FAN48685UC08X [ONSEMI]
Fixed-Output Synchronous TinyBoost® Regulator;型号: | FAN48685UC08X |
厂家: | ONSEMI |
描述: | Fixed-Output Synchronous TinyBoost® Regulator 开关 输出元件 |
文件: | 总12页 (文件大小:547K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
DATA SHEET
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Fixed-Output Synchronous
TinyBoost) Regulator
WLCSP9
CASE 567QW
FAN48685
Description
MARKING DIAGRAM
The FAN48685 is a low−power boost regulator designed to provide
a minimum voltage−regulated rail from a standard single−cell Li−Ion
battery and advanced battery chemistries. Even below the minimum
system battery voltage, the device maintains the output voltage
regulation for an output load current of 800 mA. The combination of
built−in power transistors, synchronous rectification, and low supply
current suit the FAN48685 for battery−powered applications.
The FAN48685 is available in a 9−bump, 0.4 mm pitch,
Wafer−Level Chip−Scale Package (WLCSP).
1
LD
AWLYYWWG
G
LD
A
WL
YY
WW
G
= Specific Device Code
= Assembly Location
= Wafer Lot
= Year
= Work Week
Features
• Input Voltage Range: 2.5 V to 5.5 V
• 800 mA Max. Load Capability
• Forced Pass−Through Mode
= Pb−Free Package
(Note: Microdot may be in either location)
• Three Output Voltage Programmability (3.6 V / 5.0 V / 5.45 V) via
MODE Pins
• 9−Bump, 0.4 mm Pitch WLCSP
• Four External Components: 0603 Inductor, 0402 Case Size Input,
0402 2 x Output Capacitors
• This is a Pb−Free Device
Applications
• NFC Module Power
SW
L
VOUT
PVIN
FAN48685
CIN
COUT
MODE 1
MODE 0
PGND
Figure 1. Typical Application
ORDERING INFORMATION
Part Number
Operating Temperature Range
−40°C to 85°C
Package
Packing Method
Device Marking
FAN48685UC08X
9−Bump, 0.4 mm Pitch,
Tape & Reel
LD
WLCSP Package
© Semiconductor Components Industries, LLC, 2018
1
Publication Order Number:
August, 2021 − Rev. 1
FAN48685/D
FAN48685
Recommended External Components
Table 1. RECOMMENDED COMPONENTS
Component
Description
Vendor
Parameter
Typical Value
Unit
mH
mW
A
L
470 nH 0603
(1.6 mm x 0.8 mm x 0.8 mm max)
DFE18SANR47ME
Murata
L
0.47
64
DCR
ISAT
C
3.1
44
COUT
CIN
2 x 22 mF, 6.3 V, X5R, 0402
GRM155R60J226ME11
Murata
mF
(1.0 mm x 0.5 mm)
10 mF, 6.3 V, X5R, 0402
(1.0 mm x 0.5 mm)
C1005X5R0J106M050BC
TDK
C
10
mF
Pin Configuration
VOUT
VOUT
PVIN
PVIN
VOUT
VOUT
A1
A2
A3
A3
A2
A1
SW
SW
MODE 0
MODE 0
SW
SW
B1
PGND
C1
B2
PGND
C2
B3
MODE 1
C3
B3
MODE 1
C3
B2
PGND
C2
B1
PGND
C1
Top View
(Bumps Down)
Bottom View
(Bumps Up)
Figure 2. Pin Assignment
Pin Descriptions
Table 2. PIN DESCRIPTIONS
Pin #
Name
Description
A1
A2
A3
B1
B2
B3
C1
C2
C3
VOUT
Output Voltage: This pin is the output voltage terminal. Connect directly to COUT.
PVIN
SW
Input Voltage: Connect to Li−Ion battery input power source and CIN.
Switching Node: Connect to inductor.
MODE 0
PGND
MODE 0: In combination with MODE 1 selects the operation of the part.
Power Ground: This is the power return for the IC. COUT and CIN capacitors should be
returned with the shortest path possible to these pins.
MODE 1
MODE 1: In combination with MODE 0 selects the operation of the part.
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2
FAN48685
Table 3. ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Min
Max
Unit
PVIN
Voltage on PVIN Pin
Voltage on VOUT Pin
−0.3
6.5
V
(1)
VOUT
−0.3
6.5
V
(1)
VSW
VCTRL
ESD
SW Node
−0.3
−0.3
6.5
V
V
(1)
MODE 0, MODE 1
6.5
Electrostatic Discharge Protection Level
Human Body Model, ANSI/ESDA/
2.0
1.0
kV
JEDEC JS−001−2012
Charged Device Model, JESD22−C101
(2)
T
Junction Temperature
−40
−65
150
150
260
°C
°C
°C
J
T
Storage Temperature
STG
T
L
Lead Soldering Temperature, 10 Seconds
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Lesser of 6.5 V or PVIN + 0.3 V.
2. Please refer to Thermal Shutdown Protection in the Application information.
Table 4. RECOMMENDED OPERATING CONDITIONS
Symbol
PVIN
L
Parameter
Min
Typ
Max
5.5
Unit
V
Supply Voltage Range
Inductor
2.5
0.470
10
0.611
mH
mF
mF
mA
°C
CIN
Input Capacitance
Output Capacitance
Maximum Output Current
Ambient Temperature
Junction Temperature
(3)
COUT
IOUT
5
2 x 22
800
−40
−40
T
A
85
T
J
125
°C
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
3. The minimum effective capacitance at the output for stability is 5 uF which includes the voltage derated affect with 5.45 V DC applied.
Table 5. THERMAL PROPERTIES
Symbol
Parameter
Junction−to−Ambient Thermal Resistance
Typical
Unit
q
50
°C/W
JA
NOTE: Junction−to−ambient thermal resistance is a function of application and board layout. This data is measured with four−layer 2s2p
boards with vias in accordance to JEDEC standard JESD51. Special attention must be paid not to exceed junction temperature,
T
, at a given ambient temperature, T .
J(max)
A
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3
FAN48685
Table 6. ELECTRICAL CHARACTERISTICS (Notes 4, 5)
Minimum and maximum values are at PVIN = 2.5 V to VOUT – 200 mV at T = −40°C to +85°C, while typical values are at T = 25°C and
A
A
PVIN = 3.8 V, VOUT = 5 V otherwise noted.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Power Supplies
I
IQ When part is in Forced
Pass−Through
No Load
3
10
mA
Q_PT
V
V
Under−Voltage Lockout
PVIN Rising
PVIN Falling
2.10
2.00
2.15
2.05
2.24
2.13
V
V
UVLO_RISE
UVLO_FALL
Output Accuracy
V
Regulated Output Voltage
PVIN = 2.5 V, MODE[1:0] = 10,
3.537
3.510
4.913
4.875
5.355
5.314
3.600
3.600
5.000
5.000
5.450
5.450
3.663
3.690
5.088
5.125
5.545
5.586
V
O_ACC
No Load, PWM Mode, T = −10°C to +50°C
A
PVIN = 2.5 V, MODE[1:0] = 10,
No Load, PWM Mode
PVIN = 3.8 V, MODE[1:0] = 01,
No Load, PWM Mode, T = −10°C to +50°C
A
PVIN = 3.8 V, MODE[1:0] = 01,
No Load, PWM Mode
PVIN = 3.8 V, MODE[1:0] = 11,
No Load, PWM Mode, T = −10°C to +50°C
A
PVIN = 3.8 V, MODE[1:0] = 11,
No Load, PWM Mode
Regulator
F
Switching Frequency
IL peak Current Limit
No Load, PVIN = 3.8 V
2.25
2.88
2.50
3.63
90
2.75
4.46
200
MHz
A
SW
I
PVIN = 2.5 V, Open Loop (Note 6)
SWLIM
LIN
Soft−Start Input Linear
Current Limit
mA
I/O Levels
V
Low−Level Input Voltage
High−Level Input Voltage
0.4
V
V
IL
V
IH
1.2
PVIN
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
4. Min and Max limits are specified by design, test and/or statistical analysis.
5. Refer to Typical Characteristics waveforms/graphs for closed loop data and variation with input supply and temperature. Electrical
specifications reflect open loop steady state data.
6. Current Limit specifications is tested open loop, for typical close loop current limit data, refer to typical performance characteristics
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FAN48685
Table 7. SYSTEM SPECIFICATIONS (Note 7)
The following system specifications are guaranteed by designed and are not performed in production testing. Recommended operating
conditions, unless otherwise noted, PVIN = 2.5 V to VOUT – 200 mV, TA = 40°C to 85°C, VOUT = 5.45 V otherwise noted. Typical val-
ues are given PVIN = 3.8 V and TA = 25°C. System Specifications area based on circuit per Figure 1. L = 0.47 mH (0603 DFE1608CK−
R47M 70 mW/ 3.0 A) CIN = 10 uF (0402 C1005X5R0J106M050BC TDK) COUT = 2 x 22 uF (0402 GRM155R60J226ME11 MURATA.)
Symbol
Efficiency
h
Parameter
Conditions
Min
Typ
Max
Unit
Efficiency
VOUT = 5.45 V, IOUT = 100 mA
VOUT = 5.45 V, IOUT = 300 mA
VOUT = 5.45 V, IOUT = 500 mA
86
92
93
%
IOUT MAX
I
IOUT Max.
800
mA
OUT
VOUT Regulation
LOAD
Load Regulation
Line Regulation
200 mA < IOUT < 600 mA, VOUT = 5.45 V
−5
mV/A
mV/V
REG
REG
LINE
3.0 V < PVIN < 4.2 V , IOUT = 550 mA,
VOUT = 5.45 V
2
Output Ripple
V
Output Ripple
VOUT Change
IOUT = 550 mA, VOUT = 5.45 V, PVIN = 3.8 V
IOUT = 450 mA, VOUT = 3.6 V, PVIN = 3.0 V
15
15
30
30
mV
RIPPLE
VOUT Transitions
T
MODE[1:0] 00 > 01 to 95% of VOUT,
VOUT = Forced Pass−Through Mode > 5 V,
IOUT = 1 mA
150
100
1.5
200
200
ms
SETTLE
MODE[1:0] 00 > 10 to 95% of VOUT,
VOUT = Forced Pass−Through Mode > 3.6 V,
IOUT = 1 mA, PVIN = 2.5 V to VOUT – 200 mV
I
SS
Soft−Start
MODE[1:0] = 00, VOUT = PVIN (Start up into
Forced Pass−Through Mode)
ms
Noise
en_bw
Output Noise Voltage
(Integrated)
VOUT = 5 V, IOUT = 550 mA,
Freq = 0 Hz to 200 kHz
26
140
70
750
500
300
mV
VOUT = 5 V, IOUT = 550 mA,
Freq = 50 kHz to 2 MHz
VOUT = 5 V and 3.6 V, IOUT = 550 mA,
Freq = 13.5 MHz 200 kHz
Transients
V
Load Transient
Load Transient
IOUT = 10 mA ↔ 400 mA, T = T = 1 ms,
75
75
mV
mV
TRRP
R
F
VOUT = 5.45 V
V
TRRP
PVIN = 3.0 V ↔ 3.5 V, T = T = 10 ms,
R
F
IOUT = 550 mA, VOUT = 5.45 V
7. System Specifications are tested closed loop while using the recommended external components as listed on Table 1.
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FAN48685
Typical Performance Characteristics
Unless otherwise specified; PVIN = 3.8 V, VOUT =
C1005X5R0J106M050BC TDK) COUT = 2 x 22 mF (0402
GRM155R60J226ME11 MURATA), L = 0.47 mH (0603,
70 mW, DFE1608CK−R47M).
5.45 V, T = 25°C, and circuit and components according to
A
Figure 1.
Components:
CIN = 10 mF
(0402
Figure 3. Efficiency vs. Load Current and Input Voltage
Figure 4. Efficiency vs. Load Current and Temperature
Figure 5. Output Regulation vs. Load Current and
Input Voltage
Figure 6. Output Ripple vs. Load Current and Input
Voltage
Figure 7. Frequency vs. Load Current and Input
Voltage
Figure 8. Quiescent Current vs. Input Voltage and
Temperature
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FAN48685
Typical Performance Characteristics
Unless otherwise specified; PVIN = 3.8 V, VOUT =
C1005X5R0J106M050BC TDK) COUT = 2 x 22 mF (0402
GRM155R60J226ME11 MURATA), L = 0.47 mH (0603,
70 mW, DFE1608CK−R47M).
5.45 V, T = 25°C, and circuit and components according to
A
Figure 1.
Components:
CIN = 10 mF
(0402
Figure 9. Load Transient, 10 e 400 mA, 1 ms Edge
Figure 10. Line Transient, 3.0 V e 3.5 V, 10 ms Edge,
550 mA Load
Figure 11. VOUT Change: Forced PT to BOOST
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FAN48685
APPLICATION INFORMATION
Operation Description
Mode Transition
The FAN48685 is low−power boost regulator designed to
provide a minimum voltage regulated rail from a standard
single−cell Li−Ion battery. The device offers superior
features for NFC applications. PWM switching frequency is
maintain away from the sub carrier of NFC application
avoiding interference. The FAN48685 automatically goes to
100% duty cycle when the input voltage nears the output
voltage. The part can also be placed in forced pass through
mode by pulling both mode pins low.
Pass−Through to Boost Mode
When going from pass−through mode to boost mode,
initially there is a delay for the internal digital circuitry to
power up the analog circuitry. After, analog circuitry is
powered, the internal DAC will begin to start stepping from
2.45 V. As soon as the internal DAC step is greater than
PVIN, the VOUT of the device begins to increase until it
reaches its final VOUT target value. The device is designed
to transitions under no load, care should be taken in system
design to ensure the load is not applied during VOUT
transitions.
Startup Behavior
Startup Description
When going from boost mode to pass−through mode, the
output voltage decay will be determined by the amount of
load at the VOUT.
The device is designed to startup with no load allowing the
implementation of input current controls that support lower
capacity batteries without inducing brown out. Care should
be taken in the system design to ensure load is applied after
regulation has been reached and output capacitance is a
suitable value to avoid fault time−outs occurring. The device
can startup in either boost mode or forced pass−through
mode. When starting in boost mode, the part has a linear
mode which limits the battery current to 90 mA (typ.) to
avoid large inrush currents from the battery. In linear mode,
if VOUT fails to reach PVIN target within 1.5 ms, a fault
condition is declared and the device waits 20 ms to attempt
an automatic restart. Once VOUT charges up to PVIN, the
linear mode current limit is disabled and the output voltage
is ramped to the final value via the DAC that programs the
output.
Boost to Boost Mode
When going from boost mode to a higher VOUT boost
mode, the internal DAC starts its step from the current
VOUT until the final VOUT target. Since there is no latency
for the analog to be powered up, immediately after the DAC
stepping, the VOUT of the device begins to increase until it
reaches its final VOUT target value.
When going from boost mode to a lower VOUT boost
mode, the output voltage decay will be determined by the
amount of load at the VOUT.
Protection Features
VOUT Fault
During startup, if the VOUT fails to reach PVIN target
within 1.5 ms, the part declares a fault. Once the fault is
triggered, the regulator stops switching and presents a
high−impedance path between PVIN and VOUT.
When starting up in forced pass−through mode, the output
voltage is charged using the same linear mode mechanism
until VOUT reaches PVIN.
Modes of Operation
Current Limit Protection (OCP)
PWM Description
FAN48685 has a current limit feature, which protects
itself and load during overloading conditions. When the
inductor peak current is reached and held for 2 ms, the device
goes into a fault. The part restarts every 20 ms once fault
occurs.
During PWM mode, the output voltage is regulated by
switching at a constant frequency and then modulating the
energy per cycle to control the power to the load.
Forced Pass−Through Mode
When both mode pins are pulled low, the part will be
forced in pass−through mode. The output voltage is around:
VOUT = (PVIN − (IOUT* (DCR of L +HIGH SIDE FET
RDSON)) during this mode.
Thermal Shutdown Protection (TSP)
When the die temperature increases, due to a high load
condition and/or a high ambient temperature; the output
switching is disabled until the die temperature falls
sufficiently. The junction temperature at which the thermal
shutdown activates is nominally 150°C with a 15°C
hysteresis.
Automatic Pass−Through Mode
In normal operation, the device automatically transitions
from boost mode to pass−through mode if PVIN is within
about 150 mV of VOUT boost voltage. In pass−through
mode, the device has a low impedance path between PVIN
and VOUT. Entry into pass−through mode occurs when
PVIN is sufficiently close to VOUT that minimum on−time
persists for 16 cycles. In Automatic pass−through mode,
there is short−circuit protection which protects both the IC
and external components.
Automatic Pass−Through Mode Protection
During automatic pass−through mode, the device is
short−circuit protected, if the voltage difference between
PVIN and VOUT exceed more than 300 mV for 10 us, then
a fault is declared. The part will restart every 20 ms.
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FAN48685
Under−Voltage Lockout (UVLO)
Once PVIN reaches UVLO rising the part will begin to
switch and begin the startup process. When PVIN falls to
UVLO falling, the part stops switching and output voltage
starts decays to 0 V.
Control Pin Functionality
Table 8. MODE PINS FUNCTIONALITY (Note 8)
Mode 1
Mode 0
Status of Device
0
0
Forced Pass−Through Mode;
VOUT = PVIN
0
1
1
1
0
1
Active; VOUT = 5.00 V
Active; VOUT = 3.60 V
Active; VOUT = 5.45 V
8. Recommended to have logic levels transitions and fall times
typically at 100 ns. MODE Pins have smart pulls down of
300 kW (typ.) and are only activated when at logic LOW.
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FAN48685
ADDITIONAL APPLICATIONS INFORMATION
Application Guidelines
overload conditions. Saturation effects causes the inductor
current ripple to become higher under high loading, as only
the peak of the inductor current ripple is controlled.
Input Capacitor Considerations
The 10 mF ceramic 0402 (1005 metric) input capacitor
should be placed as close as possible between the PVIN pin
and GND to minimize the parasitic inductance. If a long wire
is used to bring power to the IC, additional “bulk”
capacitance (electrolytic or tantalum) should be placed (on
Evaluation board) between CIN and the power source lead
to reduce the ringing that can occur between the inductance
of the power source leads and CIN. The effective
capacitance value decreases as PVIN increases due to DC
bias effects.
Layout Considerations
The layout recommendations below highlight various
top−copper pours using different colors. To minimize spikes
at VOUT, COUT must be placed as close as possible to
PGND and VOUT, as shown in Figure 12.
For thermal reasons, it is suggested to maximize the pour
area for all planes other than SW. Especially the ground pour
should be set to fill all available PCB surface area and tied
to internal layers with a cluster of thermal vias.
Output Capacitor Considerations
The two 22 mF ceramic 0402 (1005 metric) output
capacitor should be placed as close as possible between the
VOUT pin and GND to minimize the parasitic inductance.
The effective capacitance value decreases as VOUT
increases due to DC bias effects. Therefore, a minimum 5 uF
capacitance is required to maintain stable regulation at the
output.
L
If the output capacitance is increased beyond the
recommended two 22 mF ceramic the system design should
be evaluated to ensure that the part does not enter fault state
or hiccup during start−up as the device charges the output
capacitance.
CIN
COUT
COUT
FAN48685
Inductor Considerations
The FAN48685 employs a peak current limiting, so peak
inductor current can reach 3.63 A for a short duration during
Figure 12. Recommended Layout
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MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
WLCSP9 1.215x1.215x0.581
CASE 567QW
ISSUE B
DATE 24 FEB 2023
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON13355G
WLCSP9 1.215x1.215x0.581
PAGE 1 OF 1
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are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular
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500-kHz Half-Bridge DC/DC Controller with Integrated Secondary Synchronous Rectification DriversWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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