AFGHL40T65SQD [ONSEMI]

AEC 101 Qualified, 650V, 40A Fieldstop 4 trench IGBT;
AFGHL40T65SQD
型号: AFGHL40T65SQD
厂家: ONSEMI    ONSEMI
描述:

AEC 101 Qualified, 650V, 40A Fieldstop 4 trench IGBT

双极性晶体管
文件: 总9页 (文件大小:348K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Field Stop Trench IGBT  
40ꢀA, 650ꢀV  
AFGHL40T65SQD  
Using the novel field stop 4th generation high speed IGBT  
technology. AFGHL40T65SQD which is AEC Q101 qualified offers  
the optimum performance for both hard and soft switching topology in  
automotive application.  
www.onsemi.com  
Features  
AECQ101 Qualified  
40 A, 650 V,  
Maximum Junction Temperature: T = 175°C  
J
VCESat = 1.6 V  
Positive Temperature Coefficient for Easy Parallel Operating  
High Current Capability  
C
Low Saturation Voltage: V  
= 1.6 V (Typ.) @ I = 40 A  
C
CE(Sat)  
100% of the Parts are Tested for I (Note 2)  
LM  
Fast Switching  
Tight Parameter Distribution  
RoHS Compliant  
G
E
Typical Applications  
Automotive HEVEV Onboard Chargers  
Automotive HEVEV DCDC Converters  
Totem Pole Bridgeless PFC  
PTC  
G
MAXIMUM RATINGS  
C
Rating  
Symbol Value  
Unit  
V
E
TO2473L  
CASE 340CX  
CollectortoEmitter Voltage  
V
CES  
V
GES  
650  
GatetoEmitter Voltage  
Transient GatetoEmitter Voltage  
20  
30  
V
MARKING DIAGRAM  
Collector Current (Note 1)  
@ T = 25°C  
I
C
80  
40  
A
C
@ T = 100°C  
C
Pulsed Collector Current (Note 2)  
Pulsed Collector Current (Note 3)  
I
160  
160  
A
A
A
LM  
I
CM  
&Z&3&K  
AFGHL  
40T65SQD  
Diode Forward Current  
(Note 1)  
@ T < 25°C  
@ T < 100°C  
I
F
80  
20  
C
C
Pulsed Diode Maximum Forward Current  
I
160  
A
FM(2)  
Maximum Power Dissipation @ T = 25°C  
P
D
238  
119  
W
C
@ T = 100°C  
C
Operating Junction  
T , T  
55 to  
°C  
°C  
J
STG  
&Z  
&3  
&K  
= Assembly Plant Code  
= 3Digit Date Code  
= 2Digit Lot Traceability Code  
/ Storage Temperature Range  
+175  
Maximum Lead Temp. for Soldering  
Purposes, 1/8from case for 5 seconds  
T
L
300  
AFGHL40T65SQD = Specific Device Code  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
1. Value limit by bond wire  
ORDERING INFORMATION  
2. V = 400 V, V = 15 V, I = 160 A, R = 15 W, Inductive Load  
Device  
Package  
Shipping  
CC  
GE  
C
G
3. Repetitive Rating: pulse width limited by max. Junction temperature  
AFGHL40T65SQD  
TO2473L 30 Units / Rail  
© Semiconductor Components Industries, LLC, 2019  
1
Publication Order Number:  
June, 2020 Rev. 2  
AFGHL40T65SQD/D  
 
AFGHL40T65SQD  
THERMAL CHARACTERISTICS  
Rating  
Symbol  
Value  
0.63  
1.71  
40  
Unit  
°C/W  
°C/W  
°C/W  
Thermal resistance junctiontocase, for IGBT  
Thermal resistance junctiontocase, for Diode  
Thermal resistance junctiontoambient  
R
q
JC  
R
q
JC  
R
q
JA  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
J
Parameter  
Test Conditions  
Symbol  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
Collectoremitter breakdown voltage,  
gateemitter shortcircuited  
V
C
= 0 V,  
BV  
650  
V
GE  
CES  
I
= 1 mA  
Temperature Coefficient of  
Breakdown Voltage  
V
C
= 0 V,  
= 1 mA  
0.6  
V/°C  
GE  
DBV  
DT  
CES  
I
J
Collectoremitter cutoff current,  
gateemitter shortcircuited  
V
CE  
= 0 V,  
I
250  
400  
mA  
GE  
CES  
V
= 650 V  
Gate leakage current, collector−  
emitter shortcircuited  
V
= 20 V,  
= 0 V  
I
nA  
GE  
GES  
V
CE  
ON CHARACTERISTICS  
Gateemitter threshold voltage  
Collectoremitter saturation voltage  
V
= V , I = 40 mA  
V
GE(th)  
3.4  
4.9  
6.4  
V
V
GE  
CE  
C
V
= 15 V, I = 40 A  
V
CE(sat)  
1.6  
1.95  
2.1  
GE  
C
V
GE  
= 15 V, I = 40 A, T = 175°C  
C
J
DYNAMIC CHARACTERISTICS  
Input capacitance  
V
= 30 V,  
GE  
C
2339  
61  
8
pF  
nC  
CE  
ies  
V
= 0 V,  
Output capacitance  
C
oes  
f = 1 MHz  
Reverse transfer capacitance  
Gate charge total  
C
res  
V
= 400 V,  
= 40 A,  
Q
68  
13  
16  
CE  
g
I
C
Gatetoemitter charge  
Gatetocollector charge  
Q
Q
ge  
gc  
V
= 15 V  
GE  
SWITCHING CHARACTERISTICS, INDUCTIVE LOAD  
Turnon delay time  
Rise time  
T
CC  
= 25°C,  
= 400 V,  
= 20 A,  
t
15  
10  
ns  
C
d(on)  
V
t
r
I
C
R
= 6 W,  
G
Turnoff delay time  
Fall time  
t
70  
d(off)  
V
GE  
= 15 V,  
Inductive Load  
t
f
3
Turnon switching loss  
Turnoff switching loss  
Total switching loss  
Turnon delay time  
Rise time  
E
on  
E
off  
0.25  
0.09  
0.34  
17  
mJ  
ns  
E
ts  
T
C
= 25°C,  
= 400 V,  
= 40 A,  
t
t
d(on)  
V
CC  
C
R
t
r
22  
I
= 6 W,  
= 15 V,  
G
Turnoff delay time  
Fall time  
67  
d(off)  
V
GE  
Inductive Load  
t
f
31  
Turnon switching loss  
Turnoff switching loss  
Total switching loss  
E
on  
E
off  
0.75  
0.29  
1.04  
mJ  
E
ts  
www.onsemi.com  
2
AFGHL40T65SQD  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted) (Continued)  
J
Parameter  
Test Conditions  
Symbol  
Min  
Typ  
Max  
Unit  
SWITCHING CHARACTERISTICS, INDUCTIVE LOAD  
Turnon delay time  
Rise time  
T
= 175°C,  
t
t
14  
12  
ns  
C
d(on)  
V
= 400 V,  
= 20 A,  
CC  
t
r
I
C
R
= 6 W,  
= 15 V,  
G
GE  
Turnoff delay time  
Fall time  
81  
d(off)  
V
Inductive Load  
t
f
7
Turnon switching loss  
Turnoff switching loss  
Total switching loss  
Turnon delay time  
Rise time  
E
on  
E
off  
0.46  
0.22  
0.68  
16  
mJ  
ns  
E
ts  
T
= 175°C,  
= 400 V,  
= 40 A,  
t
t
C
d(on)  
V
CC  
t
r
25  
I
C
R
= 6 W,  
= 15 V,  
G
GE  
Turnoff delay time  
Fall time  
75  
d(off)  
V
Inductive Load  
t
f
38  
Turnon switching loss  
Turnoff switching loss  
Total switching loss  
DIODE CHARACTERISTICS  
Diode Forward Voltage  
E
on  
E
off  
1.06  
0.47  
1.53  
mJ  
V
E
ts  
I = 20 A, T = 25°C  
V
2.0  
1.75  
54  
2.6  
F
C
FM  
rec  
I = 20 A, T = 175°C  
F
C
Reverse Recovery Energy  
I = 20 A, dl /dt = 200 A/ms,  
E
mJ  
F
F
T
= 175°C  
C
Diode Reverse Recovery Time  
T
rr  
28  
209  
38  
ns  
I = 20 A, dl /dt = 200 A/ms,  
F
F
T
= 25°C  
C
I = 20 A, dl /dt = 200 A/ms,  
T
rr  
F
F
T
C
= 175°C  
Diode Reverse Recovery Charge  
Q
nC  
I = 20 A, dl /dt = 200 A/ms,  
F
F
rr  
rr  
T
C
= 25°C  
I = 20 A, dl /dt = 200 A/ms,  
Q
605  
F
F
T
C
= 175°C  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
www.onsemi.com  
3
AFGHL40T65SQD  
TYPICAL CHARACTERISTICS  
200  
160  
120  
80  
200  
TC  
20V  
15V  
= 25°C  
TC  
= 175°C  
20V  
15V  
160  
120  
80  
40  
0
12V  
10V  
12V  
10V  
VGE = 8V  
VGE = 8V  
40  
0
0
1
2
3
4
5
0
1
2
3
4
5
200  
20  
CollectorEmitter Voltage, VCE [V]  
CollectorEmitter Voltage, V [V]  
CE  
Figure 1. Typical Output Characteristics  
Figure 2. Typical Output Characteristics  
3.0  
2.0  
1.0  
200  
160  
120  
80  
TC  
= 25°C  
Common Emitter  
VGE = 15V  
Common Emitter  
V GE = 15V  
TC  
= 175°C  
80A  
40A  
40  
0
IC = 20A  
0
1
2
3
4
5
100  
50  
0
50  
100  
150  
CollectorEmitter Voltage, VCE [V]  
CollectorEmitter Case Temperature, TC [°C]  
Figure 3. Typical Saturation Voltage  
Figure 4. Saturation Voltage vs. Case  
Temperature  
20  
16  
12  
8
20  
16  
12  
8
Common Emitter  
Common Emitter  
TC  
TC  
= 175°C  
= 25°C  
IC = 20A  
80A  
40A  
80A  
40A  
4
0
4
0
IC = 20A  
4
8
12  
16  
[V]  
20  
4
8
12  
16  
GateEmitter Voltage, V  
GE  
GateEmitter Voltage, VGE [V]  
Figure 5. Saturation Voltage vs. VGE  
Figure 6. Saturation Voltage vs. VGE  
www.onsemi.com  
4
AFGHL40T65SQD  
TYPICAL CHARACTERISTICS  
10000  
1000  
100  
10  
15  
Common Emitter  
T C = 25°C  
Cies  
300V  
400V  
12  
9
V CC = 200V  
Coes  
6
Cres  
3
Common Emitter  
VGE = 0V, f = 1Mhz  
T C  
= 25°C  
1
1
0
10  
30  
0
25  
50  
Gate Charge, Q g [nC]  
75  
100  
CollectorEmitter Voltage, V  
[V]  
CE  
Figure 7. Capacitance Characteristics  
Figure 8. Gate Charge  
100  
1000  
100  
10  
tr  
td(off)  
tf  
Common Emitter  
td(on)  
Common Emitter  
VCC = 400V, VGE = 15V  
VCC = 400V, V  
= 15V,  
GE  
IC = 40A  
IC = 40A  
TC  
TC  
TC  
TC  
= 25°C  
= 175°C  
= 25°C  
= 175°C  
10  
0
10  
20  
30  
40  
50  
0
10  
20  
30  
40  
50  
Gate Resistance, Rg [ W]  
Gate Resistance, Rg [ W ]  
Figure 9. TurnOn Characteristics vs. Gate  
Figure 10. TurnOff Characteristics vs. Gate  
Resistance  
Resistance  
200  
100  
1000  
100  
tr  
td(off)  
td(on)  
tf  
10  
1
10  
1
Common Emitter  
Common Emitter  
V
CC = 400V, VGE = 15V,  
VCC = 400V, V GE = 15V,  
RG = 6 W  
RG = 6 W  
TC  
TC  
TC = 25°C  
TC = 175°C  
= 25°C  
= 175°C  
0
30  
60  
90  
120  
0
30  
60  
90  
120  
Collector Current, IC [A]  
Collector Current, IC [A]  
Figure 11. TurnOn Characteristics vs.  
Figure 12. TurnOff Characteristics vs.  
Collector Current  
Collector Current  
www.onsemi.com  
5
AFGHL40T65SQD  
TYPICAL CHARACTERISTICS  
5
1
10  
1
Eon  
Eon  
Eoff  
0.1  
Common Emitter  
VCC = 400V, V  
IC = 40A  
Common Emitter  
= 15V,  
VCC = 400V, V GE = 15V,  
GE  
RG = 6 W  
Eoff  
T C = 25°C  
T C = 175°C  
TC  
TC  
= 25°C  
= 175°C  
0.1  
0.01  
0
10  
20  
30  
40  
50  
0
30  
60  
90  
120  
Gate Resistance, Rg [ W ]  
Collector Current, IC [A]  
Figure 13. Switching Loss vs. Gate Resistance  
Figure 14. Switching Loss vs. Collector  
Current  
80  
300  
100 DC  
ms  
10  
TC  
= 175°C  
ms  
100  
1ms  
TC  
= 75°C  
10  
1
10ms  
10  
TC  
= 25°C  
*Notes:  
1. T C  
2. T J  
= 25°C  
= 175°C  
3. Single Pulse  
1
0
0.1  
1
10  
100  
1000  
1
2
3
4
5
Forward Voltage, VF [V]  
Collector Emitter Voltage, VCE [V]  
Figure 16. Forward Characteristics  
Figure 15. SOA Characteristics  
10  
8
350  
280  
210  
140  
70  
T C = 25°C  
T C = 175°C  
T C = 25°C  
T C = 175°C  
di/dt = 200A/uS  
di/dt = 100A/uS  
6
di/dt = 100A/uS  
4
di/dt = 200A/uS  
di/dt = 200A/uS  
di/dt = 100A/uS  
2
0
0
0
10  
20  
30  
40  
0
10  
20  
Forward Current, VF [V]  
30  
40  
Forward Current, VF [V]  
Figure 17. Reverse Recovery Current  
Figure 18. Reverse Recovery Time  
www.onsemi.com  
6
AFGHL40T65SQD  
TYPICAL CHARACTERISTICS  
1000  
800  
600  
400  
200  
T C = 25°C  
T C = 175°C  
di/dt = 100A/uS  
di/dt = 200A/uS  
0
0
10  
20  
30  
40  
Forward Current, VF [V]  
Figure 19. Stored Charge  
1
0.5  
0.2  
0.1  
0.1  
Notes:  
Duty Factor, D = t /t  
P
0.05  
DM  
1
2
0.02  
0.01  
Peak T = P  
x Z  
(t) + T  
q
J
DM  
JC C  
t
1
t
2
Single Pulse  
0.01  
5  
4  
3  
2  
1  
0
1
10  
10  
10  
10  
Rectangular Pulse Duration [sec]  
10  
10  
10  
Figure 20. Transient Thermal Impedance of IGBT  
2
1
0.5  
0.2  
0.1  
0.05  
0.1  
Notes:  
Duty Factor, D = t /t  
P
0.02  
0.01  
DM  
1
2
Peak T = P  
x Z  
(t) + T  
q
J
DM  
JC C  
t
1
Single Pulse  
t
2
0.01  
5  
4  
3  
2  
1  
0
1
10  
10  
10  
10  
10  
10  
10  
Rectangular Pulse Duration [sec]  
Figure 21. Transient Thermal Impedance of Diode  
www.onsemi.com  
7
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
TO2473LD  
CASE 340CX  
ISSUE A  
DATE 06 JUL 2020  
GENERIC  
MARKING DIAGRAM*  
XXXXX = Specific Device Code  
A
Y
= Assembly Location  
= Year  
WW  
G
= Work Week  
= PbFree Package  
XXXXXXXXX  
AYWWG  
*This information is generic. Please refer to  
device data sheet for actual part marking.  
PbFree indicator, “G” or microdot “ G”, may  
or may not be present. Some products may  
not follow the Generic Marking.  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON93302G  
TO2473LD  
PAGE 1 OF 1  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically  
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the  
rights of others.  
© Semiconductor Components Industries, LLC, 2018  
www.onsemi.com  
onsemi,  
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates  
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.  
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. onsemi reserves the right to make changes at any time to any  
products or information herein, without notice. The information herein is provided “asis” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the  
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use  
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products  
and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information  
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may  
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license  
under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems  
or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should  
Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
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Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
ADDITIONAL INFORMATION  
TECHNICAL PUBLICATIONS:  
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