ARRAYJ-40035-64P-PCB

ArrayJ Series

Silicon Photomultiplier

(SiPM) High Fill-Factor

Arrays

ON Semiconductor’s range of J−Series SiPM sensors have been

used to create high fill−factor, scaleable arrays. The sensors are

mounted onto PCB boards with minimal dead space, forming arrays

with industry−leading fill factor of up to 90%.

www.onsemi.com

The back of each ArrayJ has either one or more multi−way

connectors, or a BGA (ball grid array). These allow access to the fast

output* and standard I/O from each pixel in the array, and a common

I/O from the summed substrates of the pixels.

The ArrayJ products with connectors can be used to interface with

the user’s own readout via a mating connector, or to a

ON Semiconductor Breakout Board (BOB). The BOBs allow for easy

access to the pixel signals and performance evaluation of the arrays.

ArrayJ products with the BGA can be reflow soldered to the user’s

readout boards, or purchased ready−mounted on a pinned PCB

evaluation board for easy testing. A BGA ArrayJ cannot be removed

from it’s PCB evaluation board. This contrasts with an ArrayJ with

connectors, as multiple arrays can be evaluated with a single BOB.

S1

S2

F1

F2

Common

ArrayJ Inputs and Outputs (I/O)

Figure 1 summarizes the array schematic for a portion of an ArrayJ.

Each SiPM sensor in the array has three electrical connections: fast

output, standard output and common.

Sn+1

Fn+1

Sn+2

Fn+2

The substrates (cathodes) of all sensors are summed together to

form the common I/O.

Each individual fast output and standard I/O (anode) are routed to its

own output pin.

The pixel−level performance of the sensors in the array can be found

in the J−Series datasheet.

Figure 1. Signal connections at the pixel

level on the ArrayJ products.

Table of Contents

ARRAYJ-60035-64P-PCB (8 X 8 Array of 6 mm Pixels) . . . . . . . . . . . . . . . . . . . . 2

ARRAYX-BOB6-64P (Breakout Board for the ARRAYJ-60035-64P) . . . . . . . . . 5

ARRAYX-BOB6-64S (Summed Breakout Board for the ARRAYJ-60035-64P) . . . 7

ARRAYJ-60035-4P-BGA (2 X 2 Array of 6 mm Pixels) . . . . . . . . . . . . . . . . . . . . 9

ARRAYJ-60035-4P-PCB (2 X 2 Array of 6 mm Pixels) . . . . . . . . . . . . . . . . . . . . 12

ARRAYJ-300XX-16P-PCB (4 X 4 Array of 3 mm Pixels) . . . . . . . . . . . . . . . . . . 17

ARRAYJ-BOB3-16P (ARRAYJ-300XX-16P Breakout Board) . . . . . . . . . . . . . . 19

ARRAYJ-300XX-64P-PCB (8 X 8 Array of 3 mm Pixels) . . . . . . . . . . . . . . . . . . 21

ARRAYJ-BOB3-64P (ARRAYJ-300XX-64P & ARRAYJ-40035-64P

Breakout Board) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Biasing and Readout from the Standard Breakout Boards . . . . . . . . . . . . . . . . . 27

Appendix A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

Appendix B . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

Appendix C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

ATTENTION!

Great care should be taken when disconnecting the

ArrayJ PCBs from the mating connectors, either on one

of the BOBs, or the user’s own boards.

The board should be gently levered up, working

progressively around the board to lever the PCB from the

connector a little on all sides, and then repeating the

process until the connectors are free from each other.

Use of Scintillators with the ArrayJ

Products

Please consult the Application Note on the use of

scintillators with the TSV arrays.

* The fast output is not available on the 2x2 array (ARRAYJ−60035−4P).

1

Publication Order Number:

January, 2019 − Rev. 6

ARRAYJ−SERIES/D

ArrayJ Series

ARRAYJ−60035−64P−PCB (8 X 8 Array of 6 mm Pixels)

Array Size

Sensor Type

Readout

Board Size

Pixel Pitch

No. Connections

No. Connectors

2

8 x 8

60035

Pixel

50.44 x 50.44 mm

6.33 mm

160

2 x 80−way

The ARRAYJ−60035−64P is comprised of 64 individual

6 mm J−Series sensors arranged in a 8 x 8 array.

The performance of the individual pixels and details of the

bias to apply can be found in the J−Series datasheet.

The connections to each array are provided by two Samtec

80−way connectors, type QTE−040−03−F−D−A. These

connectors mate with the Samtec QSE−040−01−F−D−A

board−to−board connector and the Samtec EQCD High

Speed Cable Assemblies. The 64 SiPM pixels all have

substrate connections (cathode) summed to form a common

I/O. The 80−way connectors provide connections as

follows:

• 64 x fast output

• 64 x standard I/O

• 32 x common I/O

• 16 x shield contacts to the Common

ARRAYJ−60035−64P Board Drawing

1

8

J1

J2

64

57

The complete ARRAYJ−60035−64P−PCB CAD is available to download.

www.onsemi.com

2

ArrayJ Series

Connector Schematic for the ARRAYJ−60035−64P−PCB

Figure 2. Connector schematic for the ARRAYJ−60035−64P

The connector location and array pixel numbering is indicated on the array schematics on the previous page.

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3

ArrayJ Series

Table 1. CONNECTOR PIN−OUTS FOR THE ARRAYJ−60035−64P−PCB

J1

J2

SIGNAL

1

S17

F17

S25

F25

S18

F18

S26

F26

S19

F19

S27

F27

S20

F20

S28

F28

CM

2

S1

F1

1

S49

F49

S57

F57

S50

F50

S58

F58

S51

F51

S59

F59

S52

F52

S60

F60

CM

2

S33

F33

S41

F41

S34

F34

S42

F42

S35

F35

S43

F43

S36

F36

S44

F44

CM

3

4

3

4

5

6

S9

5

6

7

8

F9

7

8

9

10

12

14

16

18

20

22

24

26

28

30

32

34

36

38

40

42

44

46

48

50

52

54

56

58

60

62

64

66

68

70

72

74

76

78

80

S2

9

10

12

14

16

18

20

22

24

26

28

30

32

34

36

38

40

42

44

46

48

50

52

54

56

58

60

62

64

66

68

70

72

74

76

78

80

11

13

15

17

19

21

23

25

27

29

31

33

35

37

39

41

43

45

47

49

51

53

55

57

59

61

63

65

67

69

71

73

75

77

79

F2

11

13

15

17

19

21

23

25

27

29

31

33

35

37

39

41

43

45

47

49

51

53

55

57

59

61

63

65

67

69

71

73

75

77

79

S10

F10

S3

F3

S11

F11

S4

F4

S12

F12

CM

S5

CM

S21

F21

S29

F29

S22

F22

S30

F30

S23

F23

S31

F31

S24

F24

S32

F32

CM

S53

F53

S61

F61

S54

F54

S62

F62

S55

F55

S63

F63

S56

F56

S64

F64

CM

S37

F37

S45

F45

S38

F38

S46

F46

S39

F39

S47

F47

S40

F40

S48

F48

CM

F5

S13

F13

S6

F6

S14

F14

S7

F7

S15

F15

S8

F8

S16

F16

CM

Sn

Fn

Common I/O

Standard I/O of pixel n

Fast output of pixel n

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4

ArrayJ Series

ARRAYX−BOB6−64P (Breakout Board for the

ARRAYJ−60035−64P)

7 mm holes are aligned on a 25 mm grid to allow mounting

of the board on an optical breadboard.

See Appendices A and B for examples of Breakout Board

usage.

The ARRAYX−BOB6−64P is an evaluation board

allowing easy access to all the signals of

a

ON Semiconductor ARRAYJ−60035−64P, 6 mm 8 x 8 TSV

SiPM array.

The Breakout Board features two Samtec 80−way

connectors, type QSE−040−01−F−D−A. These connectors

mate with the Samtec QTE−040−03−F−D−A board−to−

board connector on the array. Since the connectors are

keyed, orientating the array on the BOB is straight−forward.

All signals on the array are routed via the mating

connectors to header pins. These pins are formed of four

50−way (25 x 2 row) 2.54 mm pitch headers; J3, J4, J5 and

J6. Each of the four headers also has 8 pins left unconnected

to allow prototyping for evaluation purposes.

The three SMA connectors on the board can be connected

via the supplied jumper cable to any of the array header pins

and used for accessing signals or suppling bias voltage. Four

Figure 3. Layout of the ARRAYX−BOB6−64P. The dimensions of the board are 112 mm x 112 mm.

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5

ArrayJ Series

Table 2. HEADER SIGNALS ON THE ARRAYX−BOB6−64P

J3

J4

J5

J6

NC

CM

F1

NC

CM

S1

NC

1

2

3

4

CM

F49

F57

F50

F58

F51

F59

F52

F60

CM

F53

F61

F54

F62

F55

F63

F56

F64

CM

NC

CM

S49

S57

S50

S58

S51

S59

S52

S60

CM

S53

S61

S54

S62

S55

S63

S56

S64

CM

NC

CM

F17

F25

F18

F26

F19

F27

F20

F28

CM

F33

F41

F34

F42

F35

F43

F36

F44

CM

NC

CM

S17

S25

S18

S26

S19

S27

S20

S28

CM

S33

S41

S34

S42

S35

S43

S36

S44

CM

NC

CM

F21

F29

F22

F30

F23

F31

F24

F32

CM

F37

F45

F38

F46

F39

F47

F40

F48

CM

NC

CM

S21

S29

S22

S30

S23

S31

S24

S32

CM

S37

S45

S38

S46

S39

S47

S40

S48

CM

NC

5

6

7

8

9

10

12

14

16

18

20

22

24

26

28

30

32

34

36

38

40

42

44

46

48

50

F9

S9

11

13

15

17

19

21

23

25

27

29

31

33

35

37

39

41

43

45

47

49

F2

S2

F10

F3

S10

S3

F11

F4

S11

S4

F12

CM

F5

S12

CM

S5

F13

F6

S13

S6

F14

F7

S14

S7

F15

F8

S15

S8

F16

CM

NC

S16

CM

NC

CM

Sn

Not Connected

Common I/O

Standard I/O of pixel n

Fast output of pixel n

Fn

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6

ArrayJ Series

ARRAYX−BOB6−64S (Summed Breakout Board for the

ARRAYJ−60035−64P)

These pins are formed of four 50−way (25 x 2 row) 2.54 mm

pitch headers; J3, J4, J5 and J6. Each of the four headers also

has 10 pins that connect to the common cathode (CM) and

8 pins left unconnected (NC) to allow prototyping for

evaluation purposes.

Two SMA connectors and Balun transformers are

provided with 4−pin headers to allow any fast signal to be

connected directly to the SMA or via the transformer using

jumper wires.

Summed output: A summed output (the anodes of pixels

1 to 64 connected together) is routed to jumper pins (SM) in

close proximity to a third SMA connector. Four 7 mm holes

are placed on a 25 mm grid to allow mounting of the board

on an optical breadboard.

The ARRAYX−BOB6−64S is an evaluation board

allowing easy access to the sum of all of standard pixel

signals of a ON Semiconductor ARRAYJ− 60035−64P,

6 mm 8 x 8 TSV array, in addition to all of the individual fast

output signals. The Breakout Board features two Samtec

80−way connectors, type QSE−040−01−F−D−A. These

connectors mate with the Samtec QTE−040−03−F−D−A

board−toboard connector on the array. Since the connectors

are keyed, orientating the array on the BOB is

straightforward. A schematic of the board is shown in

Figure 4 below.

Fast signals: All of the fast output signals (Fn) from the

array are routed via the mating connectors to header pins.

See Appendix C for an example of the use of the summed

BOB.

Figure 4. Layout of the ARRAYX−BOB6−64P. The dimensions of the board are 112 mm x 112 mm.

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7

ArrayJ Series

Table 3. HEADER SIGNALS ON THE ARRAYX−BOB6−64S

J3

J4

J5

J6

CM

NC

F1

CM

NC

F1

CM

NC

CM

NC

CM

NC

CM

NC

CM

NC

CM

NC

1

2

3

4

5

6

NC

7

8

F49

F57

F50

F58

F51

F59

F52

F60

CM

F53

F61

F54

F62

F55

F63

F56

F64

NC

F49

F57

F50

F58

F51

F59

F52

F60

CM

F53

F61

F54

F62

F55

F63

F56

F64

NC

F17

F25

F18

F26

F19

F27

F20

F28

CM

F33

F41

F34

F42

F35

F43

F36

F44

NC

F17

F25

F18

F26

F19

F27

F20

F28

CM

F33

F41

F34

F42

F35

F43

F36

F44

NC

F21

F29

F22

F30

F23

F31

F24

F32

CM

F37

F45

F38

F46

F39

F47

F40

F48

NC

F21

F29

F22

F30

F23

F31

F24

F32

CM

F37

F45

F38

F46

F39

F47

F40

F48

NC

9

10

12

14

16

18

20

22

24

26

28

30

32

34

36

38

40

42

44

46

48

50

F9

11

13

15

17

19

21

23

25

27

29

31

33

35

37

39

41

43

45

47

49

F2

F10

F3

F10

F3

F11

F4

F11

F4

F12

CM

F5

F12

CM

F5

F13

F6

F13

F6

F14

F7

F14

F7

F15

F8

F15

F8

F16

NC

CM

F16

NC

CM

NC

CM

NC

CM

Fn

Not Connected

Common I/O

Fast output of pixel n

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8

ArrayJ Series

ARRAYJ−60035−4P−BGA (2 X 2 Array of 6 mm Pixels)

Array Size

Sensor Type

Readout

Board Size

Pixel Pitch

No. Connections

No. Connectors

2

2 x 2

60035

Pixel

12.64 x 12.64 mm

6.33 mm

9

3 x 3 BGA

The ARRAYJ−60035−4P is comprised of 4 individual

6 mm J−Series sensors arranged in a 2 x 2 array.

The performance of the individual pixels and details of the

bias to apply can be found in the J−Series datasheet.

Connections to each sensor are provided by a BGA (ball

grid array). The BGA can be reflow soldered onto the user’s

own readout board.

The 4 SiPM sensors have all substrate connections

(cathodes) connected together to form a common I/O. The

3 x 3 BGA provides connections as follows:

• 4 x standard I/O

• 5 x common I/O

• There is NO fast output

ARRAYJ−60035−4P−BGA Board Dimensions and Pin Location

A

B

C

3

2

1

The complete ARRAYJ−60035−4P−BGA CAD and solder footrprint is available to download.

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9

ArrayJ Series

BGA Connections for the ARRAYJ−60035−4P−BGA

The fiducial is indicated in the image below. It marks the

location of both pin A1 and pixel 1.

Pin. No

A1

Function

Anode 1

A2

Anode 2

A3

Common Cathode

Anode 3

B1

B2

Anode 4

B3

Common Cathode

Fiducial

C1

C2

C3

ARRAYJ−60035−4P−BGA − Solder Footprint and

Reflow Solder Profile

for recommendation based upon placement accuracy

capability.

Solder paste (ON Semiconductor recommend using

no−clean solder paste) must be evenly applied to each

soldering pad to insure proper bonding and positioning of

the array. After soldering, allow at least three minutes for the

component to cool to room temperature before further

operations.

Solder reflow conditions must be in compliance with

J−STD−20, table 5.2. This is summarized in Figure 6. The

number of passes should not be more than 2.

The BGA package is compatible with standard reflow

solder processes (J−STD−20) and so is ideal for

high−volume manufacturing.

The ARRAYJ−60035−4P−BGA should be mounted

according to specified soldering pad patterns, as shown in

Figure 5 and in the CAD file which can be downloaded here.

The solder pads may be oversized to ease placement of the

carrier on the PCB. Consult with your contract manufacturer

Figure 5. Recommended solder footprint for use with the ARRAYJ−60035−4P−BGA

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10

ArrayJ Series

Solder Reflow Profile

300

250

200

150

100

50

Max 10 s at 260°C

Max 6°C/s

Max 260°C

217°C

Max 4°C/s

180°C

60~100 s

60 to 120 s

0

50

100

150

200

250

300

Time (s)

Figure 6. Solder reflow profile. Conditions must be in compliance with J−STD−20, table 5.2.

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11

ArrayJ Series

ARRAYJ−60035−4P−PCB (2 x 2 Array of 6 mm Pixels)

The ARRAYJ−60035−4P−PCB is an evaluation board

allowing easy access to the signals of

a

ARRAYJ−60035−4P−BGA via pins.

The ARRAYJ−60035−4P−PCB has the array on the front

and pins on the back of the PCB. The pins are compatible

with a standard 8−pin DIL socket for evaluation purposes.

Alternatively, the pins can be directly soldered into

through−holes in the user’s readout PCB. Four of the pins are

connected to the anodes of the individual pixels and the other

four pins are connected to the common cathode. An example

mating 8−pin DIL socket is the 110−93−308−41−001000

from Mill−Max.

The ARRAYJ−60035−4P−PCB does NOT provide access

to the fast output.

ARRAYJ−60035−4P−PCB Pin−Outs

Pin. No

Function

Anode 1

1

2

3

4

5

6

7

8

Common Cathode

Anode 3

Common Cathode

Anode 4

Common Cathode

Anode 2

The location of the pin 1 indicator is shown on the image

on the right.

ARRAYJ−60035−4P−PCB Board Dimensions and Pin Locations

The complete ARRAYJ−60035−4P−PCB CAD is available to download.

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12

ArrayJ Series

ARRAYJ−40035−64P−PCB (8 X 8 Array of 4 mm Pixels)

Array Size

Sensor Type

Readout

Board Size

Pixel Pitch

No. Connections

No. Connectors

2

8 x 8

40035

Pixel

33.4 x 33.4 mm

4.2 mm

160

2 x 80−way

The ARRAYJ−40035−64P is comprised of 64 individual

4 mm J−Series sensors arranged in a 8 x 8 array. The

performance of the individual pixels and details of the bias

to apply can be found in the J−Series datasheet.

Connections to each sensor are provided by two Hirose

80−way connectors, type DF17(2.0)−80DP−0.5v(57).

These connectors mate with the Hirose DF17(2.0)−80DS−

0.5v(57) board−to−board connectors. The 64 SiPM sensors

have all substrate connections (cathodes) connected

together to form a common I/O. The 2 x 80−way connectors

provide connections as follows:

• 64 x fast output

• 64 x standard I/O

• 32 x common I/O

• 4 x shield contacts to the Common

ARRAYJ−40035−64P Breakout Board

The breakout board for the ARRAYJ−40035−64P−PCB is

the same as for the ARRAYJ−300XX−64P−PCB: the

ARRAYJ−BOB3−64P. Please see page 25 for details.

ARRAYJ−40035−64P−PCB Board Drawing

The complete ARRAYJ−40035−64P−PCB CAD is available to download.

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13

ArrayJ Series

Connector Schematics for the ARRAYJ−40035−64P

Figure 7. Schematic of the ARRAYJ−40035−64P connectors.

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14

ArrayJ Series

Figure 8. Highlighting the location of the connector, pin and array pixel numbering on the ARRAYJ−40035−64P.

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15

ArrayJ Series

Table 4. CONNECTOR PIN−OUTS FOR THE ARRAYJ−40035−64P

J1

J2

SIGNAL

S9

SIGNAL

S1

SIGNAL

S41

F41

CM

SIGNAL

S33

F33

S42

F42

CM

1

2

1

2

F9

F1

3

4

3

4

CM

S2

S10

F10

CM

S3

5

6

5

6

S34

F34

S43

F43

CM

7

8

7

8

F2

9

10

12

14

16

18

20

22

24

26

28

30

32

34

36

38

40

42

44

46

48

50

52

54

56

58

60

62

64

66

68

70

72

74

76

78

80

9

10

12

14

16

18

20

22

24

26

28

30

32

34

36

38

40

42

44

46

48

50

52

54

56

58

60

62

64

66

68

70

72

74

76

78

80

S11

F11

CM

S4

S35

F35

S44

F44

CM

11

13

15

17

19

21

23

25

27

29

31

33

35

37

39

41

43

45

47

49

51

53

55

57

59

61

63

65

67

69

71

73

75

77

79

11

13

15

17

19

21

23

25

27

29

31

33

35

37

39

41

43

45

47

49

51

53

55

57

59

61

63

65

67

69

71

73

75

77

79

F3

S12

F12

CM

S5

S36

F36

S45

F45

CM

F4

S13

F13

CM

S6

S37

F37

S46

F46

CM

F5

S14

F14

CM

S7

S38

F38

S47

F47

CM

F6

S15

F15

CM

S8

S39

F39

S48

F48

CM

F7

S16

F16

CM

F24

S24

CM

F31

S31

F22

S22

CM

F29

S29

F20

S20

CM

F27

S27

F18

S18

CM

F25

S25

S40

F40

CM

F8

CM

F32

S32

F23

S23

CM

F30

S30

F21

S21

CM

F28

S28

F19

S19

CM

F26

S26

F17

S17

F56

S56

CM

F64

S64

F55

S55

CM

F63

S63

F54

S54

CM

F62

S62

F53

S53

CM

F61

S61

F52

S52

CM

F60

S60

F51

S51

CM

F59

S59

F50

S50

CM

F58

S58

F49

S49

F57

S57

CM

Sn

Fn

Common I/O

Standard I/O of pixel n

Fast output of pixel n

www.onsemi.com

16

ArrayJ Series

ARRAYJ−300XX−16P−PCB (4 X 4 Array of 3 mm Pixels)

Array Size

Sensor Type

30035

Readout

Board Size

Pixel Pitch

No. Connections

No. Connectors

2

4 x 4

Pixel

13.24 x 13.24 mm

3.36 mm

40

2 x 20−way

30020

The ARRAYJ−300XX−16P is comprised of 16 individual

3 mm J−Series sensors arranged in a 4 x 4 array. There are

two types: The ARRAYJ−30035−16P has pixels which are

formed of 35 um microcells, and the ARRAYJ−30020−16P

has pixels that are formed of 20 um microcells.

The performance of the individual pixels and details of the

bias to apply can be found in the J−Series datasheet.

Connections to each sensor are provided by two 20−way

Hirose plug−type board−to−board connectors, DF17(2.0)−

20DP−0.5V(57). These connectors mate with the Hirose

DF17(3.0)−20DS−0.5V(57). The 16 SiPM pixels have all

substrates (cathodes) connected together to form a common

I/O. The 20−way connector provides connections as

follows:

• 16 x fast output

• 16 x standard I/O

• 8 x common I/O

• 4 x shield contacts to the Common

ARRAYJ−300XX−16P−PCB Board Drawing

The complete ARRAYJ−300XX−16P−PCB CAD is available to download.

www.onsemi.com

17

ArrayJ Series

Connector Schematic for the ARRAYJ−300XX−16P−PCB

Figure 9. Connector pin−outs for the ARRAYJ−300XX−16P (left), and the location of the connectors (right).

Connector Schematic for the ARRAYJ−300XX−16P−PCB

The array pixel numbering is indicated on the drawing on the previous page.

J1

J2

SIGNAL

S2

SIGNAL

F1

SIGNAL

S9

SIGNAL

F9

1

3

2

1

3

2

S1

F2

S10

S11

CM

F10

F11

4

S3

F3

5

6

5

6

CM

F4

CM

S4

CM

7

8

7

8

S12

F16

CM

F12

S16

CM

9

10

12

14

16

18

20

9

10

12

14

16

18

20

F8

S8

11

13

15

17

19

11

13

15

17

19

CM

F7

CM

S7

F15

F14

S13

S15

S14

F13

F6

S6

S5

F5

CM

Common I/O

Sn

Fn

Standard I/O of pixel n

Fast output of pixel n

www.onsemi.com

18

ArrayJ Series

ARRAYJ−BOB3−16P (ARRAYJ−300XX−16P Breakout

Board)

routed via the mating connectors to header pins. These pins

are formed by two 20−way (10 x 2 row) 2.54 mm pitch

headers.

Three SMA connectors and Balun transformers are

provided with 4−pin headers to allow any signal to be

connected directly to the SMA or via the transformer using

jumper wires. Four 7 mm holes are aligned on a 25 mm grid

to allow mounting of the board on an optical breadboard.

See Appendices A and B for examples of Breakout Board

usage.

The ARRAYJ−BOB3−16P is an evaluation board

allowing easy access to the signals from

ON Semiconductor ARRAYJ−300XX−16P, 3 mm 4 x 4

SiPM array.

The Breakout Board has two HIROSE 20−way

connectors DF17(3.0)−20DS−0.5v(57). These connectors

mate with the Samtec DF17(2.0)−20DP−0.5v(57) board−

to−board connectors on the array. All signals on the array are

a

Figure 10. Layout of the ARRAYJ−BOB3−16P. Note that the array corner pixel numbers are shown on the

silkscreen of the PCB to ensure correct orientation of the array.

www.onsemi.com

19

ArrayJ Series

Header Signals for the ARRAYX−BOB3−16P

J2

J3

CM

S1

S5

S2

S6

S3

S7

S4

S8

NC

CM

F1

CM

S9

CM

F9

1

3

2

4

F5

S13

S10

S14

S11

S15

S12

S16

NC

F13

F10

F14

F11

F15

F12

F16

NC

5

6

F2

7

8

F6

9

10

12

14

16

18

20

F3

11

13

15

17

19

F17

F4

F6

NC

CM

Sn

Not Connected

Common I/O

Standard I/O of pixel n

Fast output of pixel n

Fn

www.onsemi.com

20

ArrayJ Series

ARRAYJ−300XX−64P−PCB (8 X 8 Array of 3 mm Pixels)

Array Size

Sensor Type

30035

Readout

Board Size

Pixel Pitch

No. Connections

No. Connectors

2

8 x 8

Pixel

26.68 x 26.68 mm

3.36 mm

160

2 x 80−way

30020

The ARRAYJ−300XX−64P is comprised of 64 individual

3 mm J−Series sensors arranged in a 8 x 8 array. There are

two types: The ARRAYJ−30035−64P has pixels which are

formed of 35 um microcells, and the ARRAYJ−30020−64P

has pixels that are formed of 20 um microcells.

The performance of the individual pixels and details of the

bias to apply can be found in the J−Series datasheet.

Connections to each sensor are provided by two Hirose

80−way connectors, type DF17(2.0)−80DP−0.5v(57).

These connectors mate with the Hirose DF17(2.0)−

80DS−0.5v(57) board−to−board connectors. The 64 SiPM

sensors have all substrate connections (cathodes) connected

together to form a common I/O. The 2 x 80−way connectors

provide connections as follows:

• 64 x fast output

• 64 x standard I/O

• 32 x common I/O

• 4 x shield contacts to the Common

ARRAYJ−300XX−64P−PCB Board Drawing

The complete ARRAYJ−300XX−64P−PCB CAD is available to download.

www.onsemi.com

21

ArrayJ Series

Connector Schematics for the ARRAYJ−300XX−64P

Figure 11. Schematic of the ARRAYJ−300XX−64P connectors.

www.onsemi.com

22

ArrayJ Series

Figure 12. Highlighting the location of the connector, pin and array pixel numbering on the ARRAYJ−300XX−64P.

www.onsemi.com

23

ArrayJ Series

Table 5. CONNECTOR PIN−OUTS FOR THE ARRAYJ−300XX−64P

J1

J2

SIGNAL

S9

SIGNAL

S1

SIGNAL

S41

F41

CM

SIGNAL

S33

F33

S42

F42

CM

1

2

1

2

F9

F1

3

4

3

4

CM

S2

S10

F10

CM

S3

5

6

5

6

S34

F34

S43

F43

CM

7

8

7

8

F2

9

10

12

14

16

18

20

22

24

26

28

30

32

34

36

38

40

42

44

46

48

50

52

54

56

58

60

62

64

66

68

70

72

74

76

78

80

9

10

12

14

16

18

20

22

24

26

28

30

32

34

36

38

40

42

44

46

48

50

52

54

56

58

60

62

64

66

68

70

72

74

76

78

80

S11

F11

CM

S4

S35

F35

S44

F44

CM

11

13

15

17

19

21

23

25

27

29

31

33

35

37

39

41

43

45

47

49

51

53

55

57

59

61

63

65

67

69

71

73

75

77

79

11

13

15

17

19

21

23

25

27

29

31

33

35

37

39

41

43

45

47

49

51

53

55

57

59

61

63

65

67

69

71

73

75

77

79

F3

S12

F12

CM

S5

S36

F36

S45

F45

CM

F4

S13

F13

CM

S6

S37

F37

S46

F46

CM

F5

S14

F14

CM

S7

S38

F38

S47

F47

CM

F6

S15

F15

CM

S8

S39

F39

S48

F48

CM

F7

S16

F16

CM

F24

S24

CM

F31

S31

F22

S22

CM

F29

S29

F20

S20

CM

F27

S27

F18

S18

CM

F25

S25

S40

F40

CM

F8

CM

F32

S32

F23

S23

CM

F30

S30

F21

S21

CM

F28

S28

F19

S19

CM

F26

S26

F17

S17

F56

S56

CM

F64

S64

F55

S55

CM

F63

S63

F54

S54

CM

F62

S62

F53

S53

CM

F61

S61

F52

S52

CM

F60

S60

F51

S51

CM

F59

S59

F50

S50

CM

F58

S58

F49

S49

F57

S57

CM

Sn

Fn

Common I/O

Standard I/O of pixel n

Fast output of pixel n

www.onsemi.com

24

ArrayJ Series

ARRAYJ−BOB3−64P (ARRAYJ−300XX−64P &

ARRAYJ−40035−64P Breakout Board)

All signals on the array are routed via the mating

connectors to header pins. These pins are formed by four

32−way (16 x 2 row) 2.54 mm pitch headers. Four additional

header pin−pairs are provided for connection to the

Common.

Three SMA connectors and Balun transformers are

provided with 4−pin headers to allow any signal to be

connected directly to the SMA or via the transformer using

jumper wires. Four 7 mm holes are placed on a 25 mm grid

to allow mounting of the board on an optical breadboard.

See Appendices A and B for examples of Breakout Board

usage.

The ARRAYJ−BOB3−64P is an evaluation board

allowing easy access to the signals from either a

ON Semiconductor ARRAYJ−300XX−64P (3 mm pixel

8 x 8

SiPM

array)

or

a

ON Semiconductor

ARRAYJ−40035−64P (4mm pixel, 8 x 8 SiPM array).

The Breakout Board has two Hirose 80−way connectors,

type DF17(3.0)−80DS−0.5v(57). These connectors mate

with the Hirose DF17(3.0)−80DP−0.5v(57) board−to−board

connector on the array.

Figure 13. Layout of the ARRAYJ−BOB3−64P. Note that the array corner pixel numbers are shown on the

silkscreen of the PCB to ensure correct orientation of the array.

www.onsemi.com

25

ArrayJ Series

Header Signals for the ARRAYJ−BOB3−64P

J3

J4

J5

J6

S9

S1

F9

F1

S57

S49

S58

S50

S59

S51

S60

S52

S61

S53

S62

S54

S63

S55

S64

S56

F57

F49

F58

F50

F59

F51

F60

F52

F61

F53

F62

F54

F63

F55

F64

F56

S25

S17

S26

S18

S27

S19

S28

S20

S41

S33

S42

S34

S43

S35

S44

S36

F25

F17

F26

F18

F27

F19

F28

F20

F41

F33

F42

F34

F43

F35

F44

F36

S29

S21

S30

S22

S31

S23

S32

S24

S45

S37

S46

S38

S47

S39

S48

S40

F29

F21

F30

F22

F31

F23

F32

F24

F45

F37

F46

F38

F47

F39

F48

F40

1

2

3

4

S10

S2

F10

F2

5

6

7

8

S11

S3

F11

F3

9

10

12

14

16

18

20

22

24

26

28

30

32

11

13

15

17

19

21

23

25

27

29

31

S12

S4

F12

F4

S13

S5

F13

F5

S14

S6

F14

F6

S15

S7

F15

F7

S16

S8

F16

F8

Sn

Fn

Standard I/O of pixel n

Fast output of pixel n

www.onsemi.com

26

ArrayJ Series

Biasing and Readout from the Standard Breakout

Boards

addition, each SMA has a balun transformer in close

proximity for impedance matching of the fast signals, shown

in Figure 13. To interface signals from the array to the SMA

connectors, there is a 4−pin header, shown in Figure 12. The

pins are labelled; Fin, Fout, I (Inner) and O (Outer).

The purpose of the Breakout Boards is to allow easy

access to either standard or fast I/O from individual pixels

for testing purposes. It should be stressed that the breakout

boards are for evaluation purposes only and do not allow for

full readout of all pixels simultaneously.

The various Breakout Boards described in this document

have features in common. All pixel fast and standard signals

are brought out to headers. The header pins can be interfaced

with the SMA connectors with the option of routing the

signal via a balun transformer. The common I/O consists of

all of the substrate connections summed together. It is not

recommended to apply the bias to the common I/O.

The Breakout Boards are each shipped with 3 x shunt

jumpers and 6 x 10 cm wire cables (3 x red, 3 x black) with

crimp sockets at each end.

• Fin provides the input to the balun transformer.

• Fout is the output of the balun transformer.

• I provides direct connection to the inner part of the

SMA connector.

• O provides direct connection to the outer part of the

SMA connector.

Balun Transformer

The Balun transformer (RFMD RFXF9503) allows

impedance matching of the fast output signal to the readout

electronics. For a customer considering their own design,

the Balun is not required if the readout amplifiers are placed

in close proximity to the sensor pixels of the array.

For optimized timing performance, the impedance

matching and signal propagation from the SiPM sensor to

the readout electronics must be carefully considered.

All header pins are suitable for use with wire wrapping in

addition to the jumpers and crimp socket leads supplied.

The ‘NC’ signals are unconnected pins that can be used for

prototyping.

SMA Connector

Each Breakout Board has three SMA connectors that can

be used for supplying bias voltage and accessing signals. In

Figure 14. (right) photo and (left) schematic of the BOB SMA, balun transformer and

4−pin header arrangement.

www.onsemi.com

27

ArrayJ Series

RFMD RFXF9503

JX

Fin

Fout

I

SG

SMA Output

O

SG

SG = Local signal ground

Each SMT/Balun/4 Way Header circuits has its own local signal ground

Figure 15. Schematic of the 4−pin header and balun transformer

EMI Considerations

For a system design, it is recommended that the customer

consider shielding of all lines. The readout requirements for

a SiPM are similar to that of a PMT and similar care should

be taken with both sensor types. In comparison to an APD

which has significantly lower gain than a SiPM, the SiPM

will provide much improved resistance to EMI due to the

higher gain of the SiPM sensor.

It has been shown that the EMI (Electromagnetic

Interference) can be picked up on the unshielded wires on

the BOB. It is recommended that customers who experience

excessive EMI seek to reduce the EMI in their lab, ideally

at the EMI source. If this is not possible then improved

shielding should be used. In all cases, testing of the SiPM

sensor should be performed in total darkness.

www.onsemi.com

28

ArrayJ Series

APPENDIX A − EXAMPLE OF USING THE BREAKOUT BOARD TO READOUT FAST SIGNALS

The Figure 16 shows the ARRAYX−BOB6−64P set up for readout of fast signals from pixel 49

Figure 16. Example of an ARRAYJ−60035−64P connected to an ARRAYX−BOB6−

64P for the readout of the fast signal from pixel 49.

Here, SMA1 is used for supplying Vbias and SMA2 for

reading out the fast output from pixel 49. In this example an

ARRAYJ−60035−64P is assumed and so the “S” (standard

I/O) is the anode.

To bias the array, the inner (“I”) of SMA1 is connected to

the S49 header pin. The cathode is common to all pixels and

is connected via a “C” pin on the header to the outer (“O”)

of SMA1. Refer to Figure 1 for signal connections for the

J−Series array. Vbias is then applied to SMA1, which for an

ArrayJ sensors has a negative polarity with respect to the

common cathode.

To access the fast output from pixel 49, the F49 header pin

is then connected to the Fin of SMA2. This is the input to the

balun transformer for impedance matching of the fast

signals. Fout (the output of the balun transformer) is then

connected via a shunt jumper to the inner (“I”) of SMA2,

with the outer (“O”) again connected to the common cathode

(“C”). The schematic of the balun transformer is shown in

Figure 15. The fast output from SMA2 will need

amplification if the signal amplitudes are small.

www.onsemi.com

29

ArrayJ Series

APPENDIX B − EXAMPLE OF USING THE BREAKOUT BOARD TO READOUT STANDARD SIGNALS

The Figure 17 shows the ARRAYX−BOB6−64P set up for readout of standard signals (anode−cathode) from pixel 49.

−ve bias

50 ꢀ

10 nF

0 V

Figure 17. Example of an ARRAYJ−60035−64P connected to an ARRAYX−BOB6−

64P for the readout of the fast signal from pixel 49.

Here, SMA 1 is used for supplying Vbias and SMA2 for

reading out the standard output from pixel 49. In this

example an ARRAYJ−60035−64P is assumed and so the “S”

(standard I/O) is the anode.

To bias the array, the inner (“I”) of SMA1 is connected to

the S49 (anode) header pin via a load resistor of 50 Ω. The

cathode is common to all pixels and is connected via a “C”

pin on the header to the outer (“O”) of SMA1. Vbias is then

applied to SMA1, which for an ArrayJ sensors has a negative

polarity with respect to the common cathode.

To access the standard output, the S49 header pin is then

connected to the inner (“I”) of SMA2 via a decoupling

capacitor of 10nF. The outer (“O”) of SMA 2 is again

connected to the common cathode (“C”). The standard

signal is then available from SMA2.

www.onsemi.com

30

ArrayJ Series

APPENDIX C − EXAMPLE OF USING THE SUMMED BREAKOUT BOARD

The Figure 18 shows the ARRAYX−BOB6−64S set up for readout of all of the pixels summed together.

−ve bias

50 ꢀ

10 nF

0 V

Figure 18. Example of an ARRAYJ−60035−64P connected to an ARRAYX−BOB6−64S

for the summed readout of all of the pixels.

SMA 1 is used for supplying Vbias and SMA2 for reading

out the summed standard output from all pixels in the

ARRAYJ−60035−64P.

To bias the array, the inner (“I”) of SMA1 is connected to

the SM (summed anode) pin on the same header, via a load

resistor of 50 ꢀ. The cathode is also common to all pixels and

is connected via a “CM” pin to the outer (“O”) of SMA1.

Vbias is then applied to SMA1, which for an ArrayJ has a

negative polarity with respect to the common.

To access the summed standard output, the second SM

header pin is then connected to the inner (“I”) of SMA2 via

a decoupling capacitor of 10nF. The outer (“O”) of SMA2

is again connected to the common cathode (“CM”). The

summed signal is then available from SMA2.

www.onsemi.com

31

ArrayJ Series

ORDERING INFORMATION

Microcell Size

(Total Number per Pixel)

Product Code

6 mm Sensor Arrays

Array Size

I/O Interface

ARRAYJ−60035−4P−BGA

ARRAYJ−60035−64P−PCB

4 mm Sensor Arrays

2 x 2

8 x 8

BGA

35 mm

(22,292 microcells)

Connector

ARRAYJ−40035−64P−PCB

35 mm

(9,260 microcells)

8 x 8

Connector

3 mm Sensor Arrays

ARRAYJ−30035−16P−PCB

ARRAYJ−30035−64P−PCB

ARRAYJ−30020−16P−PCB

ARRAYJ−30020−64P−PCB

Optional Breakout Boards

ARRAYX−BOB6−64P−GEVK

ARRAYJ−BOB3−16P−GEVK

ARRAYJ−BOB3−64P−GEVK

4 x 4

8 x 8

4 x 4

8 x 8

Connector

35 mm

(5,676 microcells)

20 mm

(14,850 microcells)

Breakout board for use with the ARRAYJ−60035−64P−PCB

Breakout board for use with the ARRAYJ−300XX−16P−PCB

Breakout board for use with the ARRAYJ−300XX−64P−PCB & ARRAYJ−40035−64P−PCB

Optional Summed Breakout Boards

ARRAYX−BOB6−64S−GEVK

Summed breakout board for use with the ARRAYJ−60035−64P−PCB

Evaluation Board with ARRAYJ Permanently Attached

ARRAYJ−60035−4P−PCB

Evaluation board with a permanently attached ARRAYJ−60035−4P−BGA and output pins

SensL is a registered trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.

ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.

ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent

coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.

ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability

arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.

Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,

regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or

specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer

application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not

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expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such

claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This

literature is subject to all applicable copyright laws and is not for resale in any manner.

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For additional information, please contact your loca

Sales Representative

◊

ARRAYJ−SERIES/D

www.onsemi.com

32


型号：	ARRAYJ-40035-64P-PCB
厂家：	ONSEMI
描述：	硅光电倍增阵列，J 系列 (SiPM) 光电
文件：	总32页 (文件大小：5764K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

ARRAYJ-40035-64P-PCB [ONSEMI]

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SI9130DB

SI9135LG-T1

SI9135LG-T1-E3

SI9135_11

SI9136_11

SI9130CG-T1-E3

SI9130LG-T1-E3

SI9130_11

SI9137

SI9137DB

SI9137LG

SI9122E