CM1400-32CP [ONSEMI]
6-Channel EMI Filter Array with ESD Protection;型号: | CM1400-32CP |
厂家: | ONSEMI |
描述: | 6-Channel EMI Filter Array with ESD Protection 数据线路滤波器 过滤器 |
文件: | 总14页 (文件大小:743K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
6 Channel EMI Filter Array
with ESD Protection
CM1400-03
Features
Product Description
•
Functionally and pin compatible with
CSPEMI306A device
The CM1400-03 is a six channel low-pass filter array
that reduces EMI/RFI emissions while at the same
time providing ESD protection. It is used on data
ports on mobile devices. To reduce EMI/RFI
emissions, the CM1400-03 integrates a pi-style filter
(C-R-C) for each of the 6 channels. Each high quality
filter provides greater than 30dB attenuation in the
800-2700 MHz range relative to the pass band
attenuation. These pi-style filters also support
bidirectional filtering, controlling EMI both to and from
a data port connector.
•
OptiGuard™ coated for improved reliability at
assembly
Six channels of EMI filtering for data ports
Pi-style EMI filters in a capacitor-resistor-
capacitor (C-R-C) network
40dB absolute attenuation (typical) at 1 GHz
35dB attenuation (typical) at 1 GHz relative to
pass band
15kV ESD protection on each channel
(IEC 61000-4-2 Level 4, contact discharge)
30kV ESD protection on each channel (HBM)
15-bump, 2.960mm X 1.330mm footprint
Chip Scale Package (CSP)
•
•
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•
•
•
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In addition, the CM1400-03 provides a very high level
of protection for sensitive electronic components that
may be subjected to electrostatic discharge (ESD).
The input pins are designed and characterized to
safely dissipate ESD strikes of 15kV, exceeding the
•
•
Chip Scale Package features extremely low
lead inductance for optimum filter and ESD
performance
RoHS compliant (lead-free) finishing
maximum requirement of the IEC 61000-4-2
international standard. Using the MIL-STD-883
(Method 3015) specification for Human Body Model
(HBM) ESD, the device provides protection for
contact discharges to greater than 30kV.
Applications
•
EMI filtering and ESD protection for both data
and I/O ports
The CM1400-03 is particularly well suited for portable
electronics (e.g., cellular telephones, PDAs, notebook
computers) because of its small package footprint
and low weight.
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Wireless Handsets
Handheld PCs / PDAs
MP3 Players
Notebooks
Desktop PCs
The CM1400-03 incorporates OptiGuard™ coating
which results in improved reliability at assembly. The
CM1400-03 is available in a space-saving, low-profile
chip scale package with RoHS compliant lead-free
finishing.
©2010 SCILLC. All rights reserved.
April 2010 Rev. 3
Publication Order Number:
CM1400-03/D
CM1400-03
Block Diagram
Package/Pinout Diagrams
Rev. 3 | Page 2 of 14 | www.onsemi.com
CM1400-03
PIN DESCRIPTIONS
PIN(s)
NAME
DESCRIPTION
A1
FILTER1
Filter Channel 1
Filter Channel 2
Filter Channel 3
Filter Channel 4
Filter Channel 5
Filter Channel 6
Device Ground
Filter Channel 1
Filter Channel 2
Filter Channel 3
Filter Channel 4
Filter Channel 5
Filter Channel 6
A2
A3
FILTER2
FILTER3
FILTER4
FILTER5
FILTER6
GND
A4
A5
A6
B1-B3
C1
FILTER1
FILTER2
FILTER3
FILTER4
FILTER5
FILTER6
C2
C3
C4
C5
C6
Ordering Information
PART NUMBERING INFORMATION
Bumps
Package
CSP
Ordering Part Number1
Part Marking
15
CM1400-03CP
N003
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Rev. 3 | Page 3 of 14 | www.onsemi.com
CM1400-03
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
UNITS
Storage Temperature Range
-65 to +150
°C
DC Power per Resistor
100
600
mW
mW
DC Package Power Rating
STANDARD OPERATING CONDITIONS
PARAMETER
RATING
UNITS
Operating Temperature Range
-40 to +85
°C
Rev. 3 | Page 4 of 14 | www.onsemi.com
CM1400-03
ELECTRICAL OPERATING CHARACTERISTICS(SEE NOTE1)
SYMBOL PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
R
Resistance
80
100
120
Ω
C
Capacitance
At 2.5V DC
24
30
1200
-300
6.0
36
pF
ppm/°C
ppm/°C
V
TCR
TCC
VDIODE
ILEAK
VSIG
Temperature Coefficient of Resistance
Temperature Coefficient of Capacitance
Diode Voltage (reverse bias)
Diode Leakage Current (reverse bias)
At 2.5V DC
IDIODE=10μA
VDIODE=3.3V
ILOAD = 10mA
100
nA
Signal Voltage
Positive Clamp
Negative Clamp
5.6
-1.5
6.8
-0.8
9.0
-0.4
V
V
VESD
In-system ESD Withstand Voltage
a) Human Body Model, MIL-STD-883,
Method 3015
Note 2
30
15
kV
kV
b) Contact Discharge per IEC 61000-4-2
Level 4
VCL
Clamping Voltage during ESD Discharge
MIL-STD-883 (Method 3015), 8kV
Positive Transients
Notes 2 and 3
+10
-5
V
V
Negative Transients
Cut-off Frequency
R=100Ω, C=30pF
f
C
ZSOURCE=50Ω, ZLOAD=50Ω
58
MHz
Note 1: TA=25°C unless otherwise specified.
Note 2: ESD applied to input and output pins with respect to GND, one at a time.
Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin
A1, then clamping voltage is measured at Pin C1.
Rev. 3 | Page 5 of 14 | www.onsemi.com
CM1400-03
Performance Information
Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment)
Figure 1. Insertion Loss vs. Frequency (A1-C1 to GND B2)
Figure 2. Insertion Loss vs. Frequency (A2-C2 to GND B2)
Rev. 3 | Page 6 of 14 | www.onsemi.com
CM1400-03
Performance Information (cont’d)
Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment)
Figure 3. Insertion Loss vs. Frequency (A3-C3 to GND B2)
Figure 4. Insertion Loss vs. Frequency (A4-C4 to GND B2)
Rev. 3 | Page 7 of 14 | www.onsemi.com
CM1400-03
Performance Information (cont’d)
Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment)
Figure 5. Insertion Loss vs. Frequency (A5-C5 to GND B2)
Figure 6. Insertion Loss vs. Frequency (A6-C6 to GND B2)
Rev. 3 | Page 8 of 14 | www.onsemi.com
CM1400-03
Performance Information (cont’d)
Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment)
Figure 7. Comparison of Filter Response Curves for CM1400-03 with DC Bias
Rev. 3 | Page 9 of 14 | www.onsemi.com
CM1400-03
Performance Information (cont’d)
Figure 8. Filter Capacitance vs. Input Voltage over Temperature
(normalized to capacitance at 2.5VDC and 25°C)
Figure 9. Resistance vs. Temperature
(normalized to resistance at 25°C)
Rev. 3 | Page 10 of 14 | www.onsemi.com
CM1400-03
Application Information
PARAMETER
VALUE
Pad Size on PCB
0.240mm
Round
Pad Shape
Pad Definition
Non-Solder Mask defined pads
0.290mm Round
Solder Mask Opening
Solder Stencil Thickness
0.125mm - 0.150mm
0.300mm Round
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Flux Ratio
Solder Paste Type
50/50 by volume
No Clean
Pad Protective Finish
OSP (Entek Cu Plus 106A)
Tolerance — Edge To Corner Ball
+50μm
Solder Ball Side Coplanarity
+20μm
60 seconds
260°C
Maximum Dwell Time Above Liquidous
Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder
Paste
Non-Solder Mask Defined Pad
0.240mm DIA.
Solder Stencil Opening
0.300mm DIA.
Solder Mask Opening
0.290mm DIA.
Figure 8. Recommended Non-Solder Mask Defined Pad Illustration
Figure 9. Lead-free (SnAgCu) Solder Ball Reflow Profile
Rev. 3 | Page 11 of 14 | www.onsemi.com
CM1400-03
Mechanical Details
CSP Mechanical Specifications
The CM1400-03 is supplied in a custom Chip Scale Package (CSP). Dimensions are presented below.
PACKAGE DIMENSIONS
Custom CSP
15
Package
Bumps
Millimeters
Min Nom Max
Inches
Nom
Dim
Min
Max
2.915 2.960 3.005 0.1148 0.1165 0.1183
1.285 1.330 1.375 0.0506 0.0524 0.0541
0.495 0.500 0.505 0.0195 0.0197 0.0199
0.245 0.250 0.255 0.0096 0.0098 0.0100
0.430 0.435 0.440 0.0169 0.0171 0.0173
0.430 0.435 0.440 0.0169 0.0171 0.0173
0.180 0.230 0.280 0.0071 0.0091 0.0110
0.180 0.230 0.280 0.0071 0.0091 0.0110
0.575 0.644 0.714 0.0226 0.0254 0.0281
0.368 0.419 0.470 0.0145 0.0165 0.0185
A1
A2
B1
B2
B3
B4
C1
C2
D1
D2
Package Dimensions for
CM1400-03 Chip Scale Package
3500 pieces
# per tape and
reel
Controlling dimension: millimeters
Rev. 3 | Page 12 of 14 | www.onsemi.com
CM1400-03
CSP Tape and Reel Specifications
POCKET SIZE (mm) TAPE WIDTH
REEL
DIAMETER
QTY PER
REEL
PART NUMBER
CHIP SIZE (mm)
B0 X A0 X K0
W
P0
P1
CM1400-03
2.96 X 1.33 X 0.644
3.10 X 1.45 X 0.74
8mm
178mm (7")
3500
4mm 4mm
Figure 12. Tape and Reel Mechanical Data
Rev. 3 | Page 13 of 14 | www.onsemi.com
CM1400-03
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any
products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising
out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical”
parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating
parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the
rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to
support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or
use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors
harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such
unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action
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Rev. 3 | Page 14 of 14 | www.onsemi.com
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