FAN23SV60MPX [ONSEMI]

10A,24V 高能效 PoL 稳压器;
FAN23SV60MPX
型号: FAN23SV60MPX
厂家: ONSEMI    ONSEMI
描述:

10A,24V 高能效 PoL 稳压器

稳压器
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September 2015  
FAN23SV60  
10 A Synchronous Buck Regulator  
Description  
Features  
The FAN23SV60 is a highly efficient synchronous buck  
regulator. The regulator is capable of operating with an  
input range from 7 V to 24 V and supporting up to 10 A  
continuous load currents.  
.
.
VIN Range: 7 V to 24 V Using Internal Linear  
Regulator for Bias  
VIN Range: 4.5 V to 5.5 V with VIN/PVIN/PVCC  
Connected to Bypass Internal Regulator  
The FAN23SV60 utilizes Fairchilds constant on-time  
control architecture to provide excellent transient  
response and to maintain a relatively constant switching  
frequency. This device utilizes Pulse Frequency  
Modulation (PFM) mode to maximize light-load  
efficiency by reducing switching frequency when the  
inductor is operating in discontinuous conduction mode  
at light loads, while clamping the minimum frequency  
above the audible range with ultrasonic mode.  
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
High Efficiency: Over to 96% Peak  
Continuous Output Current: 10 A  
Internal Linear Bias Regulator  
Accurate Enable facilitates VIN UVLO Functionality  
PFM Mode for Light-Load Efficiency  
Excellent Line and Load Transient Response  
Precision Reference: ±1% Over Temperature  
Output Voltage Range: 0.6 to 5.5 V  
Programmable Frequency: 200 kHz to 1.5 MHz  
Programmable Soft-Start  
Switching frequency and over-current protection can  
be programmed to provide a flexible solution for  
various applications. Output over-voltage, under-  
voltage, over-current, and thermal shutdown protections  
help prevent damage to the device during fault  
conditions. After thermal shutdown is activated, a  
hysteresis feature restarts the device when normal  
operating temperature is reached.  
Low Shutdown Current  
Adjustable Sourcing Current Limit  
Internal Boot Diode  
Thermal Shutdown  
Halogen and Lead Free, RoHS Compliant  
Applications  
.
.
.
.
.
.
Mainstream Notebooks  
Servers and Desktop Computers  
Game Consoles  
Telecommunications  
Storage  
Base Stations  
Ordering Information  
Operating  
Temperature Range  
Output  
Current (A)  
Part Number  
Configuration  
PFM with Ultrasonic Mode  
Package  
34-Lead, PQFN,  
5.5 mm x 5.0 mm  
FAN23SV60MPX  
-40 to 125°C  
10  
© 2011 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FAN23SV60 • Rev. 1.10  
Typical Application Diagrams  
VIN = 19V  
VIN = 19V  
R11  
10  
C10  
2.2µF  
C9  
0.1µF  
CIN  
0.1µF  
CIN  
3x10µF  
R7  
64.9kΩ  
PVCC  
VIN  
PVIN  
VCC  
EN  
Ext  
EN  
C3  
0.1µF  
R8  
10kΩ  
VOUT = 1.2V  
IOUT=0-10A  
BOOT  
SW  
FAN23SV60  
R7, R8 used for Accurate EN  
R7, R8 open for Ext EN  
L1  
0.72µH  
PGOOD  
ILIM  
SOFT START  
FREQ  
R2  
1.5kΩ  
C4  
0.1µF  
COUT  
6x47µF  
R5 1.62kΩ  
R3  
10kΩ  
C5  
100pF  
C7  
15nF  
FB  
R9  
54.9kΩ  
R4  
10kΩ  
AGND  
PGND  
Figure 1. Typical Application with VIN = 19 V  
VIN = 5V  
R11  
10  
C10  
2.2µF  
C9  
0.1µF  
CIN  
CIN  
0.1µF  
3x10µF  
PVCC  
VIN  
PVIN  
VCC  
EN  
Ext  
EN  
C3  
0.1µF  
VOUT = 1.2V  
IOUT=0-10A  
BOOT  
SW  
FAN23SV60  
L1  
0.72µH  
PGOOD  
ILIM  
SOFT START  
R2  
1.5kΩ  
C4  
0.1µF  
COUT  
6x47µF  
R5 1.62kΩ  
R3  
10kΩ  
C5  
100pF  
C7  
15nF  
FREQ  
FB  
R9  
54.9kΩ  
R4  
10kΩ  
AGND  
PGND  
Figure 2. Typical Application with VIN = 5 V  
© 2011 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FAN23SV60 • Rev. 1.10  
2
 
Functional Block Diagram  
VIN  
BOOT PVIN  
PVCC  
Linear  
Regulator  
PVCC  
VCC  
VCC  
VCC UVLO  
ENABLE  
1.26V/1.14V  
PVCC  
EN  
VCC  
VCC  
10µA  
Modulator  
HS Gate  
Driver  
SS  
FB  
FB  
Comparator  
VREF  
SW  
PFM  
Comparator  
FREQ  
Control  
Logic  
2nd Level OVP  
Comparator  
x1.2  
PVCC  
1st Level OVP  
Comparator  
x1.1  
x0.9  
LS Gate  
Driver  
Under-Voltage  
Comparator  
VCC  
PGOOD  
Thermal  
Shutdown  
10µA  
Current Limit  
Comparator  
AGND  
ILIM  
PGND  
Figure 3. Block Diagram  
© 2011 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FAN23SV60 • Rev. 1.10  
3
Pin Configuration  
5
5
7
6
4
2
1
3
4
6
8
9
8
3
2
7
1
9
PVIN 10  
PVIN 11  
34 NC  
33 NC  
NC  
34  
33  
10 PVIN  
PVIN  
(P2)  
11  
12  
13  
NC  
PVIN  
FREQ  
SS  
FREQ  
32  
31  
SW 12  
SW 13  
32  
31  
SW  
SW  
SS  
AGND  
(P1)  
SW  
(P3)  
SW 14  
SW 15  
SW 16  
SW 17  
PGOOD 30  
SW  
SW  
SW  
SW  
30 PGOOD  
14  
15  
EN  
29  
28  
27  
EN  
29  
28  
27  
16  
17  
NC  
FB  
NC  
FB  
21  
20  
19  
18  
18  
19  
20  
21  
22  
23  
24  
25  
26  
25  
24  
23  
22  
26  
Figure 4. Pin Assignments (Bottom View)  
Figure 5. Pin Assignments (Top View)  
Pin Definitions  
Name  
PVIN  
VIN  
Pad / Pin  
Description  
P2, 5-11  
1
Power input for the power stage  
Power input to the linear regulator; used in the modulator for input voltage feed-forward  
Power output of the linear regulator; directly supplies power for the low-side gate driver  
and boot diode. Can be connected to VIN and PVIN for operation from 5 V rail.  
PVCC  
25  
VCC  
PGND  
AGND  
SW  
26  
Power supply input for the controller  
18-21  
Power ground for the low-side power MOSFET and for the low-side gate driver  
Analog ground for the analog portions of the IC and for substrate  
P1, 4, 23  
P3, 2, 12-17, 22 Switching node; junction between high-and low-side MOSFETs  
Supply for high-side MOSFET gate driver. A capacitor from BOOT to SW supplies the  
charge to turn on the N-channel high-side MOSFET. During the freewheeling interval  
(low-side MOSFET on), the high-side capacitor is recharged by an internal diode  
BOOT  
3
connected to PVCC.  
ILIM  
FB  
24  
27  
29  
31  
Current limit. A resistor between ILIM and SW sets the current limit threshold.  
Output voltage feedback to the modulator  
EN  
SS  
Enable input to the IC. Pin must be driven logic high to enable, or logic low to disable.  
Soft-start input to the modulator  
On-time and frequency programming pin. Connect a resistor between FREQ and  
AGND to program on-time and switching frequency.  
FREQ  
32  
PGOOD  
NC  
30  
Power good; open-drain output indicating VOUT is within set limits.  
Leave pin open or connect to AGND.  
28, 33-34  
© 2011 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FAN23SV60 • Rev. 1.10  
4
Absolute Maximum Ratings  
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be  
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.  
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.  
The absolute maximum ratings are stress ratings only.  
Symbol  
VPVIN  
Parameter  
Power Input  
Conditions  
Referenced to PGND  
Min.  
Max.  
Unit  
-0.3  
-0.3  
-0.3  
-0.3  
-1  
30.0  
30.0  
30.0  
33.0  
30.0  
30.0  
6.0  
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
°C  
°C  
VIN  
Modulator Input  
Referenced to AGND  
Referenced to PVCC  
VBOOT  
Boot Voltage  
Referenced to PVCC, <20 ns  
Referenced to PGND, AGND  
Referenced to PGND, AGND < 20 ns  
Referenced to SW  
VSW  
SW Voltage to GND  
-5  
Boot to SW Voltage  
Boot to PGND  
-0.3  
-0.3  
-0.3  
-0.3  
-0.3  
-0.3  
-0.3  
-0.3  
-0.3  
-0.3  
VBOOT  
Referenced to PGND  
30  
VPVCC  
VVCC  
VILIM  
VFB  
Gate Drive Supply Input  
Controller Supply Input  
Current Limit Input  
Output Voltage Feedback  
Enable Input  
Referenced to PGND, AGND  
Referenced to PGND, AGND  
Referenced to AGND  
6.0  
6.0  
6.0  
Referenced to AGND  
6.0  
VEN  
Referenced to AGND  
6.0  
VSS  
Soft Start Input  
Referenced to AGND  
6.0  
VFREQ  
Frequency Input  
Referenced to AGND  
6.0  
VPGOOD Power Good Output  
Referenced to AGND  
6.0  
Human Body Model, JESD22-A114(1)  
Charged Device Model, JESD22-C101(2)  
2000  
2500  
+150  
+150  
ESD  
Electrostatic Discharge  
TJ  
Junction Temperature  
Storage Temperature  
TSTG  
-55  
Note:  
1. Exception for FB pin up to 350V  
2. Exception for FB pin up to 500V  
Recommended Operating Conditions  
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended  
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not  
recommend exceeding them or designing to Absolute Maximum Ratings.  
Symbol  
VPVIN  
VIN  
Parameter  
Power Input  
Conditions  
Referenced to PGND  
Referenced to AGND  
Min.  
7
Max.  
24  
Unit  
V
Modulator Input  
Junction Temperature  
Load Current  
7
24  
V
TJ  
-40  
+125  
15  
°C  
A
ILOAD  
TA=25°C, No Airflow  
VPVIN, VIN , VPVCC Connected for 5 V  
Rail Operation and Referenced to  
PGND, AGND  
PVIN, VIN, and Gate Drive  
Supply Input  
VPVIN, VIN , VPVCC  
4.5  
5.5  
V
© 2011 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FAN23SV60 • Rev. 1.10  
5
 
Thermal Characteristics  
The thermal characteristics were evaluated on a 4-layer pcb structure (1 oz/1 oz/1 oz/1 oz) measuring 7 cm x 7 cm).  
Symbol  
Parameter  
Typical  
Unit  
Thermal Resistance, Junction-to-Ambient  
35  
2.7  
2.3  
°C/W  
°C/W  
°C/W  
JA  
ψJC  
Thermal Characterization Parameter, Junction-to-Top of Case  
Thermal Characterization Parameter, Junction-to-PCB  
ψJPCB  
© 2011 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FAN23SV60 • Rev. 1.10  
6
Electrical Characteristics  
Unless otherwise noted; VIN=12 V, VOUT=1.2 V, and TA=TJ = -40 to +125°C. (4)  
Symbol  
Parameter  
Condition  
Min.  
Typ.  
Max.  
Unit  
Supply Current  
IVIN,SD  
IVIN,Q  
Shutdown Current  
Quiescent Current  
EN=0 V  
16  
µA  
mA  
mA  
EN=5 V, Not Switching  
EN=5 V, fSW=500 kHz  
1.8  
IVIN,GateCharge Gate Charge Current  
14  
Linear Regulator  
VREG  
IREG  
Regulator Output Voltage  
Regulator Current Limit  
4.75  
60  
5.00  
5.25  
V
mA  
Reference, Feedback Comparator  
VFB  
IFB  
FB Voltage Trip Point  
FB Pin Bias Current  
590  
596  
0
602  
100  
mV  
nA  
-100  
Modulator  
RFREQ=56.2 k, VIN=10 V,  
tON=250 ns, No Load  
tON  
On-Time Accuracy  
-20  
20  
%
tOFF,MIN  
tON,MIN  
DMIN  
Minimum SW Off-Time  
Minimum SW On-Time  
Minimum Duty Cycle  
320  
45  
374  
ns  
ns  
FB=1 V  
0
%
fMINF  
Minimum Frequency Clamp  
18.2  
25.4  
32.7  
kHz  
Soft-Start  
ISS  
Soft-Start Current  
SS=0 V  
7
10  
13  
µA  
%
tON,SSMOD  
Soft-Start On-Time Modulation  
SS<0.6 V  
VFB=0.6 V  
25  
100  
VSSCLAMP,NOM Nominal Soft-Start Voltage Clamp  
400  
40  
mV  
Soft-Start Voltage Clamp in Overload  
VSSCLAMP,OVL  
Condition  
VFB=0.3 V, OC Condition  
mV  
PFM Zero-Crossing Detection Comparator  
VOFF  
Current Limit  
ILIM  
ZCD Offset Voltage  
TA=TJ=25°C  
-6  
0
mV  
%
Valley Current Limit Accuracy  
ILIM Set-Point Scale Factor  
Temperature Coefficient  
TA=TJ=25°C, IVALLEY=7 A  
-10  
10  
KILIM  
149  
ILIMTC  
4000  
ppm/°C  
Enable  
VTH+  
Rising Threshold  
Hysteresis  
1.11  
1.26  
122  
1.14  
4.5  
1.43  
1.28  
V
mV  
V
VHYST  
VTH-  
Falling Threshold  
Enable Voltage Clamp  
Clamp Current  
1.00  
4.3  
VENCLAMP  
IENCLAMP  
IENLK  
IEN=20 µA  
V
24  
100  
76  
µA  
nA  
µA  
Enable Pin Leakage  
Enable Pin Leakage  
EN=1.2 V  
VEN=5 V  
IENLK  
UVLO  
VON  
VCC Good Threshold Rising  
Hysteresis Voltage  
4.4  
V
VHYS  
160  
mV  
© 2011 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FAN23SV60 • Rev. 1.10  
7
Electrical Characteristics  
Unless otherwise noted; VIN=12 V, VOUT=1.2 V, and TA=TJ = -40 to +125°C. (4)  
Symbol  
Parameter  
Condition  
Min.  
Typ.  
Max.  
Unit  
Fault Protection  
VUVP  
VVOP1  
VOVP2  
RPGOOD  
PGOOD UV Trip Point  
PGOOD OV Trip Point  
On FB Falling  
86  
89  
92  
115  
125  
125  
2.03  
1
%
%
On FB Rising  
108  
118  
111  
122  
Second OV Trip Point  
On FB Rising; LS=On  
IPGOOD=2 mA  
%
PGOOD Pull-Down Resistance  
Ω
tPG,SSDELAY PGOOD Soft-Start Delay  
IPG,LEAK PGOOD Leakage Current  
Thermal Shutdown  
0.82  
1.42  
ms  
µA  
TOFF  
THYS  
Thermal Shutdown Trip Point(3)  
Hysteresis(3)  
155  
15  
°C  
°C  
Internal Bootstrap Diode  
VFBOOT Forward Voltage  
IR Reverse Leakage  
Notes:  
3. Guaranteed by design; not production tested.  
IF=10 mA  
VR=5 V  
0.6  
V
1000  
µA  
4. Device is 100% production tested at TA=25°C. Limits over that temperature are guaranteed by design.  
© 2011 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FAN23SV60 • Rev. 1.10  
8
 
 
Typical Performance Characteristics  
Tested using evaluation board circuit shown in Figure 1 with VIN=19 V, VOUT=1.2 V, fSW=500 kHz, TA=25°C, and no  
airflow; unless otherwise specified.  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
12VIN_1.05VOUT_500KHZ_0.72UH  
12VIN_1.2VOUT_500KHZ_0.72UH  
12VIN_3.3VOUT_500KHZ_1.2UH  
12VIN_5VOUT_500KHZ_1.8UH  
19VIN_1.05VOUT_500KHZ_0.72UH  
19VIN_1.2VOUT_500KHZ_0.72UH  
19VIN_3.3VOUT_500KHZ_1.8UH  
19VIN_5VOUT_500KHZ_1.8UH  
0.01  
0.1  
1
10  
0.01  
0.1  
1
10  
Load Current(A)  
Load Current(A)  
Figure 6. Efficiency vs. Load Current with VIN=19 V  
and fSW=500 kHz  
Figure 7. Efficiency vs. Load Current with VIN=12 V  
and fSW=500kHz  
100  
90  
80  
70  
60  
50  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
12VIN_1.2VOUT_300KHZ_1.2UH  
12VIN_1.2VOUT_500KHZ_0.72UH  
12VIN_1.2VOUT_1MHZ_0.4UH  
12VIN_1.2VOUT_1.5MHZ_0.23UH  
40  
19VIN_1.2VOUT_300KHZ_1.2UH  
30  
20  
10  
19VIN_1.2VOUT_500KHZ_0.72UH  
19VIN_1.2VOUT_1MHZ_0.4UH  
19VIN_1.2VOUT_1.5MHZ_0.23UH  
0.01  
0.1  
1
10  
0.01  
0.1  
1
10  
Load Current(A)  
Load Current(A)  
Figure 8. Efficiency vs. Load Current with VIN=19 V  
and VOUT=1.2 V  
Figure 9. Efficiency vs. Load Current with VIN=12 V  
and VOUT=1.2 V  
90  
80  
19VIN_1.2VOUT_1.5MHz_0.23uH  
19VIN_1.2VOUT_1MHz_0.4uH  
19VIN_1.2VOUT_1.5MHz_0.23uH  
80  
70  
19VIN_1.2VOUT_1MHz_0.4uH  
19VIN_1.2VOUT_500kHz_0.72uH  
70  
19VIN_1.2VOUT_500kHz_0.72uH  
60  
60  
50  
40  
30  
20  
10  
0
50  
40  
30  
20  
10  
0
0
5
10  
15  
0
5
10  
15  
Load Current (A)  
Load Current (A)  
Figure 10. Case Temperature Rise vs. Load Current Figure 11. Case Temperature Rise vs. Load Current  
on 4 Layer PCB, 1 oz Copper, 7 cm x 7 cm on 4 Layer PCB, 1 oz Copper, 7 cm x 7 cm  
© 2011 Fairchild Semiconductor Corporation  
FAN23SV60 • Rev. 1.10  
www.fairchildsemi.com  
9
Typical Performance Characteristics  
Tested using evaluation board circuit shown in Figure 1 with VIN=19 V, VOUT=1.2 V, fSW=500 kHz, TA=25°C, and no  
airflow; unless otherwise specified.  
1.212  
1.208  
1.204  
1.2  
1.212  
1.208  
1.204  
1.2  
0A_1.2VOUT[V]  
10A_1.2VOUT[V]  
12VIN_1.2VOUT  
19VIN_1.2VOUT  
1.196  
1.192  
1.188  
1.196  
1.192  
1.188  
7
9
11 13 15 17 19 21 23 25  
0
2
4
6
8
10  
Load Current(A)  
Figure 12. Load Regulation  
InputVoltage (V)  
Figure 13. Line Regulation  
EN (5V/div)  
EN (5V/div)  
VIN=19V  
IOUT=0A  
VIN=19V  
IOUT=10A  
Soft Start (0.5V/div)  
VOUT (0.5V/div)  
Soft Start (0.5V/div)  
VOUT (0.5V/div)  
PGOOD (5V/div)  
PGOOD (5V/div)  
Time (500µs/div)  
Time (500µs/div)  
Figure 14. Startup Waveforms with 0 A Load Current Figure 15. Startup Waveforms with 10 A Load Current  
EN (5V/div)  
EN (5V/div)  
VIN=19V  
IOUT=0A  
Soft Start (0.5V/div)  
Soft Start (0.5V/div)  
VOUT (0.5V/div)  
PGOOD (5V/div)  
VIN=19V  
IOUT=10A  
Vout Prebias  
VOUT (0.5V/div)  
PGOOD (5V/div)  
Time (500µs/div)  
Time (200µs/div)  
Figure 16. Shutdown Waveforms with 10 A  
Load Current  
Figure 17. Startup Waveforms with Pre-Bias  
Voltage on Output  
© 2011 Fairchild Semiconductor Corporation  
FAN23SV60 • Rev. 1.10  
www.fairchildsemi.com  
10  
Typical Performance Characteristics  
Tested using evaluation board circuit shown in Figure 1 with VIN=19 V, VOUT=1.2 V, fSW=500 kHz, TA=25°C, and no  
airflow; unless otherwise specified.  
VOUT (20mV/div)  
VOUT (20mV/div)  
VIN=19V  
VIN=19V  
IOUT=0A  
IOUT=10A  
VSW (10V/div)  
VSW (10V/div)  
Time (10µs/div)  
Time (10µs/div)  
Figure 18. Static Load Ripple at No Load  
Figure 19. Static Load Ripple at Full Load  
VOUT (20mV/div)  
VOUT (20mV/div)  
VIN=19V  
VOUT=1.2V  
VIN=19V  
VOUT=1.2V  
IOUT (1A/div)  
IOUT (1A/div)  
Time (50µs/div)  
Time (50µs/div)  
Figure 20. Operation as Load Changes from 0 A to 2 A Figure 21. Operation as Load Changes from 2 A to 0 A  
VOUT (20mV/div)  
VOUT (20mV/div)  
VIN=19V, VOUT=1.2V  
IOUT from 5A to 10A, 2.5A/us  
VIN=19V, VOUT=1.2V  
IOUT from 0A to 5A, 2.5A/us  
IOUT (5A/div)  
IOUT (5A/div)  
Time (100µs/div)  
Time (100µs/div)  
Figure 22. Load Transient from 0% to 50%  
Load Current  
Figure 23. Load Transient from 50% to 100%  
Load Current  
© 2011 Fairchild Semiconductor Corporation  
FAN23SV60 • Rev. 1.10  
www.fairchildsemi.com  
11  
Typical Performance Characteristics  
Tested using evaluation board circuit shown in Figure 1 with VIN=19 V, VOUT=1.2 V, fSW=500 kHz, TA=25°C, and no  
airflow; unless otherwise specified.  
PGOOD indicates UVP  
VOUT (1V/div)  
With VOUT falling in OCP  
PGOOD (5V/div)  
Pull VOUT to 2.8V  
through 3Ω resistor  
VFB (0.5V/div)  
VOUT (1V/div)  
Soft Start (1V/div)  
Level 1  
PGOOD (5V/div)  
VSW (10V/div)  
IL (10A/div)  
Level 2  
IOUT=0A then short output  
Time (200µs/div)  
Time (50µs/div)  
Figure 24. Over-Current Protection with Heavy Load Figure 25. Over-Voltage Protection Level 1 and Level 2  
© 2011 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FAN23SV60 • Rev. 1.10  
12  
Circuit Operation  
The FAN23SV60 uses a constant on-time modulation  
Constant On-time Modulation  
architecture with  
a
VIN feed-forward input to  
The FAN23SV60 uses a constant on-time modulation  
technique, in which the HS MOSFET is turned on for a  
fixed time, set by the modulator, in response to the input  
voltage and the frequency setting resistor. This on-time  
is proportional to the desired output voltage, divided by  
the input voltage. With this proportionality, the frequency  
is essentially constant over the load range where  
inductor current is continuous.  
accommodate a wide VIN range. This method provides  
fixed switching frequency (fSW) operation when the  
inductor operates in Continuous Conduction Mode  
(CCM) and variable frequency when operating in Pulse  
Frequency Mode (PFM) at light loads. Additional  
benefits include excellent line and load transient  
response,  
cycle-by-cycle  
current  
limiting,  
and  
elimination of the need for loop compensation.  
For buck converter in Continuous-Conduction Mode  
(CCM), the switching frequency fSW is expressed as:  
At the beginning of each cycle, FAN23SV60 turns on  
the high-side MOSFET (HS) for a fixed duration (tON). At  
ꢜꢝꢞ  
the end of tON, HS turns off for a duration (tOFF  
)
ꢚꢛ  
ꢡꢡꢡꢡꢡꢡ  
(3)  
determined by the operating conditions. Once the FB  
voltage (VFB) falls below the reference voltage (VREF), a  
new switching cycle begins.  
ꢅꢆ  ꢜꢆ  
The on-time generator sets the on-time (tON) for the  
high-side MOSFET, which results in the switching  
frequency of the regulator during steady-state operation.  
To maintain a relatively constant switching frequency  
over a wide range of input conditions, the input voltage  
information is fed into the on-time generator.  
The modulator provides a minimum off-time (tOFF-MIN) of  
320 ns to provide a guaranteed interval for low-side  
MOSFET (LS) current sensing and PFM operation. tOFF-  
is also used to provide stability against multiple  
MIN  
pulsing and limits maximum switching frequency during  
transient events.  
tON is determined by:  
ꢣꢜꢆ  
Enable  
ꢜꢆ  
 ꢖꢄꢡꢡꢡꢡꢡ  
(4)  
ꢣꢜꢆ  
The enable pin can be driven with an external logic  
signal, connected to a resistive divider from PVIN/Vin to  
ground to create an Under-Voltage Lockout (UVLO)  
based on the PVIN/VIN supply, or connected to  
PVIN/VIN through a single resistor to auto-enable while  
operating within the EN pin internal clamp current sink  
capability.  
where ItON is:  
ꢅꢆ  
ꢣꢜꢆ  
ꢡꢡꢡꢡꢡ  
(5)  
ꢌꢥ   
ꢦꢧꢊꢨ  
where RFREQ is the frequency-setting resistor  
described in the Setting Switching Frequency section;  
CtON is the internal 2.2 pF capacitor; and ItON is the VIN  
feed-forward current that generates the on-time.  
The EN pin can be directly driven by logic voltages of  
5 V, 3.3 V, 2.5 V, etc. If the EN pin is driven by 5 V logic,  
a small current flows into the pin when the EN pin  
voltage exceeds the internal clamp voltage of 4.3 V. To  
eliminate clamp current flowing into the EN pin use a  
voltage divider to limit the EN pin voltage to < 4 V.  
The FAN23SV60 implements open-circuit detection on  
the FREQ pin to protect the output from an infinitely long  
on-time. In the event the FREQ pin is left floating,  
switching of the regulator is disabled. The FAN23SV60  
is designed for VIN input range 7 to 24 V, fSW 200 kHz to  
1.5 MHz, resulting in an ItON ratio exceeding 1 to 25.  
To implement the UVLO function based on PVIN/VIN  
voltage level, select values for R7 and R8 in Figure 1  
the tap point reaches 1.26 V when VIN reaches the  
desired startup level using the following equation:  
As the ratio of VOUT to VIN increases, tOFF,min introduces a  
limit on the maximum switching frequency as calculated  
in the following equation, where the factor 1.2 is  
included in the denominator to provide some headroom  
for transient operation:  
ꢅꢆꢇꢈꢉ  
 ꢀ   ꢂ   
 ꢌꢍ  
(1)  
ꢊꢆꢇꢈꢉ  
where VIN,on is the input voltage for startup and VEN,on  
is the EN pin rising threshold of 1.26 V. With R8  
selected as 10 kΩ, and VIN,on=9 V the value of R7 is  
61.9 kΩ.  
ꢜꢝꢞ  
ꢪꢌ   
ꢅꢆꢇꢏꢕꢉ  
(6)  
ꢚꢛ  
ꢌꢬꢖ  ꢜꢦꢦꢇꢏꢕꢉ  
The EN pin can be pulled high with a single resistor  
connected from VIN to the EN pin. With VIN > 5.5V a  
series resistor is required to limit the current flow into  
the EN pin clamp to less than 24 µA to keep the internal  
clamp within normal operating range. The resistor value  
can be calculated from the following equation:  
Soft-Start (SS)  
A conventional soft-start ramp is implemented to provide  
a controlled startup sequence of the output voltage. A  
current is generated on the SS pin to charge an external  
capacitor. The lesser of the voltage on the SS pin and  
the reference voltage is used for output regulation. To  
reduce VOUT ripple and achieve a smoother ramp of the  
output voltage, tON is modulated during soft-start. tON  
starts at 50% of the steady-state on-time (PWM Mode)  
and ramps up to 100% gradually.  
ꢅꢆꢇꢏꢐꢑ  ꢊꢆꢇꢒꢓꢐꢏꢔꢇꢏꢕꢉ  
 
ꢊꢆ  
(2)  
ꢖꢖꢗꢘ  
© 2011 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FAN23SV60 • Rev. 1.10  
13  
During normal operation, the SS voltage is clamped to  
400 mV above the FB voltage. The clamp voltage drops  
to 40 mV during an overload condition to allow the  
converter to recover using the soft-start ramp once the  
overload condition is removed. On-time modulation  
during SS is disabled when an overload condition exists.  
To maintain a monotonic soft-start ramp, the regulator is  
forced into PFM Mode during soft-start. The minimum  
frequency clamp is disabled during soft-start.  
Pulse Frequency Modulation (PFM)  
One of the key benefits of using a constant on-time  
modulation scheme is the seamless transitions in and  
out of Pulse Frequency Modulation (PFM) Mode. The  
PWM signal is not slave to a fixed oscillator and,  
therefore, can operate at any frequency below the target  
steady-state frequency. By reducing the frequency  
during light-load conditions, the efficiency can be  
significantly improved.  
The nominal startup time is programmable through an  
internal current source charging the external soft-start  
The FAN23SV60 provides a Zero-Crossing Detector  
(ZCD) circuit to identify when the current in the inductor  
reverses direction. To improve efficiency at light load,  
the LS MOSFET is turned off around the zero crossing  
to eliminate negative current in the inductor. For  
predictable operation entering PFM mode the controller  
waits for nine consecutive zero crossings before  
allowing the LS MOSFET to turn off.  
capacitor CSS  
:
ꢚꢚ  ꢚꢚ  
ꢧꢊꢦ  
ꢚꢚ  
ꢡꢡꢡꢡꢡ  
(7)  
where:  
CSS = External soft-start programming capacitor;  
In PFM Mode, fSW varies or modulates proportionally to  
the load; as load decreases, fSW also decreases. The  
switching frequency, while the regulator is operating in  
PFM, can be expressed as:  
ISS = Internal soft-start charging current source,  
10 µA;  
tSS = Soft-start time; and  
VREF = 600 mV  
    ꢜꢝꢞ  
  ꢅꢆ  ꢜꢝꢞ  
ꢜꢝꢞ  
ꢚꢛ  
ꢡꢡꢡꢡ  
(8)  
For example; for 1 ms startup time, CSS=15 nF.  
ꢅꢆ  
The soft-start option can be used for ratiometric tracking.  
When EN is LOW, the soft-start capacitor is discharged.  
where L is inductance and IOUT is output load current.  
Minimum Frequency Clamp  
To maintain a switching frequency above the audible  
range, the FAN23SV60 clamps the switching frequency  
to a minimum value of 18 kHz. The LS MOSFET is  
turned on to discharge the output and trigger a new  
PWM cycle. The minimum frequency clamp is disabled  
during soft-start.  
Startup on Pre-Bias  
FAN23SV60 allows the regulator to start on a pre-bias  
output, VOUT, and ensures VOUT is not discharged during  
the soft-start operation.  
To guarantee no glitches on VOUT at the beginning of the  
soft-start ramp, the LS is disabled until the first positive-  
going edge of the PWM signal. The regulator is also  
forced into PFM Mode during soft-start to ensure the  
inductor current remains positive, reducing the  
possibility of discharging the output voltage.  
Protection Features  
The converter output is monitored and protected against  
over-current, over-voltage, under-voltage, and high-  
temperature conditions.  
Over-Current Protection (OCP)  
Internal Linear Regulator  
The FAN23SV60 uses current information through the  
LS to implement valley-current limiting. While an OC  
event is detected, the HS is prevented from turning on  
and the LS is kept on until the current falls below the  
user-defined set point. Once the current is below the set  
point, the HS is allowed to turn on.  
The FAN23SV60 includes a linear regulator to facilitate  
single-supply operation for self-biased applications.  
PVCC is the linear regulator output and supplies power  
to the internal gate drivers. The PVCC pin should be  
bypassed with a 2.2 µF ceramic capacitor. The device  
can operate from a 5 V rail if the VIN, PVIN, and PVCC  
pins are connected together to bypass the internal  
linear regulator.  
During an OC event, the output voltage may droop if the  
load current is greater than the current the converter is  
providing. If the output voltage drops below the UV  
threshold, an overload condition is triggered. During an  
overload condition, the SS clamp voltage is reduced to  
40 mV and the on-time is fixed at the steady-state  
duration. By nature of the control method; as VOUT drops,  
the switching frequency is lower due to the reduced rate  
of inductor current decay during the off-time.  
VCC Bias Supply and UVLO  
The VCC rail supplies power to the controller. It is  
generally connected to the PVCC rail through a low-  
pass filter of a 10 resistor and 0.1 µF capacitor to  
minimize any noise sources from the driver supply.  
An Under-Voltage Lockout (UVLO) circuit monitors the  
VCC voltage to ensure proper operation. Once the VCC  
voltage is above the UVLO threshold, the part begins  
operation after an initialization routine of 50 µs. There is  
no UVLO circuitry on either the PVCC or VIN rails.  
The ILIM pin has an open-detection circuit to provide  
protection against operation without a current limit.  
Under-Voltage Protection (UVP)  
If VFB is below the under-voltage threshold of -11% VREF  
(534 mV), the part enters UVP and PGOOD pulls LOW.  
© 2011 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FAN23SV60 • Rev. 1.10  
14  
Over-Voltage Protection (OVP)  
There are two levels of OV protection: +11% and +22%.  
During an over-voltage event, PGOOD pulls LOW.  
ꢥꢬꢶꢶ  ꢖꢷ  ꢚꢛ  ꢜꢝꢞ  ꢜꢝꢞ  
ꢢꢵ  
(12)  
 ꢖ   
The minimum value of C5 can be selected to minimize  
the capacitive component of ripple appearing on the  
feedback pin:  
When VFB is > +11% of VREF (666 mV), both HS and LS  
turn off. By turning off the LS during an OV event, VOUT  
overshoot can be reduced when there is positive  
inductor current by increasing the rate of discharge.  
Once the VFB voltage falls below VREF, the latched OV  
signal is cleared and operation returns to normal.  
ꢾꢿꣀ  ꢾꢿꣀ  ꢯꣁꢶ  ꣁꢵꢰ  
(13)  
ꢸꢹꢺꢻꢼ  
ꣁꢖ  ꣁꢶ  ꣁꢵ  ꢸꢵ  
Using the minimum value of C5 generally offers the best  
transient response, and 100 pF is a good initial value in  
many applications. However, under some operating  
conditions excessive pulse jitter may be observed. To  
reduce jitter and improve stability, the value of C5 can  
be increased:  
A second over-voltage detection is implemented to  
protect the load from more serious failure. When VFB  
rises +22% above the VREF (732 mV), the HS turns off,  
but the LS is forced on until a power cycle on VCC.  
Over-Temperature Protection (OTP)  
The FAN23SV60 incorporates an over-temperature  
protection circuit that disables the converter when the  
die temperature reaches 155°C. The IC restarts when  
the die temperature falls below 140°C.  
(14)  
ꢢꢹ    ꢸꢹꢺꢻꢼ  
5 V PVCC  
Power Good (PGOOD)  
The PVCC is the output of the internal regulator that  
supplies power to the drivers and VCC. It is crucial to keep  
this pin decoupled to PGND with a ≥1 µF X5R or X7R  
ceramic capacitor. Because VCC powers internal analog  
circuit, it is filtered from PVCC with a 10 Ω resistor and  
0.1 µF X7R decoupling ceramic capacitor to AGND.  
The PGOOD pin serves as an indication to the system  
that the output voltage of the regulator is stable and  
within regulation. Whenever VOUT is outside the  
regulation window or the regulator is at over-  
temperature (UV, OV, and OT), the PGOOD pin is  
pulled LOW.  
Setting the Output Voltage (VOUT  
)
PGOOD is an open-drain output that asserts LOW when  
VOUT is out of regulation or when OT is detected.  
The output voltage VOUT is regulated by initiating a high-  
side MOSFET on-time interval when the valley of the  
divided output voltage appearing at the FB pin reaches  
VREF. Since this method regulates at the valley of the  
output ripple voltage, the actual DC output voltage on  
VOUT is offset from the programmed output voltage by the  
average value of the output ripple voltage. The initial VOUT  
setting of the regulator can be programmed from 0.6 V to  
5.5 V by an external resistor divider (R3 and R4):  
Application Information  
Stability  
Constant on-time stability consists of two parameters:  
stability criterion and sufficient signal at VFB.  
Stability criterion is given by:  
 ꢶ  
 ꢵ   
ꢜꢆ  
(15)  
ꢜꢝꢞ    
(9)  
 ꢊꢚꢧ  ꢜꢝꢞ  
ꢡꢡꢡ  
ꢧꢊꢦ  
Sufficient signal requirement is given by:  
where VREF is 600 mV.  
For example; for 1.2 V VOUT and 10 kR3, then R4 is  
10 k. For 600 mV VOUT, R4 is left open. VFB is  
trimmed to a value of 596 mV when VREF=600 mV, so  
the final output voltage, including the effect of the output  
ripple voltage, can be approximated by the equation:  
ꢲꢤꢅꢆꢳ     ꢦꢴꢡꢡꢡꢡ  
(10)  
ꢊꢚꢧ  
where IIND is the inductor current ripple and VFB is  
the ripple voltage on VFB, which should be 12 mV.  
In certain applications, especially designs utilizing only  
ceramic output capacitors, there may not be sufficient  
ripple magnitude available on the feedback pin for  
stable operation. In this case, an external circuit can be  
added to inject ripple voltage into the FB pin.  
 ꢶ  
ꢜꢝꢞꢡ  ꢦꢴꢡ  ꣇ꢌ     ꣉ꢕꢔ  
 ꢵ  
(16)  
Setting the Switching Frequency (fSW)  
There are some specific considerations when selecting  
the RCC ripple injector circuit. For typical applications,  
the value of C4 can be selected as 0.1 µF and  
approximate values for R2 and C5 can be determined  
using the following equations.  
fSW is programmed through external RFREQ as follows:  
ꢜꢝꢞ  
 
ꢦꢧꢊꢨ  
(17)  
ꢖꢥ  ꢣꢜꢆ    
ꢚꢛ  
where CtON=2.2 pF internal capacitor that generates  
tON. For example; for fSW=500 kHz and VOUT=1.2 V,  
select a standard resistor value for RFREQ=54.9 k.  
R2 must be small enough to develop 12 mV of ripple:  
ꢅꢆ  ꢜꢝꢞ  ꢜꢝꢞ  
(11)  
 ꢖ   
ꢅꢆ  ꢥꢬꢥꢌꢖꢄ  ꢢꢵ    
ꢚꢛ  
R2 must be selected such that the R2C4 time constant  
enables stable operation:  
© 2011 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FAN23SV60 • Rev. 1.10  
15  
When calculating COUT  
,
usually the dominant  
Inductor Selection  
requirement is the current load step transient. If the  
unloading transient requirement (IOUT transitioning from  
HIGH to LOW), is satisfied, then the load transient (IOUT  
transitioning LOW to HIGH), is also usually satisfied.  
The unloading COUT calculation, assuming COUT has  
negligible parasitic resistance and inductance in the  
circuit path, is given by:  
The inductor is typically selected based on the ripple  
current (IL), which is approximately 25% to 45% of the  
maximum DC load. The inductor current rating should  
be selected such that the saturation and heating current  
ratings exceed the intended currents encountered in the  
application over the expected temperature range of  
operation. Regulators that require fast transient  
response use smaller inductance and higher current  
ripple; while regulators that require higher efficiency  
keep ripple current on the low side.  
 ꣌꣎   ꢅꢆ  
ꢜꢝꢞ     
ꢡꢡꢡꢡꢡꢡꢡꢡ  
(21)  
ꢜꢝꢞ  ꢜꢝꢞ  ꢝꢞ  
where IMAX and IMIN are maximum and minimum load  
steps, respectively and VOUT is the voltage  
overshoot, usually specified at 3 to 5%.  
The inductor value is given by:  
ꢅꢆ  ꢜꢝꢞ ꢜꢝꢞ  
   
(18)  
ꢲꢤ    
ꢅꢆ  
ꢚꢛ  
For example: for VI=19 V, VOUT=1.2 V, 6A IMAX, 2 A IMIN  
,
fSW=500 kHz, LOUT=720 nH, and 3% VOUT deviation of  
36 mV; the COUT value is calculated to be 263µF. This  
capacitor requirement can be satisfied using six 47 µF,  
6.3 V-rated X5R ceramic capacitors. This calculation  
applies for load current slew rates that are faster than  
the inductor current slew rate, which can be defined as  
VOUT/L during the load current removal. For reduced-  
load-current slew rates and/or reduced transient  
requirements, the output capacitor value may be  
reduced and comprised of low-cost 22 µF capacitors.  
For example: for 19 V VIN, 1.2 V VOUT, 10 A load, 30%  
IL, and 500 kHz fSW; L is 720 nH.  
Input Capacitor Selection  
Input capacitor CIN is selected based on voltage rating,  
RMS current ICIN(RMS) rating, and capacitance. For  
capacitors having DC voltage bias derating, such as  
ceramic capacitors, higher rating is strongly  
recommended. RMS current rating is given by:  
(19)  
ꢒꢅꢆꢯꢧ꣋ꢚꢰ  ꣊ꢜ꣌ꢳ꣍꣋꣌꣎  ꣏꣐  ꢯꢌ  ꣐ꢰꢡꢡꢡꢡꢡꢡꢡ  
Setting the Current Limit  
where ILOAD-MAX is the maximum load current and D is  
the duty cycle VOUT/VIN. The maximum ICIN(RMS) occurs  
at 50% duty cycle.  
Current limit is implemented by sensing the inductor  
valley current across the LS MOSFET VDS during the LS  
on-time. The current limit comparator prevents a new  
on-time from being started until the valley current is less  
than the current limit.  
The capacitance is given by:  
The set point is configured by connecting a resistor from  
the ILIM pin to the SW pin. A trimmed current is output  
onto the ILIM pin, which creates a voltage across the  
resistor. When the voltage on ILIM goes negative, an  
over-current condition is detected.  
꣊ꢜ꣌ꢳ꣍꣋꣌꣎    ꢯꢌ  ꣐ꢰ  
ꢅꢆ  
ꢡꢡꢡꢡꢡꢡ  
(20)  
ꢚꢛ  ꢲꢄ  
ꢅꢆ  
where VIN is the input voltage ripple, normally 1% of  
VIN.  
For example; for VIN=19 V, VIN=120 mV, VOUT=1.2 V,  
10 A load, and fSW=500 kHz; CIN is 9.8 F and ICIN(RMS) is  
2.4 ARMS. Select a minimum of two 10 F 25 V-rated  
ceramic capacitors with X7R or similar dielectric,  
recognizing that the capacitor DC bias characteristic  
indicates that the capacitance value falls approximately  
60% at VIN=19 V. Also, each 10 µF can carry over  
3 ARMS in the frequency range from 100 kHz to 1 MHz,  
exceeding the input capacitor current rating  
requirements. An additional 1 µF capacitor may be  
needed to suppress noise generated by high frequency  
switching transitions  
RILIM is calculated by:  
 
ꢅ꣊ꢅ꣋  
 ꢌꢬꢥꢵ  ꢅ꣊ꢅ꣋  ꢡꢤꢅ꣊ꢅ꣋ꢇ꣒꣌꣊꣊ꢊ꣓  
(22)  
where KILIM is the current source scale factor, and  
IVALLEY is the inductor valley current when the current  
limit threshold is reached. The factor 1.04 accounts  
for the temperature offset of the LS MOSFET  
compared to the control circuit.  
With the constant on-time architecture, HS is always  
turned on for a fixed on-time; this determines the peak-  
to-peak inductor current.  
Current ripple I is given by:  
Output Capacitor Selection  
ꢅꢆ  ꢜꢝꢞ ꢜꢆ  
Output capacitor COUT is also selected based on voltage  
rating, RMS current ICIN (RMS) rating, and  
capacitance. For capacitors having DC voltage bias  
derating, such as ceramic capacitors, higher rating is  
highly recommended.  
ꢲꢤ   
ꢡꢡꢡꢡꢡꢡ  
(23)  
From the equation above, the worst-case ripple occurs  
during an output short circuit (where VOUT is 0 V). This  
should be taken into account when selecting the current  
limit set point.  
The FAN23SV60 uses valley-current sensing, the  
current limit (IILIM) set point is the valley (IVALLEY).  
ꢲꢤ  
(24)  
꣒꣌꣊꣊ꢊ꣓  ꣊ꢜ꣌ꢳꢡꢯꢒ꣊ꢰ  
ꢡꢡ  
The valley current level for calculating RILIM is given by:  
© 2011 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FAN23SV60 • Rev. 1.10  
16  
PGND). This inner PCB layer should have a separate  
analog ground (AGND) under the P1 pad and the  
associated analog components. AGND and PGND  
should be connected together near the IC between  
PGND pins 18-21 and AGND pin 23, which connects to  
P1 thermal pad.  
where ILOAD  
current limit threshold is reached.  
is the DC load current when the  
(CL)  
For example: In a converter designed for 10 A steady-  
state operation and 3 A current ripple, the current-limit  
threshold could be selected at 120% of ILOAD,(MAX) to  
accommodate transient operation and inductor value  
decrease under loading. As a result, ILOAD,(MAX) is 12 A,  
IVALLEY=10.5 A, and RILIM is 1.62 k  
The AGND thermal pad (P1) should be connected to  
AGND plane on inner layer using four 0.25 mm vias  
spread under the pad. No vias are included under PVIN  
(P2) and SW (P3) to maintain the PGND plane under  
the power circuitry intact.  
Boot Resistor  
In some applications, especially with higher input  
voltage, the VSW ring voltage may exceed derating  
Power circuit loops that carry high currents should be  
arranged to minimize the loop area. Primary focus  
should be to minimize the loop for current flow from the  
input capacitor to PVIN, through the internal MOSFETs,  
and returning to the input capacitor. The input capacitor  
should be as close to the PVIN terminals as possible.  
guidelines of 80% to 90% of the absolute rating for VSW  
.
In this situation, a resistor can be connected in series  
with a boot capacitor (C3 in Figure 1) to reduce the turn-  
on speed of the high-side MOSFET to reduce the  
amplitude of the VSW ring voltage. If necessary, a  
resistor and capacitor snubber can be added from VSW  
to PGND to reduce the magnitude of the ringing voltage.  
Please contact Fairchild Customer Support for  
assistance selecting a boot resistor or snubber circuit in  
applications that operate above a 21 V typical input  
voltage.  
The current return path from PGND at the low-side  
MOSFET source to the negative terminal of the input  
capacitor can be routed under the inductor and also  
through vias that connect the input capacitor and low-  
side MOSFET source to the PGND region under the  
power portion of the IC.  
The SW node trace that connects the source of the  
high-side MOSFET and the drain of the low-side  
MOSFET to the inductor should be short and wide.  
Printed Circuit Board (PCB) Layout  
Guidelines  
To control the voltage across the output capacitor, the  
output voltage divider should be located close to the FB  
pin, with the upper FB voltage divider resistor connected  
to the positive side of the output capacitor and the  
bottom resistor connected to the AGND portion of the  
FAN23SV60 device.  
The following points should be considered before  
beginning a PCB layout using the FAN23SV60. A  
sample PCB layout from the evaluation board is shown  
in Figure 26 - Figure 29 following these layout  
guidelines.  
Power components (input capacitors, output capacitors,  
inductor, and FAN23SV60 device) should be placed on  
a common side of the PCB in close proximity to each  
other and connected using surface copper.  
When using ceramic capacitors with external ramp  
injection circuitry (R2, C4, C5 in Figure 1), R2 and C4  
should be connected near the inductor and coupling  
capacitor C5 should be placed near FB pin to minimize  
FB pin trace length.  
Sensitive analog components including SS, FB, ILIM,  
FREQ, and EN should be placed away from the high-  
voltage switching circuits such as SW and BOOT and  
connected to their respective pins with short traces.  
Decoupling capacitors for PVCC and VCC should be  
located close to their respective device pins.  
SW node connections to BOOT, ILIM, and ripple  
injection resistor R2 should be through separate traces.  
The inner PCB layer closest to the FAN23SV60 device  
should have power ground (PGND) under the power  
processing portion of the device (PVIN, SW, and  
© 2011 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FAN23SV60 • Rev. 1.10  
17  
Figure 26. Evaluation Board Top Layer Copper  
Figure 27. Evaluation Board Inner Layer 1 Copper  
© 2011 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FAN23SV60 • Rev. 1.10  
18  
Figure 28. Evaluation Board Inner Layer 2 Copper  
Figure 29. Evaluation Board Bottom Layer Copper  
© 2011 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FAN23SV60 • Rev. 1.10  
19  
5.50±0.10  
26  
18  
1.05±0.10  
17  
10  
27  
34  
(30X)  
0.25±0.05  
5.00±0.10  
0.25±0.05  
0.025±0.025  
1
9
SEATING  
PLANE  
PIN#1  
INDICATOR  
SEE  
DETAIL 'A'  
SCALE: 2:1  
1.58±0.01  
(0.43)  
2.18±0.01  
(0.35)  
0.50±0.01  
9
1
(0.25)  
0.40±0.01 (30X)  
(0.35) 34  
10  
0.68±0.01  
(0.35)  
3.50±0.01  
2.58±0.01  
(1.75)  
17  
(0.33)  
(0.35)  
(0.75)  
27  
0.43±0.01  
18  
26  
(0.35)  
(0.25)  
(3X)  
(0.28)  
(0.24)  
NOTES: UNLESS OTHERWISE SPECIFIED  
A) NO INDUSTRY REGISTRATION APPLIES.  
B) ALL DIMENSIONS ARE IN MILLIMETERS.  
C) DIMENSIONS DO NOT INCLUDE BURRS  
OR MOLD FLASH. MOLD FLASH OR  
BURRS DOES NOT EXCEED 0.10MM.  
D) DIMENSIONING AND TOLERANCING PER  
ASME Y14.5M-2009.  
1.75±0.01  
E) DRAWING FILE NAME: MKT-PQFN34AREV2  
F) FAIRCHILD SEMICONDUCTOR  
5.70  
2.18  
2.10  
1.58  
(0.35)  
0.55 (30X)  
1.80  
26  
18  
0.55  
17  
27  
(1.75)  
2.58  
0.68  
4.10 3.50  
5.20  
3.60  
0.75  
(1.85)  
34  
10  
1
9
(0.30)  
(0.35)  
0.20  
0.30 (30X)  
0.50±0.05  
0.43  
(0.08)  
4.10  
LAND PATTERN  
RECOMMENDATION  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent  
coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.  
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arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
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