74LVC244AMN2TWG [ONSEMI]

Low-Voltage CMOS Octal Buffer;
74LVC244AMN2TWG
型号: 74LVC244AMN2TWG
厂家: ONSEMI    ONSEMI
描述:

Low-Voltage CMOS Octal Buffer

驱动 逻辑集成电路
文件: 总10页 (文件大小:113K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
74LVC244A  
Low-Voltage CMOS Octal  
Buffer  
With 5 V−Tolerant Inputs and Outputs  
(3−State, Non−Inverting)  
www.onsemi.com  
The 74LVC244A is a high performance, non−inverting octal buffer  
operating from a 1.2 to 3.6 V supply. High impedance TTL compatible  
inputs significantly reduce current loading to input drivers while TTL  
compatible outputs offer improved switching noise performance. A V  
I
specification of 5.5 V allows 74LVC244A inputs to be safely driven  
from 5 V devices. The 74LVC244A is suitable for memory address  
driving and all TTL level bus oriented transceiver applications.  
Current drive capability is 24 mA at the outputs. The Output Enable  
(OE) input, when HIGH, disables the output by placing them in  
a HIGH Z condition.  
TSSOP−20  
DT SUFFIX  
CASE 948E  
QFN20  
MN SUFFIX  
CASE 485AA  
QFN20  
MN SUFFIX  
CASE 485CB  
MARKING DIAGRAMS  
Features  
20  
Designed for 1.2 V to 3.6 V V Operation  
5 V Tolerant − Interface Capability With 5 V TTL Logic  
Supports Live Insertion and Withdrawal  
CC  
LVC  
244A  
ALYW G  
G
I  
Specification Guarantees High Impedance When V = 0 V  
CC  
OFF  
1
24 mA Output Sink and Source Capability  
Near Zero Static Supply Current in All Three Logic States (10 mA)  
Substantially Reduces System Power Requirements  
ESD Performance:  
1
1
LVC  
244A  
ALYWG  
G
244A  
ALYWG  
G
Human Body Model >2000 V  
Machine Model >200 V  
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS  
Compliant  
QFN20 − 485AA  
QFN20 − 485CB  
A
L
= Assembly Location  
= Wafer Lot  
Y
W
G
= Year  
= Work Week  
= Pb−Free Package  
(Note: Microdot may be in either location)  
ORDERING INFORMATION  
See detailed ordering and shipping information on page 7 of  
this data sheet.  
This document contains information on some products that are still under development.  
ON Semiconductor reserves the right to change or discontinue these products without  
notice.  
© Semiconductor Components Industries, LLC, 2016  
1
Publication Order Number:  
February, 2016 − Rev. 1  
74LVC244A/D  
74LVC244A  
1
V
2OE 1O0 2D0 1O1 2D1 1O2 2D2 1O3 2D3  
19 18 17 16 15 14 12  
CC  
1OE  
1D0  
1D1  
1D2  
1D3  
20  
13  
11  
2
4
6
8
18  
16  
14  
12  
1O0  
1O1  
1O2  
1O3  
1
2
3
4
5
6
7
9
8
10  
1OE 1D0 2O0 1D1 2O1 1D2 2O2 1D3 2O3 GND  
19  
12  
11  
10  
20  
19  
2OE  
2D0  
2D1  
2D2  
2D3  
QFN  
PIN #1  
17  
3
5
7
9
2O0  
2O1  
2O2  
2O3  
2
9
15  
13  
11  
Figure 1. Pinout: 20−Lead (Top View)  
PIN NAMES  
PINS  
FUNCTION  
Output Enable Inputs  
Data Inputs  
nOE  
1Dn, 2Dn  
1On, 2On  
3−State Outputs  
Figure 2. Logic Diagram  
TRUTH TABLE  
INPUTS  
OUTPUTS  
1On, 2On  
1OE  
2OE  
1Dn  
2Dn  
L
L
L
H
X
L
H
Z
H
H = High Voltage Level  
L = Low Voltage Level  
Z = High Impedance State  
X = High or Low Voltage Level and Transitions are Acceptable  
For I reasons, DO NOT FLOAT Inputs  
CC  
www.onsemi.com  
2
74LVC244A  
MAXIMUM RATINGS  
Symbol  
Parameter  
Condition  
Value  
Unit  
V
V
CC  
DC Supply Voltage  
−0.5 to +6.5  
V
I
DC Input Voltage  
−0.5 V +6.5  
V
I
V
O
DC Output Voltage  
Output in 3−State  
−0.5 V +6.5  
V
O
Output in HIGH or LOW State  
(Note 1)  
−0.5 V V + 0.5  
V
O
CC  
I
DC Input Diode Current  
DC Output Diode Current  
V < GND  
−50  
mA  
mA  
mA  
mA  
mA  
mA  
°C  
IK  
I
I
V
O
< GND  
−50  
+50  
50  
OK  
V
O
> V  
CC  
I
DC Output Source/Sink Current  
DC Supply Current Per Supply Pin  
DC Ground Current Per Ground Pin  
Storage Temperature Range  
O
I
100  
100  
CC  
I
GND  
T
−65 to +150  
STG  
T
L
Lead Temperature, 1 mm from Case for  
10 Seconds  
T = 260  
L
°C  
T
Junction Temperature Under Bias  
Thermal Resistance (Note 2)  
Moisture Sensitivity  
T = 135  
°C  
J
J
q
110.7  
°C/W  
JA  
MSL  
Level 1  
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality  
should not be assumed, damage may occur and reliability may be affected.  
1. I absolute maximum rating must be observed.  
O
2. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow.  
RECOMMENDED OPERATING CONDITIONS  
Symbol  
Parameter  
Min  
Typ  
Max  
Units  
V
CC  
Supply Voltage  
Operating  
Functional  
V
1.65  
1.2  
3.6  
3.6  
V
Input Voltage  
0
5.5  
V
V
I
V
O
Output Voltage  
HIGH or LOW State  
3−State  
0
0
V
CC  
5.5  
I
HIGH Level Output Current  
mA  
mA  
OH  
V
CC  
V
CC  
= 3.0 V − 3.6 V  
= 2.7 V − 3.0 V  
−24  
−12  
I
LOW Level Output Current  
OL  
V
CC  
V
CC  
= 3.0 V − 3.6 V  
= 2.7 V − 3.0 V  
24  
12  
T
Operating Free−Air Temperature  
Input Transition Rise or Fall Rate  
−40  
+125  
°C  
A
Dt/DV  
ns/V  
V
CC  
V
CC  
= 1.65 V to 2.7 V  
= 2.7 V to 3.6 V  
0
0
20  
10  
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond  
the Recommended Operating Ranges limits may affect device reliability.  
www.onsemi.com  
3
 
74LVC244A  
DC ELECTRICAL CHARACTERISTICS  
−405C to +855C  
−405C to +1255C  
Typ  
Typ  
(Note 3)  
(Note 3)  
Min  
Max  
Min  
Max  
Symbol  
Parameter  
Conditions  
= 1.2 V  
Unit  
VIH  
HIGH−level input  
voltage  
V
1.08  
1.08  
V
CC  
V
CC  
= 1.65 V to 1.95 V  
0.65 x  
VCC  
0.65 x  
VCC  
V
V
= 2.3 V to 2.7 V  
= 2.7 V to 3.6 V  
1.7  
2.0  
1.7  
2.0  
CC  
CC  
V
LOW−level input  
voltage  
V
CC  
= 1.2 V  
0.12  
0.35 x  
0.12  
V
V
IL  
V
CC  
= 1.65 V to 1.95 V  
0.35 x  
VCC  
V
CC  
V
V
= 2.3 V to 2.7 V  
= 2.7 V to 3.6 V  
0.7  
0.8  
0.7  
0.8  
CC  
CC  
V
OH  
HIGH−level output  
voltage  
V = V or V  
I
IH  
IL  
I
= −100 mA;  
V
V −  
CC  
O
CC  
V
= 1.65 V to 3.6 V  
0.2  
1.2  
1.8  
2.2  
2.4  
2.2  
0.3  
CC  
I
= −4 mA; V = 1.65 V  
1.05  
1.65  
2.05  
2.25  
2.0  
O
CC  
I
= −8 mA; V = 2.3 V  
CC  
O
I
I
I
= −12 mA; V = 2.7 V  
CC  
O
O
O
= −18 mA; V = 3.0 V  
CC  
= −24 mA; V = 3.0 V  
CC  
VOL  
LOW−level output  
voltage  
V = V or V  
IL  
V
I
IH  
I
O
= 100 mA;  
0.2  
0.3  
V
CC  
= 1.65 V to 3.6 V  
I
= 4 mA; V = 1.65 V  
0.45  
0.6  
0.4  
0.55  
5
0.65  
0.8  
0.6  
0.8  
20  
O
CC  
I
= 8 mA; V = 2.3 V  
O
CC  
I
O
I
O
= 12 mA; V = 2.7 V  
CC  
= 24 mA; V = 3.0 V  
CC  
II  
Input leakage current  
V = 5.5V or GND V = 3.6 V  
0.1  
0.1  
0.1  
0.1  
mA  
mA  
I
CC  
I
OFF−state output  
current  
VI = VIH or VIL;  
5
20  
OZ  
V
O
= 5.5 V or GND; V = 3.6 V  
CC  
I
Power−off leakage  
current  
V or V = 5.5 V; V = 0.0 V  
0.1  
0.1  
5
10  
10  
0.1  
0.1  
5
20  
40  
mA  
mA  
mA  
OFF  
I
O
CC  
I
Supply current  
V = V or GND; I = 0 A;  
I CC O  
CC  
V
CC  
= 3.6 V  
DI  
Additional supply  
current  
per input pin;  
V = V − 0.6 V; I = 0 A;  
500  
5000  
CC  
I
CC  
O
V
CC  
= 2.7 V to 3.6 V  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
3. All typical values are measured at T = 25°C and V = 3.3 V, unless stated otherwise.  
A
CC  
www.onsemi.com  
4
 
74LVC244A  
AC ELECTRICAL CHARACTERISTICS (t = t = 2.5 ns)  
R
F
−405C to +855C  
−405C to +1255C  
Min  
Typ1  
17.0  
6.4  
3.4  
3.4  
2.9  
24.0  
7.0  
3.9  
4.1  
3.2  
9.0  
4.5  
3.6  
3.3  
3.1  
Max  
Min  
Typ1  
Max  
Symbol  
Parameter  
Conditions  
Unit  
t
Propagation Delay (Note 5)  
nDn to nOn  
V
= 1.2 V  
13.7  
7.1  
6.9  
5.9  
ns  
pd  
CC  
V
= 1.65 V to 1.95 V  
1.5  
1.0  
1.5  
1.5  
1.5  
1.0  
1.5  
1.5  
15.8  
8.2  
9.0  
7.5  
CC  
V
= 2.3 V to 2.7 V  
CC  
V
CC  
= 2.7 V  
V
= 3.0 V to 3.6 V  
= 1.2 V  
CC  
t
en  
Enable Time (Note 6)  
nOE to nOn  
V
CC  
ns  
ns  
ns  
V
CC  
= 1.65 V to 1.95 V  
1.5  
1.5  
1.5  
1.0  
17.3  
9.5  
8.6  
7.6  
1.5  
1.5  
1.5  
1.0  
20.0  
11.0  
11.0  
9.5  
V
= 2.3 V to 2.7 V  
CC  
V
CC  
= 2.7 V  
V
= 3.0 V to 3.6 V  
= 1.2 V  
CC  
t
dis  
Disable Time (Note 7)  
nOE to nOn  
V
CC  
V
CC  
= 1.65 V to 1.95 V  
2.2  
0.5  
1.5  
1.5  
9.8  
5.5  
6.8  
5.8  
1
2.2  
0.5  
1.5  
1.5  
11.3  
6.4  
8.5  
7.5  
1.5  
V
= 2.3 V to 2.7 V  
CC  
V
CC  
= 2.7 V  
V
= 3.0 V to 3.6 V  
CC  
t
Output Skew Time (Note 8)  
sk(0)  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
4. Typical values are measured at TA = 25°C and VCC = 3.3 V, unless stated otherwise.  
5. t is the same as t  
and t  
.
pd  
PLH  
PHL  
6. t is the same as t  
and t  
.
en  
PZL  
PZH  
7. t is the same as t  
and t  
.
dis  
PLZ  
PHZ  
8. Skew between any two outputs of the same package switching in the same direction. This parameter is guaranteed by design.  
DYNAMIC SWITCHING CHARACTERISTICS  
T
A
= +25°C  
Min  
Typ  
Max  
Symbol  
Characteristic  
Condition  
= 3.3 V, C = 50 pF, V = 3.3 V, V = 0 V  
Unit  
V
OLP  
Dynamic LOW Peak Voltage (Note 9)  
V
CC  
V
CC  
0.8  
0.6  
V
L
IH  
IL  
= 2.5 V, C = 30 pF, V = 2.5 V, V = 0 V  
L
IH  
IL  
V
OLV  
Dynamic LOW Valley Voltage (Note 9)  
V
CC  
V
CC  
= 3.3 V, C = 50 pF, V = 3.3 V, V = 0 V  
−0.8  
−0.6  
V
L
IH  
IL  
= 2.5 V, C = 30 pF, V = 2.5 V, V = 0 V  
L
IH  
IL  
9. Number of outputs defined as “n”. Measured with “n−1” outputs switching from HIGH−to−LOW or LOW−to−HIGH. The remaining output is  
measured in the LOW state.  
CAPACITIVE CHARACTERISTICS  
Symbol  
CIN  
Parameter  
Input Capacitance  
Condition  
= 3.3 V, V = 0 V or V  
Typical  
Unit  
pF  
V
V
4
5
CC  
I
CC  
CC  
COUT  
CPD  
Output Capacitance  
= 3.3 V, V = 0 V or V  
pF  
CC  
I
Power Dissipation Capacitance  
(Note 10)  
Per input; V = GND or V  
pF  
I
CC  
V
= 1.65 V to 1.95 V  
6.4  
9.6  
CC  
V
CC  
V
CC  
= 2.3 V to 2.7 V  
= 3.0 V to 3.6 V  
12.5  
10.C is used to determine the dynamic power dissipation (P in mW).  
PD  
D
2
2
P
= C x V  
x fi x N + S (C x V  
x fo) where:  
D
PD  
CC  
L
CC  
fi = input frequency in MHz; fo = output frequency in MHz  
C = output load capacitance in pF V = supply voltage in Volts  
L
CC  
N = number of outputs switching  
2
S(C x V  
x fo) = sum of the outputs.  
L
CC  
www.onsemi.com  
5
 
74LVC244A  
V
CC  
Vmi  
Vmi  
1Dn, 2Dn  
1On, 2On  
0 V  
t
t
PHL  
PLH  
V
OH  
OL  
Vmo  
Vmo  
V
WAVEFORM 1 − PROPAGATION DELAYS  
= t = 2.5 ns, 10% to 90%; f = 1 MHz; t = 500 ns  
t
R
F
W
V
CC  
Vmi  
Vmi  
1OE, 2OE  
1On, 2On  
0 V  
t
t
PHZ  
PZH  
V
V
CC  
- 0.3 V  
OH  
Vmo  
Vmo  
0 V  
t
t
PLZ  
PZL  
3.0 V  
1On, 2On  
V + 0.3 V  
OL  
GND  
WAVEFORM 2 − OUTPUT ENABLE AND DISABLE TIMES  
t
R
= t = 2.5 ns, 10% to 90%; f = 1 MHz; t = 500 ns  
F
W
Figure 3. AC Waveforms  
V
CC  
Symbol 3.3 V 0.3 V  
2.7 V  
1.5 V  
1.5 V  
V
CC  
< 2.7 V  
Vmi  
1.5 V  
1.5 V  
V
CC  
/2  
/2  
Vmo  
V
CC  
V
V
+ 0.3 V  
− 0.3 V  
V
+ 0.3 V  
V
OL  
+ 0.15 V  
− 015 V  
HZ  
OL  
OL  
V
V
OH  
V
OH  
− 0.3 V  
V
OH  
LZ  
www.onsemi.com  
6
74LVC244A  
V
CC  
V
EXT  
V
I
V
O
OPEN  
GND  
R
1
PULSE  
GENERATOR  
DUT  
R
T
C
R
L
L
C includes jig and probe capacitance  
L
R = Z  
T
of pulse generator (typically 50 W)  
OUT  
R = R  
1
L
Supply Voltage  
Input  
Load  
V
EXT  
V
CC  
(V)  
V
I
t , t  
C
R
t
, t  
t
, t  
t
, t  
r
f
L
L
PLH PHL  
PLZ PZL  
PHZ PZH  
1.2  
V
V
V
2 ns  
2 ns  
30 pF  
30 pF  
30 pF  
50 pF  
50 pF  
1 kW  
1 kW  
Open  
Open  
Open  
Open  
Open  
2 x V  
GND  
CC  
CC  
CC  
CC  
1.65 − 1.95  
2.3 − 2.7  
2.7  
2 x V  
GND  
GND  
GND  
GND  
CC  
2 ns  
500 W  
500 W  
500 W  
2 x V  
CC  
2.7 V  
2.7 V  
2.5 ns  
2.5 ns  
2 x V  
CC  
3 − 3.6  
2 x V  
CC  
Figure 4. Test Circuit  
ORDERING INFORMATION  
Device  
Package  
Shipping  
74LVC244ADTR2G  
TSSOP−20  
(Pb−Free)  
2500 / Tape & Reel  
3000 / Tape & Reel  
3000 / Tape & Reel  
74LVC244AMN2TWG  
(In Development)  
QFN20, 2.5x3.5  
(Pb−Free)  
74LVC244AMNTWG  
(In Development)  
QFN20, 2.5x4.5  
(Pb−Free)  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
www.onsemi.com  
7
74LVC244A  
PACKAGE DIMENSIONS  
TSSOP−20  
CASE 948E−02  
ISSUE C  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER  
ANSI Y14.5M, 1982.  
2. CONTROLLING DIMENSION:  
MILLIMETER.  
20X K REF  
K
M
S
S
V
0.10 (0.004)  
T U  
S
K1  
0.15 (0.006) T U  
3. DIMENSION A DOES NOT INCLUDE  
MOLD FLASH, PROTRUSIONS OR GATE  
BURRS. MOLD FLASH OR GATE BURRS  
SHALL NOT EXCEED 0.15 (0.006) PER SIDE.  
4. DIMENSION B DOES NOT INCLUDE  
INTERLEAD FLASH OR PROTRUSION.  
INTERLEAD FLASH OR PROTRUSION  
SHALL NOT EXCEED 0.25 (0.010) PER SIDE.  
5. DIMENSION K DOES NOT INCLUDE  
DAMBAR PROTRUSION. ALLOWABLE  
DAMBAR PROTRUSION SHALL BE 0.08  
(0.003) TOTAL IN EXCESS OF THE K  
DIMENSION AT MAXIMUM MATERIAL  
CONDITION.  
J J1  
20  
11  
2X L/2  
B
SECTION N−N  
L
−U−  
PIN 1  
IDENT  
0.25 (0.010)  
N
1
10  
M
6. TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
7. DIMENSION A AND B ARE TO BE  
S
0.15 (0.006) T U  
DETERMINED AT DATUM PLANE −W−.  
A
−V−  
N
MILLIMETERS  
DIM MIN MAX  
INCHES  
MIN  
MAX  
0.260  
0.177  
0.047  
0.006  
0.030  
F
A
B
6.40  
4.30  
---  
6.60 0.252  
4.50 0.169  
DETAIL E  
C
1.20  
---  
D
0.05  
0.50  
0.15 0.002  
0.75 0.020  
F
G
H
0.65 BSC  
0.026 BSC  
−W−  
0.27  
0.09  
0.09  
0.19  
0.19  
0.37  
0.011  
0.015  
0.008  
0.006  
0.012  
0.010  
C
J
0.20 0.004  
0.16 0.004  
0.30 0.007  
0.25 0.007  
J1  
K
G
D
H
K1  
L
DETAIL E  
6.40 BSC  
0.252 BSC  
0
0.100 (0.004)  
−T− SEATING  
M
0
8
8
_
_
_
_
PLANE  
SOLDERING FOOTPRINT*  
7.06  
1
0.65  
PITCH  
16X  
0.36  
16X  
1.26  
DIMENSIONS: MILLIMETERS  
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
www.onsemi.com  
8
74LVC244A  
PACKAGE DIMENSIONS  
QFN20, 2.5x4.5 MM  
CASE 485AA  
ISSUE B  
NOTES:  
D
A
B
1. DIMENSIONING AND TOLERANCING PER  
ASME Y14.5M, 1994.  
2. CONTROLLING DIMENSION: MILLIMETERS.  
3. DIMENSIONS b APPLIES TO PLATED  
TERMINAL AND IS MEASURED BETWEEN  
0.25 AND 0.30 MM FROM TERMINAL.  
4. COPLANARITY APPLIES TO THE EXPOSED  
PAD AS WELL AS THE TERMINALS.  
PIN ONE REFERENCE  
MILLIMETERS  
DIM MIN  
MAX  
1.00  
0.05  
A
A1  
A3  
b
0.80  
0.00  
E
0.20 REF  
0.20  
0.30  
1.15  
D
2.50 BSC  
D2  
E
0.85  
2.85  
2X  
4.50 BSC  
0.15  
C
0.15  
C
E2  
e
3.15  
0.50 BSC  
2X  
K
0.20  
0.35  
---  
0.45  
L
C
TOP VIEW  
SIDE VIEW  
0.10  
0.08  
A
C
20X  
(A3)  
SEATING  
PLANE  
A1  
C
D2  
e
11  
20X L  
9
12  
e
E2  
20X  
b
20X  
19  
2
0.10 C A B  
0.05  
1
20  
C
K
NOTE 3  
BOTTOM VIEW  
www.onsemi.com  
9
74LVC244A  
PACKAGE DIMENSIONS  
QFN20, 2.5x3.5, 0.4P  
CASE 485CB  
ISSUE O  
NOTES:  
A
B
D
1. DIMENSIONING AND TOLERANCING PER  
ASME Y14.5M, 1994.  
L
L
2. CONTROLLING DIMENSION: MILLIMETERS.  
3. DIMENSIONS b APPLIES TO PLATED  
TERMINAL AND IS MEASURED BETWEEN  
0.15 AND 0.30 MM FROM TERMINAL TIP.  
4. COPLANARITY APPLIES TO THE EXPOSED  
PAD AS WELL AS THE TERMINALS.  
PIN ONE  
REFERENCE  
L1  
DETAIL A  
ALTERNATE TERMINAL  
CONSTRUCTIONS  
MILLIMETERS  
DIM MIN  
MAX  
1.00  
0.05  
E
A
A1  
A3  
b
0.80  
0.00  
0.20 REF  
EXPOSED Cu  
MOLD CMPD  
0.15  
0.25  
1.10  
0.15  
C
2X  
D
2.50 BSC  
D2  
E
0.90  
3.50 BSC  
2X  
0.15  
C
E2  
e
2.00  
2.20  
TOP VIEW  
DETAIL B  
0.40 BSC  
ALTERNATE  
L
L1  
0.35  
---  
0.45  
0.15  
A
CONSTRUCTIONS  
DETAIL B  
(A3)  
A1  
0.10  
0.08  
C
C
NOTE 4  
SEATING  
PLANE  
C
SIDE VIEW  
D2  
SOLDERING FOOTPRINT*  
3.80  
2.24  
0.10 C A B  
PACKAGE  
OUTLINE  
20X  
L
9
12  
0.10 C A B  
DETAIL A  
20X  
0.63  
2.80 1.14  
E2  
1
20X  
b
20X  
0.25  
0.40  
PITCH  
0.10 C A B  
0.05  
2
19  
1
C
NOTE 3  
DIMENSIONS: MILLIMETERS  
e
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
e/2  
BOTTOM VIEW  
ON Semiconductor and the  
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specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets  
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74LVC244A/D  

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