ARRAYJ-60035-64P-PCB [ONSEMI]
Silicon Photomultiplier (SiPM) High Fill-Factor Arrays;型号: | ARRAYJ-60035-64P-PCB |
厂家: | ONSEMI |
描述: | Silicon Photomultiplier (SiPM) High Fill-Factor Arrays |
文件: | 总32页 (文件大小:5764K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
ArrayJ Series
Silicon Photomultiplier
(SiPM) High Fill-Factor
Arrays
ON Semiconductor’s range of J−Series SiPM sensors have been
used to create high fill−factor, scaleable arrays. The sensors are
mounted onto PCB boards with minimal dead space, forming arrays
with industry−leading fill factor of up to 90%.
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The back of each ArrayJ has either one or more multi−way
connectors, or a BGA (ball grid array). These allow access to the fast
output* and standard I/O from each pixel in the array, and a common
I/O from the summed substrates of the pixels.
The ArrayJ products with connectors can be used to interface with
the user’s own readout via a mating connector, or to a
ON Semiconductor Breakout Board (BOB). The BOBs allow for easy
access to the pixel signals and performance evaluation of the arrays.
ArrayJ products with the BGA can be reflow soldered to the user’s
readout boards, or purchased ready−mounted on a pinned PCB
evaluation board for easy testing. A BGA ArrayJ cannot be removed
from it’s PCB evaluation board. This contrasts with an ArrayJ with
connectors, as multiple arrays can be evaluated with a single BOB.
S1
S2
F1
F2
Common
ArrayJ Inputs and Outputs (I/O)
Figure 1 summarizes the array schematic for a portion of an ArrayJ.
Each SiPM sensor in the array has three electrical connections: fast
output, standard output and common.
Sn+1
Fn+1
Sn+2
Fn+2
The substrates (cathodes) of all sensors are summed together to
form the common I/O.
Each individual fast output and standard I/O (anode) are routed to its
own output pin.
The pixel−level performance of the sensors in the array can be found
in the J−Series datasheet.
Figure 1. Signal connections at the pixel
level on the ArrayJ products.
Table of Contents
ARRAYJ-60035-64P-PCB (8 X 8 Array of 6 mm Pixels) . . . . . . . . . . . . . . . . . . . . 2
ARRAYX-BOB6-64P (Breakout Board for the ARRAYJ-60035-64P) . . . . . . . . . 5
ARRAYX-BOB6-64S (Summed Breakout Board for the ARRAYJ-60035-64P) . . . 7
ARRAYJ-60035-4P-BGA (2 X 2 Array of 6 mm Pixels) . . . . . . . . . . . . . . . . . . . . 9
ARRAYJ-60035-4P-PCB (2 X 2 Array of 6 mm Pixels) . . . . . . . . . . . . . . . . . . . . 12
ARRAYJ-300XX-16P-PCB (4 X 4 Array of 3 mm Pixels) . . . . . . . . . . . . . . . . . . 17
ARRAYJ-BOB3-16P (ARRAYJ-300XX-16P Breakout Board) . . . . . . . . . . . . . . 19
ARRAYJ-300XX-64P-PCB (8 X 8 Array of 3 mm Pixels) . . . . . . . . . . . . . . . . . . 21
ARRAYJ-BOB3-64P (ARRAYJ-300XX-64P & ARRAYJ-40035-64P
Breakout Board) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Biasing and Readout from the Standard Breakout Boards . . . . . . . . . . . . . . . . . 27
Appendix A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Appendix B . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Appendix C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
ATTENTION!
Great care should be taken when disconnecting the
ArrayJ PCBs from the mating connectors, either on one
of the BOBs, or the user’s own boards.
The board should be gently levered up, working
progressively around the board to lever the PCB from the
connector a little on all sides, and then repeating the
process until the connectors are free from each other.
Use of Scintillators with the ArrayJ
Products
Please consult the Application Note on the use of
scintillators with the TSV arrays.
* The fast output is not available on the 2x2 array (ARRAYJ−60035−4P).
© Semiconductor Components Industries, LLC, 2018
1
Publication Order Number:
January, 2019 − Rev. 6
ARRAYJ−SERIES/D
ArrayJ Series
ARRAYJ−60035−64P−PCB (8 X 8 Array of 6 mm Pixels)
Array Size
Sensor Type
Readout
Board Size
Pixel Pitch
No. Connections
No. Connectors
2
8 x 8
60035
Pixel
50.44 x 50.44 mm
6.33 mm
160
2 x 80−way
The ARRAYJ−60035−64P is comprised of 64 individual
6 mm J−Series sensors arranged in a 8 x 8 array.
The performance of the individual pixels and details of the
bias to apply can be found in the J−Series datasheet.
The connections to each array are provided by two Samtec
80−way connectors, type QTE−040−03−F−D−A. These
connectors mate with the Samtec QSE−040−01−F−D−A
board−to−board connector and the Samtec EQCD High
Speed Cable Assemblies. The 64 SiPM pixels all have
substrate connections (cathode) summed to form a common
I/O. The 80−way connectors provide connections as
follows:
• 64 x fast output
• 64 x standard I/O
• 32 x common I/O
• 16 x shield contacts to the Common
ARRAYJ−60035−64P Board Drawing
1
8
J1
J2
64
57
The complete ARRAYJ−60035−64P−PCB CAD is available to download.
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2
ArrayJ Series
Connector Schematic for the ARRAYJ−60035−64P−PCB
Figure 2. Connector schematic for the ARRAYJ−60035−64P
The connector location and array pixel numbering is indicated on the array schematics on the previous page.
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3
ArrayJ Series
Table 1. CONNECTOR PIN−OUTS FOR THE ARRAYJ−60035−64P−PCB
J1
J2
PIN
SIGNAL
PIN
SIGNAL
PIN
SIGNAL
PIN
SIGNAL
1
S17
F17
S25
F25
S18
F18
S26
F26
S19
F19
S27
F27
S20
F20
S28
F28
CM
2
S1
F1
1
S49
F49
S57
F57
S50
F50
S58
F58
S51
F51
S59
F59
S52
F52
S60
F60
CM
2
S33
F33
S41
F41
S34
F34
S42
F42
S35
F35
S43
F43
S36
F36
S44
F44
CM
3
4
3
4
5
6
S9
5
6
7
8
F9
7
8
9
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
42
44
46
48
50
52
54
56
58
60
62
64
66
68
70
72
74
76
78
80
S2
9
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
42
44
46
48
50
52
54
56
58
60
62
64
66
68
70
72
74
76
78
80
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
41
43
45
47
49
51
53
55
57
59
61
63
65
67
69
71
73
75
77
79
F2
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
41
43
45
47
49
51
53
55
57
59
61
63
65
67
69
71
73
75
77
79
S10
F10
S3
F3
S11
F11
S4
F4
S12
F12
CM
CM
CM
CM
S5
CM
CM
CM
CM
CM
CM
CM
CM
CM
S21
F21
S29
F29
S22
F22
S30
F30
S23
F23
S31
F31
S24
F24
S32
F32
CM
S53
F53
S61
F61
S54
F54
S62
F62
S55
F55
S63
F63
S56
F56
S64
F64
CM
S37
F37
S45
F45
S38
F38
S46
F46
S39
F39
S47
F47
S40
F40
S48
F48
CM
F5
S13
F13
S6
F6
S14
F14
S7
F7
S15
F15
S8
F8
S16
F16
CM
CM
CM
CM
CM
CM
CM
CM
CM
CM
CM
CM
CM
CM
Sn
Fn
Common I/O
Standard I/O of pixel n
Fast output of pixel n
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4
ArrayJ Series
ARRAYX−BOB6−64P (Breakout Board for the
ARRAYJ−60035−64P)
7 mm holes are aligned on a 25 mm grid to allow mounting
of the board on an optical breadboard.
See Appendices A and B for examples of Breakout Board
usage.
The ARRAYX−BOB6−64P is an evaluation board
allowing easy access to all the signals of
a
ON Semiconductor ARRAYJ−60035−64P, 6 mm 8 x 8 TSV
SiPM array.
The Breakout Board features two Samtec 80−way
connectors, type QSE−040−01−F−D−A. These connectors
mate with the Samtec QTE−040−03−F−D−A board−to−
board connector on the array. Since the connectors are
keyed, orientating the array on the BOB is straight−forward.
All signals on the array are routed via the mating
connectors to header pins. These pins are formed of four
50−way (25 x 2 row) 2.54 mm pitch headers; J3, J4, J5 and
J6. Each of the four headers also has 8 pins left unconnected
to allow prototyping for evaluation purposes.
The three SMA connectors on the board can be connected
via the supplied jumper cable to any of the array header pins
and used for accessing signals or suppling bias voltage. Four
Figure 3. Layout of the ARRAYX−BOB6−64P. The dimensions of the board are 112 mm x 112 mm.
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5
ArrayJ Series
Table 2. HEADER SIGNALS ON THE ARRAYX−BOB6−64P
Pin
J3
J4
J5
J6
NC
NC
CM
CM
F1
NC
NC
CM
CM
S1
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
1
2
3
4
CM
CM
F49
F57
F50
F58
F51
F59
F52
F60
CM
F53
F61
F54
F62
F55
F63
F56
F64
CM
CM
NC
CM
CM
S49
S57
S50
S58
S51
S59
S52
S60
CM
S53
S61
S54
S62
S55
S63
S56
S64
CM
CM
NC
CM
CM
F17
F25
F18
F26
F19
F27
F20
F28
CM
F33
F41
F34
F42
F35
F43
F36
F44
CM
CM
NC
CM
CM
S17
S25
S18
S26
S19
S27
S20
S28
CM
S33
S41
S34
S42
S35
S43
S36
S44
CM
CM
NC
CM
CM
F21
F29
F22
F30
F23
F31
F24
F32
CM
F37
F45
F38
F46
F39
F47
F40
F48
CM
CM
NC
CM
CM
S21
S29
S22
S30
S23
S31
S24
S32
CM
S37
S45
S38
S46
S39
S47
S40
S48
CM
CM
NC
5
6
7
8
9
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
42
44
46
48
50
F9
S9
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
41
43
45
47
49
F2
S2
F10
F3
S10
S3
F11
F4
S11
S4
F12
CM
F5
S12
CM
S5
F13
F6
S13
S6
F14
F7
S14
S7
F15
F8
S15
S8
F16
CM
CM
NC
NC
S16
CM
CM
NC
NC
NC
NC
NC
NC
NC
NC
NC
CM
Sn
Not Connected
Common I/O
Standard I/O of pixel n
Fast output of pixel n
Fn
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6
ArrayJ Series
ARRAYX−BOB6−64S (Summed Breakout Board for the
ARRAYJ−60035−64P)
These pins are formed of four 50−way (25 x 2 row) 2.54 mm
pitch headers; J3, J4, J5 and J6. Each of the four headers also
has 10 pins that connect to the common cathode (CM) and
8 pins left unconnected (NC) to allow prototyping for
evaluation purposes.
Two SMA connectors and Balun transformers are
provided with 4−pin headers to allow any fast signal to be
connected directly to the SMA or via the transformer using
jumper wires.
Summed output: A summed output (the anodes of pixels
1 to 64 connected together) is routed to jumper pins (SM) in
close proximity to a third SMA connector. Four 7 mm holes
are placed on a 25 mm grid to allow mounting of the board
on an optical breadboard.
The ARRAYX−BOB6−64S is an evaluation board
allowing easy access to the sum of all of standard pixel
signals of a ON Semiconductor ARRAYJ− 60035−64P,
6 mm 8 x 8 TSV array, in addition to all of the individual fast
output signals. The Breakout Board features two Samtec
80−way connectors, type QSE−040−01−F−D−A. These
connectors mate with the Samtec QTE−040−03−F−D−A
board−toboard connector on the array. Since the connectors
are keyed, orientating the array on the BOB is
straightforward. A schematic of the board is shown in
Figure 4 below.
Fast signals: All of the fast output signals (Fn) from the
array are routed via the mating connectors to header pins.
See Appendix C for an example of the use of the summed
BOB.
Figure 4. Layout of the ARRAYX−BOB6−64P. The dimensions of the board are 112 mm x 112 mm.
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7
ArrayJ Series
Table 3. HEADER SIGNALS ON THE ARRAYX−BOB6−64S
Pin
J3
J4
J5
J6
CM
CM
NC
NC
F1
CM
CM
NC
NC
F1
CM
CM
NC
CM
CM
NC
CM
CM
NC
CM
CM
NC
CM
CM
NC
CM
CM
NC
1
2
3
4
5
6
NC
NC
NC
NC
NC
NC
7
8
F49
F57
F50
F58
F51
F59
F52
F60
CM
F53
F61
F54
F62
F55
F63
F56
F64
NC
F49
F57
F50
F58
F51
F59
F52
F60
CM
F53
F61
F54
F62
F55
F63
F56
F64
NC
F17
F25
F18
F26
F19
F27
F20
F28
CM
F33
F41
F34
F42
F35
F43
F36
F44
NC
F17
F25
F18
F26
F19
F27
F20
F28
CM
F33
F41
F34
F42
F35
F43
F36
F44
NC
F21
F29
F22
F30
F23
F31
F24
F32
CM
F37
F45
F38
F46
F39
F47
F40
F48
NC
F21
F29
F22
F30
F23
F31
F24
F32
CM
F37
F45
F38
F46
F39
F47
F40
F48
NC
9
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
42
44
46
48
50
F9
F9
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
41
43
45
47
49
F2
F2
F10
F3
F10
F3
F11
F4
F11
F4
F12
CM
F5
F12
CM
F5
F13
F6
F13
F6
F14
F7
F14
F7
F15
F8
F15
F8
F16
NC
NC
CM
CM
F16
NC
NC
CM
CM
NC
NC
NC
NC
NC
NC
CM
CM
CM
CM
CM
CM
CM
CM
CM
CM
CM
CM
NC
CM
Fn
Not Connected
Common I/O
Fast output of pixel n
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8
ArrayJ Series
ARRAYJ−60035−4P−BGA (2 X 2 Array of 6 mm Pixels)
Array Size
Sensor Type
Readout
Board Size
Pixel Pitch
No. Connections
No. Connectors
2
2 x 2
60035
Pixel
12.64 x 12.64 mm
6.33 mm
9
3 x 3 BGA
The ARRAYJ−60035−4P is comprised of 4 individual
6 mm J−Series sensors arranged in a 2 x 2 array.
The performance of the individual pixels and details of the
bias to apply can be found in the J−Series datasheet.
Connections to each sensor are provided by a BGA (ball
grid array). The BGA can be reflow soldered onto the user’s
own readout board.
The 4 SiPM sensors have all substrate connections
(cathodes) connected together to form a common I/O. The
3 x 3 BGA provides connections as follows:
• 4 x standard I/O
• 5 x common I/O
• There is NO fast output
ARRAYJ−60035−4P−BGA Board Dimensions and Pin Location
A
B
C
3
2
1
The complete ARRAYJ−60035−4P−BGA CAD and solder footrprint is available to download.
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9
ArrayJ Series
BGA Connections for the ARRAYJ−60035−4P−BGA
The fiducial is indicated in the image below. It marks the
location of both pin A1 and pixel 1.
Pin. No
A1
Function
Anode 1
A2
Anode 2
A3
Common Cathode
Anode 3
B1
B2
Anode 4
B3
Common Cathode
Common Cathode
Common Cathode
Common Cathode
Fiducial
C1
C2
C3
ARRAYJ−60035−4P−BGA − Solder Footprint and
Reflow Solder Profile
for recommendation based upon placement accuracy
capability.
Solder paste (ON Semiconductor recommend using
no−clean solder paste) must be evenly applied to each
soldering pad to insure proper bonding and positioning of
the array. After soldering, allow at least three minutes for the
component to cool to room temperature before further
operations.
Solder reflow conditions must be in compliance with
J−STD−20, table 5.2. This is summarized in Figure 6. The
number of passes should not be more than 2.
The BGA package is compatible with standard reflow
solder processes (J−STD−20) and so is ideal for
high−volume manufacturing.
The ARRAYJ−60035−4P−BGA should be mounted
according to specified soldering pad patterns, as shown in
Figure 5 and in the CAD file which can be downloaded here.
The solder pads may be oversized to ease placement of the
carrier on the PCB. Consult with your contract manufacturer
Figure 5. Recommended solder footprint for use with the ARRAYJ−60035−4P−BGA
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10
ArrayJ Series
Solder Reflow Profile
300
250
200
150
100
50
Max 10 s at 260°C
Max 6°C/s
Max 260°C
217°C
Max 4°C/s
180°C
60~100 s
60 to 120 s
0
0
50
100
150
200
250
300
Time (s)
Figure 6. Solder reflow profile. Conditions must be in compliance with J−STD−20, table 5.2.
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11
ArrayJ Series
ARRAYJ−60035−4P−PCB (2 x 2 Array of 6 mm Pixels)
The ARRAYJ−60035−4P−PCB is an evaluation board
allowing easy access to the signals of
a
ARRAYJ−60035−4P−BGA via pins.
The ARRAYJ−60035−4P−PCB has the array on the front
and pins on the back of the PCB. The pins are compatible
with a standard 8−pin DIL socket for evaluation purposes.
Alternatively, the pins can be directly soldered into
through−holes in the user’s readout PCB. Four of the pins are
connected to the anodes of the individual pixels and the other
four pins are connected to the common cathode. An example
mating 8−pin DIL socket is the 110−93−308−41−001000
from Mill−Max.
The ARRAYJ−60035−4P−PCB does NOT provide access
to the fast output.
ARRAYJ−60035−4P−PCB Pin−Outs
Pin. No
Function
Anode 1
1
2
3
4
5
6
7
8
Common Cathode
Anode 3
Common Cathode
Common Cathode
Anode 4
Common Cathode
Anode 2
The location of the pin 1 indicator is shown on the image
on the right.
ARRAYJ−60035−4P−PCB Board Dimensions and Pin Locations
The complete ARRAYJ−60035−4P−PCB CAD is available to download.
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12
ArrayJ Series
ARRAYJ−40035−64P−PCB (8 X 8 Array of 4 mm Pixels)
Array Size
Sensor Type
Readout
Board Size
Pixel Pitch
No. Connections
No. Connectors
2
8 x 8
40035
Pixel
33.4 x 33.4 mm
4.2 mm
160
2 x 80−way
The ARRAYJ−40035−64P is comprised of 64 individual
4 mm J−Series sensors arranged in a 8 x 8 array. The
performance of the individual pixels and details of the bias
to apply can be found in the J−Series datasheet.
Connections to each sensor are provided by two Hirose
80−way connectors, type DF17(2.0)−80DP−0.5v(57).
These connectors mate with the Hirose DF17(2.0)−80DS−
0.5v(57) board−to−board connectors. The 64 SiPM sensors
have all substrate connections (cathodes) connected
together to form a common I/O. The 2 x 80−way connectors
provide connections as follows:
• 64 x fast output
• 64 x standard I/O
• 32 x common I/O
• 4 x shield contacts to the Common
ARRAYJ−40035−64P Breakout Board
The breakout board for the ARRAYJ−40035−64P−PCB is
the same as for the ARRAYJ−300XX−64P−PCB: the
ARRAYJ−BOB3−64P. Please see page 25 for details.
ARRAYJ−40035−64P−PCB Board Drawing
The complete ARRAYJ−40035−64P−PCB CAD is available to download.
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13
ArrayJ Series
Connector Schematics for the ARRAYJ−40035−64P
Figure 7. Schematic of the ARRAYJ−40035−64P connectors.
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14
ArrayJ Series
Figure 8. Highlighting the location of the connector, pin and array pixel numbering on the ARRAYJ−40035−64P.
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15
ArrayJ Series
Table 4. CONNECTOR PIN−OUTS FOR THE ARRAYJ−40035−64P
J1
J2
PIN
SIGNAL
S9
PIN
SIGNAL
S1
PIN
SIGNAL
S41
F41
CM
PIN
SIGNAL
S33
F33
S42
F42
CM
1
2
1
2
F9
F1
3
4
3
4
CM
S2
S10
F10
CM
S3
5
6
5
6
S34
F34
S43
F43
CM
7
8
7
8
F2
9
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
42
44
46
48
50
52
54
56
58
60
62
64
66
68
70
72
74
76
78
80
9
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
42
44
46
48
50
52
54
56
58
60
62
64
66
68
70
72
74
76
78
80
S11
F11
CM
S4
S35
F35
S44
F44
CM
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
41
43
45
47
49
51
53
55
57
59
61
63
65
67
69
71
73
75
77
79
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
41
43
45
47
49
51
53
55
57
59
61
63
65
67
69
71
73
75
77
79
F3
S12
F12
CM
S5
S36
F36
S45
F45
CM
F4
S13
F13
CM
S6
S37
F37
S46
F46
CM
F5
S14
F14
CM
S7
S38
F38
S47
F47
CM
F6
S15
F15
CM
S8
S39
F39
S48
F48
CM
F7
S16
F16
CM
F24
S24
CM
F31
S31
F22
S22
CM
F29
S29
F20
S20
CM
F27
S27
F18
S18
CM
F25
S25
S40
F40
CM
F8
CM
F32
S32
F23
S23
CM
F30
S30
F21
S21
CM
F28
S28
F19
S19
CM
F26
S26
F17
S17
F56
S56
CM
F64
S64
F55
S55
CM
F63
S63
F54
S54
CM
F62
S62
F53
S53
CM
F61
S61
F52
S52
CM
F60
S60
F51
S51
CM
F59
S59
F50
S50
CM
F58
S58
F49
S49
F57
S57
CM
Sn
Fn
Common I/O
Standard I/O of pixel n
Fast output of pixel n
www.onsemi.com
16
ArrayJ Series
ARRAYJ−300XX−16P−PCB (4 X 4 Array of 3 mm Pixels)
Array Size
Sensor Type
30035
Readout
Board Size
Pixel Pitch
No. Connections
No. Connectors
2
4 x 4
Pixel
13.24 x 13.24 mm
3.36 mm
40
2 x 20−way
30020
The ARRAYJ−300XX−16P is comprised of 16 individual
3 mm J−Series sensors arranged in a 4 x 4 array. There are
two types: The ARRAYJ−30035−16P has pixels which are
formed of 35 um microcells, and the ARRAYJ−30020−16P
has pixels that are formed of 20 um microcells.
The performance of the individual pixels and details of the
bias to apply can be found in the J−Series datasheet.
Connections to each sensor are provided by two 20−way
Hirose plug−type board−to−board connectors, DF17(2.0)−
20DP−0.5V(57). These connectors mate with the Hirose
DF17(3.0)−20DS−0.5V(57). The 16 SiPM pixels have all
substrates (cathodes) connected together to form a common
I/O. The 20−way connector provides connections as
follows:
• 16 x fast output
• 16 x standard I/O
• 8 x common I/O
• 4 x shield contacts to the Common
ARRAYJ−300XX−16P−PCB Board Drawing
The complete ARRAYJ−300XX−16P−PCB CAD is available to download.
www.onsemi.com
17
ArrayJ Series
Connector Schematic for the ARRAYJ−300XX−16P−PCB
Figure 9. Connector pin−outs for the ARRAYJ−300XX−16P (left), and the location of the connectors (right).
Connector Schematic for the ARRAYJ−300XX−16P−PCB
The array pixel numbering is indicated on the drawing on the previous page.
J1
J2
PIN
SIGNAL
S2
PIN
SIGNAL
F1
PIN
SIGNAL
S9
PIN
SIGNAL
F9
1
3
2
1
3
2
S1
F2
S10
S11
CM
F10
F11
4
4
S3
F3
5
6
5
6
CM
F4
CM
S4
CM
7
8
7
8
S12
F16
CM
F12
S16
CM
9
10
12
14
16
18
20
9
10
12
14
16
18
20
F8
S8
11
13
15
17
19
11
13
15
17
19
CM
F7
CM
S7
F15
F14
S13
S15
S14
F13
F6
S6
S5
F5
CM
Common I/O
Sn
Fn
Standard I/O of pixel n
Fast output of pixel n
www.onsemi.com
18
ArrayJ Series
ARRAYJ−BOB3−16P (ARRAYJ−300XX−16P Breakout
Board)
routed via the mating connectors to header pins. These pins
are formed by two 20−way (10 x 2 row) 2.54 mm pitch
headers.
Three SMA connectors and Balun transformers are
provided with 4−pin headers to allow any signal to be
connected directly to the SMA or via the transformer using
jumper wires. Four 7 mm holes are aligned on a 25 mm grid
to allow mounting of the board on an optical breadboard.
See Appendices A and B for examples of Breakout Board
usage.
The ARRAYJ−BOB3−16P is an evaluation board
allowing easy access to the signals from
ON Semiconductor ARRAYJ−300XX−16P, 3 mm 4 x 4
SiPM array.
The Breakout Board has two HIROSE 20−way
connectors DF17(3.0)−20DS−0.5v(57). These connectors
mate with the Samtec DF17(2.0)−20DP−0.5v(57) board−
to−board connectors on the array. All signals on the array are
a
Figure 10. Layout of the ARRAYJ−BOB3−16P. Note that the array corner pixel numbers are shown on the
silkscreen of the PCB to ensure correct orientation of the array.
www.onsemi.com
19
ArrayJ Series
Header Signals for the ARRAYX−BOB3−16P
PIN
J2
J3
CM
S1
S5
S2
S6
S3
S7
S4
S8
NC
CM
F1
CM
S9
CM
F9
1
3
2
4
F5
S13
S10
S14
S11
S15
S12
S16
NC
F13
F10
F14
F11
F15
F12
F16
NC
5
6
F2
7
8
F6
9
10
12
14
16
18
20
F3
11
13
15
17
19
F17
F4
F6
NC
NC
CM
Sn
Not Connected
Common I/O
Standard I/O of pixel n
Fast output of pixel n
Fn
www.onsemi.com
20
ArrayJ Series
ARRAYJ−300XX−64P−PCB (8 X 8 Array of 3 mm Pixels)
Array Size
Sensor Type
30035
Readout
Board Size
Pixel Pitch
No. Connections
No. Connectors
2
8 x 8
Pixel
26.68 x 26.68 mm
3.36 mm
160
2 x 80−way
30020
The ARRAYJ−300XX−64P is comprised of 64 individual
3 mm J−Series sensors arranged in a 8 x 8 array. There are
two types: The ARRAYJ−30035−64P has pixels which are
formed of 35 um microcells, and the ARRAYJ−30020−64P
has pixels that are formed of 20 um microcells.
The performance of the individual pixels and details of the
bias to apply can be found in the J−Series datasheet.
Connections to each sensor are provided by two Hirose
80−way connectors, type DF17(2.0)−80DP−0.5v(57).
These connectors mate with the Hirose DF17(2.0)−
80DS−0.5v(57) board−to−board connectors. The 64 SiPM
sensors have all substrate connections (cathodes) connected
together to form a common I/O. The 2 x 80−way connectors
provide connections as follows:
• 64 x fast output
• 64 x standard I/O
• 32 x common I/O
• 4 x shield contacts to the Common
ARRAYJ−300XX−64P−PCB Board Drawing
The complete ARRAYJ−300XX−64P−PCB CAD is available to download.
www.onsemi.com
21
ArrayJ Series
Connector Schematics for the ARRAYJ−300XX−64P
Figure 11. Schematic of the ARRAYJ−300XX−64P connectors.
www.onsemi.com
22
ArrayJ Series
Figure 12. Highlighting the location of the connector, pin and array pixel numbering on the ARRAYJ−300XX−64P.
www.onsemi.com
23
ArrayJ Series
Table 5. CONNECTOR PIN−OUTS FOR THE ARRAYJ−300XX−64P
J1
J2
PIN
SIGNAL
S9
PIN
SIGNAL
S1
PIN
SIGNAL
S41
F41
CM
PIN
SIGNAL
S33
F33
S42
F42
CM
1
2
1
2
F9
F1
3
4
3
4
CM
S2
S10
F10
CM
S3
5
6
5
6
S34
F34
S43
F43
CM
7
8
7
8
F2
9
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
42
44
46
48
50
52
54
56
58
60
62
64
66
68
70
72
74
76
78
80
9
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
42
44
46
48
50
52
54
56
58
60
62
64
66
68
70
72
74
76
78
80
S11
F11
CM
S4
S35
F35
S44
F44
CM
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
41
43
45
47
49
51
53
55
57
59
61
63
65
67
69
71
73
75
77
79
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
41
43
45
47
49
51
53
55
57
59
61
63
65
67
69
71
73
75
77
79
F3
S12
F12
CM
S5
S36
F36
S45
F45
CM
F4
S13
F13
CM
S6
S37
F37
S46
F46
CM
F5
S14
F14
CM
S7
S38
F38
S47
F47
CM
F6
S15
F15
CM
S8
S39
F39
S48
F48
CM
F7
S16
F16
CM
F24
S24
CM
F31
S31
F22
S22
CM
F29
S29
F20
S20
CM
F27
S27
F18
S18
CM
F25
S25
S40
F40
CM
F8
CM
F32
S32
F23
S23
CM
F30
S30
F21
S21
CM
F28
S28
F19
S19
CM
F26
S26
F17
S17
F56
S56
CM
F64
S64
F55
S55
CM
F63
S63
F54
S54
CM
F62
S62
F53
S53
CM
F61
S61
F52
S52
CM
F60
S60
F51
S51
CM
F59
S59
F50
S50
CM
F58
S58
F49
S49
F57
S57
CM
Sn
Fn
Common I/O
Standard I/O of pixel n
Fast output of pixel n
www.onsemi.com
24
ArrayJ Series
ARRAYJ−BOB3−64P (ARRAYJ−300XX−64P &
ARRAYJ−40035−64P Breakout Board)
All signals on the array are routed via the mating
connectors to header pins. These pins are formed by four
32−way (16 x 2 row) 2.54 mm pitch headers. Four additional
header pin−pairs are provided for connection to the
Common.
Three SMA connectors and Balun transformers are
provided with 4−pin headers to allow any signal to be
connected directly to the SMA or via the transformer using
jumper wires. Four 7 mm holes are placed on a 25 mm grid
to allow mounting of the board on an optical breadboard.
See Appendices A and B for examples of Breakout Board
usage.
The ARRAYJ−BOB3−64P is an evaluation board
allowing easy access to the signals from either a
ON Semiconductor ARRAYJ−300XX−64P (3 mm pixel
8 x 8
SiPM
array)
or
a
ON Semiconductor
ARRAYJ−40035−64P (4mm pixel, 8 x 8 SiPM array).
The Breakout Board has two Hirose 80−way connectors,
type DF17(3.0)−80DS−0.5v(57). These connectors mate
with the Hirose DF17(3.0)−80DP−0.5v(57) board−to−board
connector on the array.
Figure 13. Layout of the ARRAYJ−BOB3−64P. Note that the array corner pixel numbers are shown on the
silkscreen of the PCB to ensure correct orientation of the array.
www.onsemi.com
25
ArrayJ Series
Header Signals for the ARRAYJ−BOB3−64P
PIN
J3
J4
J5
J6
S9
S1
F9
F1
S57
S49
S58
S50
S59
S51
S60
S52
S61
S53
S62
S54
S63
S55
S64
S56
F57
F49
F58
F50
F59
F51
F60
F52
F61
F53
F62
F54
F63
F55
F64
F56
S25
S17
S26
S18
S27
S19
S28
S20
S41
S33
S42
S34
S43
S35
S44
S36
F25
F17
F26
F18
F27
F19
F28
F20
F41
F33
F42
F34
F43
F35
F44
F36
S29
S21
S30
S22
S31
S23
S32
S24
S45
S37
S46
S38
S47
S39
S48
S40
F29
F21
F30
F22
F31
F23
F32
F24
F45
F37
F46
F38
F47
F39
F48
F40
1
2
3
4
S10
S2
F10
F2
5
6
7
8
S11
S3
F11
F3
9
10
12
14
16
18
20
22
24
26
28
30
32
11
13
15
17
19
21
23
25
27
29
31
S12
S4
F12
F4
S13
S5
F13
F5
S14
S6
F14
F6
S15
S7
F15
F7
S16
S8
F16
F8
Sn
Fn
Standard I/O of pixel n
Fast output of pixel n
www.onsemi.com
26
ArrayJ Series
Biasing and Readout from the Standard Breakout
Boards
addition, each SMA has a balun transformer in close
proximity for impedance matching of the fast signals, shown
in Figure 13. To interface signals from the array to the SMA
connectors, there is a 4−pin header, shown in Figure 12. The
pins are labelled; Fin, Fout, I (Inner) and O (Outer).
The purpose of the Breakout Boards is to allow easy
access to either standard or fast I/O from individual pixels
for testing purposes. It should be stressed that the breakout
boards are for evaluation purposes only and do not allow for
full readout of all pixels simultaneously.
The various Breakout Boards described in this document
have features in common. All pixel fast and standard signals
are brought out to headers. The header pins can be interfaced
with the SMA connectors with the option of routing the
signal via a balun transformer. The common I/O consists of
all of the substrate connections summed together. It is not
recommended to apply the bias to the common I/O.
The Breakout Boards are each shipped with 3 x shunt
jumpers and 6 x 10 cm wire cables (3 x red, 3 x black) with
crimp sockets at each end.
• Fin provides the input to the balun transformer.
• Fout is the output of the balun transformer.
• I provides direct connection to the inner part of the
SMA connector.
• O provides direct connection to the outer part of the
SMA connector.
Balun Transformer
The Balun transformer (RFMD RFXF9503) allows
impedance matching of the fast output signal to the readout
electronics. For a customer considering their own design,
the Balun is not required if the readout amplifiers are placed
in close proximity to the sensor pixels of the array.
For optimized timing performance, the impedance
matching and signal propagation from the SiPM sensor to
the readout electronics must be carefully considered.
All header pins are suitable for use with wire wrapping in
addition to the jumpers and crimp socket leads supplied.
The ‘NC’ signals are unconnected pins that can be used for
prototyping.
SMA Connector
Each Breakout Board has three SMA connectors that can
be used for supplying bias voltage and accessing signals. In
Figure 14. (right) photo and (left) schematic of the BOB SMA, balun transformer and
4−pin header arrangement.
www.onsemi.com
27
ArrayJ Series
RFMD RFXF9503
JX
Fin
Fout
I
SG
SG
SMA Output
O
SG
SG = Local signal ground
Each SMT/Balun/4 Way Header circuits has its own local signal ground
Figure 15. Schematic of the 4−pin header and balun transformer
EMI Considerations
For a system design, it is recommended that the customer
consider shielding of all lines. The readout requirements for
a SiPM are similar to that of a PMT and similar care should
be taken with both sensor types. In comparison to an APD
which has significantly lower gain than a SiPM, the SiPM
will provide much improved resistance to EMI due to the
higher gain of the SiPM sensor.
It has been shown that the EMI (Electromagnetic
Interference) can be picked up on the unshielded wires on
the BOB. It is recommended that customers who experience
excessive EMI seek to reduce the EMI in their lab, ideally
at the EMI source. If this is not possible then improved
shielding should be used. In all cases, testing of the SiPM
sensor should be performed in total darkness.
www.onsemi.com
28
ArrayJ Series
APPENDIX A − EXAMPLE OF USING THE BREAKOUT BOARD TO READOUT FAST SIGNALS
The Figure 16 shows the ARRAYX−BOB6−64P set up for readout of fast signals from pixel 49
Figure 16. Example of an ARRAYJ−60035−64P connected to an ARRAYX−BOB6−
64P for the readout of the fast signal from pixel 49.
Here, SMA1 is used for supplying Vbias and SMA2 for
reading out the fast output from pixel 49. In this example an
ARRAYJ−60035−64P is assumed and so the “S” (standard
I/O) is the anode.
To bias the array, the inner (“I”) of SMA1 is connected to
the S49 header pin. The cathode is common to all pixels and
is connected via a “C” pin on the header to the outer (“O”)
of SMA1. Refer to Figure 1 for signal connections for the
J−Series array. Vbias is then applied to SMA1, which for an
ArrayJ sensors has a negative polarity with respect to the
common cathode.
To access the fast output from pixel 49, the F49 header pin
is then connected to the Fin of SMA2. This is the input to the
balun transformer for impedance matching of the fast
signals. Fout (the output of the balun transformer) is then
connected via a shunt jumper to the inner (“I”) of SMA2,
with the outer (“O”) again connected to the common cathode
(“C”). The schematic of the balun transformer is shown in
Figure 15. The fast output from SMA2 will need
amplification if the signal amplitudes are small.
www.onsemi.com
29
ArrayJ Series
APPENDIX B − EXAMPLE OF USING THE BREAKOUT BOARD TO READOUT STANDARD SIGNALS
The Figure 17 shows the ARRAYX−BOB6−64P set up for readout of standard signals (anode−cathode) from pixel 49.
−ve bias
50 ꢀ
10 nF
0 V
Figure 17. Example of an ARRAYJ−60035−64P connected to an ARRAYX−BOB6−
64P for the readout of the fast signal from pixel 49.
Here, SMA 1 is used for supplying Vbias and SMA2 for
reading out the standard output from pixel 49. In this
example an ARRAYJ−60035−64P is assumed and so the “S”
(standard I/O) is the anode.
To bias the array, the inner (“I”) of SMA1 is connected to
the S49 (anode) header pin via a load resistor of 50 Ω. The
cathode is common to all pixels and is connected via a “C”
pin on the header to the outer (“O”) of SMA1. Vbias is then
applied to SMA1, which for an ArrayJ sensors has a negative
polarity with respect to the common cathode.
To access the standard output, the S49 header pin is then
connected to the inner (“I”) of SMA2 via a decoupling
capacitor of 10nF. The outer (“O”) of SMA 2 is again
connected to the common cathode (“C”). The standard
signal is then available from SMA2.
www.onsemi.com
30
ArrayJ Series
APPENDIX C − EXAMPLE OF USING THE SUMMED BREAKOUT BOARD
The Figure 18 shows the ARRAYX−BOB6−64S set up for readout of all of the pixels summed together.
−ve bias
50 ꢀ
10 nF
0 V
Figure 18. Example of an ARRAYJ−60035−64P connected to an ARRAYX−BOB6−64S
for the summed readout of all of the pixels.
SMA 1 is used for supplying Vbias and SMA2 for reading
out the summed standard output from all pixels in the
ARRAYJ−60035−64P.
To bias the array, the inner (“I”) of SMA1 is connected to
the SM (summed anode) pin on the same header, via a load
resistor of 50 ꢀ. The cathode is also common to all pixels and
is connected via a “CM” pin to the outer (“O”) of SMA1.
Vbias is then applied to SMA1, which for an ArrayJ has a
negative polarity with respect to the common.
To access the summed standard output, the second SM
header pin is then connected to the inner (“I”) of SMA2 via
a decoupling capacitor of 10nF. The outer (“O”) of SMA2
is again connected to the common cathode (“CM”). The
summed signal is then available from SMA2.
www.onsemi.com
31
ArrayJ Series
ORDERING INFORMATION
Microcell Size
(Total Number per Pixel)
Product Code
6 mm Sensor Arrays
Array Size
I/O Interface
ARRAYJ−60035−4P−BGA
ARRAYJ−60035−64P−PCB
4 mm Sensor Arrays
2 x 2
8 x 8
BGA
35 mm
(22,292 microcells)
Connector
ARRAYJ−40035−64P−PCB
35 mm
(9,260 microcells)
8 x 8
Connector
3 mm Sensor Arrays
ARRAYJ−30035−16P−PCB
ARRAYJ−30035−64P−PCB
ARRAYJ−30020−16P−PCB
ARRAYJ−30020−64P−PCB
Optional Breakout Boards
ARRAYX−BOB6−64P−GEVK
ARRAYJ−BOB3−16P−GEVK
ARRAYJ−BOB3−64P−GEVK
4 x 4
8 x 8
4 x 4
8 x 8
Connector
Connector
Connector
Connector
35 mm
(5,676 microcells)
20 mm
(14,850 microcells)
Breakout board for use with the ARRAYJ−60035−64P−PCB
Breakout board for use with the ARRAYJ−300XX−16P−PCB
Breakout board for use with the ARRAYJ−300XX−64P−PCB & ARRAYJ−40035−64P−PCB
Optional Summed Breakout Boards
ARRAYX−BOB6−64S−GEVK
Summed breakout board for use with the ARRAYJ−60035−64P−PCB
Evaluation Board with ARRAYJ Permanently Attached
ARRAYJ−60035−4P−PCB
Evaluation board with a permanently attached ARRAYJ−60035−4P−BGA and output pins
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ARRAYJ−SERIES/D
相关型号:
ARRAYRDM-0112A20-QFN-TR-E
Silicon Photomultipliers (SiPM), RDM-Series 1 x 12 Monolithic Array
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