DF01S [ONSEMI]

1.5A桥式整流器;
DF01S
型号: DF01S
厂家: ONSEMI    ONSEMI
描述:

1.5A桥式整流器

PC 光电二极管
文件: 总6页 (文件大小:178K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DATA SHEET  
www.onsemi.com  
Bridge Rectifiers  
DF005S - DF10S  
Description  
With the everpressing need to improve power supply efficiency,  
improve surge rating, improve reliability, and reduce size, the DFxS  
family sets a standard in performance.  
PDIP4 GW  
CASE 709AE  
The design offers an surge rating of 50 A. This is important when  
improving reliability and increasing efficiency. High efficiency  
designs strive to reduce circuit resistance, which, unfortunately can  
result in increased inrush surge. As such high surge current ratings can  
be required to maintain or improve reliability.  
̃
IN  
+
OUT  
The design also offers better efficiency by achieving a 1.5 A V of  
F
̃
1.1 V maximum at 25°C. This lower V also supports cooler and more  
SDIP  
F
efficient operation.  
Finally, the DFxS achieves all this in a SDIP surface mount form  
factor, reducing board space and volumetric requirements vs.  
competitive devices.  
MARKING DIAGRAM  
Features  
2
2
Maximum Surge Rating: I  
= 50 A, I t = 10 A Sec  
FSM  
Optimized V : Typical 0.94 V at 1.5 A, 25°C  
F
Glass Passivated Junctions  
ON  
Lead Free Compliant to EU RoHS 2002/95/EU Directives  
Green Molding Compound: IEC61249  
Qualified with IR Reflow and Wave Soldering  
UL Certified, UL #E258596  
ZXYY  
DF06M  
Z
X
YY  
= Subcon Assembly Plant Code  
= Last Digit of Calendar Year  
= Weekly Payweek Date code  
DFXXXM = Specific Device Number  
xxx = 01, 02, 04, 06, 08, 10, or 005  
ORDERING INFORMATION  
See detailed ordering and shipping information on page 4 of  
this data sheet.  
© Semiconductor Components Industries, LLC, 2013  
1
Publication Order Number:  
March, 2022 Rev 2  
DF10S/D  
DF005S DF10S  
ABSOLUTE MAXIMUM RATINGS (Note 3) Values are at T = 25°C unless otherwise noted.  
A
Value  
DF005S DF01S DF02S DF04S DF06S DF08S DF10S  
Symbol  
Parameter  
Unit  
V
V
V
Maximum Repetitive Reverse Voltage  
Maximum RMS Bridge Input Voltage  
DC Reverse Voltage at Rated IR  
50  
35  
50  
100  
70  
200  
140  
200  
400  
280  
400  
1.5  
50  
600  
420  
600  
800  
560  
800  
1000  
700  
RRM  
V
RMS  
V
DC  
100  
1000  
V
I
Average Rectified Forward Current at TA = 40°C  
A
F(AV)  
I
NonRepetitive Peak Forward Surge Current  
8.3 ms Single HalfSine Wave  
A
FSM  
T
Storage Temperature Range  
55 to +150  
55 to +150  
°C  
°C  
STG  
T
J
Operating Junction Temperature  
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality  
should not be assumed, damage may occur and reliability may be affected.  
THERMAL CHARACTERISTICS Values are at T = 25°C unless otherwise noted.  
A
Symbol  
Parameter  
Value  
3.1  
Unit  
W
P
D
Power Dissipation  
R
Thermal Resistance,  
JunctiontoAmbient  
SingleDie Measurement (Note 1)  
(Maximum Land Pattern: 13 x 13 mm)  
62  
°C/W  
θ
JA  
MultiDie Measurement (Note 2)  
50  
105  
27  
(Maximum Land Pattern: 13 x 13 mm)  
MultiDie Measurement (Note 2)  
(Minimum Land Pattern: 1.3 x 1.5 mm)  
ψ
Thermal Characterization  
Parameter, Junction to Lead (Maximum and Minimum Land Pattern)  
SingleDie Measurement (Note 2)  
°C/W  
JL  
1. Device mounted on PCB with 0.5 inch x 0.5 inch (13 mm x 13 mm). Minimum Pads of 2 oz Copper.  
2. The thermal resistances (R  
& ψ ) are characterized with the device mounted on the following FR4 printed circuit boards, as shown in  
θ
JA  
JL  
Figure 1 and Figure 2. PCB size: 76.2 x 114.3 mm. Heating effect from adjacent dice is considered and only tow dices are powered at the  
same time.  
F
S
F
S
S
S
F
F
Figure 1. Maximum pads of 2 oz copper  
ELECTRICAL CHARACTERISTICS  
Figure 2. Minimun pads of 2 oz copper  
Values are at T = 25°C unless otherwise noted.  
A
Symbol  
Parameter  
Forward Voltage, per Element  
Conditions  
I = 1.5 A  
Min.  
Typ.  
Max.  
1.1  
5.0  
500  
10  
Unit  
V
V
F
F
I
R
Reverse Current, per Element at Rated V  
T = 25°C  
A
mA  
R
T = 125_C  
A
2
2
I t  
Rating for Fusing (t < 8.35 ms)  
Typical Capacitance, per Leg  
A s  
C
V
= 4.0 V,  
25  
pF  
J
R
f = 1.0 MHz  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
www.onsemi.com  
2
 
DF005S DF10S  
TYPICAL CHARACTERISTICS  
1.5  
50  
40  
1
30  
20  
10  
0
0.5  
Based on R , per Leg  
q
JA  
0
1
2
5
10  
20  
50  
100  
20  
40  
60  
80  
100  
120  
140 160  
Number of Cycles at 60 Hz  
Ambient Temperature [5C]  
Figure 3. NonRepetitive Surge Current  
Figure 4. Forward Current Derating Curve  
100  
10  
1
10  
1
T =125°C  
J
T =150°C  
J
T = 150°C  
J
T =25°C  
J
0.1  
0.01  
0.1  
T = 25°C  
J
T = 125°C  
J
T =55°C  
J
T =55°C  
J
0.01  
0.001  
0.2 0.3 0.4 0.5  
0.6 0.7 0.8 0.9 1.0 1.1 1.2  
500  
200  
300  
400  
600  
700 800  
900 1000  
Forward Voltage Drop, V [V]  
Reverse Voltage Drop, V [V]  
R
F
Figure 5. Forward Voltage Characteristics  
Figure 6. Reverse Current vs. Reverse Voltage  
www.onsemi.com  
3
DF005S DF10S  
ORDERING INFORMATION  
Product Number  
Device Code Marking  
Package  
Shipping  
DF005S  
DF01S  
DF02S  
DF04S  
DF06S  
DF08S  
DF10S  
DF005S  
DF01S  
DF02S  
DF04S  
DF06S  
DF08S  
DF10S  
PDIP4, GW  
1500 / Tape and Reel  
1500 / Tape and Reel  
1500 / Tape and Reel  
1500 / Tape and Reel  
1500 / Tape and Reel  
1500 / Tape and Reel  
1500 / Tape and Reel  
(PbFree, Halide Free)  
PDIP4, GW  
(PbFree, Halide Free)  
PDIP4, GW  
(PbFree, Halide Free)  
PDIP4 GW  
(PbFree, Halide Free)  
PDIP4, GW  
(PbFree, Halide Free)  
PDIP4, GW  
(PbFree, Halide Free)  
PDIP4, GW  
(PbFree, Halide Free)  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
www.onsemi.com  
4
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
PDIP4 GW  
CASE 709AE  
ISSUE O  
DATE 31 JUL 2016  
5.200  
5.000  
1.30  
4
3
1.50  
PIN1 ID  
OPTIONAL  
10.300  
9.400  
6.500  
6.200  
10.40  
1
2
1.200  
0.890  
5.10  
TOP VIEW  
LAND PATTERN RECOMMENDATION  
8.510  
8.050  
7.874  
7.370  
CHAMFER  
OPTIONAL  
2.60  
2.20  
0.330  
0.220  
0.330  
0.076  
1.530  
1.020  
1.12  
SIDE VIEW  
END VIEW  
NOTES:  
A. THIS PACKAGE DOES NOT CONFORM TO  
ANY REFERENCE STANDARD.  
B. ALL DIMENSIONS ARE IN MILLIMETERS.  
C. DIMENSIONS ARE EXCLUSIVE OF BURRS,  
MOLD FLASH AND TIE BAR PROTRUSIONS.  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON13473G  
PDIP4 GW  
PAGE 1 OF 1  
onsemi and  
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves  
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular  
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation  
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.  
© Semiconductor Components Industries, LLC, 2016  
www.onsemi.com  
onsemi,  
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates  
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.  
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. onsemi reserves the right to make changes at any time to any  
products or information herein, without notice. The information herein is provided “asis” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the  
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use  
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products  
and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information  
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may  
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license  
under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems  
or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should  
Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
ADDITIONAL INFORMATION  
TECHNICAL PUBLICATIONS:  
Technical Library: www.onsemi.com/design/resources/technicaldocumentation  
onsemi Website: www.onsemi.com  
ONLINE SUPPORT: www.onsemi.com/support  
For additional information, please contact your local Sales Representative at  
www.onsemi.com/support/sales  

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