DA121TT1 [ONSEMI]

Silicon Switching Diode; 硅开关二极管


型号：	DA121TT1
厂家：	ONSEMI
描述：	Silicon Switching Diode 硅开关二极管二极管开关
文件：	总8页 (文件大小：127K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Preferred Device

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MAXIMUM RATINGS (T = 25°C)

Rating

Symbol

Max

Unit

Continuous Reverse Voltage

Recurrent Peak Forward Current

Peak Forward Surge Current

CATHODE

ANODE

200

500

FM(surge)

Pulse Width = 10

THERMAL CHARACTERISTICS

Characteristic

Symbol

Max

Unit

Total Device Dissipation,

(1)

FR–4 Board

= 25°C

225

CASE 463

SOT–416/SC–75

STYLE 2

Derated above 25°C

1.8

mW/°C

°C/W

Thermal Resistance,

Junction to Ambient

555

θJA

(1)

Total Device Dissipation,

(2)

FR–4 Board

= 25°C

360

DEVICE MARKING

Derated above 25°C

2.9

mW/°C

°C/W

Thermal Resistance,

Junction to Ambient

345

θJA

(2)

Junction and Storage

Temperature Range

T , T

J stg

–55 to

+150

°C

(1) FR–4 @ Minimum Pad

(2) FR–4 @ 1.0 × 1.0 Inch Pad

ORDERING INFORMATION

Device

DA121TT1

Package

Shipping

3000 / Tape & Reel

SOT–416

Preferred devices are recommended choices for future use

and best overall value.

This document contains information on a new product. Specifications and information

herein are subject to change without notice.

Semiconductor Components Industries, LLC, 2000

Publication Order Number:

May, 2000 – Rev. 1

DA121TT1/D

DA121TT1

ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)

Characteristic

Symbol

Min

Max

Unit

Forward Voltage

(I = 1.0 mA)

—

715

866

1000

1250

(I = 10 mA)

(I = 50 mA)

(I = 150 mA)

Reverse Current

µA

(V = 75 V)

—

1.0

(V = 75 V, T = 150°C)

(V = 25 V, T = 150°C)

Capacitance

(V = 0, f = 1.0 MHz)

—

2.0

6.0

Reverse Recovery Time

(I = I = 10 mA, R = 50 Ω) (Figure 1)

Stored Charge

(I = 10 mA to V = 6.0 V, R = 500 Ω) (Figure 2)

Forward Recovery Voltage

(I = 10 mA, t = 20 ns) (Figure 3)

1.75

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DA121TT1

1 ns MAX

DUT

500 Ω

10%

50 Ω

DUTY CYCLE = 2%

90%

100 ns

Figure 1. Reverse Recovery Time Equivalent Test Circuit

OSCILLOSCOPE

R ≥ 10 MΩ

C ≤ 7 pF

DUT

BAW62

243 pF

500 Ω

20 ns MAX

100 KΩ

10%

DUTY CYCLE = 2%

90%

400 ns

Figure 2. Recovery Charge Equivalent Test Circuit

120 ns

1 KΩ

450 Ω

90%

DUT

50 Ω

10%

DUTY CYCLE = 2%

2 ns MAX

Figure 3. Forward Recovery Voltage Equivalent Test Circuit

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DA121TT1

100

T = 150°C

T = 125°C

1.0

T = 85°C

0.1

0.01

T = 25°C

T = 55°C

1.0

0.1

T = –40°C

T = 25°C

0.001

0.2

0.4

0.6

0.8

1.0

1.2

V , FORWARD VOLTAGE (VOLTS)

V , REVERSE VOLTAGE (VOLTS)

Figure 4. Forward Voltage

Figure 5. Leakage Current

0.68

0.64

0.60

0.56

0.52

V , REVERSE VOLTAGE (VOLTS)

Figure 6. Capacitance

1.0

0.1

D = 0.5

0.2

0.1

0.05

0.02

0.01

SINGLE PULSE

0.001

0.00001

0.0001

0.001

0.01

0.1

t, TIME (s)

1.0

100

1000

Figure 7. Normalized Thermal Response

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DA121TT1

INFORMATION FOR USING THE SOT-416 SURFACE MOUNT PACKAGE

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS

Surface mount board layout is a critical portion of the

total design. The footprint for the semiconductor packages

must be the correct size to insure proper solder connection

interface between the board and the package. With the

correct pad geometry, the packages will self align when

subjected to a solder reflow process.

0.5 min. (3x)

TYPICAL

SOLDERING PATTERN

Unit: mm

1.4

SOT–416/SC–75 POWER DISSIPATION

The power dissipation of the SOT–416/SC–75 is a

function of the pad size. This can vary from the minimum

pad size for soldering to the pad size given for maximum

power dissipation. Power dissipation for a surface mount

into the equation for an ambient temperature T of 25°C,

one can calculate the power dissipation of the device which

in this case is 225 milliwatts.

150°C – 25°C

555°C/W

= 225 milliwatts

device is determined by T

, the maximum rated

J(max)

junction temperature of the die, R

, the thermal

θJA

resistance from the device junction to ambient; and the

operating temperature, T . Using the values provided on

The 555°C/W assumes the use of the recommended

footprint on a glass epoxy printed circuit board to achieve a

power dissipation of 225 milliwatts. Another alternative

would be to use a ceramic substrate or an aluminum core

board such as Thermal Clad . Using a board material such

as Thermal Clad, a higher power dissipation can be

achieved using the same footprint.

the data sheet, P can be calculated as follows.

– T

J(max)

θJA

The values for the equation are found in the maximum

ratings table on the data sheet. Substituting these values

SOLDERING PRECAUTIONS

The melting temperature of solder is higher than the rated

temperature of the device. When the entire device is heated

to a high temperature, failure to complete soldering within

a short time could result in device failure. Therefore, the

following items should always be observed in order to

minimize the thermal stress to which the devices are

subjected.

• Always preheat the device.

• The delta temperature between the preheat and

soldering should be 100°C or less.*

• When preheating and soldering, the temperature of the

leads and the case must not exceed the maximum

temperature ratings as shown on the data sheet. When

using infrared heating with the reflow soldering

method, the difference should be a maximum of 10°C.

• The soldering temperature and time should not exceed

260°C for more than 10 seconds.

• When shifting from preheating to soldering, the

maximum temperature gradient should be 5°C or less.

• After soldering has been completed, the device should

be allowed to cool naturally for at least three minutes.

Gradual cooling should be used as the use of forced

cooling will increase the temperature gradient and

result in latent failure due to mechanical stress.

• Mechanical stress or shock should not be applied

during cooling

* Soldering a device without preheating can cause

excessive thermal shock and stress which can result in

damage to the device.

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DA121TT1

SOLDER STENCIL GUIDELINES

Prior to placing surface mount components onto a printed

The stencil opening size for the surface mounted package

should be the same as the pad size on the printed circuit

board, i.e., a 1:1 registration.

circuit board, solder paste must be applied to the pads. A

solder stencil is required to screen the optimum amount of

solder paste onto the footprint. The stencil is made of brass

or stainless steel with a typical thickness of 0.008 inches.

TYPICAL SOLDER HEATING PROFILE

For any given circuit board, there will be a group of

control settings that will give the desired heat pattern. The

operator must set temperatures for several heating zones,

and a figure for belt speed. Taken together, these control

settings make up a heating “profile” for that particular

circuit board. On machines controlled by a computer, the

computer remembers these profiles from one operating

session to the next. Figure NO TAG shows a typical heating

profile for use when soldering a surface mount device to a

printed circuit board. This profile will vary among

soldering systems but it is a good starting point. Factors that

can affect the profile include the type of soldering system in

use, density and types of components on the board, type of

solder used, and the type of board or substrate material

being used. This profile shows temperature versus time.

The line on the graph shows the actual temperature that

might be experienced on the surface of a test board at or

near a central solder joint. The two profiles are based on a

high density and a low density board. The Vitronics

SMD310 convection/infrared reflow soldering system was

used to generate this profile. The type of solder used was

62/36/2 Tin Lead Silver with a melting point between

177–189°C. When this type of furnace is used for solder

reflow work, the circuit boards and solder joints tend to

heat first. The components on the board are then heated by

conduction. The circuit board, because it has a large surface

area, absorbs the thermal energy more efficiently, then

distributes this energy to the components. Because of this

effect, the main body of a component may be up to 30

degrees cooler than the adjacent solder joints.

STEP 5

HEATING

ZONES 4 & 7

“SPIKE”

STEP 6 STEP 7

VENT COOLING

STEP 1

PREHEAT

ZONE 1

STEP 2

VENT

“SOAK” ZONES 2 & 5

“RAMP”

STEP 3

HEATING

STEP 4

HEATING

ZONES 3 & 6

“SOAK”

205° TO 219°C

PEAK AT

SOLDER JOINT

“RAMP”

200°C

150°C

170°C

DESIRED CURVE FOR HIGH

MASS ASSEMBLIES

160°C

150°C

SOLDER IS LIQUID FOR

40 TO 80 SECONDS

(DEPENDING ON

140°C

100°C

MASS OF ASSEMBLY)

100°C

50°C

DESIRED CURVE FOR LOW

MASS ASSEMBLIES

TIME (3 TO 7 MINUTES TOTAL)

MAX

Figure 8. Typical Solder Heating Profile

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DA121TT1

PACKAGE DIMENSIONS

SC–75 (SC–90, SOT–416)

CASE 463–01

ISSUE B

–A–

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

–B–

MILLIMETERS

DIM MIN MAX

INCHES

MIN

MAX

0.031

0.071

0.035

0.012

D 3 PL

0.70

1.40

0.60

0.15

0.80 0.028

1.80 0.055

0.90 0.024

0.30 0.006

0.20 (0.008)

0.20 (0.008) A

1.00 BSC

0.039 BSC

–––

0.10

1.45

0.10

–––

0.004

0.010

0.069

0.008

0.25 0.004

1.75 0.057

0.20 0.004

0.50 BSC

0.020 BSC

STYLE 1:

PIN 1. BASE

STYLE 2:

PIN 1. ANODE

STYLE 3:

PIN 1. ANODE

STYLE 4:

PIN 1. CATHODE

2. CATHODE

3. ANODE

2. EMITTER

3. COLLECTOR

2. N/C

3. CATHODE

2. ANODE

3. CATHODE

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DA121TT1

Thermal Clad is a trademark of the Bergquist Company.

ON Semiconductor and

are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes

withoutfurthernoticetoanyproductsherein. SCILLCmakesnowarranty,representationorguaranteeregardingthesuitabilityofitsproductsforanyparticular

purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability,

including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or

specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be

validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others.

SCILLCproductsarenotdesigned, intended, orauthorizedforuseascomponentsinsystemsintendedforsurgicalimplantintothebody, orotherapplications

intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or

death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold

SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable

attorneyfees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim

alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.

PUBLICATION ORDERING INFORMATION

NORTH AMERICA Literature Fulfillment:

CENTRAL/SOUTH AMERICA:

Literature Distribution Center for ON Semiconductor

P.O. Box 5163, Denver, Colorado 80217 USA

Spanish Phone: 303–308–7143 (Mon–Fri 8:00am to 5:00pm MST)

Email: ONlit–spanish@hibbertco.com

Phone: 303–675–2175 or 800–344–3860 Toll Free USA/Canada

Fax: 303–675–2176 or 800–344–3867 Toll Free USA/Canada

Email: ONlit@hibbertco.com

ASIA/PACIFIC: LDC for ON Semiconductor – Asia Support

Phone: 303–675–2121 (Tue–Fri 9:00am to 1:00pm, Hong Kong Time)

Toll Free from Hong Kong & Singapore:

Fax Response Line: 303–675–2167 or 800–344–3810 Toll Free USA/Canada

001–800–4422–3781

N. American Technical Support: 800–282–9855 Toll Free USA/Canada

Email: ONlit–asia@hibbertco.com

EUROPE: LDC for ON Semiconductor – European Support

German Phone: (+1) 303–308–7140 (M–F 1:00pm to 5:00pm Munich Time)

Email: ONlit–german@hibbertco.com

JAPAN: ON Semiconductor, Japan Customer Focus Center

4–32–1 Nishi–Gotanda, Shinagawa–ku, Tokyo, Japan 141–0031

Phone: 81–3–5740–2745

French Phone: (+1) 303–308–7141 (M–F 1:00pm to 5:00pm Toulouse Time)

Email: ONlit–french@hibbertco.com

English Phone: (+1) 303–308–7142 (M–F 12:00pm to 5:00pm UK Time)

Email: ONlit@hibbertco.com

Email: r14525@onsemi.com

ON Semiconductor Website: http://onsemi.com

EUROPEAN TOLL–FREE ACCESS*: 00–800–4422–3781

For additional information, please contact your local

Sales Representative.

*Available from Germany, France, Italy, England, Ireland

DA121TT1/D

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DA121TT1 [ONSEMI]

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