FAN5340UCX [ONSEMI]

LED 驱动器,同步升压,带 PWM 调光接口;
FAN5340UCX
型号: FAN5340UCX
厂家: ONSEMI    ONSEMI
描述:

LED 驱动器,同步升压,带 PWM 调光接口

驱动 驱动器
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中文:  中文翻译
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June 2013  
FAN5340  
PWM亮度控制并可断开负载的同步恒流升压串联LED驱动器  
产品特性  
说明  
FAN5340 同步LED驱动器,可以向最多4个串联的LED  
提供最可达0mW功率。优化设计更适用于小型装置,  
1.2M的固定率从而允许使用较小的芯片电感和电  
容。  
. 同步电流模式升压变换器  
. 输出功率可达500mW  
. 支持2, 3, 4 LED 串联  
. 输入电压范围:2.7V4.8V  
. 1.2MHz 固定开关频率  
. 1mA 最大静态电流  
安全方面,件整合了短路检测、过压和热关断保护功能。此  
外,若电池电压过低将触发输入欠压闭锁保护。  
亮度调光)控制通过在EN脚上施加 300Hz 1kHz 的  
PM 信号来实现。关断期间,FAN40 LED节点从保持  
升压稳压器电压COUT压稳压器输出端上断开,从而减少  
PWM调光的音频噪声,并断开 ED 串的电源。  
. 软启动  
. 输入欠压锁定(UVLO)  
. 输出过压保护 (OVP)  
. 短路检测  
GND  
EN  
VIN  
1
2
3
4
8
7
6
5
CIN  
. 热关闭保护()TSD  
. 8-引脚, 3.00 x 3.00mm UMLP  
. 8-引脚 (焊球), 1.57 x 1.LCSP  
COUT  
VOUT  
SW  
2 4  
LEDs  
L
P1  
GND  
1
ED  
FB  
PGND  
RSET  
适用范围  
. 手机,智能电
Figure 1.  
典型应用  
. 便携式电脑  
. WLAN DC-DC 变换器模块  
. PDADSCPMP 以及 MP3 播放器  
订购信息  
器件型号  
FAN5340UCX  
工作温度范围  
封装  
包装  
卷带  
卷带  
8 球型,1.57 x 1.57mm 晶圆级芯片封装  
WLCSP)  
-40 +85°C  
-40 +85°C  
FAN5340MPX (初级)  
8-管脚,3.00 x 3.00mm 超薄模塑无铅封装(MLP)  
© 2010 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FAN5340 • Rev. 1.0.1  
框图  
L1  
SW  
VIN  
CIN  
Q1  
Q2  
D1  
GATE  
DRIVE  
VOUT  
VL
PGND  
COUT  
Q3  
BOOST  
CONTROL  
2 – 4  
LEDs  
EN  
GND  
FB  
15 -  
RS
133  
Figure 2.  
框图  
Table 1. 建议使用的外部件  
组件  
厂商  
参数  
L(1)  
最小值 典型值 最大值 单位  
22  
H  
rata  
LQH3NPN220MGOK  
L1  
2H
DCR (系列 R)  
1100  
4.7  
m  
F  
COUT  
CIN  
5R 或更好  
X5R 或更好  
C
C
4.7  
F  
说明:  
1. 最小 L (电感) 涉及容限、温度和直流偏压的影响(L随电流升高而降低)。  
©2010 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FAN5340 • Rev. 1.0.1  
2
 
引脚布局  
GND  
A1  
EN  
A2  
VLED  
A3  
A3  
B3  
C3  
A2  
C2  
A1  
B1  
C1  
B1  
C1  
B3  
C3  
VIN  
FB  
C2  
VOUT SW PGND  
Figure 3.  
WLCSP 封装,顶视图  
Fure 4.  
WLCSP 封装,底视图  
GND  
EN  
1
2
4
8 VIN  
VOUT  
6 SW  
P1  
GND  
VLED  
5 PGND  
8-引脚, 3 x 3mm 顶视图MLP,  
引脚说明  
引脚号  
明  
CSP  
MLP  
A1  
1
2
3
4
ND  
N  
模拟地。所有信号均以该引脚为参照。  
启用 / PWM亮度控制。该引脚上的逻辑低电平可关断芯片,将LEDVOUT断开,并降低芯  
片的功耗。该管脚上存在一只内部 300kΩ的下拉电阻。  
A2  
A3  
B3  
VLED  
FB  
LED串输出。连接至两个至四个LED组成的串节点。  
电流反馈。升压稳压器可将该引脚的电压调至0.5V,以控制LED的串行电流。将该引脚连接  
GNDLED阴极之间的电流设置电阻(RSET)。  
C3  
C2  
C1  
B1  
5
6
7
8
PGND  
SW  
电源地。升压开关和栅极驱动在此引脚接地。  
开关。电感L1连接在VIN和该引脚之间。  
升压输出电压。升压稳压器的输出。  
输入电压。  
VOUT  
VIN  
©2010 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FAN5340 • Rev. 1.0.1  
3
绝对最大额定值  
如果应力超过绝对最大额定值,器件就会毁损。在推荐的工作条件之上,该器件可能无法正常运行或操作,且不建议让器件在这  
些条件下长期工作。此外,过度暴露在高于推荐的工作条件下,会影响器件的可靠性。绝对最大额定值仅是额定应力值。  
符号  
参数  
最小值 最大值  
单位  
V
VIN  
VIN  
0.3  
0.3  
0.3  
0.3  
6.0  
VIN + 0.3  
24.0  
V
FBVEN FBEN引脚  
V
VSW  
SW 引脚  
V
VOUT  
VOUT 引脚  
24.0  
V
人体模型满足JESD22-A114  
4.0  
1.5  
ESD  
静电放电防护等级  
kV  
充电器件模型满足JESD22-C10
TJ  
TSTG  
TL  
结温  
40  
65  
+150  
+150  
+260  
°C  
°C  
°C  
存储温度  
引线焊接温度,10秒  
推荐工作条件  
推荐的操作条件表定义了真实器件的工作条件。指定推的工作条件,以确保设备的最佳性达到数据表中的规格。飞兆半导体  
建议不要超过推荐工作条件,也不能按照绝对最定值行设计。  
符号  
VIN  
最小值  
2.7  
典型值  
最大值  
4.8  
单位  
V
VIN 电源电压  
VOUT 电压  
VOUT  
IOUT  
6.2  
16.0  
40  
V
VOUT 负载电流  
5
mA  
Hz  
°C  
°C  
fEN_PWM EN 引脚 PW
100  
40  
40  
300  
1000  
+85  
TA  
TJ  
环境温度  
结温  
+125  
热性能  
-环境之间热阻与具体应用和电路板布局有关。该数据由2s2p四层板测得,符合JESD51-JEDEC标准。特别注意的是,不要超  
过给定环境温度TA时的结温 TJ(max)  
符号  
参数  
典型值  
110  
单位  
°C/W  
°C/W  
WLCSP 封装  
MLP 封装  
-环境之间热阻  
JA  
49  
©2010 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FAN5340 • Rev. 1.0.1  
4
电气规格  
VIN = 2.7V 4.8V, TA = -40°C+85°C,除非另有说明。典型值测量条件为 TA = 25°C VIN = 3.6V。  
参数  
工作条件  
最小值 典型值 最大值 单位  
符号  
电源  
IQ  
静态电流  
EN = VIN, 器件未开关  
1
mA  
A  
V
ISD  
停机电源电流  
EN = GND, VIN = 3.6V  
0.3  
2.40  
2.15  
250  
1.0  
V
IN 升  
IN 降  
2.30  
2.00  
2.50  
2.25  
VUVLO  
欠压锁定  
V
V
VUVHYST 欠压锁定滞环宽度  
EN:启用引脚  
mV  
VIH  
VIL  
输入电压高电平  
输入电压低电平  
EN 下拉电阻  
1.2  
V  
V  
0.4  
400  
80  
REN  
200  
20  
30
k  
ms  
tSD  
EN 低电平,关断延迟  
EN 的下降沿  
反馈和参考  
VFB  
反馈电压  
480  
00  
0.1  
520  
1.0  
mV  
IFB  
反馈输入电流  
VFB 500m
A  
电源输出  
= 3.6V, VOUT = V, ISW = 100mA  
IN = 2.7V, VOUT 10V, ISW = 100mA  
VOUT = 10V, ISW = 1mA  
600  
850  
2.0  
2.8  
RDS(ON)_Q1 升压开关接通电阻  
m  
RDS(ON)_Q2 同步整流导通电阻  
RDS(ON)_Q3 负载开关导通电阻  
VOUT = 10V, ILED = 10mA  
EN = 0, VIN = VSW = VOUT = 5.5V,  
VLED = 0  
ISW(OFF) SW 节点漏电
0.1  
1.0  
A  
ILIM-PK  
振荡器  
fSW  
升压开电流
升压稳频率  
PWM 占空比(3)  
VIN = 3.6V  
325  
1.0  
400  
475  
mA  
1.2  
1.4  
100  
20.0  
MHz  
%
PWM 调光  
DPWM  
PWM调光频率≤1kHz  
1.0  
输出和保护  
VOVP  
升压输出过压保护 (OVP)  
18.0  
19.0  
0.8  
V
V
VOVPHYST OVP 滞环  
V
OUT 降  
OUT 升  
VIN 1.5  
VIN 1.3  
V
VTHSC  
VLED 短路检测阈值  
V
V
DMAX  
DMIN  
TSD  
最大升压占空比(3)  
最小升压占空比(3)  
热关闭  
85  
%
%
°C  
°C  
20  
150  
25  
THYS  
热关闭滞环宽度  
说明:  
2. SW 漏电流包括三个内部开关的漏电流; SW GND, VOUT VLED, 以及 SW VOUT  
3. 设计保证。  
.
©2010 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FAN5340 • Rev. 1.0.1  
5
 
 
典型特性  
VIN = 3.6V, TA = 25C, ILED = 20mA, L = 22µH, COUT = 4.7µF.  
Figure 6.  
效率 vs. LED 电流:2 LED  
Figure 7.  
效率 vs. LED 电流:3 LED  
Fig
效率 vs. LED 电流:4 LED  
Figure 9.  
fSW vs.输入电压 vs.温度  
Figure 10. FB 电压 vs.输入电压 vs.温度  
Figure 11. OVP vs.输入电压vs.温度  
©2010 Fairchild Semiconductor Corporation  
FAN5340 • Rev. 1.0.1  
www.fairchildsemi.com  
6
典型特性()  
Figure 12. PWM 线性化,超过调光占空比全程,4  
Figure . PWM 线性化,调光占空比<2.5%4 LED  
LED  
VOUT上的最大输出电流  
Figure 15. 电源瞬态,步进10µs 4 LED  
Figure 16. 过压保护:软起动,打开LED串  
©2010 Fairchild Semiconductor Corporation  
FAN5340 • Rev. 1.0.1  
www.fairchildsemi.com  
7
典型特性()  
Figure 17. 1ms/Div100%占空比的冷启动波形  
Figure 18. 100%占空比的冷启动波形以10ms/Div显示  
启动关断再启动。  
Figure 19. FAN5340 ILOAD 20mA 步进至 30mA,  
通过在10mA 启用 FAN5640 3 LED  
Figure 20. FAN5340 ILOAD 30mA 步进至 20mA,  
通过在10mA 禁用 FAN5640 3 LED  
©2010 Fairchild Semiconductor Corporation  
FAN5340 • Rev. 1.0.1  
www.fairchildsemi.com  
8
电路说明  
概述  
过压保护  
FAN5340 是一款电感电流模式升压的串联 LED 驱动器,通  
过保持RSET电阻 0.5V 的电压实现LED电流的调节。LED 串的  
电流(ILED)的计算公式为:  
LED 串采用开路,FB 保持为 0V,且输出电压在没有过压  
保护(OVP)电路的情况下持续升高。当 VOUT 超过19.0V  
时,FAN5340 OVP电路将禁用升压稳压器,并持续到VOUT  
降至18.2V以下方可启用。  
0.5  
ILED  
(1)  
RSET  
热关闭  
晶圆温度超过150°C时,发生复位并保持,直至晶圆冷却至  
125°C;此时允电路开始软起动序列。  
LED上的正向电压可决定 VOUTFAN5340 的升压稳压器输出  
也可以支持VOUT (参见图 21) 上的其他负载,前提是不超过输  
入电流限制。  
适用范围  
使用 VUT 驱动附加的 LED 串  
VOUT 引脚用作简单电流源(如图22使用FAN5640所示)  
或分离电流槽。为避免 EN 引脚在低电平时下拉 VOUT,应启  
用辅助,除非 EN 引脚处于高电平。因而辅助串可使用与  
N 同线路进行 PWM 调光,如图所示,或单独启用,但应  
FAN5340 的导通期间。  
OUT1  
GND  
IOUT2  
VIN  
1
2
3
6
5
4
FAN5640  
R1  
RSET  
EN  
GND  
VIN  
1
8
CIN  
Figure 21. 电流 v. 输入电压  
COUT  
EN  
VLED  
FB  
VOUT  
SW  
2
3
4
7
6
5
FAN5340  
UVLO 和软启动  
PGND  
EN 低电平超芯片在EN 升高时将进行冷启动的  
软起动周期,前UVLO 阈值。软起动电路将参考  
电压输入误差放大控制冲击电流。  
R2  
Figure 22. 驱动附加的 LED 串  
若使用 VOUT 驱动附加负载,应注意不要超过输入电流限  
PWM 调光  
EN 低电平时,芯片关断一个 MOSFET (Q3 2), 其断开  
LED 负载,防止EN引脚低电平时 COUT 放电只要 EN 低电  
平的时间不超过 20ms,稳压器的主回路将在 EN 恢复高电平  
时迅速恢复控制。  
制。图21 给出了典型芯片的限制。总负载(IOUT1 + IOUT2 + ILED  
)
应保持低于图21值的 70%。  
短路检测  
VOUT 降至 VIN 1.5V 以下时,Q3 关断直至 VOUT 至少恢复至  
VIN 1.3V 方可导通。  
©2010 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FAN5340 • Rev. 1.0.1  
9
物理尺寸  
BALL A1  
INDEX AREA  
(Ø0.25)  
Cu PAD  
2X  
(Ø0.35)  
SOLDER MASK  
OPENING  
D
2X  
RECOMMENDED LAND PATTERN (NSMD)  
TOP VIEW  
E
D
SIDE VEWS  
NOTES:  
A. NO DEC REGISTATION APPLIES.  
B. DIMENSIONS ARE IN MILLIMETERS.  
(X).018  
C, DIMNSIONS AND TOLERANCES PER  
ASME Y15M, 1994  
8 X Ø0+/- .025  
D. DATUM C, THE SEATING PLANE, IS DEFINED  
BY THE SPHERICAL CROWNS OF THE BALLS.  
(Y)+/-.018  
B
A
E. PACKAGE TYPICAL HEIGHT IS 582 MICRONS  
± 43 MICRONS (539-625 MICRONS).  
1
3
F. FOR DIMENSIONS D, E, X, AND Y SEE  
PRODUCT DATASHEET.  
BOTTOM VIEW  
G. BALL COMPOSITION: Sn95.5-Ag3.9-Cu0.6  
I. DRAWING FILENAME: MKT-UC008ABrev2.  
产品规格尺寸  
D
E
X
Y
产品  
FAN5340UC  
1.570  
1.570  
0.285  
0.285  
Figure 23. 8 球型,1.57 x 1.57mm 晶圆级芯片封装(WLCSP)  
封装图纸是作为一项服务,提供给考虑飞兆半导体产品的客户。具体参数可进行改动,且无需做出相应通知。请注意图纸上的版本和/或日期,  
并联系飞兆半导体代表核实或获得最新版本。封装规格并不超出飞兆公司全球范围内的条款与条件,尤其指保修,保修涉及飞兆半导体的全部产  
品。  
随时访问飞兆半导体在线封装网页,可以获得最新的封装图:  
http://www.fairchildsemi.com/packaging/。  
©2010 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FAN5340 • Rev. 1.0.1  
10  
物理尺寸()  
2X  
0.8 MAX  
2X  
RECOMMENDED LAND PATERN  
0.05  
0.00  
SEATING  
PLANE  
A. CONFORMS TO JEDEC EGISTRATION MO-229,  
VARIATION VEEC, DATED 11/2001  
B. DIMENSIONS ARE IN MILIMETERS.  
C. DIMENSIONS AND TOLERANCES PER  
ASME Y14.5M, 1994  
D. FILENAME: MKT-MLP08Drev2  
Figure 24. 8-管脚,3 x 3mm 超薄模塑无铅封装(MLP)  
封装图纸是作为一项服务,提供给考虑飞兆半导体产品的客户。具体参数可进行改动,且无需做出相应通知。请注意图纸上的版本和/或日期,  
并联系飞兆半导体代表核实或获得最新版本。封装规格并不超出飞兆公司全球范围内的条款与条件,尤其指保修,保修涉及飞兆半导体的全部产  
品。  
随时访问飞兆半导体在线封装网页,可以获得最新的封装图:  
http://www.fairchildsemi.com/packaging/。  
©2010 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FAN5340 • Rev. 1.0.1  
11  
©2010 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FAN5340 • Rev. 1.0.1  
12  
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