BUL45D2G [ONSEMI]
High Speed, High Gain Bipolar NPN Power Transistor; 高速,高增益双极NPN功率晶体管型号: | BUL45D2G |
厂家: | ONSEMI |
描述: | High Speed, High Gain Bipolar NPN Power Transistor |
文件: | 总11页 (文件大小:227K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
BUL45D2G
High Speed, High Gain
Bipolar NPN Power
Transistor
with Integrated Collector−Emitter Diode
and Built−in Efficient Antisaturation
Network
The BUL45D2G is state−of−art High Speed High gain BiPolar
transistor (H2BIP). High dynamic characteristics and lot−to−lot
minimum spread ( 150 ns on storage time) make it ideally suitable for
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POWER TRANSISTOR
5.0 AMPERES,
700 VOLTS, 75 WATTS
light ballast applications. Therefore, there is no need to guarantee an h
FE
window. It’s characteristics make it also suitable for PFC application.
Features
• Low Base Drive Requirement
• High Peak DC Current Gain (55 Typical) @ I = 100 mA
C
• Extremely Low Storage Time Min/Max Guarantees Due to
the H2BIP Structure which Minimizes the Spread
• Integrated Collector−Emitter Free Wheeling Diode
• Fully Characterized and Guaranteed Dynamic V
CE(sat)
• “6 Sigma” Process Providing Tight and Reproductible
Parameter Spreads
TO−220AB
CASE 221A−09
STYLE 1
• These Devices are Pb−Free and are RoHS Compliant*
MAXIMUM RATINGS
Rating
Symbol
Value
400
700
700
12
Unit
Vdc
Vdc
Vdc
Vdc
Adc
1
2
3
Collector−Emitter Sustaining Voltage
Collector−Base Breakdown Voltage
Collector−Emitter Breakdown Voltage
Emitter−Base Voltage
V
CEO
V
CBO
V
V
CES
MARKING DIAGRAM
EBO
Collector Current − Continuous
− Peak (Note 1)
I
5
10
C
I
CM
Base Current
− Continuous
− Peak (Note 1)
I
2
4
Adc
B
I
BM
BUL45D2G
AY WW
Total Device Dissipation @ T = 25_C
P
75
W
C
D
Derate above 25°C
0.6
W/_C
Operating and Storage Temperature
T , T
J
−65 to 150
_C
stg
THERMAL CHARACTERISTICS
Characteristics
Symbol
Max
1.65
62.5
260
Unit
_C/W
_C/W
_C
A
Y
= Assembly Location
= Year
Thermal Resistance, Junction−to−Case
Thermal Resistance, Junction−to−Ambient
R
q
JC
R
q
JA
WW
G
= Work Week
= Pb−Free Package
Maximum Lead Temperature for Soldering
Purposes 1/8″ from Case for 5 Seconds
T
L
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Pulse Test: Pulse Width = 5 ms, Duty Cycle ≤ 10%.
ORDERING INFORMATION
Device
Package
Shipping
50 Units / Rail
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
BUL45D2G
TO−220
(Pb−Free)
©
Semiconductor Components Industries, LLC, 2010
1
Publication Order Number:
April, 2010 − Rev. 5
BUL45D2/D
BUL45D2G
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)
C
Characteristic
Symbol
Min
Typ
Max
Unit
OFF CHARACTERISTICS
Collector−Emitter Sustaining Voltage
(I = 100 mA, L = 25 mH)
C
V
400
700
12
450
910
14.1
Vdc
Vdc
CEO(sus)
Collector−Base Breakdown Voltage
V
V
CBO
EBO
CEO
(I
CBO
= 1 mA)
Emitter−Base Breakdown Voltage
(I = 1 mA)
Vdc
EBO
Collector Cutoff Current
(V = Rated V , I = 0)
I
100
mAdc
mAdc
CE
CEO
B
Collector Cutoff Current (V = Rated V
, V = 0)
@ T = 25°C
I
100
500
100
CE
CES EB
C
CES
@ T = 125°C
C
Collector Cutoff Current (V = 500 V, V = 0)
@ T = 125°C
CE
EB
C
Emitter−Cutoff Current
(V = 10 Vdc, I = 0)
I
100
mAdc
EBO
EB
C
ON CHARACTERISTICS
Base−Emitter Saturation Voltage
(I = 0.8 Adc, I = 80 mAdc)
V
V
Vdc
BE(sat)
@ T = 25°C
0.8
0.7
1
0.9
C
B
C
@ T = 125°C
C
(I = 2 Adc, I = 0.4 Adc)
@ T = 25°C
0.89
0.79
1
0.9
C
B
C
@ T = 125°C
C
Collector−Emitter Saturation Voltage
(I = 0.8 Adc, I = 80 mAdc)
Vdc
CE(sat)
@ T = 25°C
0.28
0.32
0.4
0.5
C
B
C
@ T = 125°C
C
(I = 2 Adc, I = 0.4 Adc)
@ T = 25°C
0.32
0.38
0.5
0.6
C
B
C
@ T = 125°C
C
(I = 0.8 Adc, I = 40 mAdc)
@ T = 25°C
0.46
0.62
0.75
1
C
B
C
@ T = 125°C
C
DC Current Gain
(I = 0.8 Adc, V = 1 Vdc)
C
h
FE
—
@ T = 25°C
22
20
34
29
CE
C
@ T = 125°C
C
(I = 2 Adc, V = 1 Vdc)
@ T = 25°C
10
7
14
9.5
C
CE
C
@ T = 125°C
C
DIODE CHARACTERISTICS
Forward Diode Voltage
V
EC
V
(I = 1 Adc)
@ T = 25°C
1.04
0.7
1.5
1.6
1.2
EC
C
@ T = 125°C
C
(I = 2 Adc)
EC
@ T = 25°C
1.2
C
@ T = 125°C
C
(I = 0.4 Adc)
EC
@ T = 25°C
0.85
0.62
C
@ T = 125°C
C
Forward Recovery Time (see Figure 27)
T
330
ns
fr
(I = 1 Adc, di/dt = 10 A/ms)
F
@ T = 25°C
C
(I = 2 Adc, di/dt = 10 A/ms)
@ T = 25°C
360
320
F
C
(I = 0.4 Adc, di/dt = 10 A/ms)
F
@ T = 25°C
C
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2
BUL45D2G
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)
C
Characteristic
DYNAMIC CHARACTERISTICS
Current Gain Bandwidth
Symbol
Min
Typ
Max
Unit
f
T
13
50
MHz
pF
(I = 0.5 Adc, V = 10 Vdc, f = 1 MHz)
C
CE
Output Capacitance
C
ob
75
(V = 10 Vdc, I = 0, f = 1 MHz)
CB
E
Input Capacitance
C
ib
340
500
pF
(V = 8 Vdc)
EB
DYNAMIC SATURATION VOLTAGE
V
3.7
9.4
V
V
V
V
@ 1 ms
@ 3 ms
@ 1 ms
@ 3 ms
@ T = 25°C
C
CE(dsat)
I
= 1 A
= 100 mA
= 300 V
@ T = 125°C
C
C
I
V
B1
Dynamic Saturation
Voltage:
@ T = 25°C
0.35
2.7
C
CC
@ T = 125°C
C
Determined 1 ms and
3 ms respectively after
@ T = 25°C
3.9
12
C
rising I reaches
B1
I
C
= 2 A
= 0.8 A
= 300 V
@ T = 125°C
C
90% of final I
B1
I
B1
@ T = 25°C
0.4
1.5
C
V
CC
@ T = 125°C
C
SWITCHING CHARACTERISTICS: Resistive Load (D.C. ≤ 10%, Pulse Width = 20 ms)
Turn−on Time
Turn−off Time
Turn−on Time
Turn−off Time
@ T = 25°C
t
90
105
150
1.3
150
2.4
ns
ms
ns
ms
C
on
I
= 2 Adc, I = 0.4 Adc
B1
@ T = 125°C
C
C
C
I
B2
= 1 Adc
@ T = 25°C
t
1.15
1.5
C
off
V
CC
= 300 Vdc
@ T = 125°C
C
@ T = 25°C
t
on
90
110
C
I
= 2 Adc, I = 0.4 Adc
@ T = 125°C
B1
C
I
= 0.4 Adc
= 300 Vdc
B2
@ T = 25°C
t
2.1
C
off
V
CC
@ T = 125°C
3.1
C
SWITCHING CHARACTERISTICS: Inductive Load (V
= 300 V, V = 15 V, L = 200 mH)
CC
clamp
Fall Time
@ T = 25°C
t
90
93
150
0.9
ns
ms
ns
ns
ms
ns
C
f
@ T = 125°C
C
I
= 1 Adc
= 100 mAdc
= 500 mAdc
C
Storage Time
Crossover Time
Fall Time
@ T = 25°C
t
t
0.72
1.05
C
s
I
I
B1
B2
@ T = 125°C
C
@ T = 25°C
95
95
150
150
2.25
300
C
c
@ T = 125°C
C
@ T = 25°C
t
f
80
105
C
@ T = 125°C
C
I
C
= 2 Adc
= 0.4 Adc
= 0.4 Adc
Storage Time
Crossover Time
@ T = 25°C
t
s
t
c
1.95
C
I
I
B1
B2
@ T = 125°C
2.9
C
@ T = 25°C
225
450
C
@ T = 125°C
C
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BUL45D2G
TYPICAL STATIC CHARACTERISTICS
100
80
60
40
20
0
100
V
CE
= 1 V
V
CE
= 5 V
T = 125°C
T = 125°C
J
80
60
40
20
0
J
T = 25°C
J
T = 25°C
J
T = -ꢀ20°C
J
T = -ꢀ20°C
J
0.001
0.01
0.1
1
10
10
10
0.001
0.01
0.1
1
10
10
10
I , COLLECTOR CURRENT (AMPS)
C
I , COLLECTOR CURRENT (AMPS)
C
Figure 1. DC Current Gain @ 1 Volt
Figure 2. DC Current Gain @ 5 Volt
4
3
2
10
T = 25°C
J
I /I = 5
C B
T = 25°C
J
1
T = 125°C
J
5 A
3 A
1
0
2 A
4 A
T = -ꢀ20°C
J
1 A
I = 500 mA
C
0.1
0.001
0.001
0.01
0.1
I , BASE CURRENT (AMPS)
1
0.01
0.1
1
I , COLLECTOR CURRENT (AMPS)
C
B
Figure 3. Collector Saturation Region
Figure 4. Collector−Emitter Saturation Voltage
10
10
I /I = 10
C B
I /I = 20
C B
1
1
T = 125°C
J
T = 25°C
J
T = -ꢀ20°C
T = -ꢀ20°C
J
J
T = 125°C
J
T = 25°C
J
0.1
0.001
0.1
0.001
0.01
0.1
1
0.01
0.1
1
I , COLLECTOR CURRENT (AMPS)
C
I , COLLECTOR CURRENT (AMPS)
C
Figure 5. Collector−Emitter Saturation Voltage
Figure 6. Collector−Emitter Saturation Voltage
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BUL45D2G
TYPICAL STATIC CHARACTERISTICS
10
10
I /I = 5
C B
I /I = 10
C B
T = 25°C
J
T = -ꢀ20°C
J
1
1
T = -ꢀ20°C
J
T = 125°C
J
T = 125°C
J
T = 25°C
J
0.1
0.1
0.001
0.01
0.1
1
10
0.001
0.01
0.1
1
10
I , COLLECTOR CURRENT (AMPS)
C
I , COLLECTOR CURRENT (AMPS)
C
Figure 7. Base−Emitter Saturation Region
Figure 8. Base−Emitter Saturation Region
10
10
I /I = 20
C B
25°C
1
1
T = -ꢀ20°C
J
125°C
T = 125°C
J
T = 25°C
J
0.1
0.1
0.001
0.01
0.1
1
10
0.01
0.1
1
10
I , COLLECTOR CURRENT (AMPS)
C
REVERSE EMITTER-COLLECTOR CURRENT (AMPS)
Figure 9. Base−Emitter Saturation Region
Figure 10. Forward Diode Voltage
1000
100
1000
900
800
700
600
T = 25°C
(test)
T = 25°C
J
J
C (pF)
ib
BVCER @ 10 mA
f
= 1 MHz
C
ob
(pF)
10
1
BVCER(sus) @ 200 mA
500
400
1
10
100
10
100
(W)
1000
V , REVERSE VOLTAGE (VOLTS)
R
R
BE
Figure 11. Capacitance
Figure 12. BVCER = f(ICER)
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5
BUL45D2G
TYPICAL SWITCHING CHARACTERISTICS
5
1000
800
600
400
I = I
Bon Boff
I
= I
T = 125°C
T = 25°C
J
Bon Boff
J
V
CC
= 300 V
V
= 300 V
I /I = 10
C B
CC
4
3
2
PW = 20 ms
PW = 20 ms
I /I = 10
C B
I /I = 5
C B
I /I = 5
C B
1
0
T = 125°C
T = 25°C
J
J
200
0
0.5
1
1.5
2
2.5
3
3.5
4
0.5
1
1.5
2
2.5
3
3.5
4
4
4
I , COLLECTOR CURRENT (AMPS)
C
I , COLLECTOR CURRENT (AMPS)
C
Figure 14. Resistive Switch Time, toff
Figure 13. Resistive Switch Time, ton
5
4
3
2
4
3
2
I
= I
Bon Boff
= 15 V
I
= I
Bon Boff
= 15 V
I /I = 5
C B
V
CC
V
CC
V = 300 V
Z
V = 300 V
Z
L = 200 mH
C
L = 200 mH
C
1
0
1
0
T = 125°C
J
T = 125°C
J
T = 25°C
J
T = 25°C
J
0
1
2
3
4
0
1
2
3
I , COLLECTOR CURRENT (AMPS)
C
I , COLLECTOR CURRENT (AMPS)
C
Figure 16. Inductive Storage Time,
Figure 15. Inductive Storage Time,
t
si @ IC/IB = 10
t
si @ IC/IB = 5
600
500
400
300
200
400
300
200
I
= I
Bon Boff
= 15 V
T = 125°C
J
I
= I
Boff Bon
= 15 V
V
CC
T = 25°C
J
V
CC
V = 300 V
Z
V = 300 V
Z
t
c
L = 200 mH
C
L = 200 mH
C
100
0
100
0
T = 125°C
J
T = 25°C
J
t
fi
0
1
2
3
0
1
2
3
4
I , COLLECTOR CURRENT (AMPS)
C
I , COLLECTOR CURRENT (AMPS)
C
Figure 17. Inductive Switching,
tc & tfi @ IC/IB = 5
Figure 18. Inductive Switching,
tfi @ IC/IB = 10
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BUL45D2G
TYPICAL SWITCHING CHARACTERISTICS
1500
1000
5
I
= I
Bon Boff
= 15 V
T = 125°C
T = 25°C
J
I
= I
Boff Bon
= 15 V
T = 125°C
T = 25°C
J
J
J
V
CC
V
CC
V = 300 V
Z
V = 300 V
Z
I = 1 A
C
L = 200 mH
C
L = 200 mH
C
4
3
500
I = 2 A
C
0
2
0
1
2
3
4
0
5
10
15
20
I , COLLECTOR CURRENT (AMPS)
C
h
FE
, FORCED GAIN
Figure 19. Inductive Switching,
tc @ IC/IB = 10
Figure 20. Inductive Storage Time
450
350
250
1400
1200
1000
800
I
= I
Boff Bon
= 15 V
T = 125°C
T = 25°C
J
I
= I
Bon Boff
= 15 V
T = 125°C
T = 25°C
J
J
J
V
CC
V
CC
V = 300 V
Z
V = 300 V
Z
I = 1 A
C
L = 200 mH
C
L = 200 mH
C
I = 2 A
C
600
400
150
50
200
0
I = 2 A
C
I = 1 A
C
2
4
6
8
10
12
14
16
18
20
2
4
6
8
10
h , FORCED GAIN
FE
12
14
16
18
20
h
FE
, FORCED GAIN
Figure 21. Inductive Fall Time
Figure 22. Inductive Crossover Time
3000
2000
360
340
I = I
B1 B2
I
= I
Bon Boff
= 15 V
V
dI/dt = 10 A/ms
T = 25°C
CC
V = 300 V
Z
C
L = 200 mH
C
I = 50 mA
B
I = 100 mA
B
1000
320
300
I = 200 mA
B
I = 500 mA
B
I = 1 A
B
0
0.5
1
1.5
2
2.5
3
3.5
4
0
0.5
1
1.5
2
I , COLLECTOR CURRENT (AMPS)
C
I , FORWARD CURRENT (AMP)
F
Figure 23. Inductive Storage Time, tsi
Figure 24. Forward Recovery Time tfr
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BUL45D2G
TYPICAL SWITCHING CHARACTERISTICS
10
V
CE
9
I
C
90% I
C
dyn 1 ms
8
7
6
t
fi
t
si
dyn 3 ms
10% I
C
0 V
V
10% V
clamp
clamp
5
4
3
2
t
c
90% I
B
I
B
90% I
B1
1 ms
I
B
1
0
3 ms
0
1
2
3
4
5
6
8
7
TIME
TIME
Figure 25. Dynamic Saturation
Voltage Measurements
Figure 26. Inductive Switching Measurements
V
FRM
V
(1.1 V unless
F
otherwise specified)
FR
V
F
V
F
t
fr
0.1 V
F
0
I
F
10% I
F
0
2
4
6
8
10
Figure 27. tfr Measurements
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BUL45D2G
TYPICAL SWITCHING CHARACTERISTICS
Table 1. Inductive Load Switching Drive Circuit
+15 V
I PEAK
C
100 mF
1 mF
100 W
3 W
MTP8P10
150 W
3 W
V
CE
PEAK
V
CE
MTP8P10
R
B1
MPF930
I 1
B
MUR105
MJE210
MPF930
I
+10 V
out
I
B
A
I 2
B
50
R
B2
W
COMMON
MTP12N10
150 W
3 W
V
(BR)CEO(sus)
L = 10 mH
Inductive Switching
RBSOA
L = 500 mH
L = 200 mH
R
500 mF
R
= ∞
= 20 Volts
= 100 mA
= 0
= 15 Volts
selected for
R
= 0
= 15 Volts
selected for
B2
CC
B2
B2
V
V
V
CC
CC
1 mF
I
R
B1
desired I
R
B1
C(pk)
-V
off
desired I
B1
B1
TYPICAL CHARACTERISTICS
100
6
T
≤ 125°C
C
5
GAIN ≥ 5
L = 2 mH
1 ms
10
1
C
10 ms
1 ms
4
3
2
5 ms
DC
-5 V
0.1
1
0
0 V
-1.5 V
600
0.01
10
100
, COLLECTOR-EMITTER VOLTAGE (VOLTS)
1000
200
300
400
500
700
800
V
CE
V , COLLECTOR-EMITTER VOLTAGE (VOLTS)
CE
Figure 28. Forward Bias Safe Operating Area
Figure 29. Reverse Bias Safe Operating Area
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BUL45D2G
TYPICAL CHARACTERISTICS
1
0.8
0.6
SECOND BREAKDOWN
DERATING
THERMAL DERATING
0.4
0.2
0
20
40
60
80
100
120
140
160
T , CASE TEMPERATURE (°C)
C
Figure 30. Forward Bias Power Derating
There are two limitations on the power handling ability of
a transistor: average junction temperature and second
Figure 28 may be found at any case temperature by using the
appropriate curve on Figure 30.
breakdown. Safe operating area curves indicate I −V
T
may be calculated from the data in Figure 31. At any
C
CE
J(pk)
limits of the transistor that must be observed for reliable
operation; i.e., the transistor must not be subjected to greater
dissipation than the curves indicate. The data of Figure 28 is
case temperatures, thermal limitations will reduce the power
that can be handled to values less than the limitations
imposed by second breakdown. For inductive loads, high
voltage and current must be sustained simultaneously during
turn−off with the base to emitter junction reverse biased. The
safe level is specified as a reverse biased safe operating area
(Figure 29). This rating is verified under clamped conditions
so that the device is never subjected to an avalanche mode.
based on T = 25°C; T
is variable depending on power
level. Second breakdown pulse limits are valid for duty
C
J(pk)
cycles to 10% but must be derated when T > 25°C. Second
C
breakdown limitations do not derate the same as thermal
limitations. Allowable current at the voltages shown on
TYPICAL THERMAL RESPONSE
1
0.5
0.2
0.1
P
(pk)
R
R
(t) = r(t) R
q
JC
q
JC
0.1
0.05
= 2.5°C/W MAX
q
JC
D CURVES APPLY FOR POWER
PULSE TRAIN SHOWN
READ TIME AT t
0.02
t
1
1
t
2
SINGLE PULSE
T
- T = P
C
R (t)
q
JC
J(pk)
(pk)
DUTY CYCLE, D = t /t
1 2
0.01
0.01
0.1
1
10
100
1000
t, TIME (ms)
Figure 31. Typical Thermal Response (ZqJC(t)) for BUL45D2
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10
BUL45D2G
PACKAGE DIMENSIONS
TO−220AB
CASE 221A−09
ISSUE AF
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION Z DEFINES A ZONE WHERE ALL
BODY AND LEAD IRREGULARITIES ARE
ALLOWED.
SEATING
PLANE
−T−
C
S
B
F
T
INCHES
DIM MIN MAX
MILLIMETERS
4
MIN
14.48
9.66
4.07
0.64
3.61
2.42
2.80
0.36
12.70
1.15
4.83
2.54
2.04
1.15
5.97
0.00
1.15
---
MAX
15.75
10.28
4.82
0.88
4.09
2.66
3.93
0.64
14.27
1.52
5.33
3.04
2.79
1.39
6.47
1.27
---
A
B
C
D
F
G
H
J
0.570
0.380
0.160
0.025
0.142
0.095
0.110
0.014
0.500
0.045
0.190
0.100
0.080
0.045
0.235
0.000
0.045
---
0.620
0.405
0.190
0.035
0.161
0.105
0.155
0.025
0.562
0.060
0.210
0.120
0.110
0.055
0.255
0.050
---
A
K
Q
Z
1
2
3
U
H
K
L
N
Q
R
S
T
U
V
Z
L
R
J
V
G
D
0.080
2.04
N
STYLE 1:
PIN 1. BASE
2. COLLECTOR
3. EMITTER
4. COLLECTOR
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BUL45D2/D
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