74LVC540A [ONSEMI]

Low-Voltage CMOS Octal Buffer Flow Through Pinout;
74LVC540A
型号: 74LVC540A
厂家: ONSEMI    ONSEMI
描述:

Low-Voltage CMOS Octal Buffer Flow Through Pinout

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74LVC540A  
Low-Voltage CMOS  
Octal Buffer  
Flow Through Pinout  
With 5 V−Tolerant Inputs and Outputs  
(3−State, Inverting)  
www.onsemi.com  
MARKING  
The 74LVC540A is a high performance, inverting octal buffer  
operating from a 1.2 to 3.6 V supply. This device is similar in function  
to the MC74LCX240, while providing flow through architecture.  
High impedance TTL compatible inputs significantly reduce current  
loading to input drivers while TTL compatible outputs offer improved  
DIAGRAMS  
20  
20  
1
LVC540A  
switching noise performance. A V specification of 5.5 V allows  
AWLYYWWG  
I
SOIC−20 WB  
DW SUFFIX  
CASE 751D  
74LVC540A inputs to be safely driven from 5 V devices. The  
74LVC540A is suitable for memory address driving and all TTL level  
bus oriented transceiver applications.  
1
Current drive capability is 24 mA at the outputs. The Output Enable  
(OE1, OE2) inputs, when HIGH, disables the outputs by placing them  
in a HIGH Z condition.  
20  
20  
LVC  
540A  
ALYW G  
G
1
Features  
TSSOP−20  
DT SUFFIX  
CASE 948E  
Designed for 1.2 to 3.6 V V Operation  
CC  
1
5 V Tolerant − Interface Capability With 5 V TTL Logic  
Supports Live Insertion and Withdrawal  
A
= Assembly Location  
= Year  
I  
Specification Guarantees High Impedance When V = 0 V  
CC  
L, WL = Wafer Lot  
OFF  
Y, YY  
24 mA Output Sink and Source Capability  
W, WW = Work Week  
Near Zero Static Supply Current in All Three Logic States (10 mA)  
Substantially Reduces System Power Requirements  
Latchup Performance Exceeds 250 mA  
G or G = Pb−Free Package  
(Note: Microdot may be in either location)  
ESD Performance:  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 7 of this data sheet.  
Human Body Model > 2000 V  
Machine Model > 200 V  
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS  
Compliant  
© Semiconductor Components Industries, LLC, 2015  
1
Publication Order Number:  
December, 2015 − Rev. 0  
74LVC540A/D  
74LVC540A  
1
OE1  
OE2  
19  
V
OE2 O0  
O1  
17  
O2  
16  
O3  
15  
O4  
14  
O5  
13  
O6  
12  
O7  
11  
2
3
4
5
6
7
8
9
18  
17  
16  
15  
14  
13  
12  
11  
CC  
D0  
O0  
O1  
O2  
O3  
O4  
O5  
O6  
O7  
20  
19  
18  
D1  
D2  
D3  
D4  
D5  
D6  
D7  
1
2
3
4
5
6
7
9
8
10  
OE1 D0  
D1  
D2  
D3  
D4  
D5  
D6  
D7 GND  
Figure 1. Pinout: 20−Lead (Top View)  
PIN NAMES  
Pins  
OEn  
Dn  
Function  
Output Enable Inputs  
Data Inputs  
On  
3−State Outputs  
Figure 2. Logic Diagram  
TRUTH TABLE  
Inputs  
Outputs  
OE1  
L
OE2  
L
Dn  
L
On  
H
L
L
L
H
X
X
H
Z
H
X
X
Z
H = High Voltage Level  
L = Low Voltage Level  
Z = High Impedance State  
X = High or Low Voltage Level and Transitions are Acceptable  
For I reasons, DO NOT FLOAT Inputs  
CC  
www.onsemi.com  
2
74LVC540A  
MAXIMUM RATINGS  
Symbol  
Parameter  
Value  
Condition  
Unit  
V
V
CC  
DC Supply Voltage  
−0.5 to +6.5  
V
I
DC Input Voltage  
−0.5 V +6.5  
V
I
V
O
DC Output Voltage  
−0.5 V +6.5  
Output in 3−State  
V
O
−0.5 V V + 0.5  
Output in HIGH or LOW State  
(Note 1)  
V
O
CC  
I
DC Input Diode Current  
DC Output Diode Current  
−50  
V < GND  
mA  
mA  
mA  
mA  
mA  
mA  
°C  
IK  
I
I
−50  
+50  
50  
V < GND  
O
OK  
V
O
> V  
CC  
I
DC Output Source/Sink Current  
DC Supply Current Per Supply Pin  
DC Ground Current Per Ground Pin  
Storage Temperature Range  
O
I
100  
100  
CC  
I
GND  
T
−65 to +150  
STG  
T
L
Lead Temperature, 1 mm from Case for  
10 Seconds  
T = 260  
L
°C  
T
Junction Temperature Under Bias  
Thermal Resistance (Note 2)  
T = 135  
°C  
J
J
q
SOIC = 65.8  
TSSOP = 110.7  
°C/W  
JA  
MSL  
Moisture Sensitivity  
Level 1  
250  
I
Latch−up Performance at V = 3.6 V  
mA  
LATCHUP  
CC  
and 125°C (Note 3)  
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality  
should not be assumed, damage may occur and reliability may be affected.  
1. I absolute maximum rating must be observed.  
O
2. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow.  
3. Tested to EIA/JES078.  
RECOMMENDED OPERATING CONDITIONS  
Symbol  
Parameter  
Min  
Typ  
Max  
Units  
V
CC  
Supply Voltage  
Operating  
Functional  
V
1.65  
1.2  
3.6  
3.6  
V
Input Voltage  
0
5.5  
V
V
I
V
O
Output Voltage  
HIGH or LOW State  
3−State  
0
0
V
CC  
5.5  
I
HIGH Level Output Current  
mA  
mA  
OH  
V
CC  
V
CC  
= 3.0 V − 3.6 V  
= 2.7 V − 3.0 V  
−24  
−12  
I
LOW Level Output Current  
OL  
V
CC  
V
CC  
= 3.0 V − 3.6 V  
= 2.7 V − 3.0 V  
24  
12  
T
Operating Free−Air Temperature  
Input Transition Rise or Fall Rate, V from 0.8 V to 2.0 V, V = 3.0 V  
−40  
0
+125  
10  
°C  
A
Dt/DV  
ns/V  
IN  
CC  
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond  
the Recommended Operating Ranges limits may affect device reliability.  
www.onsemi.com  
3
 
74LVC540A  
DC ELECTRICAL CHARACTERISTICS  
−405C to +855C  
−405C to +1255C  
Typ  
Typ  
(Note 4)  
(Note 4)  
Min  
Max  
Min  
Max  
Symbol  
Parameter  
Conditions  
= 1.2 V  
Unit  
VIH  
HIGH−level input  
voltage  
V
1.08  
1.08  
V
CC  
V
CC  
= 1.65 V to 1.95 V  
0.65 x  
VCC  
0.65 x  
VCC  
V
V
= 2.3 V to 2.7 V  
= 2.7 V to 3.6 V  
1.7  
2.0  
1.7  
2.0  
CC  
CC  
V
LOW−level input  
voltage  
V
CC  
= 1.2 V  
0.12  
0.35 x  
0.12  
V
V
IL  
V
CC  
= 1.65 V to 1.95 V  
0.35 x  
VCC  
V
CC  
V
V
= 2.3 V to 2.7 V  
= 2.7 V to 3.6 V  
0.7  
0.8  
0.7  
0.8  
CC  
CC  
V
OH  
HIGH−level output  
voltage  
V = V or V  
I
IH  
IL  
I
= −100 mA;  
V
V −  
CC  
O
CC  
V
= 1.65 V to 3.6 V  
0.2  
1.2  
1.8  
2.2  
2.4  
2.2  
0.3  
CC  
I
= −4 mA; V = 1.65 V  
1.05  
1.65  
2.05  
2.25  
2.0  
O
CC  
I
= −8 mA; V = 2.3 V  
CC  
O
I
I
I
= −12 mA; V = 2.7 V  
CC  
O
O
O
= −18 mA; V = 3.0 V  
CC  
= −24 mA; V = 3.0 V  
CC  
VOL  
LOW−level output  
voltage  
V = V or V  
IL  
V
I
IH  
I
O
= 100 mA;  
0.2  
0.3  
V
CC  
= 1.65 V to 3.6 V  
I
= 4 mA; V = 1.65 V  
0.45  
0.6  
0.4  
0.55  
5
0.65  
0.8  
0.6  
0.8  
20  
O
CC  
I
= 8 mA; V = 2.3 V  
O
CC  
I
O
= 12 mA; V = 2.7 V  
CC  
I
O
= −24 mA; V = 3.0 V  
CC  
II  
Input leakage current  
V = 5.5V or GND V = 3.6 V  
0.1  
0.1  
0.1  
0.1  
mA  
mA  
I
CC  
I
OFF−state output  
current  
VI = VIH or VIL;  
5
20  
OZ  
V
O
= 5.5 V or GND; V = 3.6 V  
CC  
I
Power−off leakage  
current  
V or V = 5.5 V; V = 0.0 V  
0.1  
0.1  
5
10  
10  
0.1  
0.1  
5
20  
40  
mA  
mA  
mA  
OFF  
I
O
CC  
I
Supply current  
V = V or GND; I = 0 A;  
I CC O  
CC  
V
CC  
= 3.6 V  
DI  
Additional supply  
current  
per input pin;  
V = V − 0.6 V; I = 0 A;  
500  
5000  
CC  
I
CC  
O
V
CC  
= 2.7 V to 3.6 V  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
4. All typical values are measured at T = 25°C and V = 3.3 V, unless stated otherwise.  
A
CC  
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4
 
74LVC540A  
AC ELECTRICAL CHARACTERISTICS (t = t = 2.5 ns)  
R
F
−405C to +855C  
Min  
Typ5  
Max  
Typ5  
Symbol  
Parameter  
Conditions  
Unit  
t
Propagation Delay (Note 6)  
nDn to nOn  
V
= 1.2 V  
18.0  
ns  
pd  
CC  
V
= 1.65 V to 1.95 V  
1.0  
1.0  
1.0  
1.0  
16.4  
7.8  
7.1  
5.3  
1.0  
1.0  
1.0  
1.0  
16.4  
7.8  
7.1  
5.3  
CC  
V
= 2.3 V to 2.7 V  
CC  
V
CC  
= 2.7 V  
V
= 3.0 V to 3.6 V  
= 1.2 V  
CC  
t
en  
Enable Time (Note 7)  
nOE to nOn  
V
CC  
20.0  
ns  
ns  
ns  
V
CC  
= 1.65 V to 1.95 V  
1.0  
1.0  
1.0  
1.0  
16.5  
10.5  
8.0  
6.6  
1.0  
1.0  
1.0  
1.0  
16.5  
10.5  
8.0  
6.6  
V
= 2.3 V to 2.7 V  
CC  
V
CC  
= 2.7 V  
V
= 3.0 V to 3.6 V  
= 1.2 V  
CC  
t
dis  
Disable Time (Note 8)  
nOE to nOn  
V
CC  
18.0  
V
CC  
= 1.65 V to 1.95 V  
1.0  
1.0  
1.0  
1.0  
15.9  
9.0  
8.2  
7.4  
1.0  
1.0  
1.0  
1.0  
1.0  
15.9  
9.0  
8.2  
7.4  
1.5  
V
= 2.3 V to 2.7 V  
CC  
V
CC  
= 2.7 V  
V
= 3.0 V to 3.6 V  
CC  
t
Output Skew Time (Note 9)  
sk(0)  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
5. Typical values are measured at TA = 25°C and VCC = 3.3 V, unless stated otherwise.  
6. t is the same as t  
and t  
.
pd  
PLH  
PHL  
7. t is the same as t  
and t  
.
en  
PZL  
PZH  
8. t is the same as t  
and t  
.
dis  
PLZ  
PHZ  
9. Skew between any two outputs of the same package switching in the same direction. This parameter is guaranteed by design.  
DYNAMIC SWITCHING CHARACTERISTICS  
T
A
= +25°C  
Min  
Typ  
Max  
Symbol  
Characteristic  
Condition  
= 3.3 V, C = 50 pF, V = 3.3 V, V = 0 V  
Unit  
V
OLP  
Dynamic LOW Peak Voltage (Note 10)  
V
CC  
V
CC  
0.8  
0.6  
V
L
IH  
IL  
= 2.5 V, C = 30 pF, V = 2.5 V, V = 0 V  
L
IH  
IL  
V
OLV  
Dynamic LOW Valley Voltage (Note  
10)  
V
CC  
V
CC  
= 3.3 V, C = 50 pF, V = 3.3 V, V = 0 V  
−0.8  
−0.6  
V
L
IH  
IL  
= 2.5 V, C = 30 pF, V = 2.5 V, V = 0 V  
L
IH  
IL  
10.Number of outputs defined as “n”. Measured with “n−1” outputs switching from HIGH−to−LOW or LOW−to−HIGH. The remaining output is  
measured in the LOW state.  
CAPACITIVE CHARACTERISTICS  
Symbol  
Parameter  
Input Capacitance  
Condition  
= 3.3 V, V = 0 V or V  
Typical  
5.0  
Unit  
pF  
CIN  
V
V
CC  
I
CC  
CC  
COUT  
CPD  
Output Capacitance  
= 3.3 V, V = 0 V or V  
7.0  
pF  
CC  
I
Power Dissipation Capacitance  
(Note 11)  
Per input; V = GND or V  
pF  
I
CC  
V
= 1.65 V to 1.95 V  
7.7  
11.3  
14.4  
CC  
V
CC  
V
CC  
= 2.3 V to 2.7 V  
= 3.0 V to 3.6 V  
11. C is used to determine the dynamic power dissipation (P in mW).  
PD  
D
2
2
P
= C * V  
x fi * N + S (C x V  
x fo) where:  
D
PD  
CC  
L
CC  
fi = input frequency in MHz; fo = output frequency in MHz  
C = output load capacitance in pF V = supply voltage in Volts  
L
CC  
N = number of outputs switching  
2
S(C * V  
x fo) = sum of the outputs.  
L
CC  
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5
 
74LVC540A  
2.7 V  
0 V  
1.5 V  
1.5 V  
Dn  
t
t
PLH  
PHL  
V
OH  
OL  
1.5 V  
1.5 V  
On  
V
WAVEFORM 1 - PROPAGATION DELAYS  
t
R
= t = 2.5 ns, 10% to 90%; f = 1 MHz; t = 500 ns  
F W  
2.7 V  
0 V  
1.5 V  
OEn  
t
t
PHZ  
PZH  
V
V
CC  
- 0.3 V  
OH  
1.5 V  
On  
0 V  
t
t
PLZ  
PZL  
3.0 V  
1.5 V  
On  
V + 0.3 V  
OL  
GND  
WAVEFORM 2 - OUTPUT ENABLE AND DISABLE TIMES  
t
R
= t = 2.5 ns, 10% to 90%; f = 1 MHz; t = 500 ns  
F W  
Figure 3. AC Waveforms  
V
CC  
Symbol 3.3 V 0.3 V  
2.7 V  
1.5 V  
1.5 V  
V
CC  
< 2.7 V  
Vmi  
1.5 V  
1.5 V  
V
CC  
/2  
/2  
Vmo  
V
CC  
V
V
+ 0.3 V  
− 0.3 V  
V
+ 0.3 V  
V
OL  
+ 0.15 V  
− 015 V  
HZ  
OL  
OL  
V
V
OH  
V
OH  
− 0.3 V  
V
OH  
LZ  
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6
74LVC540A  
V
CC  
V
EXT  
V
I
V
O
OPEN  
GND  
R
1
PULSE  
GENERATOR  
DUT  
R
T
C
R
L
L
C includes jig and probe capacitance  
L
R = Z  
T
of pulse generator (typically 50 W)  
OUT  
R = R  
1
L
Supply Voltage  
Input  
Load  
V
EXT  
V
CC  
(V)  
V
I
t , t  
C
R
t
, t  
t
, t  
t
, t  
r
f
L
L
PLH PHL  
PLZ PZL  
PHZ PZH  
1.2  
V
V
V
2 ns  
2 ns  
30 pF  
30 pF  
30 pF  
50 pF  
50 pF  
1 kW  
1 kW  
Open  
Open  
Open  
Open  
Open  
2 x V  
GND  
CC  
CC  
1.65 − 1.95  
2.3 − 2.7  
2.7  
2 x V  
GND  
GND  
GND  
GND  
CC  
CC  
CC  
2 ns  
500 W  
500 W  
500 W  
2 x V  
CC  
2.7 V  
2.7 V  
2.5 ns  
2.5 ns  
2 x V  
CC  
3 − 3.6  
2 x V  
CC  
Figure 4. Test Circuit  
ORDERING INFORMATION  
Device  
Package  
Shipping  
74LVC540ADWR2G  
SOIC−20  
(Pb−Free)  
1000 / Tape & Reel  
2500 / Tape & Reel  
74LVC540ADTR2G  
TSSOP−20  
(Pb−Free)  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
www.onsemi.com  
7
74LVC540A  
PACKAGE DIMENSIONS  
TSSOP−20  
CASE 948E−02  
ISSUE C  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER  
ANSI Y14.5M, 1982.  
2. CONTROLLING DIMENSION:  
MILLIMETER.  
20X K REF  
K
M
S
S
V
0.10 (0.004)  
T
U
S
T U  
K1  
0.15 (0.006)  
3. DIMENSION A DOES NOT INCLUDE  
MOLD FLASH, PROTRUSIONS OR GATE  
BURRS. MOLD FLASH OR GATE BURRS  
SHALL NOT EXCEED 0.15 (0.006) PER SIDE.  
4. DIMENSION B DOES NOT INCLUDE  
INTERLEAD FLASH OR PROTRUSION.  
INTERLEAD FLASH OR PROTRUSION  
SHALL NOT EXCEED 0.25 (0.010) PER SIDE.  
5. DIMENSION K DOES NOT INCLUDE  
DAMBAR PROTRUSION. ALLOWABLE  
DAMBAR PROTRUSION SHALL BE 0.08  
(0.003) TOTAL IN EXCESS OF THE K  
DIMENSION AT MAXIMUM MATERIAL  
CONDITION.  
J J1  
20  
11  
2X L/2  
B
SECTION N−N  
L
−U−  
PIN 1  
IDENT  
0.25 (0.010)  
N
1
10  
M
6. TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
7. DIMENSION A AND B ARE TO BE  
S
0.15 (0.006)  
T U  
DETERMINED AT DATUM PLANE −W−.  
A
−V−  
N
MILLIMETERS  
INCHES  
MIN  
DIM MIN  
MAX  
6.60  
4.50  
1.20  
0.15  
0.75  
MAX  
0.260  
0.177  
0.047  
0.006  
0.030  
F
A
B
6.40  
4.30  
---  
0.252  
0.169  
---  
DETAIL E  
C
D
0.05  
0.50  
0.002  
0.020  
F
G
H
0.65 BSC  
0.026 BSC  
−W−  
C
0.27  
0.09  
0.09  
0.19  
0.19  
0.37  
0.20  
0.16  
0.30  
0.25  
0.011  
0.004  
0.004  
0.007  
0.007  
0.015  
0.008  
0.006  
0.012  
0.010  
J
J1  
K
G
D
H
DETAIL E  
K1  
L
0.100 (0.004)  
−T− SEATING  
6.40 BSC  
0.252 BSC  
0
M
0
8
8
_
_
_
_
PLANE  
SOLDERING FOOTPRINT*  
7.06  
1
0.65  
PITCH  
16X  
0.36  
16X  
1.26  
DIMENSIONS: MILLIMETERS  
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
www.onsemi.com  
8
74LVC540A  
PACKAGE DIMENSIONS  
SOIC−20 WB  
CASE 751D−05  
ISSUE G  
D
A
q
NOTES:  
1. DIMENSIONS ARE IN MILLIMETERS.  
2. INTERPRET DIMENSIONS AND TOLERANCES  
PER ASME Y14.5M, 1994.  
20  
11  
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD  
PROTRUSION.  
E
B
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.  
5. DIMENSION B DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE PROTRUSION  
SHALL BE 0.13 TOTAL IN EXCESS OF B  
DIMENSION AT MAXIMUM MATERIAL  
CONDITION.  
1
10  
MILLIMETERS  
20X B  
DIM MIN  
MAX  
2.65  
0.25  
0.49  
0.32  
12.95  
7.60  
A
A1  
B
C
D
E
2.35  
0.10  
0.35  
0.23  
12.65  
7.40  
M
S
S
B
T
0.25  
A
A
e
1.27 BSC  
H
h
10.05  
0.25  
0.50  
0
10.55  
0.75  
0.90  
7
SEATING  
PLANE  
L
18X e  
A1  
C
q
T
_
_
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74LVC540A/D  

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