BSV52LT1D [ONSEMI]

Switching Transistor; 开关晶体管


型号：	BSV52LT1D
厂家：	ONSEMI
描述：	Switching Transistor 开关晶体管晶体开关晶体管
文件：	总3页 (文件大小：105K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BSV52LT1G

Switching Transistor

NPN Silicon

Features

• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS

http://onsemi.com

Compliant

COLLECTOR

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

BASE

Collector−Emitter Voltage

Vdc

CEO

CBO

Collector−Base Voltage

Vdc

EMITTER

Collector Current − Continuous

100

mAdc

THERMAL CHARACTERISTICS

Characteristic

Symbol

Max

Unit

Total Device Dissipation FR−5 Board,

(Note 1) T = 25°C

225

1.8

mW/°C

Derate above 25°C

Thermal Resistance, Junction−to−Ambient

556

°C/W

SOT−23 (TO−236)

CASE 318

Total Device Dissipation

STYLE 6

Alumina Substrate, (Note 2) T = 25°C

300

2.4

mW/°C

Derate above 25°C

Thermal Resistance, Junction−to−Ambient

Junction and Storage Temperature

417

°C/W

°C

MARKING DIAGRAM

T , T

−55 to +150

stg

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

1. FR−5 = 1.0 x 0.75 x 0.062 in.

B2 M G

2. Alumina = 0.4 x 0.3 x 0.024 in. 99.5% alumina.

B2 = Device Code

= Date Code*

= Pb−Free Package

(Note: Microdot may be in either location)

*Date Code orientation and/or overbar may

vary depending upon manufacturing location.

ORDERING INFORMATION

†

Device

Package

Shipping

BSV52LT1G

SOT−23

3,000 / Tape & Reel

(Pb−Free)

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

Publication Order Number:

August, 2009 − Rev. 3

BSV52LT1/D

BSV52LT1G

ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)

Characteristic

OFF CHARACTERISTICS

Symbol

Min

Max

Unit

Collector−Emitter Breakdown Voltage

Vdc

(BR)CEO

(I = 1.0 mAdc)

−

Collector Cutoff Current

CBO

(V = 10 Vdc, I = 0)

−

100

5.0

nAdc

mAdc

(V = 10 Vdc, I = 0, T = 125°C)

ON CHARACTERISTICS

DC Current Gain

−

(I = 1.0 mAdc, V = 1.0 Vdc)

−

120

−

(I = 10 mAdc, V = 1.0 Vdc)

(I = 50 mAdc, V = 1.0 Vdc)

Collector−Emitter Saturation Voltage

(I = 10 mAdc, I = 300 mAdc)

mVdc

CE(sat)

BE(sat)

−

300

250

400

(I = 10 mAdc, I = 1.0 mAdc)

(I = 50 mAdc, I = 5.0 mAdc)

Base−Emitter Saturation Voltage

(I = 10 mAdc, I = 1.0 mAdc)

700

850

(I = 50 mAdc, I = 5.0 mAdc)

−

1200

SMALL−SIGNAL CHARACTERISTICS

Current−Gain − Bandwidth Product

MHz

(I = 10 mAdc, V = 10 Vdc, f = 100 MHz)

400

−

Output Capacitance

obo

(V = 5.0 Vdc, I = 0, f = 1.0 MHz)

4.0

4.5

Input Capacitance

ibo

(V = 1.0 Vdc, I = 0, f = 1.0 MHz)

−

SWITCHING CHARACTERISTICS

Storage Time

(I = I = I = 10 mAdc)

−

Turn−On Time

(V = 1.5 Vdc, I = 10 mAdc, I = 3.0 mAdc)

off

Turn−Off Time

(I = 10 mAdc, I = 3.0 mAdc)

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BSV52LT1G

PACKAGE DIMENSIONS

SOT−23 (TO−236)

CASE 318−08

ISSUE AN

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

SEE VIEW C

2. CONTROLLING DIMENSION: INCH.

3. MAXIMUM LEAD THICKNESS INCLUDES LEAD

FINISH THICKNESS. MINIMUM LEAD

THICKNESS IS THE MINIMUM THICKNESS OF

BASE MATERIAL.

4. 318−01 THRU −07 AND −09 OBSOLETE, NEW

STANDARD 318−08.

MILLIMETERS

INCHES

NOM

DIM

MIN

0.89

0.01

0.37

0.09

2.80

1.20

1.78

0.10

0.35

2.10

NOM

1.00

0.06

0.44

0.13

2.90

1.30

1.90

0.20

0.54

2.40

MAX

1.11

0.10

0.50

0.18

3.04

1.40

2.04

0.30

0.69

2.64

MIN

MAX

0.044

0.004

0.020

0.007

0.120

0.055

0.081

0.012

0.029

0.104

0.25

0.035

0.001

0.015

0.003

0.110

0.047

0.070

0.004

0.014

0.083

0.040

0.002

0.018

0.005

0.114

0.051

0.075

0.008

0.021

0.094

VIEW C

STYLE 6:

PIN 1. BASE

2. EMITTER

3. COLLECTOR

SOLDERING FOOTPRINT*

0.95

0.037

0.95

0.037

2.0

0.079

0.9

0.035

inches

SCALE 10:1

0.8

0.031

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

ON Semiconductor and

are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice

to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability

arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.

“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All

operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights

nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications

intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should

Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,

and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death

associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal

Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

PUBLICATION ORDERING INFORMATION

LITERATURE FULFILLMENT:

N. American Technical Support: 800−282−9855 Toll Free

USA/Canada

Europe, Middle East and Africa Technical Support:

Phone: 421 33 790 2910

Japan Customer Focus Center

Phone: 81−3−5773−3850

ON Semiconductor Website: www.onsemi.com

Order Literature: http://www.onsemi.com/orderlit

Literature Distribution Center for ON Semiconductor

P.O. Box 5163, Denver, Colorado 80217 USA

Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada

Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada

Email: orderlit@onsemi.com

For additional information, please contact your local

Sales Representative

BSV52LT1/D

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