ARRAYC-30035-144P-PCB

ArrayC Series

Silicon Photomultiplier

(SiPM) 4-Side Scaleable

Arrays

ON Semiconductor’s range of C-Series, SMT (surface mount

technology) SiPM sensors have been used to create compact and

scaleable arrays. The sensors are mounted onto PCB boards with

minimal dead space. The ArrayC products are available in a variety of

formats, and formed of pixels of different sizes. Details of the arrays

available are given in the Ordering Information table on page 29 of

this document.

www.onsemi.com

The back of each ArrayC has either one or more multi-way

connectors, or a BGA (ball grid array), that allow access to the fast

output* and standard I/O from each pixel in the array, and a common

I/O from the summed substrates of the pixels. The ArrayC products

with connectors can be used to interface with the user’s own readout

via the mating connector, or to ON Semiconductor’s Breakout Boards

(BOBs). The BOBs allow for easy access to the pixel signals and

performance evaluation of the arrays.

ArrayC products with the BGA can be reflow soldered to the user’s

readout boards, or purchased ready-mounted on an Evaluation Board

(EVB) for easy testing. The BGA ArrayC products cannot be removed

from their EVBs. This contrasts with an ArrayC that has connectors,

where multiple arrays can be evaluated with a single BOB.

S1

S2

F1

F2

Common

Sn+1

Sn+2

Fn+2

ArrayC Inputs and Outputs (I/O)

Figure 1 summarizes the array schematic for a portion of an ArrayC.

Each SiPM sensor in the array has three electrical connections: fast

output*, standard output and common.

Fn+1

The substrates (cathodes) of all sensors are summed together to

form the common I/O.

Each individual fast output* and standard I/O (anode) are routed to

its own output pin.

Figure 1. Signal connections at the pixel

level of an ArrayC

The pixel-level performance of the sensors in the array can be found

in the C-Series datasheet.

ATTENTION!

Table of Contents

Great care should be taken when disconnecting the

ArrayC PCBs from the mating connectors, either on one

of the BOBs, or the user’s own boards.

ARRAYC−60035−4P−BGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

ARRAYC−60035−4P−GEVB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

ARRAYC−60035−64P−PCB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

ARRAYX−BOB6−64S . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

ARRAYX−BOB6−64S . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

ARRAYC−30035−16P−PCB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

ARRAYX−BOB3−16P . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

ARRAYX−BOB3−16S . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

ARRAYC−30035−144P−PCB . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

ARRAYX−BOB3−144P . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Biasing and Readout from the Standard Breakout Boards . . . . 24

Appendix A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Appendix B . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

Appendix C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

The board should be gently levered up, working

progressively around the board to lever the PCB from the

connector a little on all sides, and then repeating the

process until the connectors are free from each other.

Note that a BGA ArrayC cannot be removed from its EVB.

* The ARRAYC-60035-4P does not have access to the fast output.

1

Publication Order Number:

March, 2019 − Rev. 7

ARRAYC−SERIES/D

ArrayC Series

ARRAYC-60035-4P-BGA (2 x 2 ARRAY OF 6 mm SMT SENSORS)

Array Size

Sensor Type

Readout

Board Size

Pixel Pitch

No. Connections

No. Connectors

2

2 x 2

60035

Pixel

14.2 x 14.2 mm

7.2 mm

9

3 x 3 BGA

The ARRAYC-60035-4P is comprised of 4 individual

6mm C-Series sensors arranged in a 2 x 2 array.

The performance of the individual pixels and details of the

bias to apply can be found in the C-Series datasheet.

Connections to each sensor are provided by a BGA (ball

grid array). The BGA can be used to mount the array on the

user’s board using reflow soldering.

The 4 SiPM sensors have all substrate connections

(cathodes) connected together to form a common I/O. The

3 x 3 BGA provides connections as follows:

• 4 x standard I/O

• 5 x common I/O

• There is NO fast output

Schematics for the ARRAYC-60035-4P-BGA

The complete ARRAYC-60035-4P-BGA CAD and solder footprint is available to download.

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2

ArrayC Series

BGA Connections for the ARRAYC-60035-4P-BGA

The fiducial is indicated in the image below. It marks the

location of both pin A1 and pixel 1.

Pin. No

A1

Function

Anode 1

Fiducial

A2

Anode 2

A3

Common Cathode

Anode 3

B1

B2

Anode 4

B3

Common Cathode

C1

C2

C3

ARRAYC-60035-4P-BGA - Solder Footprint and Reflow

Solder Profile

proper bonding and positioning of the array. After soldering,

allow at least three minutes for the component to cool to

room temperature before further operations.

Solder reflow conditions must be in compliance with

J-STD-20, table 5.2. This is summarized in Figure 2. The

number of passes should not be more than 2.

The BGA package is compatible with standard reflow

solder processes (J-STD-20) and so is ideal for high-volume

manufacturing. The ARRAYC-60035-4P-BGA should be

mounted according to specified soldering pad patterns, as

given in of the CAD file.

Solder paste (we recommend using no-clean solder paste)

must be evenly applied to each soldering pad to insure

Solder Reflow Profile

300

250

200

150

100

50

Max 10 s at 260°C

Max 260°C

Max 4°C/s

217°C

180°C

Max 6°C/s

60~100 s

60 to 120 s

0

50

100

150

Time (s)

200

250

300

Figure 2. Solder reflow profile. Conditions must be in compliance with J-STD-20, table 5.2

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3

ArrayC Series

ARRAYC-60035-4P-GEVB

(ARRAYC-60035-4P-BGA Evaluation Board)

The ARRAYC-60035-4P-GEVB is an evaluation board

allowing easy access to the signals of a ARRAYC-60035-

4P-BGA via pins.

The ARRAYC-60035-4P-GEVB has the array on the

front and pins on the back of the PCB. The pins are

compatible with a standard 8-pin DIL socket for evaluation

purposes. Alternatively, the pins can be directly soldered

into through-holes in the user’s readout PCB. Four of the

pins are connected to the anodes of the individual pixels and

the other four pins are connected to the common cathode. An

Pin. No

Function

Anode 1

example

mating

8-pin

DIL

socket

is

the

1

2

3

4

5

6

7

8

110-93-308-41-001000 from Mill-Max.

The GEVB PCB is slightly smaller than the actual array,

allowing for tiling.

Common Cathode

Anode 3

Common Cathode

Anode 4

The GEVB does NOT provide access to the fast output.

Common Cathode

Anode 2

Schematics for the ARRAYC-60035-4P-GEVB

The complete ARRAYC-60035-4P-GEVB CAD and solder footprint is available to download.

www.onsemi.com

4

ArrayC Series

ARRAYC-60035-64P-PCB (8 x 8 ARRAY OF 6 mm SMT SENSORS)

Array Size

Sensor Type

Readout

Board Size

Pixel Pitch

No. Connections

No. Connectors

2

8 x 8

60035

Pixel

57.4 x 57.4 mm

7.2 mm

160

2 x 80-way

The ARRAYC-60035-64P is comprised of 64 individual

6mm SMT sensors arranged in a 8 x 8 array.

The performance of the individual pixels and details of the

bias to apply can be found in the C-Series datasheet.

The connections to each array are provided by two

Samtec 80-way connectors, type QTE-040-03-F-D-A.

These connectors mate with the Samtec QSE-040-

01-F-D-A board-to-board connector and the Samtec EQCD

High Speed Cable Assemblies. The 64 SiPM pixels all have

substrate connections (cathode) summed to form a common

I/O. The 80-way connectors provide connections as follows:

• 64 x fast output

• 64 x standard I/O

• 32 x common I/O

Schematics for the ARRAYC-60035-64P-PCB

The complete ARRAYC-60035-64P-PCB CAD is available to download.

www.onsemi.com

5

ArrayC Series

Figure 3. Connector schematic for the ARRAYC-60035-64P

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6

ArrayC Series

Table 1. Connector Pin-Outs for the ARRAYC-60035-64P-PCB

J1

J2

SIGNAL

1

S17

F17

S25

F25

S18

F18

S26

F26

S19

F19

S27

F27

S20

F20

S28

F28

CM

2

S1

F1

1

S49

F49

S57

F57

S50

F50

S58

F58

S51

F51

S59

F59

S52

F52

S60

F60

CM

2

S33

F33

S41

F41

S34

F34

S42

F42

S35

F35

S43

F43

S36

F36

S44

F44

CM

3

4

3

4

5

6

S9

5

6

7

8

F9

7

8

9

10

12

14

16

18

20

22

24

26

28

30

32

34

36

38

40

42

44

46

48

50

52

54

56

58

60

62

64

66

68

70

72

74

76

78

80

S2

9

10

12

14

16

18

20

22

24

26

28

30

32

34

36

38

40

42

44

46

48

50

52

54

56

58

60

62

64

66

68

70

72

74

76

78

80

11

13

15

17

19

21

23

25

27

29

31

33

35

37

39

41

43

45

47

49

51

53

55

57

59

61

63

65

67

69

71

73

75

77

79

F2

11

13

15

17

19

21

23

25

27

29

31

33

35

37

39

41

43

45

47

49

51

53

55

57

59

61

63

65

67

69

71

73

75

77

79

S10

F10

S3

F3

S11

F11

S4

F4

S12

F12

CM

S5

CM

S21

F21

S29

F29

S22

F22

S30

F30

S23

F23

S31

F31

S24

F24

S32

F32

CM

S53

F53

S61

F61

S54

F54

S62

F62

S55

F55

S63

F63

S56

F56

S64

F64

CM

S37

F37

S45

F45

S38

F38

S46

F46

S39

F39

S47

F47

S40

F40

S48

F48

CM

F5

S13

F13

S6

F6

S14

F14

S7

F7

S15

F15

S8

F8

S16

F16

CM

Sn

Fn

Common I/O

Standard I/O of pixel n

Fast output of pixel n

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7

ArrayC Series

ARRAYX-BOB6-64P

(ARRAYC-60035-64P Breakout Board)

The ARRAYX-BOB6-64P is an evaluation board

allowing easy access to all the signals of

a

ON Semiconductor ARRAYC-60035-64P, 6 mm 8 x 8

SiPM array.

The Breakout Board features two Samtec 80-way

connectors, type QSE-040-01-F-D-A. These connectors

mate with the Samtec QTE-040-03-F-D-A board-to- board

connector on the array. Since the connectors are keyed,

orientating the array on the BOB is straightforward.

All signals on the array are routed via the mating

connectors to header pins. These pins are formed of four

50-way (25 x 2 row) 2.54 mm pitch headers; J3, J4, J5 and

J6. Each of the four headers also has 8 pins left unconnected

to allow prototyping for evaluation purposes. The layout of

the board can be seen in Figure 4.

The three SMA connectors on the board can be connected

via the supplied jumper cable to any of the array header pins

and used for accessing signals or suppling bias voltage. Four

7 mm holes are aligned on a 25 mm grid to allow mounting

of the board on an optical breadboard.

See Appendices A and B for examples of Breakout Board

usage.

Schematics for the ARRAYC-60035-4P-EVB

Figure 4. Layout of the ARRAYX-BOB6-64P. The dimensions of the board are 112 mm x 112 mm

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8

ArrayC Series

Table 2. HEADER SIGNALS ON THE ARRAYX-BOB6-64P

J3

J4

J5

J6

NC

CM

F1

NC

CM

S1

NC

1

2

3

4

CM

F49

F57

F50

F58

F51

F59

F52

F60

CM

F53

F61

F54

F62

F55

F63

F56

F64

CM

NC

CM

S49

S57

S50

S58

S51

S59

S52

S60

CM

S53

S61

S54

S62

S55

S63

S56

S64

CM

NC

CM

F17

F25

F18

F26

F19

F27

F20

F28

CM

F33

F41

F34

F42

F35

F43

F36

F44

CM

NC

CM

S17

S25

S18

S26

S19

S27

S20

S28

CM

S33

S41

S34

S42

S35

S43

S36

S44

CM

NC

CM

F21

F29

F22

F30

F23

F31

F24

F32

CM

F37

F45

F38

F46

F39

F47

F40

F48

CM

NC

CM

S21

S29

S22

S30

S23

S31

S24

S32

CM

S37

S45

S38

S46

S39

S47

S40

S48

CM

NC

5

6

7

8

9

10

12

14

16

18

20

22

24

26

28

30

32

34

36

38

40

42

44

46

48

50

F9

S9

11

13

15

17

19

21

23

25

27

29

31

33

35

37

39

41

43

45

47

49

F2

S2

F10

F3

S10

S3

F11

F4

S11

S4

F12

CM

F5

S12

CM

S5

F13

F6

S13

S6

F14

F7

S14

S7

F15

F8

S15

S8

F16

CM

NC

S16

CM

NC

CM

Sn

Not Connected

Common I/O

Standard I/O of pixel n

Fast output of pixel n

Fn

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9

ArrayC Series

ARRAYX-BOB6-64S (Summed Breakout Board for the

ARRAYC-60035-64P)

These pins are formed of four 50-way (25 x 2 row) 2.54 mm

pitch headers; J3, J4, J5 and J6. Each of the four headers also

has 10 pins that connect to the common cathode (CM) and

8 pins left unconnected (NC) to allow prototyping for

evaluation purposes.

Two SMA connectors and Balun transformers are

provided with 4-pin headers to allow any fast signal to be

connected directly to the SMA or via the transformer using

jumper wires.

Summed output: A summed output (the anodes of pixels

1 to 64 connected together) is routed to jumper pins (SM) in

close proximity to a third SMA connector. Four 7 mm holes

are placed on a 25 mm grid to allow mounting of the board

on an optical breadboard.

The ARRAYX-BOB6-64S is an evaluation board

allowing easy access to the sum of all of standard pixel

signals of a ON Semiconductor ARRAYC-60035-64P,

6 mm 8x 8 SiPM array, in addition to all of the individual fast

output signals. The Breakout Board features two Samtec

80-way connectors, type QSE-040-01-F-D-A. These

connectors mate with the Samtec QTE-040-03-F-D-A

board-to-board connector on the array. Since the connectors

are keyed, orientating the array on the BOB is

straightforward. A schematic of the board is shown in

Figure 5 below.

Fast signals: All of the fast output signals (Fn) from the

array are routed via the mating connectors to header pins.

Figure 5. Layout of the ARRAYX-BOB6-64S. The dimensions of the board are 112 mm x 112 mm

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10

ArrayC Series

Table 3. HEADER SIGNALS ON THE ARRAYX-BOB6-64S

J3

J4

J5

J6

CM

NC

F1

CM

NC

F1

CM

NC

CM

NC

CM

NC

CM

NC

CM

NC

CM

NC

1

2

3

4

5

6

NC

7

8

F49

F57

F50

F58

F51

F59

F52

F60

CM

F53

F61

F54

F62

F55

F63

F56

F64

NC

F49

F57

F50

F58

F51

F59

F52

F60

CM

F53

F61

F54

F62

F55

F63

F56

F64

NC

F17

F25

F18

F26

F19

F27

F20

F28

CM

F33

F41

F34

F42

F35

F43

F36

F44

NC

F17

F25

F18

F26

F19

F27

F20

F28

CM

F33

F41

F34

F42

F35

F43

F36

F44

NC

F21

F29

F22

F30

F23

F31

F24

F32

CM

F37

F45

F38

F46

F39

F47

F40

F48

NC

F21

F29

F22

F30

F23

F31

F24

F32

CM

F37

F45

F38

F46

F39

F47

F40

F48

NC

9

10

12

14

16

18

20

22

24

26

28

30

32

34

36

38

40

42

44

46

48

50

F9

11

13

15

17

19

21

23

25

27

29

31

33

35

37

39

41

43

45

47

49

F2

F10

F3

F10

F3

F11

F4

F11

F4

F12

CM

F5

F12

CM

F5

F13

F6

F13

F6

F14

F7

F14

F7

F15

F8

F15

F8

F16

NC

CM

F16

NC

CM

NC

CM

NC

CM

Fn

Not Connected

Common I/O

Fast output of pixel n

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11

ArrayC Series

ARRAYC-30035-16P-PCB (4 x 4 ARRAY OF 3 mm SMT SENSORS)

Array Size

Sensor Type

Readout

Board Size

Pixel Pitch

No. Connections

No. Connectors

2

4 x 4

30035

Pixel

16.6 x 16.6 mm

4.2 mm

40

1 x 40-way

The ARRAYC-30035-16P-PCB is comprised of 16

individual 3 mm C-Series sensors arranged in a 4 x 4 array.

The performance of the individual pixels and details of the

bias to apply can be found in the C-Series datasheet.

Connections to each sensor are provided by a 40-way

Hirose plug-type board-to-board connector DF17(2.0)-

40DP-0.5V(57). These connectors mate with the Hirose

DF17(3.0)-40DS-0.5V(57). The 16 SiPM pixels have all

substrates (cathodes) connected together to form a common

I/O. The 40-way connector provides connections as follows:

• 16 x fast output

• 16 x standard I/O

• 8 x common I/O

Schematics for the ARRAYC-30035-16P-PCB

The complete ARRAYC-30035-16P-PCB CAD is available to download.

www.onsemi.com

12

ArrayC Series

Connector Pin-Outs for the ARRAYC-30035-16P-PCB

Figure 6. Connector schematic for the ARRAYC-30035-16P

SIGNAL

CM

S1

SIGNAL

CM

1

2

40

39

38

37

36

35

34

33

32

31

30

29

28

27

26

25

24

23

22

21

CM

S9

3

F1

F9

4

S5

S13

F13

S10

F10

S14

F14

S11

F11

S15

F15

S12

F12

S16

F16

CM

5

F5

6

S2

7

F2

8

S6

9

F6

10

11

12

13

14

15

16

17

18

19

20

S3

F3

S7

F7

S4

F4

S8

F8

CM

Common I/O

Sn

Fn

Standard I/O of pixel n

Fast output of pixel n

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13

ArrayC Series

ARRAYX-BOB3-16P

(ARRAYC-30035-16P Breakout Board)

The ARRAYX-BOB3-16P is an evaluation board

allowing easy access to the signals from

a

ON Semiconductor ARRAYC-30035-16P, 3 mm 4 x 4

SiPM array. See Figure 7 for details on orientating the array

correctly on the BOB.

The Breakout Board has a centrally located Hirose

40-way connector DF17(2.0)-40DS-0.5V(57). This

connector mates with the Hirose DF17(2.0)-40DP-

0.5V(57) board-to-board connector on the ARRAYC-

30035-16P. All signals on the ARRAY are routed via the

mating connector to header pins. These pins are formed by

two 20-way (10 x 2 row) 2.54 mm pitch headers; J2 and J3.

Three SMA connectors and Balun transformers are

provided with 4-pin headers to allow any signal to be

connected directly to the SMA or via the transformer using

jumper wires. Four 7 mm holes are aligned on a 25 mm grid

to allow mounting of the board on an optical breadboard.

See Appendices A and B for examples of Breakout Board

usage.

Pixel 4

Pixel 1

Pixel 16

Pixel 13

Figure 7. Layout of the ArrayX-BOB3-16P (left). The board dimensions are 62 mm x 62 mm. The underside of the

ArrayC-30035-16P is also shown (right). The pixel numbering is shown, and can be matched the pixel numbers

that are marked on the BOB, as indicated. This allows for the correct orientation of the array on the BOB

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14

ArrayC Series

Header Signals for the ARRAYX-BOB3-16P

J2

J3

CM

S1

S5

S2

S6

S3

S7

S4

S8

NC

CM

F1

CM

S9

CM

F9

1

3

2

4

F5

S13

S10

S14

S11

S15

S12

S16

NC

F13

F10

F14

F11

F15

F12

F16

NC

5

6

F2

7

8

F6

9

10

12

14

16

18

20

F3

11

13

15

17

19

F17

F4

F6

NC

CM

Sn

Not Connected

Common I/O

Standard I/O of pixel n

Fast output of pixel n

Fn

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15

ArrayC Series

ARRAYX-BOB3-16S (Summed Breakout Board for the

ARRAYC-30035-16P)

These pins are formed by two 20-way (10 x 2 row) 2.54 mm

pitch headers; J2 and J3. Each of the headers also has 2 pins

that connect to the common cathode (CM) and 2 pins left

unconnected (NC) to allow prototyping for evaluation

purposes.

Two SMA connectors and Balun transformers are

provided with 4-pin headers to allow any fast signal to be

connected directly to the SMA or via the transformer using

jumper wires.

Summed output: A summed output (the anodes of pixels

1 to 16 connected together) is routed to jumper pins (SM) in

close proximity to a third SMA connector. Four 7 mm holes

are placed on a 25 mm grid to allow mounting of the board

on an optical breadboard.

The ARRAYX-BOB3-16S is an evaluation board

allowing easy access to the sum of all of standard pixel

signals of a ON Semiconductor ARRAYC-30035-16P,

3 mm 4 x 4 SiPM array, in addition to all of the individual

fast output signals. The Summed Breakout Board has a

centrally

located

Hirose

40-way

connector

DF17(2.0)-40DS-0.5V(57). This connector mates with the

Hirose DF17(2.0)- 40DP-0.5V(57) board-to-board

connector on the ARRAYC-30035-16P. See Figure 7 in the

previous section for information on orientating the array on

the BOB. A schematic of the board is shown in Figure 8

below.

Fast signals: All of the fast output signals (Fn) from the

array are routed via the mating connectors to header pins.

Figure 8. Layout of the ARRAYX-BOB3-16S. The board dimensions are 62 mm x 62 mm

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16

ArrayC Series

Header Signals for the ARRAYX-BOB3-16S

J2

J3

CM

F1

F5

F2

F6

F3

F7

F4

F8

CM

NC

F1

F5

F2

F6

F3

F7

F4

F8

NC

CM

F9

NC

F9

1

3

2

4

F13

F10

F14

F11

F15

F12

F16

CM

F13

F10

F14

F11

F15

F12

F16

NC

5

6

7

8

9

10

12

14

16

18

20

11

13

15

17

19

NC

CM

Sn

Not Connected

Common I/O

Standard I/O of pixel n

Fast output of pixel n

Fn

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17

ArrayC Series

ARRAYC-30035-144P-PCB (12 x 12 ARRAY OF 3 mm SMT SENSORS)

Array Size

Sensor Type

Readout

Board Size

Pixel Pitch

No. Connections

No. Connectors

2

12 x 12

30035

Pixel

50.2 x 50.2 mm

4.2 mm

320

4 x 80-way

The ARRAYC-30035-144P is comprised of 144

individual 3 mm C-Series sensors arranged in a 12 x 12

array.

The performance of the individual pixels and details of the

bias to apply can be found in the C-Series datasheet.

Connections to each sensor are provided by four Samtec

80-way connectors, type QTE-040-03-F-D-A. These

connectors mate with the Samtec QSE-040-01-F-D-A

board-to-board connector and the Samtec EQCD High

Speed Cable Assemblies. The 144 SiPM sensors have all

substrate connections (cathodes) connected together to form

a common I/O. The 80-way connectors provide connections

as follows:

• 144 x fast output

• 144 x standard I/O

• 32 x common I/O

Schematics for the ARRAYC-30035-144P-PCB

The complete ARRAYC-30035-144P-PCB CAD is available to download.

www.onsemi.com

18

ArrayC Series

Connector Schematics for the ARRAYC-30035-144P

Figure 9. Connector pin-outs for the ARRAYC-30035-144P

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19

ArrayC Series

Table 4. Connector Pin-Outs for the ARRAYC-30035-144P

J1

J2

SIGNAL

S25

F25

S14

F14

S26

F26

S27

F27

S28

F28

CM

SIGNAL

S1

SIGNAL

S61

F61

S50

F50

S62

F62

S63

F63

S64

F64

CM

SIGNAL

S37

F37

S49

F49

S38

F38

S39

F39

S51

F51

S40

F40

S41

F41

CM

1

2

1

2

F1

3

4

3

4

S13

F13

S2

5

6

5

6

7

8

7

8

9

10

12

14

16

18

20

22

24

26

28

30

32

34

36

38

40

42

44

46

48

50

52

54

56

58

60

62

64

66

68

70

72

74

76

78

80

9

10

12

14

16

18

20

22

24

26

28

30

32

34

36

38

40

42

44

46

48

50

52

54

56

58

60

62

64

66

68

70

72

74

76

78

80

F2

11

13

15

17

19

21

23

25

27

29

31

33

35

37

39

41

43

45

47

49

51

53

55

57

59

61

63

65

67

69

71

73

75

77

79

11

13

15

17

19

21

23

25

27

29

31

33

35

37

39

41

43

45

47

49

51

53

55

57

59

61

63

65

67

69

71

73

75

77

79

S3

F3

S15

F15

S4

CM

F4

CM

S17

F17

S29

F29

S30

F30

S18

F18

S19

F19

S31

F31

S32

F32

S20

F20

CM

S5

S53

F53

S65

F65

S66

F66

S54

F54

S55

F55

S67

F67

S68

F68

S56

F56

CM

F5

CM

S16

F16

S6

CM

S52

F52

S42

F42

S43

F43

S57

F57

CM

F6

S7

F7

S21

F21

CM

S8

CM

S44

F44

S45

F45

S58

F58

S46

F46

S47

F47

S60

F60

S48

F48

F8

S9

CM

F9

CM

S33

F33

S34

F34

S35

F35

S23

F23

S36

F36

S22

F22

S10

F10

S11

F11

S24

F24

S12

F12

S69

F69

S70

F70

S71

F71

S59

F59

S72

F72

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20

ArrayC Series

J3

J4

SIGNAL

1

3

5

7

S97

F97

S86

F86

S98

F98

S99

F99

S100

F100

CM

S89

2

4

6

8

S73

F73

S85

F85

S74

F74

S75

F75

S87

F87

S76

F76

S77

F77

CM

1

3

5

7

S133

F133

S122

F122

S134

F134

S135

F135

S136

F136

CM

2

4

6

8

S109

F109

S121

F121

S110

F110

S111

F111

S123

F123

S112

F112

S113

F113

CM

9

10

12

14

16

18

20

22

24

26

28

30

32

34

36

38

40

42

44

46

48

50

52

54

56

58

60

62

64

66

68

70

72

74

76

78

80

9

10

12

14

16

18

20

22

24

26

28

30

32

34

36

38

40

42

44

46

48

50

52

54

56

58

60

62

64

66

68

70

72

74

76

78

80

11

13

15

17

19

21

23

25

27

29

31

33

35

37

39

41

43

45

47

49

51

53

55

57

59

61

63

65

67

69

71

73

75

77

79

11

13

15

17

19

21

23

25

27

29

31

33

35

37

39

41

43

45

47

49

51

53

55

57

59

61

63

65

67

69

71

73

75

77

79

CM

S125

F125

S137

F137

S138

F138

S126

F126

S127

F127

S139

F139

S140

F140

S128

F128

CM

F89

S101

F101

S102

F102

S90

F90

S91

F91

S103

F103

S104

F104

S92

F92

CM

S105

F105

S106

F106

S107

F107

S95

F95

S108

F108

CM

S88

F88

S78

F78

S79

F79

S93

F93

CM

S124

F124

S114

F114

S115

F115

S129

F129

CM

S80

F80

S81

F81

S94

F94

S82

F82

S83

F83

S96

F96

S84

F84

S116

F116

S117

F117

S130

F130

S118

F118

S119

F119

S132

F132

S120

F120

CM

S141

F141

S142

F142

S143

F143

S131

F131

S144

F144

NC

CM

Sn

Not Connected

Common I/O

Standard I/O of pixel n

Fast output of pixel n

Fn

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21

ArrayC Series

ARRAYX-BOB3-144P

(ARRAYC-30035-144P Breakout Board)

The ARRAYX-BOB3-144P is an evaluation board

allowing easy access to the signals from

a

ON Semiconductor ARRAYC-30035-144P, 3 mm 12 x 12

SiPM array.

The Breakout Board is comprised of four Samtec 80-way

connectors, type QSE-040-01-F-D-A. These connectors

mate with the Samtec QTE-040-03-FD- A board-to-board

connector on the array. Since the connectors are keyed,

orientating the array on the BOB is straightforward.

All signals on the array are routed via the mating

connectors to header pins. These pins are formed by eight

50-way (25 x 2 row) 2.54 mm pitch headers.

Three SMA connectors and Balun transformers are

provided with 4-pin headers to allow any signal to be

connected directly to the SMA or via the transformer using

jumper wires. Four 7 mm holes are placed on a 25 mm grid

to allow mounting of the board on an optical breadboard.

The layout of the board is shown in Figure 10.

See Appendices A and B for examples of Breakout Board

usage.

Figure 10. Layout of the ARRAYX-BOB3-144P. The board dimensions are 112 mm x 112 mm

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22

ArrayC Series

Table 5. HEADER SIGNALS ON THE ARRAYX-BOB3-144P

J1

J2

J7

J8

1

3

5

7

2

4

6

8

CM

S25

S14

S26

S27

S28

S17

S29

S30

S18

S19

S31

S32

S20

S33

S34

S35

S23

S36

NC

CM

F25

F14

F26

F27

F28

F17

F29

F30

F18

F19

F31

F32

F20

F33

F34

F35

F23

F36

NC

CM

S52

S40

S39

S49

S54

S65

S64

S62

S61

S88

S76

S85

S75

S97

S98

S100

S101

S90

NC

CM

F52

F40

F39

F49

F54

F65

F64

F62

F61

F88

F76

F85

F75

F97

F98

F100

F101

F90

NC

CM

S1

S13

S2

S3

S15

S4

S5

S16

S6

S7

S21

S8

CM

F1

F13

F2

F3

F15

F4

F5

F16

F6

F7

F21

F8

CM

S42

S41

S51

S38

S37

S66

S53

S63

S50

S78

S77

S73

S74

S87

S86

S99

S89

S102

NC

CM

F42

F41

F51

F38

F37

F66

F53

F63

F50

F78

F77

F73

F74

F87

F86

F99

F89

F102

NC

9

10

12

14

16

18

20

22

24

26

28

30

32

34

36

38

40

11

13

15

17

19

21

23

25

27

29

31

33

35

37

39

S9

F9

S22

S10

S11

S24

S12

NC

F22

F10

F11

F24

F12

NC

J13

J15

J16

J18

1

3

5

7

2

4

6

8

CM

S43

S44

S58

S47

S48

S67

S56

S70

S59

S79

S80

S84

S83

S94

S95

S106

S92

S103

NC

CM

F43

F44

F58

F47

F48

F67

F56

F70

F59

F79

F80

F84

F83

F94

F95

F106

F92

F103

NC

CM

S57

S45

S46

S60

S55

S68

S69

S71

S72

S93

S81

S96

S82

S108

S107

S105

S104

S91

NC

CM

F57

F45

F46

F60

F55

F68

F69

F71

F72

F93

F81

F96

F82

F108

F107

F105

F104

F91

NC

S133

S122

S134

S135

S136

S125

S137

S138

S126

S127

S139

S140

S128

S141

S142

S143

S131

S144

NC

F133

F122

F134

F135

F136

F125

F137

F138

F126

F127

F139

F140

F128

F141

F142

F143

F131

F144

NC

S109

S121

S110

S111

S123

S112

S113

S124

S114

S115

S129

S116

S117

S130

S118

S119

S132

S120

NC

F109

F121

F110

F111

F123

F112

F113

F124

F114

F115

F129

F116

F117

F130

F118

F119

F132

F120

NC

9

10

12

14

16

18

20

22

24

26

28

30

32

34

36

38

40

11

13

15

17

19

21

23

25

27

29

31

33

35

37

39

NC

CM

Sn

Not Connected

Common I/O

Standard I/O of pixel n

Fast output of pixel n

Fn

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23

ArrayC Series

Biasing and Readout from the Standard Breakout

Boards

addition, each SMA has a balun transformer in close

proximity for impedance matching of the fast signals, shown

in Figure 13. To interface signals from the array to the SMA

connectors, there is a 4-pin header, shown in Figures 11 and

12. The pins are labelled; Fin, Fout, I (Inner) and O (Outer).

The purpose of the Breakout Boards is to allow easy

access to either standard or fast I/O from individual pixels

for testing purposes. It should be stressed that the breakout

boards are for evaluation purposes only and do not allow for

full readout of all pixels simultaneously.

The various Breakout Boards described in this document

have features in common. All pixel fast and standard signals

are brought out to headers. The header pins can be interfaced

with the SMA connectors with the option of routing the

signal via a balun transformer. The common I/O consists of

all of the substrate connections summed together. It is not

recommended to apply the bias to the common I/O.

The Breakout Boards are each shipped with 3 x shunt

jumpers and 6 x 10 cm wire cables (3 x red, 3 x black) with

crimp sockets at each end.

• Fin provides the input to the balun transformer.

• Fout is the output of the balun transformer.

• I provides direct connection to the inner part of the

SMA connector.

• O provides direct connection to the outer part of the

SMA connector.

Balun Transformer

The Balun transformer (RFMD RFXF9503) allows

impedance matching of the fast output signal to the readout

electronics. For a customer considering their own design,

the Balun is not required if the readout amplifiers are placed

in close proximity to the sensor pixels of the array.

For optimized timing performance, the impedance

matching and signal propagation from the SiPM sensor to

the readout electronics must be carefully considered.

All header pins are suitable for use with wire wrapping in

addition to the jumpers and crimp socket leads supplied.

The ‘NC’ signals are unconnected pins that can be used for

prototyping.

SMA Connector

Each Breakout Board has three SMA connectors that can

be used for supplying bias voltage and accessing signals. In

Figure 11. (right) photo and (left) schematic of the BOB SMA, balun transformer and

4-pin header arrangement.

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24

ArrayC Series

RFMD RFXF9503

JX

Fin

Fout

I

SG

SMA Output

O

SG

SG = Local signal ground

Each SMT/Balun/4 Way Header circuits has its own local signal ground

Figure 12. Schematic of the 4-pin header and balun transformer

EMI Considerations

For a system design, it is recommended that the customer

consider shielding of all lines. The readout requirements for

a SiPM are similar to that of a PMT and similar care should

be taken with both sensor types. In comparison to an APD

which has significantly lower gain than a SiPM, the SiPM

will provide much improved resistance to EMI due to the

higher gain of the SiPM sensor.

It has been shown that the EMI (Electromagnetic

Interference) can be picked up on the unshielded wires on

the BOB. It is recommended that customers who experience

excessive EMI seek to reduce the EMI in their lab, ideally

at the EMI source. If this is not possible then improved

shielding should be used. In all cases, testing of the SiPM

sensor should be performed in total darkness.

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25

ArrayC Series

APPENDIX A - EXAMPLE OF USING THE BREAKOUT BOARD TO READOUT FAST SIGNALS

The Figure 13 shows the ARRAYX-BOB6-64P set up for readout of fast signals from pixel 49

Figure 13. Example of an ARRAYC-60035-64P connected to an ARRAYX-BOB6-

64P for the readout of the fast signal from pixel 49.

Here, SMA1 is used for supplying Vbias and SMA2 for

reading out the fast output from pixel 49. In this example an

ARRAYC-60035-64P is assumed and so the “S” (standard

I/O) is the anode.

To bias the array, the inner (“I”) of SMA1 is connected to

the S49 header pin. The cathode is common to all pixels and

is connected via a “C” pin on the header to the outer (“O”)

of SMA1. Refer to Figure 1 for signal connections for the

C-Series array. Vbias is then applied to SMA1, which for an

ArrayC sensors has a negative polarity with respect to the

common cathode.

To access the fast output from pixel 49, the F49 header pin

is then connected to the Fin of SMA2. This is the input to the

balun transformer for impedance matching of the fast

signals. Fout (the output of the balun transformer) is then

connected via a shunt jumper to the inner (“I”) of SMA2,

with the outer (“O”) again connected to the common cathode

(“C”). The schematic of the balun transformer is shown in

Figure 12. The fast output from SMA2 will need

amplification if the signal amplitudes are small.

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26

ArrayC Series

APPENDIX B - EXAMPLE OF USING THE BREAKOUT BOARD TO READOUT STANDARD SIGNALS

The Figure 14 shows the ARRAYX-BOB6-64P set up for readout of standard signals (anode-cathode) from pixel 49.

−ve bias

50 ꢀ

10 nF

0 V

Figure 14. Example of an ARRAYC-60035-64P connected to an ARRAYX-BOB6-64P for the readout of

the standard (anode-cathode) signal from pixel 49 (left), with simplified readout schematic (right).

Here, SMA 1 is used for supplying Vbias and SMA2 for

reading out the standard output from pixel 49. In this

example an ARRAYC-60035-64P is assumed and so the “S”

(standard I/O) is the anode.

To bias the array, the inner (“I”) of SMA1 is connected to

the S49 (anode) header pin via a load resistor of 50 Ω. The

cathode is common to all pixels and is connected via a “C”

pin on the header to the outer (“O”) of SMA1. Vbias is then

applied to SMA1, which for an ArrayC sensors has a

negative polarity with respect to the common cathode.

To access the standard output, the S49 header pin is then

connected to the inner (“I”) of SMA2 via a decoupling

capacitor of 10 nF. The outer (“O”) of SMA 2 is again

connected to the common cathode (“C”). The standard

signal is then available from SMA2.

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27

ArrayC Series

APPENDIX C - EXAMPLE OF USING THE SUMMED BREAKOUT BOARD

The Figure 15 shows the ARRAYX-BOB6-64S set up for readout of all of the pixels summed together.

−ve bias

50 ꢀ

10 nF

0 V

Figure 15. Example of an ARRAYC-60035-64P connected to an ARRAYX-BOB6-64S for the summed

readout of all of the pixels (left), with simplified readout schematic (right).

SMA 1 is used for supplying Vbias and SMA2 for reading

out the summed standard output from all pixels in the

ARRAYC-60035-64P.

To bias the array, the inner (“I”) of SMA1 is connected to

the SM (summed anode) pin on the same header, via a load

resistor of 50 ꢀ. The cathode is also common to all pixels and

is connected via a “CM” pin to the outer (“O”) of SMA1.

Vbias is then applied to SMA1, which for an ArrayC has a

negative polarity with respect to the common.

To access the summed standard output, the second SM

header pin is then connected to the inner (“I”) of SMA2 via

a decoupling capacitor of 10 nF. The outer (“O”) of SMA2

is again connected to the common cathode (“CM”). The

summed signal is then available from SMA2.

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28

ArrayC Series

ORDERING INFORMATION

Microcell Size

(Total Number per Pixel)

Product Code

Array Size

I/O Interface

6 mm Sensor Arrays

ARRAYC-60035-4P-BGA

ARRAYC-60035-64P-PCB

3 mm Sensor ARRAYs

ARRAYC-30035-16P-PCB

ARRAYC-30035-144P-PCB

Optional Breakout Boards

ARRAYX-BOB6-64P-GEVK

ARRAYX-BOB3-16P-GEVK

ARRAYX-BOB3-144P-GEVK

2 x 2

8 x 8

BGA

35 mm (18,980 microcells)

Connector

4 x 4

Connector

35 mm (4,774 microcells)

12 x 12

Breakout board with connectors for use with the 8 x 8 arrays of 6 mm pixels

Breakout board with connectors for use with the 4 x 4 arrays of 3 mm pixels

Breakout board with connectors for use with the 12 x 12 arrays of 3 mm pixels

Optional Summed Breakout Boards

ARRAYX-BOB6-64S-GEVK

ARRAYX-BOB6-16S-GEVK

Summed breakout board for use with the 8 x 8 array of 6 mm pixels

Summed breakout board for use with the 4 x 4 array of 3 mm pixels

Evaluation Board with ARRAYC Permanently Attached

ARRAYC-60035-4P-GEVB Evaluation board with a permanently attached 2 x 2 array of 6 mm pixels

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29


型号：	ARRAYC-30035-144P-PCB
厂家：	ONSEMI
描述：	Silicon Photomultiplier (SiPM) 4-Side Scaleable Arrays
文件：	总29页 (文件大小：1551K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

ARRAYC-30035-144P-PCB [ONSEMI]

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