CM1401-03CP [ONSEMI]

4-Channel ESD/EMI Filter Array plus 4-Channel ESD Array for USB;
CM1401-03CP
型号: CM1401-03CP
厂家: ONSEMI    ONSEMI
描述:

4-Channel ESD/EMI Filter Array plus 4-Channel ESD Array for USB

文件: 总12页 (文件大小:354K)
中文:  中文翻译
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4-Channel ESD/EMI Filter Array Plus  
4-Channel ESD Array for USB  
CM1401-32CP  
Product Description  
The CM1401-32CP is a multichannel array with four  
low-pass filter + ESD channels and four ESD-only  
channels. The CM1401-32CP reduces EMI/RFI emis-  
sions on a data port and protects against ESD on a  
USB port. Each EMI/RFI channel integrates a high  
quality pi-style filter (C-R-C) that provides greater  
than 30dB attenuation in the 800-2700 MHz range  
relative to the pass band attenuation. These pi-style  
filters are bidirectional, controlling EMI both to and  
from a data port connector.  
Features  
Functionally and pin-compatible with  
CSPEMI307A device  
OptiGuard coated for improved reliability at  
assembly  
Four channels of combined EMI/RFI filtering +  
ESD protection  
Four additional channels of ESD-only protection  
40dB absolute attenuation (typical) at 1GHz  
35dB attenuation (typical) at 1GHz relative to  
pass band  
The CM1401-32CP provides a high-level of ESD pro-  
tection on all eight channels for sensitive electronic  
components that may be subjected to electrostatic  
discharge (ESD). The input pins safely dissipate ESD  
15kV ESD protection on all channels  
(IEC 61000-4-2 Level 4, contact discharge)  
30kV ESD protection on all channels (HBM)  
15-bump, 2.960mm X 1.330mm footprint  
Chip Scale Package (CSP) features extremely  
low  
strikes of  
15kV, exceeding the maximum  
requirement of the IEC 61000-4-2 international  
standard. Using the MIL-STD-883 (Method 3015)  
specification for Human Body Model (HBM) ESD, the  
device provides protection for contact discharges to  
greater than 30kV.  
lead inductance for optimum filter and ESD  
performance  
RoHS-compliant (lead-free) finishing  
The CM1401-32CP is particularly well suited for  
portable electronics (e.g., cellular telephones, PDAs,  
notebook computers) because of its small package  
footprint and low weight.  
Applications  
EMI filtering and ESD protection for both data  
and I/O ports  
Outer four channels provide ESD protection for  
USB lines and other I/O port applications  
Wireless handsets  
Handheld PCs / PDAs  
MP3 players  
The CM1401-32CP incorporates OptiGuardcoating  
for improved reliability at assembly and comes in a  
space-saving, low-profile Chip Scale Package with  
RoHS-compliant lead-free finishing.  
Notebooks  
Desktop PCs  
©2010 SCILLC. All rights reserved.  
June 2010 Rev. 0  
Publication Order Number:  
CM1401-32CP/D  
CM1401-32CP  
Rev. P2 | Page 2 of 12 | www.onsemi.com  
CM1401-32CP  
PIN DESCRIPTIONS  
PIN(s)  
NAME  
DESCRIPTION  
A1  
ESD_1  
ESD Channel 1  
A2  
A3  
A4  
A5  
FILTER+ESD_1  
FILTER+ESD_2  
FILTER+ESD_3  
Filter + ESD Channel 1  
Filter + ESD Channel 2  
Filter + ESD Channel 3  
Filter + ESD Channel 4  
FILT  
ER+ESD_4  
A6  
B1-B3  
C1  
ESD_2  
GND  
ESD Channel 2  
Device Ground  
ESD_3  
ESD Channel 3  
C2  
FILTER+ESD_1  
FILTER+ESD_2  
FILTER+ESD_3  
FILTER+ESD_4  
ESD_4  
Filter + ESD Channel 1  
Filter + ESD Channel 2  
Filter + ESD Channel 3  
Filter + ESD Channel 4  
ESD Channel 4  
C3  
C4  
C5  
C6  
Ordering Information  
PART NUMBERING INFORMATION  
Pins  
Package  
CSP  
Variation  
Ordering Part Number1  
Part Marking  
15  
SAC387  
CM1401-32CP  
N012A  
Note 1: Parts are shipped in Tape and Reel form unless otherwise specified.  
Rev. P2 | Page 3 of 12 | www.onsemi.com  
CM1401-32CP  
Specifications  
ABSOLUTE MAXIMUM RATINGS  
PARAMETER  
RATING  
UNITS  
Storage Temperature Range  
-65 to +150  
100  
°C  
DC Power per Resistor  
mW  
mW  
DC Package Power Rating  
600  
STANDARD OPERATING CONDITIONS  
PARAMETER  
RATING  
UNITS  
Operating Temperature Range  
-40 to +85  
°C  
Rev. P2 | Page 4 of 12 | www.onsemi.com  
CM1401-32CP  
ELECTRICAL OPERATING CHARACTERISTICS(SEE NOTE1)  
SYMBOL PARAMETER  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
R
Resistance  
80  
100  
120  
Ω
C
Capacitance  
At 2.5V DC  
24  
30  
1200  
-300  
6.0  
36  
pF  
ppm/°C  
ppm/°C  
V
TCR  
TCC  
VDIODE  
ILEAK  
VSIG  
Temperature Coefficient of Resistance  
Temperature Coefficient of Capacitance  
Diode Voltage (reverse bias)  
Diode Leakage Current (reverse bias)  
At 2.5V DC  
IDIODE=10μA  
VDIODE=3.3V  
ILOAD = 10mA  
100  
nA  
Signal Voltage  
Positive Clamp  
Negative Clamp  
5.6  
-1.5  
6.8  
-0.8  
9.0  
-0.4  
V
V
VESD  
In-system ESD Withstand Voltage  
a) Human Body Model, MIL-STD-883,  
Method 3015  
Note 3  
30  
15  
kV  
kV  
b) Contact Discharge per IEC 61000-4-2  
Level 4  
VCL  
Clamping Voltage during ESD Discharge  
MIL-STD-883 (Method 3015), 8kV  
Positive Transients  
Notes 2 and 3  
+10  
-5  
V
V
Negative Transients  
Cut-off Frequency  
R=100Ω, C=30pF  
f
C
ZSOURCE=50Ω, ZLOAD=50Ω  
58  
MHz  
Note 1: TA=25°C unless otherwise specified.  
Note 2: ESD applied to input and output pins with respect to GND, one at a time.  
Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin  
A2, then clamping voltage is measured at Pin C2.  
Rev. P2 | Page 5 of 12 | www.onsemi.com  
CM1401-32CP  
Performance Information  
Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment)  
Figure 1. Insertion Loss vs. Frequency (A1-C1 to GND B2)  
Figure 2. Insertion Loss vs. Frequency (A2-C2 to GND B2)  
Rev. P2 | Page 6 of 12 | www.onsemi.com  
CM1401-32CP  
Performance Information (cont’d)  
Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment)  
Figure 3. Insertion Loss vs. Frequency (A3-C3 to GND B2)  
Figure 4. Insertion Loss vs. Frequency (A4-C4 to GND B2)  
Rev. P2 | Page 7 of 12 | www.onsemi.com  
CM1401-32CP  
Performance Information (cont’d)  
Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment)  
Figure 5. Comparison of Filter Response Curves for CM1400-32CP with DC Bias  
Rev. P2 | Page 8 of 12 | www.onsemi.com  
CM1401-32CP  
Performance Information (cont’d)  
Figure 6. Filter Capacitance vs. Input Voltage over Temperature  
(normalized to capacitance at 2.5VDC and 25°C)  
Figure 7. Resistance vs. Temperature  
(normalized to resistance at 25°C)  
Rev. P2 | Page 9 of 12 | www.onsemi.com  
CM1401-32CP  
Application Information  
PARAMETER  
VALUE  
Pad Size on PCB  
0.240mm  
Pad Shape  
Round  
Non-Solder Mask defined pads  
0.290mm Round  
0.125mm - 0.150mm  
0.300mm Round  
50/50 by volume  
No Clean  
Pad Definition  
Solder Mask Opening  
Solder Stencil Thickness  
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)  
Solder Flux Ratio  
Solder Paste Type  
Pad Protective Finish  
OSP (Entek Cu Plus 106A)  
+50μm  
Tolerance — Edge To Corner Ball  
Solder Ball Side Coplanarity  
Maximum Dwell Time Above Liquidous (183°C)  
+20μm  
60 seconds  
Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder  
Paste  
260°C  
Non-Solder Mask Defined Pad  
0.240mm DIA.  
Solder Stencil Opening  
0.300mm DIA.  
Solder Mask Opening  
0.290mm DIA.  
Figure 1. Recommended Non-Solder Mask Defined Pad Illustration  
Figure 2. Lead-free (SnAgCu) Solder Ball Reflow Profile  
Rev. P2 | Page 10 of 12 | www.onsemi.com  
CM1401-32CP  
Mechanical Details  
CSP Mechanical Specifications  
The CM1401-32CP is supplied in a custom Chip Scale Package (CSP). Dimensions are presented below.  
PACKAGE DIMENSIONS  
Custom CSP  
15  
Package  
Bumps  
Millimeters  
Min Nom Max  
Inches  
Nom  
Dim  
Min  
Max  
2.915 2.960 3.005 0.1148 0.1165 0.1183  
1.285 1.330 1.375 0.0506 0.0524 0.0541  
0.495 0.500 0.505 0.0195 0.0197 0.0199  
0.245 0.250 0.255 0.0096 0.0098 0.0100  
0.430 0.435 0.440 0.0169 0.0171 0.0173  
0.430 0.435 0.440 0.0169 0.0171 0.0173  
0.180 0.230 0.280 0.0071 0.0091 0.0110  
0.180 0.230 0.280 0.0071 0.0091 0.0110  
0.575 0.644 0.714 0.0226 0.0254 0.0281  
0.368 0.419 0.470 0.0145 0.0165 0.0185  
A1  
A2  
B1  
B2  
B3  
B4  
C1  
C2  
D1  
D2  
Package Dimensions for  
CM1401-32CP Chip Scale Package  
3500 pieces  
# per tape and  
reel  
Controlling dimension: millimeters  
Rev. P2 | Page 11 of 12 | www.onsemi.com  
CM1401-32CP  
CSP Tape and Reel Specifications  
POCKET SIZE (mm) TAPE WIDTH  
REEL  
QTY PER  
PART NUMBER  
CHIP SIZE (mm)  
B0 X A0 X K0  
W
DIAMETER  
REEL  
P0  
P1  
CM1401-32CP  
2.96 X 1.33 X 0.644  
3.10 X 1.45 X 0.74  
8mm  
178mm (7")  
3500  
4mm 4mm  
Figure 12. Tape and Reel Mechanical Data  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any  
products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising  
out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical”  
parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating  
parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the  
rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to  
support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or  
use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors  
harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such  
unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action  
Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
N. American Technical Support: 800-282-9855  
ON Semiconductor Website: www.onsemi.com  
Order Literature: http://www.onsemi.com/orderlit  
Literature Distribution Center for ON Semiconductor  
P.O. Box 5163, Denver, Colorado 80217 USA  
Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada  
Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada  
Email: orderlit@onsemi.com  
Toll Free USA/Canada  
Europe, Middle East and Africa Technical  
Support:  
Phone: 421 33 790 2910  
Japan Customer Focus Center  
Phone: 81-3-5773-3850  
For additional information, please contact your local  
Sales Representative  
Rev. P2 | Page 12 of 12 | www.onsemi.com  

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