CAV24M01_18_技术文档

CAV24M01

EEPROM Serial 1-Mb I²C

-ꢀAutomotive Grade 1

Description

2

The CAV24M01 is a EEPROM Serial 1−Mb I C, internally

organized as 131,072 words of 8 bits each.

It features a 256−byte page write buffer and supports the Standard

(100 kHz), Fast (400 kHz) and Fast−Plus (1 MHz) I C protocol.

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2

Write operations can be inhibited by taking the WP pin High (this

protects the entire memory).

External address pins make it possible to address up to four

CAV24M01 devices on the same bus.

On−Chip ECC (Error Correction Code) makes the device suitable

for high reliability applications.

SOIC−8

W SUFFIX

CASE 751BD

Features

• Automotive Temperature Grade 1 (−40°C to +125°C)

TSSOP−8

Y SUFFIX

CASE 948AL

2

• Supports Standard, Fast and Fast−Plus I C Protocol

• 2.5 V to 5.5 V Supply Voltage Range

• 256−Byte Page Write Buffer

PIN CONFIGURATION

• Hardware Write Protection for Entire Memory

2

• Schmitt Triggers and Noise Suppression Filters on I C Bus Inputs

1

NC

V

CC

(SCL and SDA)

A

1

WP

• Low Power CMOS Technology

• 1,000,000 Program/Erase Cycles

• 100 Year Data Retention

• 8−pin SOIC and TSSOP Packages

• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS

Compliant

SCL

SDA

A

2

V

SS

SOIC (W), TSSOP (Y)

For the location of Pin 1, please consult the

corresponding package drawing.

V

CC

PIN FUNCTION

Pin Name

A , A

Function

Device Address

1

2

SCL

SDA

SCL

WP

Serial Data

Serial Clock

Write Protect

Power Supply

Ground

CAV24M01

SDA

A , A

2

1

WP

V

CC

V

SS

V

SS

Figure 1. Functional Symbol

ORDERING INFORMATION

See detailed ordering and shipping information in the package

dimensions section on page 9 of this data sheet.

1

Publication Order Number:

May, 2018 − Rev. 2

CAV24M01/D

CAV24M01

MARKING DIAGRAMS

M01C

AYMXXX

24M01A

AYMXXX

G

(TSSOP−8)

M01C = Specific Device Code

(SOIC−8)

A

= Assembly Location

24M01A = Specific Device Code

Y

M

XXX

= Production Year (Last Digit)

= Production Month (1−9, O, N, D)

= Last Three Digits of

= Assembly Lot Number

= Pb−Free Microdot

A

Y

M

= Assembly Location

= Production Year (Last Digit)

= Production Month (1−9, O, N, D)

XXX = Last Three Digits of

XXX = Assembly Lot Number

G

Table 1. ABSOLUTE MAXIMUM RATINGS

Parameters

Ratings

Units

Storage Temperature

–65 to +150

–0.5 to +6.5

°C

Voltage on any Pin with Respect to Ground (Note 1)

V

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

1. The DC input voltage on any pin should not be lower than −0.5 V or higher than V + 0.5 V. During transitions, the voltage on any pin may

CC

undershoot to no less than −1.5 V or overshoot to no more than V + 1.5 V, for periods of less than 20 ns.

CC

Table 2. RELIABILITY CHARACTERISTICS (Note 2)

Symbol

(Notes 3, 4)

Parameter

Min

1,000,000

100

Units

Program/Erase Cycles

Years

N

Endurance

END

T

DR

Data Retention

2. These parameters are tested initially and after a design or process change that affects the parameter according to appropriate AEC−Q100

and JEDEC test methods.

3. Test Condition: Page Mode, V = 5 V, 25°C.

CC

4. The device uses ECC (Error Correction Code) logic with 6 ECC bits to correct one bit error in 4 data bytes. Therefore, when a single byte

has to be written, 4 bytes (including the ECC bits) are re-programmed. It is recommended to write by multiple of 4 bytes in order to benefit

from the maximum number of write cycles.

Table 3. D.C. OPERATING CHARACTERISTICS V = 2.5 V to 5.5 V, T = −40°C to +125°C, unless otherwise speciﬁed.

CC

A

Symbol

Parameter

Read Current

Test Conditions

= 400 kHz / 1 MHz

Min

Max

1

Units

mA

V

I

Read, f

SCL

CCR

I

Write Current

V

CC

= 5.5 V

5.0

5

CCW

I

SB

Standby Current

I/O Pin Leakage

Input Low Voltage

Input High Voltage

Output Low Voltage

All I/O Pins at GND or V

T = −40°C to +125°C

A

CC

I

L

Pin at GND or V

T = −40°C to +125°C

A

2

CC

V

−0.5

0.3 V

CC

IL1

IH1

OL1

V

0.7 V

V

+ 0.5

V

CC

V

I

OL

= 3.0 mA

0.4

V

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2

CAV24M01

Table 4. PIN IMPEDANCE CHARACTERISTICS V = 2.5 V to 5.5 V, T = −40°C to +125°C, unless otherwise speciﬁed.

CC

A

Symbol

Parameter

SDA I/O Pin Capacitance

Input Capacitance (other pins)

WP Input Current, Address Input Current (A , A )

Conditions

= 0 V

Max

8

Units

pF

C

(Note 5)

V

IN

V

IN

V

IN

V

IN

V

IN

= 0 V

< V , V = 5.5 V

6

pF

I

, I (Note 6)

75

50

2

mA

WP

A

1

2

IH

CC

< V , V = 3.3 V

IH

CC

> V

5. These parameters are tested initially and after a design or process change that affects the parameter according to appropriate AEC−Q100

and JEDEC test methods.

6. When not driven, the WP, A , A pins are pulled down to GND internally. For improved noise immunity, the internal pull−down is relatively

1

2

strong; therefore the external driver must be able to supply the pull−down current when attempting to drive the input HIGH. To conserve power,

as the input level exceeds the trip point of the CMOS input buffer (~ 0.5 x V ), the strong pull−down reverts to a weak current source.

CC

Table 5. A.C. CHARACTERISTICS (Note 7) V = 2.5 V to 5.5 V, T = −40°C to +125°C, unless otherwise specified.

CC

A

Fast−Plus

T

A

= −405C to +855C

Standard

Fast

Min

Max

Min

Max

Min

Max

Symbol

Parameter

Clock Frequency

Units

kHz

ms

F

SCL

100

400

1,000

t

START Condition Hold Time

Low Period of SCL Clock

High Period of SCL Clock

START Condition Setup Time

Data In Hold Time

4

4.7

4

0.6

1.3

0.6

0

0.25

0.45

0.40

0.25

0

HD:STA

t

ms

LOW

t

ms

HIGH

t

4.7

0

ms

SU:STA

HD:DAT

t

ms

t

Data In Setup Time

250

100

50

ns

SU:DAT

t

(Note 8)

SDA and SCL Rise Time

SDA and SCL Fall Time

STOP Condition Setup Time

1,000

300

100

ns

R

t (Note 8)

ns

F

t

4

0.6

1.3

0.25

0.5

ms

SU:STO

t

Bus Free Time Between

STOP and START

4.7

ms

BUF

t

SCL Low to Data Out Valid

Data Out Hold Time

3.5

50

0.9

50

0.40

50

ms

ns

AA

t

50

DH

T (Note 8)

Noise Pulse Filtered at SCL

and SDA Inputs

i

t

WP Setup Time

0

1

ms

SU:WP

t

WP Hold Time

2.5

HD:WP

t

Write Cycle Time

Power-up to Ready Mode

5

ms

WR

t

(Notes 8, 9)

0.1

PU

7. Test conditions according to “A.C. Test Conditions” table.

8. Tested initially and after a design or process change that affects this parameter.

9. t is the delay between the time V is stable and the device is ready to accept commands.

PU

CC

Table 6. A.C. TEST CONDITIONS

Input Levels

0.2 x V to 0.8 x V

CC

Input Rise and Fall Times

Input Reference Levels

Output Reference Levels

Output Load

≤ 50 ns

0.3 x V , 0.7 x V

CC

0.5 x V

CC

Current Source: I = 3 mA; C = 100 pF

L

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3

CAV24M01

Power-On Reset (POR)

During data transfer, the SDA line must remain stable

while the SCL line is HIGH. An SDA transition while SCL

is HIGH will be interpreted as a START or STOP condition

(Figure 2).

The CAV24M01 incorporates Power−On Reset (POR)

circuitry which protects the internal logic against powering

up in the wrong state.

The device will power up into Standby mode after V

exceeds the POR trigger level and will power down into

CC

START

The START condition precedes all commands. It consists

of a HIGH to LOW transition on SDA while SCL is HIGH.

The START acts as a ‘wake−up’ call to all receivers. Absent

a START, a Slave will not respond to commands.

Reset mode when V drops below the POR trigger level.

CC

This bi−directional POR behavior protects the device

against brown−out failure, following a temporary loss of

power.

STOP

Pin Description

The STOP condition completes all commands. It consists

of a LOW to HIGH transition on SDA while SCL is HIGH.

The STOP starts the internal Write cycle (when following a

Write command) or sends the Slave into standby mode

(when following a Read command).

SCL: The Serial Clock input pin accepts the Serial Clock

signal generated by the Master.

SDA: The Serial Data I/O pin receives input data and

transmits data stored in EEPROM. In transmit mode, this pin

is open drain. Data is acquired on the positive edge, and is

delivered on the negative edge of SCL.

Device Addressing

The Master initiates data transfer by creating a START

condition on the bus. The Master then broadcasts an 8−bit

serial Slave address. The first 4 bits of the Slave address are

set to 1010, for normal Read/Write operations (Figure 3).

The next 2 bits, A2, A1, select one of 4 possible memory

A and A : The Address pins accept the device address.

1

2

These pins have on−chip pull−down resistors.

WP: The Write Protect input pin inhibits all write

operations, when pulled HIGH. This pin has an on−chip

pull−down resistor.

2

devices connected on a single I C bus. The A2 and A1 bits

must match the state of the external address pins. The

seventh bit, a16 is the most significant internal address bit.

The last bit, R/W, specifies whether a Read (1) or Write (0)

operation is to be performed. To select an internal memory

location (data byte) a 17−bit address word is required:

a16 bit from the Slave address byte followed by two address

bytes.

Functional Description

The CAV24M01 supports the Inter−Integrated Circuit

2

(I C) Bus data transmission protocol, which defines a device

that sends data to the bus as a transmitter and a device

receiving data as a receiver. Data flow is controlled by a

Master device, which generates the serial clock and all

START and STOP conditions. The CAV24M01 acts as a

Slave device. Master and Slave alternate as either

transmitter or receiver. Up to 4 devices may be connected to

Acknowledge

After processing the Slave address, the Slave responds

with an acknowledge (ACK) by pulling down the SDA line

during the 9th clock cycle (Figure 4). The Slave will also

acknowledge the byte address and every data byte presented

in Write mode. In Read mode the Slave shifts out a data byte,

and then releases the SDA line during the 9th clock cycle. If

the Master acknowledges the data, then the Slave continues

transmitting. The Master terminates the session by not

acknowledging the last data byte (NoACK) and by sending

a STOP to the Slave. Bus timing is illustrated in Figure 5.

the bus as determined by the device address inputs A and

A .

2

1

I²C Bus Protocol

2

The I C bus consists of two ‘wires’, SCL and SDA. The

two wires are connected to the V supply via pull−up

CC

resistors. Master and Slave devices connect to the 2−wire

bus via their respective SCL and SDA pins. The transmitting

device pulls down the SDA line to ‘transmit’ a ‘0’ and

releases it to ‘transmit’ a ‘1’.

Data transfer may be initiated only when the bus is not

busy (see A.C. Characteristics).

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4

CAV24M01

SCL

SDA

START

CONDITION

STOP

CONDITION

Figure 2. Start/Stop Timing

1

0

1

0

A

2

A

1

a

16

R/W

DEVICE ADDRESS

Figure 3. Slave Address Bits

BUS RELEASE DELAY (TRANSMITTER)

BUS RELEASE DELAY (RECEIVER)

SCL FROM

MASTER

1

8

9

DATA OUTPUT

FROM TRANSMITTER

DATA OUTPUT

FROM RECEIVER

ACK SETUP (≥ t

)

SU:DAT

START

ACK DELAY (≤ t

)

AA

Figure 4. Acknowledge Timing

t

F

t

R

HIGH

t

LOW

SCL

t

HD:DAT

SU:STA

t

SU:DAT

SU:STO

HD:STA

SDA IN

t

BUF

t

AA

t

DH

SDA OUT

Figure 5. Bus Timing

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5

CAV24M01

Acknowledge Polling

WRITE OPERATIONS

Acknowledge polling can be used to determine if the

CAV24M01 is busy writing or is ready to accept commands.

Polling is implemented by interrogating the device with a

‘Selective Read’ command (see READ OPERATIONS).

The CAV24M01 will not acknowledge the Slave address,

as long as internal Write is in progress.

Byte Write

In Byte Write mode the Master sends a START, followed

by Slave address, two byte address and data to be written

(Figure 6). The Slave acknowledges all 4 bytes, and the

Master then follows up with a STOP, which in turn starts the

internal Write operation (Figure 7). During internal Write,

the Slave will not acknowledge any Read or Write request

from the Master.

Hardware Write Protection

With the WP pin held HIGH, the entire memory is

protected against Write operations. If the WP pin is left

floating or is grounded, it has no impact on the operation of

the CAV24M01. The state of the WP pin is strobed on the last

falling edge of SCL immediately preceding the first data

byte (Figure 9). If the WP pin is HIGH during the strobe

interval, the CAV24M01 will not acknowledge the data byte

and the Write request will be rejected.

Page Write

The CAV24M01 contains 131,072 bytes of data, arranged

in 512 pages of 256 bytes each. The most significant 9 bits

of the address word (a16 from the Slave Address byte and

most significant Address byte) identify the page and the last

8 bits identify the byte within the page. The 17−bit address

word (a16 from the Slave Address byte followed by two

address bytes) points to the first byte to be written. Up to 256

bytes can be written in one Write cycle (Figure 8).

The internal byte address counter is automatically

incremented after each data byte is loaded. If the Master

transmits more than 256 data bytes, then earlier bytes will be

overwritten by later bytes in a ‘wrap−around’ fashion

(within the selected page). The internal Write cycle starts

immediately following the STOP.

Delivery State

The CAV24M01 is shipped erased, i.e., all bytes are FFh.

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6

CAV24M01

S

T

A

R

T

S

T

BUS ACTIVITY:

MASTER

SLAVE

BYTE ADDRESS

8

O

P

ADDRESS

DATA

a

15

− a

a − a

7 0

SDA LINE

S

P

A

C

K

A

C

K

A

C

K

A

C

K

Figure 6. Byte Write Timing

SCL

SDA

8th Bit

Byte n

ACK

t

WR

STOP

START

CONDITION

ADDRESS

CONDITION

Figure 7. Write Cycle Timing

S

T

A

R

T

BUS

ACTIVITY:

MASTER

S

T

SLAVE

ADDRESS

BYTE ADDRESS

− a a − a

7 0

O

P

a

15

DATA n

DATA n+1

DATA n+x

8

S

P

SDA LINE

A

C

K

A

C

K

A

C

K

A

C

K

A

C

K

C

K

C

K

Figure 8. Page Write Timing

ADDRESS

BYTE

DATA

BYTE

1

8

9

8

d

SCL

a

0

d

7

SDA

WP

7

0

t

SU:WP

t

HD:WP

Figure 9. WP Timing

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7

CAV24M01

READ OPERATIONS

The address counter can be initialized by performing a

‘dummy’ Write operation (Figure 11). Here the START is

followed by the Slave address (with the R/W bit set to ‘0’)

and the desired two byte address. Instead of following up

with data, the Master then issues a 2nd START, followed by

the ‘Immediate Address Read’ sequence, as described

earlier.

Immediate Address Read

In standby mode, the CAV24M01 internal address counter

points to the data byte immediately following the last byte

accessed by a previous operation. If that ‘previous’ byte was

the last byte in memory, then the address counter will point

to the 1st memory byte, etc.

When, following a START, the CAV24M01 is presented

with a Slave address containing a ‘1’ in the R/W bit position

(Figure 10), it will acknowledge (ACK) in the 9th clock cycle,

and will then transmit data being pointed at by the internal

address counter. The Master can stop further transmission by

issuing a NoACK, followed by a STOP condition.

Sequential Read

If the Master acknowledges the 1st data byte transmitted

by the CAV24M01, then the device will continue

transmitting as long as each data byte is acknowledged by

the Master (Figure 12). If the end of memory is reached

during sequential Read, then the address counter will

‘wrap−around’ to the beginning of memory, etc. Sequential

Read works with either ‘Immediate Address Read’ or

‘Selective Read’, the only difference being the starting byte

address.

Selective Read

The Read operation can also be started at an address

different from the one stored in the internal address counter.

S

T

S

T

A

R

T

BUS ACTIVITY:

MASTER

SLAVE

ADDRESS

O

P

SDA LINE

S

P

A

C

K

N

O

A

C

K

DATA

SCL

SDA

8

9

8th Bit

DATA OUT

NO ACK

STOP

Figure 10. Immediate Address Read Timing

S

T

A

R

T

S

T

S

T

BUS ACTIVITY:

MASTER

A

R

T

BYTE ADDRESS

− a a − a

7 0

SLAVE

O

P

ADDRESS

a

15

DATA

8

S

P

SDA LINE

N

O

A

C

K

A

C

K

A

C

K

A

C

K

A

C

K

Figure 11. Selective Read Timing

S

T

BUS ACTIVITY:

MASTER

SLAVE

ADDRESS

O

P

DATA n

DATA n+1

DATA n+2

DATA n+x

P

SDA LINE

N

O

A

C

K

A

C

K

A

C

K

A

C

K

A

C

K

Figure 12. Sequential Read Timing

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8

CAV24M01

ORDERING INFORMATION (Note 10)

Specific

Device

Marking

Device Order

Number

Temperature

Range

Lead

Finish

†

Package Type

SOIC−8, JEDEC

TSSOP−8

Shipping

CAV24M01WE−GT3

CAV24M01YE−GT3

24M01A

M01C

−40°C to +125°C

NiPdAu

Tape & Reel, 3,000 Units / Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

10.All packages are RoHS-compliant (Lead-free, Halogen-free).

2

ON Semiconductor is licensed by the Philips Corporation to carry the I C bus protocol.

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9

MECHANICAL CASE OUTLINE

PACKAGE DIMENSIONS

SOIC 8, 150 mils

CASE 751BD−01

ISSUE O

DATE 19 DEC 2008

SYMBOL

MIN

NOM

MAX

1.35

A

1.75

A1

b

0.10

0.33

0.19

4.80

5.80

3.80

0.25

0.51

0.25

5.00

6.20

4.00

c

E1

E

D

E

E1

e

h

L

θ

1.27 BSC

0.25

0.40

0º

0.50

1.27

8º

PIN # 1

IDENTIFICATION

TOP VIEW

D

h

A1

θ

A

c

e

b

L

SIDE VIEW

END VIEW

Notes:

(1) All dimensions are in millimeters. Angles in degrees.

(2) Complies with JEDEC MS-012.

98AON34272E

DOCUMENT NUMBER:

STATUS:

Electronic versions are uncontrolled except when

accessed directly from the Document Repository. Printed

versions are uncontrolled except when stamped

“CONTROLLED COPY” in red.

ON SEMICONDUCTOR STANDARD

REFERENCE:

Case Outline Number:

http://onsemi.com

1

October, 2002 − Rev. 0

DESCRIPTION: SOIC 8, 150 MILS

PAGE 1 OFX2XX

DOCUMENT NUMBER:

98AON34272E

PAGE 2 OF 2

ISSUE

REVISION

DATE

19 DEC 2008

O

RELEASED FOR PRODUCTION FROM POD #SOIC8−002−01 TO ON

SEMICONDUCTOR. REQ. BY B. BERGMAN.

ON Semiconductor and

are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice

to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability

arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.

“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All

operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights

nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications

intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should

Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,

and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death

associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal

Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

Case Outline Number:

December, 2008 − Rev. 01O

751BD

MECHANICAL CASE OUTLINE

PACKAGE DIMENSIONS

TSSOP8, 4.4x3

CASE 948AL−01

ISSUE O

DATE 19 DEC 2008

b

SYMBOL

MIN

NOM

MAX

A

A1

A2

b

1.20

0.15

1.05

0.30

0.20

3.10

6.50

4.50

0.05

0.80

0.19

0.09

2.90

6.30

4.30

0.90

E

c

E1

D

3.00

6.40

E

E1

e

4.40

0.65 BSC

1.00 REF

0.60

L

L1

0.50

0.75

0º

8º

θ

e

TOP VIEW

D

c

A2

A

q1

A1

L1

L

SIDE VIEW

END VIEW

Notes:

(1) All dimensions are in millimeters. Angles in degrees.

(2) Complies with JEDEC MO-153.

98AON34428E

ON SEMICONDUCTOR STANDARD

DOCUMENT NUMBER:

STATUS:

Electronic versions are uncontrolled except when

accessed directly from the Document Repository. Printed

versions are uncontrolled except when stamped

“CONTROLLED COPY” in red.

REFERENCE:

Case Outline Number:

http://onsemi.com

1

October, 2002 − Rev. 0

DESCRIPTION: TSSOP8, 4.4X3

PAGE 1 OFX2XX

DOCUMENT NUMBER:

98AON34428E

PAGE 2 OF 2

ISSUE

REVISION

DATE

O

RELEASED FOR PRODUCTION FROM POD #TSSOP8−004−01 TO ON