995 Fairchild Semiconductor Corporation  
74LCX74 Rev. 1.7.1  
www.fairchildsemi.com  
5
AC Loading and Waveforms (Generic for LCX Family)  
Test  
Switch  
t
t
, t  
Open  
PLH PHL  
, t  
6V at V = 3.3 0.3V  
PZL PLZ  
CC  
V
x 2 at V = 2.5 0.2V  
CC  
CC  
t
, t  
GND  
PZH PHZ  
Figure 1. AC Test Circuit (C includes probe and jig capacitance)  
L
3-STATE Output Low Enable and  
Waveform for Inverting and Non-Inverting Functions  
Disable Times for Logic  
Setup Time, Hold Time and Recovery Time for Logic  
Propagation Delay. Pulse Width and t Waveforms  
rec  
3-STATE Output High Enable and  
Disable Times for Logic  
t
and t  
fall  
rise  
V
CC  
Symbol  
3.3V 0.3V  
1.5V  
2.7V  
1.5V  
1.5V  
2.5V 0.2V  
V
V
V
/ 2  
/ 2  
mi  
CC  
CC  
V
1.5V  
mo  
V
V
+ 0.3V  
– 0.3V  
V
+ 0.3V  
V
+ 0.15V  
– 0.15V  
x
y
OL  
OL  
OL  
V
V
V
– 0.3V  
V
OH  
OH  
OH  
Figure 2. Waveforms (Input Characteristics; f = 1MHz, t = t = 3ns)  
r
f
©1995 Fairchild Semiconductor Corporation  
74LCX74 Rev. 1.7.1  
www.fairchildsemi.com  
6
Schematic Diagram (Generic for LCX Family)  
©1995 Fairchild Semiconductor Corporation  
74LCX74 Rev. 1.7.1  
www.fairchildsemi.com  
7
Tape and Reel Specification  
Tape Format for DQFN  
Package Designator  
Tape Section  
Number of Cavities  
125 (Typ.)  
Cavity Status  
Empty  
Cover Tape Status  
Sealed  
BQX  
Leader (Start End)  
Carrier  
3000  
Filled  
Sealed  
Trailer (Hub End)  
75 (Typ.)  
Empty  
Sealed  
Tape Dimensions inches (millimeters)  
Reel Dimensions inches (millimeters)  
Tape Size  
A
B
C
D
N
W1  
W2  
12mm  
13.0 (330.0)  
0.059 (1.50)  
0.512 (13.00) 0.795 (20.20) 2.165 (55.00)  
0.488 (12.4)  
0.724 (18.4)  
©1995 Fairchild Semiconductor Corporation  
74LCX74 Rev. 1.7.1  
www.fairchildsemi.com  
8
0.65  
A
ꢀꢁꢂꢂ“ꢂꢁꢃꢂ  
0.43TYP  
14  
8
B
6.4  
ꢄꢁꢄꢂ“ꢂꢁꢃꢂ  
6.10  
3.2  
1.65  
0.2 C B A  
ALL LEAD TIPS  
1
7
PIN#1 IDENT  
TOP VIEW  
0.45  
RECOMMENDED LAND PATTERN  
SEE DETAIL A  
1.2 MAX  
+0.15  
-0.10  
0.90  
0.20  
0.09  
ꢂꢁꢃꢂ“ꢂꢁꢂꢀ  
0.30  
0.19  
ALL LEAD TIPS  
C
0.1 C  
0.13  
A B  
C
0.65  
ꢃꢅꢁꢂꢂƒꢆ723ꢆꢇꢆ%27720  
FRONT VIEW  
0.09 MIN  
NOTES:  
GAGE PLANE  
A. CONFORMS TO JEDEC REGISTRATION MO-153,  
VARIATION AB, REF NOTE 6  
B. DIMENSIONS ARE IN MILLIMETERS.  
C. DIMENSIONS ARE EXCLUSIVE OF BURRS,  
MOLD FLASH, AND TIE BAR EXTRUSIONS  
D. DIMENSIONING AND TOLERANCES PER ANSI  
Y14.5M, 2009.  
0.25  
0.09 MIN  
ꢂƒꢉꢆꢊƒ  
ꢂꢁꢈ“ꢂꢁꢃ  
1.00  
SEATING PLANE  
DETAIL A  
E. LANDPATTERN STANDARD: SOP65P640X110-14M.  
F. DRAWING FILE NAME: MKT-MTC14rev7.  
8.75  
8.50  
A
0.65  
7.62  
14  
8
14  
8
B
4.00  
3.80  
5.60  
6.00  
1.70  
1
7
PIN #1  
IDENT.  
1
7
1.27  
0.51  
0.35  
1.27  
(0.33)  
M
0.25  
C B A  
LAND PATTERN RECOMMENDATION  
TOP VIEW  
1.75 MAX  
A
0.25  
0.19  
C
0.10 C  
NOTES:  
1.50  
1.25  
0.25  
0.10  
SIDE VIEW  
FRONT VIEW  
A. CONFORMS TO JEDEC MS-012,  
VARIATION AB, ISSUE C  
B. ALL DIMENSIONS ARE IN MILLIMETERS  
C. DIMENSIONS DO NOT INCLUDE MOLD  
FLASH OR BURRS  
0.50  
0.25  
x 45  
R0.10  
GAGE  
PLANE  
D. LAND PATTERN STANDARD:  
SOIC127P600X145-14M  
R0.10  
E. CONFORMS TO ASME Y14.5M, 2009  
D. DRAWING FILENAME: MKT-M14Arev14  
0.36  
8°  
0°  
0.90  
0.50  
SEATING PLANE  
(1.04)  
DETAIL A  
SCALE 16 : 1  
4.00 MAX  
2.20 MAX  
1.40 MAX  
B
3.00  
0.05 C  
A
2X  
1.00  
MAX  
1.70  
MAX  
2.50  
0.50 TYP  
3.50  
MAX  
(0.90)  
0.05 C  
TOP VIEW  
2X  
PIN #1 QUADRANT  
0.50 TYP  
0.24 TYP  
ꢀꢁꢈꢀ“ꢀꢁꢀꢃ  
RECOMMENDED LAND PATTERN  
0.10 C  
ꢀꢁꢂꢀ“ꢀꢁꢀꢃ  
0.08 C  
ꢀꢁꢀꢂꢃ“ꢀꢁꢀꢂꢃ  
C
SIDE VIEW  
SEATING  
PLANE  
ꢄꢁꢀꢀ“ꢀꢁꢀꢃ  
ꢅꢁꢆꢃ“ꢀꢁꢀꢃ  
ꢀꢁꢄꢇꢀ“ꢀꢁꢀꢃ  
(14X)  
A. CONFORMS TO JEDEC REGISTRATION  
MO-241, VARIATION AA  
PIN #1 IDENT  
0.50  
B. DIMENSIONS ARE IN MILLIMETERS.  
C. DIMENSIONS AND TOLERANCES PER  
ASME Y14.5M, 2009.  
ꢅꢁꢅꢃ“ꢀꢁꢀꢃ  
ꢂꢁꢃꢀ“ꢀꢁꢀꢃ  
D. LAND PATTERN RECOMMENDATION IS  
EXISTING INDUSTRY LAND PATTERN.  
E. DRAWING FILENAME: MKT-MLP14Arev2.  
ꢀꢁꢂꢃ“ꢀꢁꢀꢃ  
(14X)  
0.50  
0.10  
0.05  
C A B  
C
2.00  
BOTTOM VIEW  
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Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,  
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or  
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer  
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