FAN23SV56AMPX [ONSEMI]

6 A 同步降压稳压器;
FAN23SV56AMPX
型号: FAN23SV56AMPX
厂家: ONSEMI    ONSEMI
描述:

6 A 同步降压稳压器

稳压器
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September 2015  
FAN23SV56AMPX  
6 A Synchronous Buck Regulator  
Description  
Features  
The FAN23SV56A is a highly efficient synchronous  
buck regulator. The regulator is capable of operating  
with an input range from 7 V to 24 V and supporting 6 A  
continuous load currents. The device can operate from  
a 5 V rail (±10%) if VIN, PVIN, and PVCC are connected  
together to bypass the internal linear regulator.  
.
VIN Range: 7 V to 24 V Using Internal Linear  
Regulator for Bias  
.
VIN Range: 4.5 V to 5.5 V with VIN/PVIN/PVCC  
Connected to Bypass Internal Regulator  
The FAN23SV56A utilizes Fairchilds constant on-time  
control architecture to provide excellent transient  
response and maintain a relatively constant switching  
frequency. Pulse Frequency Modulation (PFM) Mode  
maximizes light-load efficiency by reducing switching  
frequency when the inductor is operating in  
Discontinuous Conduction Mode (DCM) at light loads,  
while clamping the minimum frequency above the  
audible range with Ultrasonic Mode.  
.
.
.
.
.
.
.
.
.
.
.
.
.
.
High Efficiency: Over 96% Peak  
Continuous Output Current: 6 A  
Accurate Enable Facilitates VIN UVLO Functionality  
PFM Mode for Light-Load Efficiency  
Excellent Line and Load Transient Response  
Precision Reference: ±1% Over Temperature  
Output Voltage Range: 0.6 to 5.5 V  
Programmable Frequency: 200 kHz to 1.5 MHz  
Programmable Soft-Start  
Switching frequency and over-current protection can  
be programmed to provide a flexible solution for  
various applications. Output over-voltage, under-  
voltage, over-current, and thermal shutdown protections  
help prevent damage to the device during fault  
conditions. A hysteresis feature restarts the device  
when normal operating temperature is reached.  
Low Shutdown Current  
Adjustable Sourcing Current Limit  
Internal Boot Diode  
Thermal Shutdown  
Halogen and Lead Free, RoHS Compliant  
Applications  
.
.
.
.
.
.
Mainstream Notebooks  
Servers and Desktop Computers  
Game Consoles  
Telecommunications  
Storage  
Base Stations  
Ordering Information  
Operating  
Temperature Range Current (A)  
Output  
Part Number  
Configuration  
Package  
34-Lead, PQFN, 5.5 mm  
x 5.0 mm  
FAN23SV56AMPX PFM with Ultrasonic Mode  
-40 to 125°C  
6
© 2015 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FAN23SV56A • Rev. 1.0  
Typical Application Diagrams  
VIN = 19V  
VIN = 19V  
R11  
10  
C10  
2.2µF  
C9  
0.1µF  
CIN  
0.1µF  
CIN  
2x10µF  
R7  
61.9kΩ  
PVCC  
VIN  
PVIN  
VCC  
EN  
Ext  
EN  
C3  
0.1µF  
R8  
10kΩ  
VOUT = 1.2V  
IOUT=0-6A  
BOOT  
SW  
FAN23SV56A  
R7, R8 used for Accurate EN  
R7, R8 open for Ext EN  
L1  
1.2µH  
PGOOD  
ILIM  
SOFT START  
FREQ  
R2  
1.5kΩ  
C4  
0.1µF  
COUT  
4x47µF  
R5 1.65kΩ  
R3  
10kΩ  
C5  
100pF  
C7  
15nF  
FB  
R9  
54.9kΩ  
R6  
4.99kΩ  
R4  
10kΩ  
AGND  
PGND  
Figure 1. Typical Application with VIN = 19 V  
VIN = 5V  
R11  
10  
C10  
2.2µF  
C9  
0.1µF  
CIN  
CIN  
0.1µF  
2x10µF  
PVCC  
VIN  
PVIN  
VCC  
EN  
Ext  
EN  
C3  
0.1µF  
VOUT = 1.2V  
IOUT=0-6A  
BOOT  
SW  
FAN23SV56A  
L1  
1.2µH  
PGOOD  
ILIM  
SOFT START  
R2  
1.5kΩ  
C4  
0.1µF  
COUT  
4x47µF  
R5 1.65kΩ  
R3  
10kΩ  
C5  
100pF  
C7  
15nF  
FREQ  
FB  
R9  
54.9kΩ  
R6  
4.99kΩ  
R4  
10kΩ  
AGND  
PGND  
Figure 2. Typical Application with VIN=5 V  
© 2015 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FAN23SV56A • Rev. 1.0  
2
 
Functional Block Diagram  
VIN  
BOOT PVIN  
PVCC  
Linear  
Regulator  
PVCC  
VCC  
VCC  
VCC UVLO  
ENABLE  
1.26V/1.14V  
PVCC  
EN  
VCC  
VCC  
10µA  
Modulator  
HS Gate  
Driver  
SS  
FB  
FB  
Comparator  
VREF  
SW  
PFM  
Comparator  
FREQ  
Control  
Logic  
2nd Level OVP  
Comparator  
x1.2  
PVCC  
1st Level OVP  
Comparator  
x1.1  
LS Gate  
Driver  
x0.9  
Under-Voltage  
Comparator  
VCC  
PGOOD  
Thermal  
Shutdown  
10µA  
Current Limit  
Comparator  
AGND  
ILIM  
PGND  
Figure 3. Block Diagram  
© 2015 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FAN23SV56A • Rev. 1.0  
3
Pin Configuration  
5
5
7
6
4
2
1
3
4
6
8
9
8
3
2
7
1
9
PVIN 10  
PVIN 11  
34 NC  
33 NC  
NC  
34  
33  
10 PVIN  
PVIN  
(P2)  
11  
12  
13  
NC  
PVIN  
FREQ  
SS  
FREQ  
32  
31  
SW 12  
SW 13  
32  
31  
SW  
SW  
SS  
AGND  
(P1)  
SW  
(P3)  
SW 14  
SW 15  
SW 16  
SW 17  
PGOOD 30  
SW  
SW  
SW  
SW  
30 PGOOD  
14  
15  
EN  
29  
28  
27  
EN  
29  
28  
27  
16  
17  
NC  
FB  
NC  
FB  
21  
20  
19  
18  
18  
19  
20  
21  
22  
23  
24  
25  
26  
25  
24  
23  
22  
26  
Figure 4. Pin Assignments(Bottom View)  
Figure 5. Pin Assignments(Top View)  
Pin Definitions  
Name  
Pad / Pin  
Description  
PVIN  
VIN  
P2, 5-11  
1
Power input for the power stage  
Power input to the linear regulator; used in the modulator for input voltage feed-forward  
Power output of the linear regulator; directly supplies power for the low-side gate driver  
and boot diode. Can be connected to VIN and PVIN for operation from 5 V rail.  
PVCC  
25  
VCC  
PGND  
AGND  
SW  
26  
Power supply input for the controller  
18-21  
Power ground for the low-side power MOSFET and for the low-side gate driver  
Analog ground for the analog portions of the IC and for substrate  
P1, 4, 23  
P3, 2, 12-17, 22 Switching node; junction between high-and low-side MOSFETs  
Supply for high-side MOSFET gate driver. A capacitor from BOOT to SW supplies the  
charge to turn on the N-channel high-side MOSFET. During the freewheeling interval  
(low-side MOSFET on), the high-side capacitor is recharged by an internal diode  
BOOT  
3
connected to PVCC.  
ILIM  
FB  
24  
27  
Current limit. A resistor between ILIM and SW sets the current limit threshold.  
Output voltage feedback to the modulator  
Enable input to the IC. Pin must be driven logic HIGH to enable or logic LOW to  
disable.  
EN  
SS  
29  
31  
32  
Soft-start input to the modulator  
On-time and frequency programming pin. Connect a resistor between FREQ and  
AGND to program on-time and switching frequency.  
FREQ  
PGOOD  
NC  
30  
Power good; open-drain output indicating VOUT is within set limits.  
Leave pin open or connect to AGND.  
28, 33-34  
© 2015 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FAN23SV56A • Rev. 1.0  
4
Absolute Maximum Ratings  
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be  
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.  
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.  
The absolute maximum ratings are stress ratings only.  
Symbol  
VPVIN  
Parameter  
Power Input  
Conditions  
Referenced to PGND  
Min.  
Max.  
Unit  
-0.3  
-0.3  
-0.3  
-0.3  
-1.0  
-5.0  
-0.3  
-0.3  
-0.3  
-0.3  
-0.3  
-0.3  
-0.3  
-0.3  
-0.3  
-0.3  
30.0  
30.0  
30.0  
33.0  
30.0  
30.0  
6.0  
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
°C  
°C  
VIN  
Modulator Input  
Referenced to AGND  
Referenced to PVCC  
VBOOT  
Boot Voltage  
Referenced to PVCC, <20 ns  
Referenced to PGND, AGND  
Referenced to PGND, AGND < 20 ns  
Referenced to SW  
VSW  
SW Voltage to GND  
Boot to SW Voltage  
Boot to PGND  
VBOOT  
Referenced to PGND  
30  
VPVCC  
VVCC  
VILIM  
VFB  
Gate Drive Supply Input  
Controller Supply Input  
Current Limit Input  
Output Voltage Feedback  
Enable Input  
Referenced to PGND, AGND  
Referenced to PGND, AGND  
Referenced to AGND  
6.0  
6.0  
6.0  
Referenced to AGND  
6.0  
VEN  
Referenced to AGND  
6.0  
VSS  
Soft-Start Input  
Referenced to AGND  
6.0  
VFREQ  
Frequency Input  
Referenced to AGND  
6.0  
VPGOOD Power-Good Output  
Referenced to AGND  
6.0  
Human Body Model, JESD22-A114  
Charged Device Model, JESD22-C101  
1000  
2500  
+150  
+150  
ESD  
Electrostatic Discharge  
TJ  
Junction Temperature  
Storage Temperature  
TSTG  
-55  
Recommended Operating Conditions  
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended  
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not  
recommend exceeding them or designing to Absolute Maximum Ratings.  
Symbol  
Parameter  
Power Input  
Conditions  
Referenced to PGND  
Min.  
Max.  
Unit  
VPVIN  
VIN  
7
7
24  
24  
V
V
Modulator Input  
Junction Temperature  
Load Current  
Referenced to AGND  
TJ  
-40  
+125  
9
°C  
A
ILOAD  
VPVIN,  
VIN  
VPVCC  
TA=25°C, No Airflow  
VPVIN, VIN, VPVCC Connected for 5 V Rail  
Operation and Referenced to PGND,  
AGND  
PVIN, VIN, and Gate Drive Supply  
Input  
,
4.5  
5.5  
V
© 2015 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FAN23SV56A • Rev. 1.0  
5
Thermal Characteristics  
The thermal characteristics were evaluated on a 4-layer PCB structure (1 oz/1 oz/1 oz/1 oz) measuring 7 cm x 7 cm)  
Symbol  
Parameter  
Thermal Resistance, Junction-to-Ambient  
Typical  
Unit  
35  
2.7  
2.3  
°C/W  
°C/W  
°C/W  
JA  
ψJC  
Thermal Characterization Parameter, Junction-to-Top of Case  
Thermal Characterization Parameter, Junction-to-PCB  
ψJPCB  
© 2015 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FAN23SV56A • Rev. 1.0  
6
Electrical Characteristics  
Unless otherwise noted; VIN=12 V, VOUT=1.2 V, and TA = TJ = -40 to +125°C. (1)  
Symbol  
Parameter  
Condition  
Min.  
Typ.  
Max.  
Unit  
Supply Current  
IVIN,SD  
IVIN,Q  
Shutdown Current  
Quiescent Current  
EN=0 V  
16  
µA  
mA  
mA  
EN=5 V, Not Switching  
EN=5 V, fSW=500 kHz  
1.8  
IVIN,GateCharge Gate Charge Current  
10  
Linear Regulator  
VREG  
IREG  
Regulator Output Voltage  
Regulator Current Limit  
4. 75  
60  
5.00  
5.25  
V
mA  
Reference, Feedback Comparator  
VFB  
IFB  
FB Voltage Trip Point  
FB Pin Bias Current  
590  
596  
0
602  
100  
mV  
nA  
-100  
Modulator  
RFREQ=56.2 kΩ,  
VIN=10 V, tON=250 ns,  
No Load  
tON  
On-Time Accuracy  
-20  
20  
%
tOFF,MIN  
DMIN  
tON,MIN  
fMINF  
Minimum SW Off-Time  
Minimum Duty Cycle  
320  
0
374  
ns  
%
FB=1 V  
Minimum SW On-Time  
Minimum Frequency Clamp  
45  
ns  
18.2  
25.4  
32.7  
kHz  
Soft-Start  
ISS  
Soft-Start Current  
SS=0.5 V  
SS<0.6 V  
VFB=0.6 V  
7
10  
13  
µA  
%
tON,SSMOD  
SS On-Time Modulation  
25  
100  
VSSCLAMP,NOM Nominal Soft-Start Voltage Clamp  
400  
40  
mV  
Soft-Start Voltage Clamp in Overload  
VSSCLAMP,OVL  
Condition  
VFB=0.3 V, OC Condition  
mV  
mV  
PFM Zero-Crossing Detection Comparator  
VOFF  
Current Limit  
ILIM  
ZCD Offset Voltage  
TA=TJ=25°C  
-6  
0
Valley Current Limit Accuracy  
TA=TJ=25°C, IVALLEY=7 A  
-10  
-1  
10  
1
%
VILIM,OFFSET Comparator Offset  
mV  
KILIM  
ILIM Set-Point Scale Factor  
258  
ILIMTC  
Temperature Coefficient  
4000  
ppm/°C  
Enable  
VTH+  
VHYS  
Rising Threshold  
Hysteresis  
1.11  
1.26  
122  
1.14  
4.5  
1.43  
1.28  
V
mV  
V
VTH-  
Falling Threshold  
Enable Voltage Clamp  
Clamp Current  
1.00  
4.3  
VENCLAMP  
IENCLAMP  
IENLK  
IEN=20 µA  
V
24  
100  
76  
µA  
nA  
µA  
Enable Pin Leakage  
Enable Pin Leakage  
VEN=1.2 V  
VEN=5 V  
IENLK  
Continued on the following page…  
© 2015 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FAN23SV56A • Rev. 1.0  
7
Electrical Characteristics (Continued)  
Unless otherwise noted; VIN=12 V, VOUT=1.2 V, and TA = TJ = -40 to +125°C. (1)  
Symbol  
UVLO  
Parameter  
Condition  
Min.  
Typ.  
Max.  
Unit  
VON  
VCC Good Threshold Rising  
Hysteresis Voltage  
4.4  
V
VHYS  
160  
mV  
Fault Protection  
VUVP  
VVOP1  
VOVP2  
RPGOOD  
PGOOD UV Trip Point  
On FB Falling  
86  
89  
92  
115  
125  
125  
2.03  
1
%
%
PGOOD OV Trip Point  
On FB Rising  
108  
118  
111  
122  
Second OV Trip Point  
On FB Rising; LS=On  
IPGOOD=2 mA  
%
PGOOD Pull-Down Resistance  
Ω
tPG,SSDELAY PGOOD Soft-Start Delay  
IPG,LEAK PGOOD Leakage Current  
Thermal Shutdown  
0.82  
1.42  
ms  
µA  
TOFF  
THYS  
Thermal Shutdown Trip Point(2)  
Hysteresis(2)  
155  
15  
°C  
°C  
Internal Bootstrap Diode  
VFBOOT Forward Voltage  
IR Reverse Leakage  
Notes:  
IF=10 mA  
VR=24 V  
0.6  
V
1000  
µA  
1. Device is 100% production tested at TA=25°C. Limits over that temperature are guaranteed by design.  
2. Guaranteed by design; not production tested.  
© 2015 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FAN23SV56A • Rev. 1.0  
8
 
 
Typical Performance Characteristics  
Tested using evaluation board circuit shown in Figure 1 with VIN=19 V, VOUT=1.2 V, fSW=500 kHz, TA=25°C, and  
no airflow; unless otherwise specified.  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
12VIN_1.05VOUT_500KHZ_1.2UH  
12VIN_1.2VOUT_500KHZ_1.2UH  
12VIN_3.3VOUT_500KHZ_2.4UH  
12VIN_5VOUT_500KHZ_3.3UH  
19VIN_1.05VOUT_500KHZ_1.2UH  
19VIN_1.2VOUT_500KHZ_1.2UH  
19VIN_3.3VOUT_500KHZ_2.4UH  
19VIN_5VOUT_500KHZ_3.3UH  
0.01  
0.1  
1
10  
0.01  
0.1  
1
10  
Load Current(A)  
Load Current(A)  
Figure 6. Efficiency vs. Load Current with VIN=19 V  
and fSW=500 kHz  
Figure 7. Efficiency vs. Load Current with VIN=12 V  
and fSW=500 kHz  
100  
90  
80  
70  
60  
50  
100  
90  
80  
70  
60  
50  
19VIN_1.2VOUT_300KHZ_1.8UH  
12VIN_1.2VOUT_300KHZ_1.8UH  
40  
40  
19VIN_1.2VOUT_500KHZ_1.2UH  
12VIN_1.2VOUT_500KHZ_1.2UH  
30  
30  
19VIN_1.2VOUT_1MHZ_0.56UH  
12VIN_1.2VOUT_1MHZ_0.56UH  
20  
20  
19VIN_1.2VOUT_1.5MHZ_0.4UH  
12VIN_1.2VOUT_1.5MHZ_0.4UH  
10  
10  
0.01  
0.1  
1
10  
0.01  
0.1  
1
10  
Load Current(A)  
Load Current(A)  
Figure 8. Efficiency vs. Load Current with VIN=19 V  
and VOUT=1.2 V  
Figure 9. Efficiency vs. Load Current with VIN=12 V  
and VOUT=1.2 V  
40  
60  
12VIN_1.2VOUT_1.5MHz_0.4uH  
19VIN_1.2VOUT_1.5MHz_0.4uH  
35  
30  
25  
20  
15  
10  
5
12VIN_1.2VOUT_1MHz_0.56uH  
12VIN_1.2VOUT_500kHz_1.2uH  
19VIN_1.2VOUT_1MHz_0.56uH  
50  
19VIN_1.2VOUT_500kHz_1.2uH  
40  
30  
20  
10  
0
0
0
2
4
6
8
10  
0
2
4
6
8
10  
Load Current(A)  
Load Current(A)  
Figure 10.Case Temperature Rise vs. Load Current  
on 4 Layer PCB, 1 oz Copper, 7 cm x 7 cm  
Figure 11.Case Temperature Rise vs. Load Current  
on 4 Layer PCB, 1 oz Copper, 7 cm x 7 cm  
© 2015 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FAN23SV56A • Rev. 1.0  
9
Typical Performance Characteristics  
Tested using evaluation board circuit shown in Figure 1 with VIN=19 V, VOUT=1.2 V, fSW=500 kHz, TA=25°C, and  
no airflow; unless otherwise specified.  
1.212  
1.208  
1.204  
1.2  
1.212  
1.208  
1.204  
1.2  
1.196  
1.192  
1.188  
1.196  
1.192  
1.188  
12VIN_1.2Vout  
19VIN_1.2Vout  
0A_1.2VOUT[V]  
6A_1.2VOUT[V]  
7
9
11 13 15 17 19 21 23 25  
0
2
4
6
8
10  
Load Current(A)  
InputVoltage (V)  
Figure 13.Line Regulation  
Figure 12. Load Regulation  
EN (5V/div)  
EN (5V/div)  
VIN=19V  
IOUT=0A  
VIN=19V  
IOUT=6A  
Soft Start (0.5V/div)  
VOUT (0.5V/div)  
Soft Start (0.5V/div)  
VOUT (0.5V/div)  
PGOOD (5V/div)  
PGOOD (5V/div)  
Time (500µs/div)  
Time (500µs/div)  
Figure 14. Startup Waveforms with 0 A Load Current Figure 15. Startup Waveforms with 10 A Load Current  
EN (5V/div)  
EN (5V/div)  
Soft Start (0.5V/div)  
VIN=19V  
IOUT=0A  
Soft Start (0.5V/div)  
VOUT (0.5V/div)  
VIN=19V  
IOUT=6A  
Vout Prebias  
VOUT (0.5V/div)  
PGOOD (5V/div)  
PGOOD (5V/div)  
Time (200µs/div)  
Time (500µs/div)  
Figure 16. Shutdown Waveforms with 10 A Load  
Current  
Figure 17. Startup Waveforms with Pre-bias Voltage  
on Output  
© 2015 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FAN23SV56A • Rev. 1.0  
10  
Typical Performance Characteristics  
Tested using evaluation board circuit shown in Figure 1 with VIN=19 V, VOUT=1.2 V, fSW=500 kHz, TA=25°C, and  
no airflow; unless otherwise specified.  
VOUT (20mV/div)  
VOUT (20mV/div)  
VIN=19V  
VIN=19V  
IOUT=0A  
IOUT=6A  
VSW (10V/div)  
VSW (10V/div)  
Time (10µs/div)  
Time (10µs/div)  
Figure 18.Static Load Ripple at Light Load  
Figure 19. Static Load Ripple at Full Load  
VOUT (20mV/div)  
VOUT (20mV/div)  
VIN=19V  
VOUT=1.2V  
VIN=19V  
VOUT=1.2V  
IOUT (1A/div)  
IOUT (1A/div)  
Time (50µs/div)  
Time (50µs/div)  
Figure 20. Operation as Load Changes from  
0 A to 2 A  
Figure 21. Operation as Load Changes from  
2 A to 0 A  
VOUT (20mV/div)  
VOUT (20mV/div)  
VIN=19V, VOUT=1.2V  
IOUT from 0A to 3A, 2.5A/us  
IOUT (2A/div)  
IOUT (2A/div)  
VIN=19V, VOUT=1.2V  
IOUT from 3A to 6A, 2.5A/us  
Time (100µs/div)  
Time (100µs/div)  
Figure 22. Load Transient from 0% to 50% Load  
Current  
Figure 23. Load Transient from 50% to 100% Load  
Current  
© 2015 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FAN23SV56A • Rev. 1.0  
11  
Typical Performance Characteristics  
Tested using evaluation board circuit shown in Figure 1 with VIN=19 V, VOUT=1.2 V, fSW=500 kHz, TA=25°C, and  
no airflow; unless otherwise specified.  
PGOOD indicates UVP  
PGOOD (5V/div)  
Pull Vout to 3.8V  
through 3Ω resistor  
Level 2  
With VOUT falling in OCP  
Vfb (0.5V/div)  
VOUT (1V/div)  
Level 1  
Soft Start (1V/div)  
Vout (1V/div)  
PGOOD (5V/div)  
IL (5A/div)  
IOUT=0A then short output  
Vsw (10V/div)  
Time (20µs/div)  
Figure 24. Over-Current Protection with Heavy Load Figure 25. Over-Voltage Protection Level 1 and Level 2  
Applied  
© 2015 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FAN23SV56A • Rev. 1.0  
12  
Circuit Operation  
The FAN23SV56A uses a constant on-time modulation  
Constant On-time Modulation  
architecture with  
a
VIN feed-forward input to  
The FAN23SV56A uses a constant on-time modulation  
technique, in which the HS MOSFET is turned on for a  
fixed time, set by the modulator, in response to the input  
voltage and the frequency setting resistor. This on-time  
is proportional to the desired output voltage, divided by  
the input voltage. With this proportionality, the frequency  
is essentially constant over the load range where  
inductor current is continuous.  
accommodate a wide VIN range. This method provides  
fixed switching frequency (fSW) operation when the  
inductor operates in Continuous Conduction Mode  
(CCM) and variable frequency when operating in Pulse  
Frequency Mode (PFM) at light loads. Additional  
benefits include excellent line and load transient  
response, cycle-by-cycle current limiting, and no  
required loop compensation.  
For buck converter in Continuous-Conduction Mode  
(CCM), the switching frequency fSW is expressed as:  
At the beginning of each cycle, FAN23SV56A turns on  
the high-side MOSFET (HS) for a fixed duration (tON). At  
the end of tON, HS turns off for a duration (tOFF  
)
ꢜꢝꢞ  
ꢚꢛ  
ꢡꢡꢡꢡꢡꢡ  
(3)  
determined by the operating conditions. Once the FB  
voltage (VFB) falls below the reference voltage (VREF), a  
new switching cycle begins.  
ꢅꢆ  ꢜꢆ  
The on-time generator sets the on-time (tON) for the  
high-side MOSFET, which results in the switching  
frequency of the regulator during steady-state operation.  
To maintain a relatively constant switching frequency  
over a wide range of input conditions, the input voltage  
information is fed into the on-time generator.  
The modulator provides a minimum off-time (tOFF-MIN) of  
320 ns to provide a guaranteed interval for low-side  
MOSFET (LS) current sensing and PFM operation. tOFF-  
is also used to provide stability against multiple  
MIN  
pulses and limit maximum switching frequency during  
transient events.  
tON is determined by:  
ꢣꢜꢆ  
ꢜꢆ  
 ꢖꢄꢡꢡꢡꢡꢡ  
(4)  
Enable  
ꢣꢜꢆ  
where ItON is:  
The enable pin can be driven with an external logic  
signal, connected to a resistive divider from PVIN/Vin to  
ground to create an Under-Voltage Lockout (UVLO)  
based on the PVIN/VIN supply, or connected to  
PVIN/VIN through a single resistor to auto-enable while  
operating within the EN pin internal clamp current sink  
capability.  
ꢅꢆ  
ꢣꢜꢆ  
ꢡꢡꢡꢡꢡ  
(5)  
ꢌꢥ   
ꢦꢧꢊꢨ  
where RFREQ is the frequency-setting resistor  
described in the Setting Switching Frequency section;  
CtON is the internal 2.2 pF capacitor; and ItON is the VIN  
feed-forward current that generates the on-time.  
The EN pin can be directly driven by logic voltages of  
5 V, 3.3 V, 2.5 V, etc. If the EN pin is driven by 5 V logic,  
a small current flows into the pin when the EN pin  
voltage exceeds the internal clamp voltage of 4.3 V. To  
eliminate clamp current flowing into the EN pin use a  
voltage divider to limit the EN pin voltage to < 4 V.  
The FAN23SV56A implements open-circuit detection on  
the FREQ pin to protect the output from an infinitely long  
on-time. In the event the FREQ pin is left floating,  
switching of the regulator is disabled. The FAN23SV56A  
is designed for VIN input range 7 to 24 V, fSW 200 kHz to  
1.5 MHz, resulting in an ItON ratio of 1 to 25.  
To implement the UVLO function based on PVIN/VIN  
voltage level, select values for R7 and R8 in Figure 1  
such that the tap point reaches 1.26 V when VIN reaches  
the desired startup level using the following equation:  
As the ratio of VOUT to VIN increases, tOFF,min introduces a  
limit on the maximum switching frequency as calculated  
in the following equation, where the factor 1.2 is  
included in the denominator to provide some headroom  
for transient operation:  
ꢅꢆꢇꢈꢉ  
 ꢀ   ꢂ   
 ꢌꢍ  
(1)  
ꢊꢆꢇꢈꢉ  
ꢜꢝꢞ  
ꢅꢆꢇꢏꢕꢉ  
where VIN,on is the input voltage for startup and VEN,on  
is the EN pin rising threshold of 1.26 V. With R8  
selected as 10 kΩ, and VIN,on=9 V the value of R7 is  
61.9 kΩ.  
ꢪꢌ   
(6)  
ꢚꢛ  
ꢌꢬꢖ  ꢜꢦꢦꢇꢏꢕꢉ  
Soft-Start (SS)  
The EN pin can be pulled high with a single resistor  
connected from VIN to the EN pin. With VIN > 5.5 V a  
series resistor is required to limit the current flow into  
the EN pin clamp to less than 24 µA to keep the internal  
clamp within normal operating range. The resistor value  
can be calculated from the following equation:  
A conventional soft-start ramp is implemented to provide  
a controlled startup sequence of the output voltage. A  
current is generated on the SS pin to charge an external  
capacitor. The lesser of the voltage on the SS pin and  
the reference voltage is used for output regulation.  
To reduce VOUT ripple and achieve a smoother ramp of  
the output voltage, tON is modulated during soft-start. tON  
starts at 50% of the steady-state on-time (PWM Mode)  
and ramps up to 100% gradually.  
ꢅꢆꢇꢏꢐꢑ  ꢊꢆꢇꢒꢓꢐꢏꢔꢇꢏꢕꢉ  
 
ꢊꢆ  
(2)  
ꢖꢖꢗꢘ  
© 2015 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FAN23SV56A • Rev. 1.0  
13  
During normal operation, the SS voltage is clamped to  
400 mV above the FB voltage. The clamp voltage drops  
to 40 mV during an overload condition to allow the  
converter to recover using the soft-start ramp once the  
overload condition is removed. On-time modulation  
during SS is disabled when an overload condition exists.  
Pulse Frequency Modulation (PFM)  
One of the key benefits of using a constant on-time  
modulation scheme is the seamless transitions in and  
out of Pulse Frequency Modulation (PFM) Mode. The  
PWM signal is not slave to a fixed oscillator and,  
therefore, can operate at any frequency below the target  
steady-state frequency. By reducing the frequency  
during light-load conditions, the efficiency can be  
significantly improved.  
To maintain a monotonic soft-start ramp, the regulator is  
forced into PFM Mode during soft-start. The minimum  
frequency clamp is disabled during soft-start.  
The FAN23SV56A provides a Zero-Crossing Detector  
(ZCD) circuit to identify when the current in the inductor  
reverses direction. To improve efficiency at light load,  
the LS MOSFET is turned off around the zero crossing  
to eliminate negative current in the inductor. For  
predictable operation entering PFM mode the controller  
waits for nine consecutive zero crossings before  
allowing the LS MOSFET to turn off.  
The nominal startup time is programmable through an  
internal current source charging the external soft-start  
capacitor CSS  
:
ꢚꢚ  ꢚꢚ  
ꢚꢚ  
ꢡꢡꢡꢡꢡ  
(7)  
ꢧꢊꢦ  
where:  
CSS = External soft-start programming capacitor;  
In PFM Mode, fSW varies or modulates proportionally to  
the load; as load decreases, fSW also decreases. The  
switching frequency, while the regulator is operating in  
PFM, can be expressed as:  
ISS = Internal soft-start charging current source,  
10 A;  
tSS = Soft-start time; and  
VREF = 600 mV  
    ꢜꢝꢞ  
  ꢅꢆ  ꢜꢝꢞ  
ꢜꢝꢞ  
ꢚꢛ  
ꢡꢡꢡꢡ  
(8)  
ꢅꢆ  
For example; for 1 ms startup time, CSS=15 nF.  
where L is inductance and IOUT is output load current.  
The soft-start option can be used for ratiometric tracking.  
When EN is LOW, the soft-start capacitor is discharged.  
Minimum Frequency Clamp  
To maintain a switching frequency above the audible  
range, the FAN23SV56A clamps the switching  
frequency to a minimum value of 18 kHz. The LS  
MOSFET is turned on to discharge the output and  
trigger a new PWM cycle. The minimum frequency  
clamp is disabled during soft-start. The minimum  
frequency clamp is not enabled in the FAN23SV56AM,  
allowing this device to operate at lower frequencies as  
the load decreases to very small levels, delivering  
higher efficiency operation.  
Startup on Pre-Bias  
FAN23SV56A allows the regulator to start on a pre-bias  
output, VOUT, and ensures VOUT is not discharged during  
the soft-start operation.  
To guarantee no glitches on VOUT at the beginning of the  
soft-start ramp, the LS is disabled until the first positive-  
going edge of the PWM signal. The regulator is also  
forced into PFM Mode during soft-start to ensure the  
inductor current remains positive, reducing the  
possibility of discharging the output voltage.  
Protection Features  
The converter output is monitored and protected against  
over-current, over-voltage, under-voltage, and high-  
temperature conditions.  
Internal Linear Regulator  
The FAN23SV56A includes  
a linear regulator to  
facilitate single-supply operation for self-biased  
applications. PVCC is the linear regulator output and  
supplies power to the internal gate drivers. The PVCC  
pin should be bypassed with a 2.2 µF ceramic capacitor.  
The device can operate from a 5 V rail if the VIN, PVIN  
and PVCC pins are connected together to bypass the  
internal linear regulator.  
Over-Current Protection (OCP)  
The FAN23SV56A uses current information through the  
LS to implement valley-current limiting. While an OC  
event is detected, the HS is prevented from turning on  
and the LS is kept on until the current falls below the  
user-defined set point. Once the current is below the set  
point, the HS is allowed to turn on.  
,
VCC Bias Supply and UVLO  
During an OC event, the output voltage may droop if the  
load current is greater than the current the converter is  
providing. If the output voltage drops below the UV  
threshold, an overload condition is triggered. During an  
overload condition, the SS clamp voltage is reduced to  
40 mV and the on-time is fixed at the steady-state  
duration. By nature of the control method; as VOUT drops,  
the switching frequency is lower due to the reduced rate  
of inductor current decay during the off-time.  
The VCC rail supplies power to the controller. It is  
generally connected to the PVCC rail through a low-  
pass filter of a 10 resistor and 0.1 µF capacitor to  
minimize any noise sources from the driver supply.  
An Under-Voltage Lockout (UVLO) circuit monitors the  
VCC voltage to ensure proper operation. Once the VCC  
voltage is above the UVLO threshold, the part begins  
operation after an initialization routine of 50 µs. There is  
no UVLO circuitry on either the PVCC or VIN rails.  
The ILIM pin has an open-detection circuit to provide  
protection against operation without a current limit.  
© 2015 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FAN23SV56A • Rev. 1.0  
14  
Under-Voltage Protection (UVP)  
R2 must be small enough to develop 12 mV of ripple:  
If VFB is below the under-voltage threshold of -11% VREF  
(534 mV), the part enters UVP and PGOOD pulls LOW.  
ꢅꢆ  ꢜꢝꢞ  ꢜꢝꢞ  
 ꢖ   
(11)  
ꢅꢆ  ꢥꢬꢥꢌꢖꢄ  ꢢꢵ    
ꢚꢛ  
Over-Voltage Protection (OVP)  
There are two levels of OV protection: +11% and +22%.  
During an over-voltage event, PGOOD pulls LOW.  
R2 must be selected such that the R2C4 time constant  
enables stable operation:  
When VFB is > +11% of VREF (666 mV), both HS and LS  
turn off. By turning off the LS during an OV event, VOUT  
overshoot can be reduced when there is positive  
inductor current by increasing the rate of discharge.  
Once the VFB voltage falls below VREF, the latched OV  
signal is cleared and operation returns to normal.  
ꢥꢬꢶꢶ  ꢖꢷ  ꢚꢛ  ꢜꢝꢞ  ꢜꢝꢞ  
(12)  
 ꢖ   
ꢢꢵ  
The minimum value of C5 can be selected to minimize  
the capacitive component of ripple appearing on the  
feedback pin:  
ꢾꢿꣀ  ꢾꢿꣀ  ꢯꣁꢶ  ꣁꢵꢰ  
A second over-voltage detection is implemented to  
protect the load from more serious failure. When VFB  
rises +22% above the VREF (732 mV), the HS latches off  
until a power cycle on VCC and the LS is forced on until  
530 mV of VFB.  
(13)  
ꢸꢹꢺꢻꢼ  
ꣁꢖ  ꣁꢶ  ꣁꢵ  ꢸꢵ  
Using the minimum value of C5 generally offers the best  
transient response, and 100 pF is a good initial value in  
many applications. Under some operating conditions,  
excessive pulse jitter may be observed. To reduce jitter  
and improve stability, the value of C5 can be increased:  
Over-Temperature Protection (OTP)  
The FAN23SV56A incorporates an over-temperature  
protection circuit that disables the converter when the  
die temperature reaches 155°C. The IC restarts when  
the die temperature falls below 140°C.  
(14)  
ꢢꢹ    ꢸꢹꢺꢻꢼ  
5 V PVCC  
Power Good (PGOOD)  
The PVCC is the output of the internal regulator that  
supplies power to the drivers and VCC. It is crucial to keep  
this pin decoupled to PGND with a ≥1 µF X5R or X7R  
ceramic capacitor. Because VCC powers internal analog  
circuit, it is filtered from PVCC with a 10 Ω resistor and  
0.1 µF X7R decoupling ceramic capacitor to AGND.  
The PGOOD pin serves as an indication to the system  
that the output voltage of the regulator is stable and  
within regulation. Whenever VOUT is outside the  
regulation window or the regulator is at over-  
temperature (UV, OV, and OT), the PGOOD pin is  
pulled LOW.  
Setting the Output Voltage (VOUT  
)
PGOOD is an open-drain output that asserts LOW when  
VOUT is out of regulation or when OT is detected.  
The output voltage VOUT is regulated by initiating a high-  
side MOSFET on-time interval when the valley of the  
divided output voltage appearing at the FB pin reaches  
VREF. Since this method regulates at the valley of the  
output ripple voltage, the actual DC output voltage on  
VOUT is offset from the programmed output voltage by  
the average value of the output ripple voltage. The initial  
regulator VOUT setting can be programmed from 0.6 V to  
5.5 V by an external resistor divider (R3 and R4):  
Application Information  
Stability  
Constant on-time stability consists of two parameters:  
stability criterion and sufficient signal at VFB.  
Stability criterion is given by:  
ꢜꢆ  
 ꢶ  
(9)  
 
ꢊꢚꢧ  ꢜꢝꢞ  
ꢡꢡꢡ  
 ꢵ   
(15)  
ꢜꢝꢞ    
ꢧꢊꢦ  
Sufficient signal requirement is given by:  
ꢲꢤꢅꢆꢳ     ꢦꢴꢡꢡꢡꢡ  
where VREF is 600 mV.  
(10)  
ꢊꢚꢧ  
For example; for 1.2 V VOUT and 10 kR3, then R4 is  
10 k. For 600 mV VOUT, R4 is left open. VFB is trimmed  
to a value of 596 mV when VREF=600 mV, so the final  
output voltage, including the effect of the output ripple  
voltage, can be approximated by the equation:  
where IIND is the inductor current ripple and VFB is  
the ripple voltage on VFB, which should be 12 mV.  
In certain applications, especially designs utilizing only  
ceramic output capacitors, there may not be sufficient  
ripple magnitude available on the feedback pin for  
stable operation. In this case, an external circuit  
consisting of 2 resistors (R2 and R6) and 2 capacitors  
(C4 and C5) can be added to inject ripple voltage into  
the FB pin (See Figure 1).  
 ꢶ  
ꢜꢝꢞꢡ  ꢦꢴꢡ  ꣇ꢌ     ꣉ꢕꢔ  
 ꢵ  
(16)  
There are some specific considerations when selecting  
the RCC ripple injector circuit. For typical applications,  
use 4.99 kΩ for R6, the value of C4 can be selected as  
0.1 µF and approximate values for R2 and C5 can be  
determined using the following equations.  
© 2015 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FAN23SV56A • Rev. 1.0  
15  
For capacitors having DC voltage bias derating, such as  
ceramic capacitors, higher rating is highly recommended.  
Setting the Switching Frequency (fSW)  
fSW is programmed through external RFREQ as follows:  
When calculating COUT  
,
usually the dominant  
ꢜꢝꢞ  
requirement is the current load step transient. If the  
unloading transient requirement (IOUT transitioning from  
HIGH to LOW), is satisfied, then the load transient (IOUT  
transitioning LOW to HIGH), is also usually satisfied.  
The unloading COUT calculation, assuming COUT has  
negligible parasitic resistance and inductance in the  
circuit path, is given by:  
 
ꢦꢧꢊꢨ  
(17)  
ꢖꢥ  ꢣꢜꢆ    
ꢚꢛ  
where CtON=2.2 pF internal capacitor that generates  
tON. For example; for fSW=500 kHz and VOUT=1.2 V,  
select a standard value for RFREQ=54.9 k.  
Inductor Selection  
The inductor is typically selected based on the ripple  
current (IL), which is usually selected as 25% to 45% of  
the maximum DC load. The inductor current rating  
should be selected such that the saturation and heating  
current ratings exceed the intended currents  
encountered in the application over the expected  
temperature range of operation. Regulators that require  
fast transient response use smaller inductance and  
higher current ripple; while regulators that require higher  
efficiency keep ripple current on the low side.  
 ꣌꣎   ꢅꢆ  
ꢜꢝꢞ     
ꢡꢡꢡꢡꢡꢡꢡꢡ  
(21)  
ꢜꢝꢞ  ꢜꢝꢞ  ꢝꢞ  
where IMAX and IMIN are maximum and minimum load  
steps, respectively and VOUT is the voltage  
overshoot, usually specified at 3 to 5%.  
For example: for VI=19 V, VOUT=1.2 V, 4 A IMAX, 2 A IMIN  
,
fSW=500 kHz, LOUT=1.2 µH, and 3% VOUT ripple of  
36 mV; the COUT value is calculated to be 164 µF. This  
capacitor requirement can be satisfied using four 47 µF,  
6.3 V-rated, X5R ceramic capacitors. This calculation  
applies for load current slew rates faster than the  
inductor current slew rate, which can be defined as  
VOUT/L during the load current removal. For reduced-  
load-current slew rates and/or reduced transient  
requirements, the output capacitor value may be  
reduced and comprised of low-cost 22 µF capacitors.  
The inductor value is given by:  
ꢅꢆ  ꢜꢝꢞ ꢜꢝꢞ  
   
(18)  
ꢲꢤ    
ꢅꢆ  
ꢚꢛ  
For example: for 19 V VIN, 1.2V VOUT, 6 A load, 30% IL,  
and 500 kHz fSW; L is 1.2 µH.  
Setting the Current Limit  
Input Capacitor Selection  
Current limit is implemented by sensing the inductor  
valley current across the LS MOSFET VDS during the LS  
on-time. The current limit comparator prevents a new  
on-time from being started until the valley current is less  
than the current limit.  
Input capacitor CIN is selected based on voltage rating,  
RMS current ICIN(RMS) rating, and capacitance. For  
capacitors having DC voltage bias derating, such as  
ceramic capacitors, higher rating is strongly  
recommended. RMS current rating is given by:  
The set point is configured by connecting a resistor from  
the ILIM pin to the SW pin. A trimmed current is output  
onto the ILIM pin, which creates a voltage across the  
resistor. When the voltage on ILIM goes negative, an  
over-current condition is detected.  
(19)  
ꢒꢅꢆꢯꢧ꣋ꢚꢰ  ꣊ꢜ꣌ꢳ꣍꣋꣌꣎  ꣏꣐  ꢯꢌ  ꣐ꢰꢡꢡꢡꢡꢡꢡꢡ  
where ILOAD-MAX is the maximum load current and D is  
the duty cycle VOUT/VIN. The maximum ICIN(RMS) occurs  
at 50% duty cycle.  
RILIM is calculated by:  
The capacitance is given by:  
꣊ꢜ꣌ꢳ꣍꣋꣌꣎    ꢯꢌ  ꣐ꢰ  
 
 ꢌꢬꢥꢖ  ꢅ꣊ꢅ꣋  ꢡꢤꢅ꣊ꢅ꣋ꢇ꣒꣌꣊꣊ꢊ꣓  
(22)  
ꢅ꣊ꢅ꣋  
ꢅꢆ  
ꢡꢡꢡꢡꢡꢡ  
(20)  
ꢚꢛ  ꢲꢄ  
ꢅꢆ  
where KILIM is the current source scale factor, and  
IVALLEY is the inductor valley current when the current  
limit threshold is reached. The factor 1.02 accounts  
for the temperature offset of the LS MOSFET  
compared to the control circuit.  
where VIN is the input voltage ripple, normally 1%  
of VIN.  
For example; for VIN=19 V, VIN=190 mV, VOUT=1.2 V,  
6 A load, and fSW=500 kHz; CIN is 4 µF and is ICIN(RMS) is  
With the constant on-time architecture, HS is always  
turned on for a fixed on-time; this determines the peak-  
to-peak inductor current.  
1.45 ARMS  
.
Select one 10 µF25 V-rated ceramic  
capacitor with X7R or similar dielectric, recognizing that  
the capacitor DC bias characteristic indicates that the  
capacitance value falls approximately 60% at VIN=19 V.  
Also, the 10 µF X7R capacitor can carry over 3 ARMS in  
the frequency range from 100 kHz to 1 MHz, exceeding  
the input capacitor current rating requirements. An  
additional 1 µF capacitor may be needed to suppress  
noise generated by high frequency switching transitions.  
Current ripple I is given by:  
ꢅꢆ  ꢜꢝꢞ ꢜꢆ  
ꢲꢤ   
ꢡꢡꢡꢡꢡꢡ  
(23)  
From the equation above, the worst-case ripple occurs  
during an output short circuit (where VOUT is 0 V). This  
should be taken into account when selecting the current  
limit set point.  
Output Capacitor Selection  
Output capacitor COUT is also selected based on voltage  
rating, RMS current ICOUT(RMS) rating, and capacitance.  
© 2015 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FAN23SV56A • Rev. 1.0  
16  
The FAN23SV56A uses valley-current sensing, the  
current limit (IILIM) set point is the valley (IVALLEY).  
The inner PCB layer closest to the FAN23SV56A device  
should have power ground (PGND) under the power  
processing portion of the device (PVIN, SW, and  
PGND). This inner PCB layer should have a separate  
analog ground (AGND) under the P1 pad and the  
associated analog components. AGND and PGND  
should be connected together near the IC between  
PGND pins 18-21 and AGND pin 23, which connects to  
P1 thermal pad.  
The valley current level for calculating RILIM is given by:  
ꢲꢤ  
(24)  
꣒꣌꣊꣊ꢊ꣓  ꣊ꢜ꣌ꢳꢡꢯꢒ꣊ꢰ  
ꢡꢡ  
where ILOAD  
is the DC load current when the  
(CL)  
current limit threshold is reached.  
The AGND thermal pad (P1) should be connected to  
AGND plane on the inner layer using four 0.2 5mm vias  
spread under the pad. No vias are included under PVIN  
(P2) and SW (P3) to maintain the PGND plane under  
the power circuitry intact.  
For example: In a converter designed for 6 A steady-  
state operation and 1.8 A current ripple, the current-limit  
threshold could be selected at 120% of ILOAD,(MAX) to  
accommodate transient operation and inductor value  
decrease under loading. As a result, ILOAD,(MAX) is 7.2 A,  
IVALLEY=6.3 A, and RILIM is selected as the standard  
value of 1.65 k  
Power circuit loops that carry high currents should be  
arranged to minimize the loop area. Primary focus  
should be directed to minimize the loop for current flow  
from the input capacitor to PVIN, through the internal  
MOSFETs, and returning to the input capacitor. The  
input capacitor should be placed as close to the PVIN  
terminals as possible.  
Boot Resistor  
In some applications, especially with higher input  
voltage, the VSW ring voltage may exceed derating  
guidelines of 80% to 90% of absolute rating for VSW. In  
this situation, a resistor can be connected in series with  
boot capacitor (C3 in Figure 1) to reduce the turn-on  
speed of the high-side MOSFET to reduce the  
amplitude of the VSW ring voltage.  
The current return path from PGND at the low-side  
MOSFET source to the negative terminal of the input  
capacitor can be routed under the inductor and also  
through vias that connect the input capacitor and low-  
side MOSFET source to the PGND region under the  
power portion of the IC.  
If necessary, a resistor and capacitor snubber can be  
added from VSW to PGND to reduce the magnitude of  
the ringing voltage. Please contact Fairchild Customer  
Support for assistance selecting a boot resistor or  
snubber circuit in applications that operate above a 21 V  
typical input voltage.  
The SW node trace that connects the source of the  
high-side MOSFET and the drain of the low-side  
MOSFET to the inductor should be short and wide.  
To control the voltage across the output capacitor, the  
output voltage divider should be located close to the FB  
pin, with the upper FB voltage divider resistor connected  
to the positive side of the output capacitor and the  
bottom resistor connected to the AGND portion of the  
FAN23SV56A device.  
PCB (Printed Circuit Board) Layout  
Guidelines  
The following points should be considered before  
beginning a PCB layout. A sample PCB layout from the  
evaluation board is shown in Figure 26 through Figure 29  
following these layout guidelines.  
When using ceramic capacitor solutions with external  
ramp injection circuitry (R2, C4, C5 in Figure 1); R2 and  
C4 should be connected near the inductor. Coupling  
capacitor C5 should be placed near FB pin to minimize  
FB pin trace length.  
Power components consisting of the input capacitors,  
output capacitors, inductor, and FAN23SV56A device  
should be placed on a common side of the PCB near  
each other and connected using surface copper.  
Decoupling capacitors for PVCC and VCC should be  
located close to their respective device pins.  
Sensitive analog components such as SS, FB, ILIM,  
FREQ, and EN should be placed away from the high-  
voltage switching circuits, such as SW and BOOT, and  
connected to their respective pins with short traces.  
SW node connections to BOOT, ILIM, and ripple  
injection resistor R2 should be through separate traces.  
© 2015 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FAN23SV56A • Rev. 1.0  
17  
Figure 26.Evaluation Board Top Layer Copper  
Figure 27.Evaluation Board Inner Layer 1 Copper  
© 2015 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FAN23SV56A • Rev. 1.0  
18  
Figure 28.Evaluation Board Inner Layer 2 Copper  
Figure 29.Evaluation Board Bottom Layer Copper  
© 2015 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FAN23SV56A • Rev. 1.0  
19  
5.50±0.10  
26  
18  
1.05±0.10  
17  
10  
27  
34  
(30X)  
0.25±0.05  
5.00±0.10  
0.25±0.05  
0.025±0.025  
1
9
SEATING  
PLANE  
PIN#1  
INDICATOR  
SEE  
DETAIL 'A'  
SCALE: 2:1  
1.58±0.01  
(0.43)  
2.18±0.01  
(0.35)  
0.50±0.01  
9
1
(0.25)  
0.40±0.01 (30X)  
(0.35) 34  
10  
0.68±0.01  
(0.35)  
3.50±0.01  
2.58±0.01  
(1.75)  
17  
(0.33)  
(0.35)  
(0.75)  
27  
0.43±0.01  
18  
26  
(0.35)  
(0.25)  
(3X)  
(0.28)  
(0.24)  
NOTES: UNLESS OTHERWISE SPECIFIED  
A) NO INDUSTRY REGISTRATION APPLIES.  
B) ALL DIMENSIONS ARE IN MILLIMETERS.  
C) DIMENSIONS DO NOT INCLUDE BURRS  
OR MOLD FLASH. MOLD FLASH OR  
BURRS DOES NOT EXCEED 0.10MM.  
D) DIMENSIONING AND TOLERANCING PER  
ASME Y14.5M-2009.  
1.75±0.01  
E) DRAWING FILE NAME: MKT-PQFN34AREV2  
F) FAIRCHILD SEMICONDUCTOR  
5.70  
2.18  
2.10  
1.58  
(0.35)  
0.55 (30X)  
1.80  
26  
18  
0.55  
17  
27  
(1.75)  
2.58  
0.68  
4.10 3.50  
5.20  
3.60  
0.75  
(1.85)  
34  
10  
1
9
(0.30)  
(0.35)  
0.20  
0.30 (30X)  
0.50±0.05  
0.43  
(0.08)  
4.10  
LAND PATTERN  
RECOMMENDATION  
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