FAN9612MX [ONSEMI]

交错双 CrCM PFC 控制器;
FAN9612MX
型号: FAN9612MX
厂家: ONSEMI    ONSEMI
描述:

交错双 CrCM PFC 控制器

控制器 功率因数校正 光电二极管
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February 2013  
FAN9612  
Interleaved Dual BCM PFC Controllers  
The FAN9612 interleaved dual Boundary-Conduction-  
Mode (BCM) Power-Factor-Correction (PFC) controller  
operates two parallel-connected boost power trains 180°  
out of phase. Interleaving extends the maximum practical  
power level of the control technique from about 300 W to  
greater than 800 W. Unlike the continuous conduction  
mode (CCM) technique often used at higher power  
levels, BCM offers inherent zero-current switching of the  
boost diodes, which permits the use of less expensive  
diodes without sacrificing efficiency. Furthermore, the  
input and output filters can be smaller due to ripple  
current cancellation and effective doubling of the  
switching frequency.  
Features  
.
Sync-Lock™ Interleaving Technology for 180°  
Out-of-Phase Synchronization Under All Conditions  
.
.
.
.
.
.
Automatic Phase Disable at Light Load  
Dead-Phase Detect Protection  
2.0 A Sink, 1.0 A Source, High-Current Gate Drivers  
High Power Factor, Low Total Harmonic Distortion  
Voltage-Mode Control with (VIN)2 Feedforward  
Closed-Loop Soft-Start with User-Programmable  
Soft-Start Time for Reduced Overshoot  
.
.
.
.
Minimum Restart Frequency to Avoid Audible Noise  
Maximum Switching Frequency Clamp  
The converter operates with variable frequency, which is  
a function of the load and the instantaneous input /  
output voltages. The switching frequency is limited  
between 16.5 kHz and 525 kHz. The Pulse Width  
Modulators (PWM) implement voltage-mode control with  
input voltage feedforward. When configured for PFC  
applications, the slow voltage regulation loop results in  
constant on-time operation within a line cycle. This PWM  
method, combined with the BCM operation of the boost  
converters, provides automatic power factor correction.  
Brownout Protection with Soft Recovery  
Non-Latching OVP on FB Pin and Latching Second-  
Level Protection on OVP Pin  
.
.
.
.
Open-Feedback Protection  
Power-Limit and Current Protection for Each Phase  
Low Startup Current of 80 µA Typical  
Works with DC and 50 Hz to 400 Hz AC Inputs  
The controller offers bias UVLO of 12.5 V / 7.5 V, input  
brownout, over-current, open-feedback, output over-  
voltage, and redundant latching over-voltage protections.  
Furthermore, the converters’ output power is limited  
independently of the input RMS voltage. Synchronization  
between the power stages is maintained under all  
operating conditions.  
Applications  
.
.
.
.
.
100-1000 W AC-DC Power Supplies  
Large Screen LCD-TV, PDP-TV, RP-TV Power  
High-Efficiency Desktop and Server Power Supplies  
Networking and Telecom Power Supplies  
Solar Micro Inverters  
Description  
Figure 1. Simplified Application Diagram  
© 2008 Fairchild Semiconductor Corporation  
FAN9612 • Rev. 1.1.7  
www.fairchildsemi.com  
Ordering Information  
Packing  
Quantity  
Part Number  
Package  
Packing Method  
FAN9612MX  
16-Lead, Small Outline Integrated Circuit (SOIC)  
Tape and Reel  
2,500  
This device passed wave soldering test by JESD22A-111.  
Package Outlines  
Figure 2. SOIC-16 (Top View)  
Thermal Resistance Table  
Thermal Resistance  
Package  
Suffix  
(1)  
(2)  
ΘJL  
ΘJA  
16-Lead SOIC  
M
35°C/W  
50 – 120°C/W(3)  
Notes:  
1. Typical ΘJL is specified from semiconductor junction to lead.  
2. Typical ΘJA is dependent on the PCB design and operating conditions, such as air flow. The range of values  
covers a variety of operating conditions utilizing natural convection with no heatsink on the package.  
3. This typical range is an estimate; actual values depend on the application.  
© 2008 Fairchild Semiconductor Corporation  
FAN9612 • Rev. 1.1.7  
www.fairchildsemi.com  
2
Typical Application Diagram  
V
IN  
L2a  
D2  
D1  
V
OUT  
V
LINE  
L2b  
L1a  
R
R
ZCD2  
ZCD1  
R
IN1  
C
IN  
L1b  
C
OUT  
AC IN  
R
R
FB1  
FB2  
EMI Filter  
1
2
3
4
ZCD1  
ZCD2  
5VB  
CS1 16  
CS2 15  
R
IN2  
C
R
5VB  
VBIAS  
14  
13  
VDD  
Q1  
MOT  
AGND  
SS  
DRV1  
R
MOT  
INHYST  
RG1  
RG2  
Q2  
5
6
7
8
DRV2 12  
C
SS  
R
R
OV1  
OV2  
PGND 11  
VIN 10  
R
C
COMP  
COMP  
FB  
C
COMP,LF  
RCS1  
RCS2  
9
OVP  
COMP,HF  
C
C
VDD2  
VDD1  
C
INF  
Figure 3. Typical Application Diagram  
Block Diagram  
Figure 4. Block Diagram  
© 2008 Fairchild Semiconductor Corporation  
FAN9612 • Rev. 1.1.7  
www.fairchildsemi.com  
3
Pin Configuration  
Figure 5. Pin Layout (Top-View)  
Pin Definitions  
Pin #  
1
Name  
ZCD1  
ZCD2  
5VB  
Description  
Zero Current Detector for Phase 1 of the interleaved boost power stage.  
Zero Current Detector for Phase 2 of the interleaved boost power stage.  
5V Bias. Bypass pin for the internal supply, which powers all control circuitry on the IC.  
Maximum On-Time adjust for the individual power stages.  
2
3
4
MOT  
AGND  
SS  
5
Analog Ground. Reference potential for all setup signals.  
6
Soft-Start Capacitor. Connected to the non-inverting input of the error amplifier.  
Compensation Network connection to the output of the gM error amplifier  
Feedback pin to sense the converter’s output voltage; inverting input of the error amplifier.  
Output Voltage monitor for the independent, second-level, latched OVP protection.  
Input Voltage monitor for brownout protection and input-voltage feedforward.  
Power Ground connection.  
7
COMP  
FB  
8
9
OVP  
VIN  
10  
11  
12  
13  
14  
15  
16  
PGND  
DRV2  
DRV1  
VDD  
CS2  
Gate Drive Output for Phase 2 of the interleaved boost power stage.  
Gate Drive Output for Phase 1 of the interleaved boost power stage.  
External Bias Supply for the IC.  
Current Sense Input for Phase 2 of the interleaved boost power stage.  
Current Sense Input for Phase 1 of the interleaved boost power stage.  
CS1  
© 2008 Fairchild Semiconductor Corporation  
FAN9612 • Rev. 1.1.7  
www.fairchildsemi.com  
4
Absolute Maximum Ratings  
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be  
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.  
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.  
The absolute maximum ratings are stress ratings only.  
Symbol  
VDD  
Parameter  
Min.  
-0.3  
-0.3  
-0.3  
-0.3  
-0.3  
Max.  
20.0  
Unit  
V
Supply Voltage to AGND & PGND  
VBIAS  
5VB Voltage to AGND & PGND  
5.5  
V
Voltage On Input Pins to AGND (Except FB Pin)  
Voltage On FB Pin (Current Limited)  
VBIAS + 0.3  
VDD + 0.8  
VDD + 0.3  
2.5  
V
V
Voltage On Output Pins to PGND (DRV1, DRV2)  
V
IOH, IOL Gate Drive Peak Output Current (Transient)  
Gate Drive Output Current (DC)  
A
0.05  
A
TL  
TJ  
Lead Soldering Temperature (10 Seconds)  
Junction Temperature  
+260  
ºC  
ºC  
ºC  
-40  
-65  
+150  
TSTG  
Storage Temperature  
+150  
Recommended Operating Conditions  
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended  
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not  
recommend exceeding them or designing to Absolute Maximum Ratings.  
Symbol  
VDD  
Parameter  
Min.  
9
Typ.  
Max.  
18  
Unit  
V
Supply Voltage Range  
Signal Input Voltage  
12  
VINS  
0
5
V
ISNK  
Output Current Sinking (DRV1, DRV2)  
Output Current Sourcing (DRV1, DRV2)  
1.5  
0.8  
2.0  
1.0  
A
ISRC  
A
LMISMATCH Boost Inductor Mismatch(4)  
±5%  
±10%  
+125  
TA  
Operating Ambient Temperature  
-40  
ºC  
Note:  
4. While the recommended maximum inductor mismatch is ±10% for optimal current sharing and ripple-current  
cancellation, there is no absolute maximum limit. If the mismatch is greater than ±10%, current sharing is  
proportionately worse, requiring over-design of the power supply. However, the accurate 180° out-of-phase  
synchronization is still maintained, providing current cancellation, although its effectiveness is reduced.  
© 2008 Fairchild Semiconductor Corporation  
FAN9612 • Rev. 1.1.7  
www.fairchildsemi.com  
5
Electrical Characteristics  
Unless otherwise noted, VDD = 12 V, TJ = -40°C to +125°C. Currents are defined as positive into the device and  
negative out of the device.  
Symbol  
Supply  
Parameter  
Conditions  
Min.  
Typ.  
Max. Unit  
ISTARTUP Startup Supply Current  
IDD Operating Current  
IDD_DYM Dynamic Operating Current(5)  
VDD = VON – 0.2 V  
80  
3.7  
4
110  
5.2  
6
µA  
mA  
mA  
V
Output Not Switching  
fSW = 50 kHz; CLOAD = 2 nF  
VON  
VOFF  
VHYS  
UVLO Start Threshold  
UVLO Stop Threshold Voltage  
UVLO Hysteresis  
12.0  
7.0  
12.5  
7.5  
5.0  
13.0  
8.0  
VDD Decreasing  
V
V
Bias Regulator (C5VB = 0.1 µF)  
TA = 25°C; ILOAD = 1 mA  
5.0  
V5VB  
5VB Output Voltage  
V
Total Variation Over Line,  
Load, and Temperature  
4.8  
5.0  
5.2  
IOUT_MAX Maximum Output Current  
mA  
Error Amplifier  
TA = 25°C  
2.95  
2.91  
3.00  
3.05  
VEA  
Voltage Reference  
V
Total Variation Over Line,  
Load, and Temperature  
3.075  
VFB = 1 V to 3 V;  
|VSS VFB| 0.1V  
IBIAS  
Input Bias Current  
-0.2  
0.2  
µA  
IOUT_SRC Output Source Current  
IOUT_SINK Output Sink Current  
VSS = 3 V; VFB = 2.9 V  
VSS = 3 V; VFB = 3.1 V  
-13.7  
4
-8  
8
-4  
12  
µA  
µA  
VOH  
VOL  
gM  
Output High Voltage  
Output Low Voltage  
Transconductance  
4.5  
0.0  
50  
4.7  
0.1  
78  
V5VB  
0.2  
V
ISINK < 100 µA  
V
115  
µmho  
PWM  
VRAMP,OFST PWM Ramp Offset  
tON,MIN Minimum On-Time  
Maximum On-Time  
TA = 25°C  
VFB > VSS  
120  
195  
270  
0
mV  
µs  
VMOT  
Maximum On-Time Voltage  
Maximum On-Time  
1.16  
3.4  
1.25  
5.0  
1.30  
6.6  
V
R = 125 kΩ  
R = 125 kΩ; VVIN = 2.5 V;  
tON,MAX  
µs  
VCOMP > 4.5 V; TA = 25°C  
Restart Timer (Each Channel)  
fSW,MIN  
Minimum Switching Frequency  
VFB > VPWM_OFFSET  
12.5  
400  
16.5  
525  
20.0  
630  
kHz  
kHz  
Frequency Clamp (Each Channel)  
fSW,MAX  
Maximum Switching Frequency(5)  
Continued on the following page…  
© 2008 Fairchild Semiconductor Corporation  
FAN9612 • Rev. 1.1.7  
www.fairchildsemi.com  
6
Electrical Characteristics (Continued)  
Unless otherwise noted, VDD = 12 V, TJ = -40°C to +125°C. Currents are defined as positive into the device and  
negative out of the device.  
Symbol  
Parameter  
Conditions  
Min. Typ.  
Max.  
Unit  
Current Sense  
VCS  
ICS  
CS Input Threshold Voltage Limit  
CS Input Current  
0.19  
-0.2  
0.21  
85  
0.23  
0.2  
V
VCSX = 0 V to 1 V  
µA  
ns  
tCS_DELAY CS to Output Delay  
CS Stepped from 0 V to 5 V  
100  
Zero Current Detection  
Input Voltage Threshold(5)  
Input High Clamp Voltage  
Input Low Clamp Voltage  
VZCD is Falling  
IZCD = 0.5 mA  
IZCD = –0.5 mA  
0
0.1  
1.2  
-0.3  
1
V
V
-0.1  
0.8  
VZCD_IN  
VZCD_H  
VZCD_L  
1.0  
-0.5  
-0.7  
V
IZCD_SRC Source Current Capability(5)  
IZCD_SNK Sink Current Capability(5)  
tZCD_DLY Turn-On Delay(5)  
Output  
mA  
mA  
ns  
10  
ZCDx to OUTx  
180  
ISINK  
ISOURCE  
tRISE  
OUTx Sink Current (5)  
OUTx Source Current (5)  
Rise Time  
VOUTx = VDD/2; CLOAD = 0.1 µF  
VOUTx = VDD/2; CLOAD = 0.1 µF  
CLOAD = 1 nF, 10% to 90%  
CLOAD = 1 nF, 90% to 10%  
VDD = 5 V; IOUT = 100 µA  
2.0  
1.0  
10  
5
A
A
25  
20  
1
ns  
ns  
V
tFALL  
Fall Time  
VO_UVLO Output Voltage During UVLO  
IRVS  
Reverse Current Withstand (5)  
Soft-Start (CSS = 0.1 µF)  
ISS_MAX Maximum Soft-Start Current  
ISS_MIN  
Minimum Soft-Start Current(5)  
Input Brownout Protection  
VIN_BO Input Brownout Threshold  
500  
mA  
-7  
-5  
-3  
VCOMP < 3.0 V  
VCOMP > 4.5 V  
µA  
µA  
-0.40  
-0.25  
-0.10  
0.76  
-0.2  
1.4  
0.925  
2
1.10  
0.2  
V
VVIN > 1.1 V  
µA  
µA  
IVINSNK  
VIN Sink Current  
VVIN < 0.8 V  
2.5  
Input-Voltage Feedforward Range  
VFF_UL  
VIN Feedforward Upper Limit (5)  
3.1  
3.6  
3.7  
4.0  
4.3  
4.3  
V
(5)  
VFF_RATIO VFF_UL / VIN_BO  
Phase Management  
V
COMP Decreasing, Transition  
VPH,DROP Phase Dropping Threshold  
VPH,ADD Phase Adding Threshold  
0.66  
0.86  
0.73  
0.93  
0.80  
1.00  
V
V
from 2 to 1 Phase, TA = 25°C  
VCOMP Increasing, Transition  
from 1 to 2 Phase, TA = 25°C  
Over-Voltage Protection Using FB Pin – Cycle-by-Cycle (Input)  
Non-Latching OVP Threshold  
(+8% above VOUT_NOMINAL  
TA = 25°C  
DRV1=DRV2=0 V  
VOVPNL  
3.15  
3.36  
3.25  
0.24  
3.35  
3.65  
V
V
)
VOVPNL_HYS OVP Hysteresis  
FB Decreasing  
Over-Voltage Protection Using OVP Pin – Latching (Input)  
VOVPLCH Latching OVP Threshold (+15%) DRV1=DRV2=0 V  
Note:  
3.50  
V
5. Not tested in production.  
© 2008 Fairchild Semiconductor Corporation  
FAN9612 • Rev. 1.1.7  
www.fairchildsemi.com  
7
Theory of Operation  
There are many fundamental differences in CCM and  
BCM operations and the respective designs of the boost  
converter.  
1. Boundary Conduction Mode  
The boost converter is the most popular topology for  
power factor correction in AC-to-DC power supplies.  
This popularity can be attributed to the continuous input  
current waveform provided by the boost inductor and to  
the fact that the boost converter’s input voltage range  
includes 0 V. These fundamental properties make close  
to unity power factor easier to achieve.  
The FAN9612 utilizes the boundary conduction mode  
control algorithm. The fundamental concept of this  
operating mode is that the inductor current starts from  
zero in each switching period, as shown in the lower  
waveform in Figure 7. When the power transistor of the  
boost converter is turned on for a fixed amount of time,  
the peak inductor current is proportional to the input  
voltage. Since the current waveform is triangular, the  
average value in each switching period is also  
proportional to the input voltage. In the case of a  
sinusoidal input voltage waveform, the input current of  
the converter follows the input voltage waveform with  
very high accuracy and draws a sinusoidal input current  
from the source. This behavior makes the boost  
converter in BCM operation an ideal candidate for  
power factor correction.  
L
This mode of control of the boost converter results in a  
variable switching frequency. The frequency depends  
primarily on the selected output voltage, the  
instantaneous value of the input voltage, the boost  
inductor value, and the output power delivered to the  
load. The operating frequency changes as the input  
voltage follows the sinusoidal input voltage waveform.  
The lowest frequency operation corresponds to the peak  
of the sine waveform at the input of the boost converter.  
Even larger frequency variation can be observed as the  
output power of the converter changes, with maximum  
output power resulting in the lowest operating  
frequency. Theoretically, under zero-load condition, the  
operating frequency of the boost converter would  
approach infinity. In practice, there are natural limits to  
the highest switching frequency. One such limiting factor  
is the resonance between the boost inductor and the  
parasitic capacitances of the MOSFET, the diode, and  
the winding of the choke, in every switching cycle.  
Figure 6. Basic PFC Boost Converter  
The boost converter can operate in continuous  
conduction mode (CCM) or in boundary conduction  
mode (BCM). These two descriptive names refer to the  
current flowing in the energy storage inductor of the  
boost power stage.  
Another important characteristic of the BCM boost  
converter is the high ripple current of the boost inductor,  
which goes from zero to a controlled peak value in every  
switching period. Accordingly, the power switch is  
stressed with high peak current. In addition, the high  
ripple current must be filtered by an EMI filter to meet  
high-frequency  
noise  
regulations  
enforced  
for  
equipment connecting to the mains. The effects usually  
limit the practical output power level of the converter.  
Figure 7. CCM vs. BCM Control  
As the names indicate, the current in Continuous  
Conduction Mode (CCM) is continuous in the inductor;  
while in Boundary Conduction Mode (BCM), the new  
switching period is initiated when the inductor current  
returns to zero.  
© 2008 Fairchild Semiconductor Corporation  
FAN9612 • Rev. 1.1.7  
www.fairchildsemi.com  
8
a sine square function. Eliminating the line frequency  
component from the feedback system is imperative to  
maintain low total harmonic distortion (THD) in the input  
current waveform.  
2. Interleaving  
The FAN9612 control IC is configured to control two  
boost converters connected in parallel, both operated in  
boundary conduction mode. In this arrangement, the  
input and output voltages of the two parallel converters  
are the same and each converter is designed to process  
approximately half the total output power.  
The pulse width modulator implements voltage mode  
control. This control method compares an artificial ramp  
to the output of the error amplifier to determine the  
desired on-time of the converter’s power transistor to  
achieve output voltage regulation.  
Figure 9. PWM Operation  
Figure 8. Interleaved PFC Boost Operation  
In FAN9612, there are two PWM sections  
corresponding to the two parallel power stages. For  
proper interleaved operation, two independent 180-  
degree out-of-phase ramps are needed; which  
necessitates the two pulse width modulators. To ensure  
that the two converters process the same amount of  
power, the artificial ramps have the same slope and use  
the same control signal generated by the error amplifier.  
Parallel power processing is penalized by the increased  
number of power components, but offers significant  
benefits to keep current and thermal stresses under  
control and to increase the power handling capability of  
the otherwise limited BCM PFC control solution.  
Furthermore, the switches of the two boost converters  
can be operated 180 degrees out of phase from each  
other. The control of parallel converters operating 180  
degrees out of phase is called interleaving. Interleaving  
provides considerable ripple current reduction at the  
input and output terminals of the power supply, which  
favorably affects the input EMI filter requirements and  
reduces the high-frequency RMS current of the power  
supply output capacitor.  
4. Input-Voltage Feedforward  
Basic voltage-mode control, as described in the  
previous section, provides satisfactory regulation  
performance  
in most cases. One important  
characteristic of the technique is that input voltage  
variation to the converter requires a corrective action  
from the error amplifier to maintain the output at the  
desired voltage. When the error amplifier has adequate  
bandwidth, as in most DC-DC applications, it is able to  
maintain regulation within a tolerable output voltage  
range during input voltage changes.  
There is an obvious difficulty in interleaving two BCM  
boost converters. Since the converter’s operating  
frequency is influenced by component tolerances in the  
power stage and in the controller, the two converters  
operate at different frequencies. Therefore special  
attention must be paid to ensure that the two converters  
are locked to 180-degree out-of-phase operation.  
Consequently, synchronization is a critical function of an  
interleaved boundary conduction mode PFC controller.  
It is implemented in the FAN9612 using proprietary and  
dedicated circuitry called Sync-Lock™ interleaving  
technology.  
On the other hand, when voltage-mode control is used  
in power factor corrector applications; the error amplifier  
bandwidth, and its capability to quickly react to input  
voltage changes, is severely limited. In these cases, the  
input voltage variation can cause excessive overshoot  
or droop at the converter output as the input voltage  
goes up or down.  
To overcome this shortcoming of the voltage-mode  
PWM circuit in PFC applications, input-voltage  
feedforward is often employed. It can be shown  
mathematically that a PWM ramp proportional to the  
square of the input voltage rejects the effect of input  
voltage variations on the output voltage and eliminates  
the need of any correction by the error amplifier.  
3. Voltage Regulation, Voltage Mode Control  
The power supply’s output voltage is regulated by a  
negative feedback loop and a pulse width modulator.  
The negative feedback is provided by an error amplifier  
that compares the feedback signal at the inverting input  
to a reference voltage connected to the non-inverting  
input of the amplifier. Similar to other PFC applications,  
the error amplifier is compensated with high DC gain for  
accurate voltage regulation, but very low bandwidth to  
suppress line frequency ripple present across the output  
capacitor of the converter. The line frequency ripple is  
the result of the constant output power of the converter  
and the fact that the input power is the product of a  
sinusoidal current and a sinusoidal voltage thus follows  
© 2008 Fairchild Semiconductor Corporation  
FAN9612 • Rev. 1.1.7  
www.fairchildsemi.com  
9
mean that the converter stops operating. To overcome  
these situations, a restart timer is employed to kick start  
the controller and provide the first turn-on command, as  
shown in Figure 12.  
Figure 12. PWM Cycle Start  
Figure 10. Input-Voltage Feedforward  
6. Terminating the Conduction Interval  
When the PWM ramp is made proportional to the input  
voltage squared, the system offers other noteworthy  
benefits. The first is the input voltage-independent small  
signal gain of the closed loop power supply, which  
makes compensation of the voltage regulation loop  
much easier. The second side benefit is that the output  
of the error amplifier becomes directly proportional to  
the input power of the converter. This phenomenon is  
Terminating the conduction period of the boost  
transistor in boundary conduction mode controllers is  
similar to any other pulse width modulator. During  
normal operation, the PWM comparator turns off the  
power transistor when the ramp waveform exceeds the  
control voltage provided by the error amplifier. In the  
FAN9612 and in similar voltage-mode PWMs, the ramp  
is a linearly rising waveform at one input of the  
comparator circuit.  
very significant and it is re-visited in Section  
describing light-load operation.  
9
5. Starting a PWM Cycle  
The principle of boundary conduction mode calls for a  
pulse width modulator able to operate with variable  
frequency and initiate a switching period whenever the  
current in the boost inductor reaches zero. Therefore,  
BCM controllers cannot utilize  
a fixed frequency  
oscillator circuit to control the operating frequency.  
Instead, a zero current detector is used to sense the  
inductor current and turn on the power switch once the  
current in the boost inductor reaches zero. This process  
is facilitated by an auxiliary winding on the boost  
inductor. The voltage waveform of the auxiliary winding  
can be used for indirect detection of the zero inductor  
current condition of the boost inductor. Therefore it  
should be connected to the zero current detect input, as  
shown in Figure 11.  
Figure 13. Conduction Interval Termination  
In addition to the PWM comparator, the current limit  
circuit and a timer circuit limiting the maximum on-time  
of the boost transistor can also terminate the gate drive  
pulse of the controller. These functions provide  
protection for the power switch against excessive  
current stress.  
7. Protecting the Power Components  
In general, power converters are designed with  
adequate margin for reliable operation under all  
operating conditions. However, it might be difficult to  
predict dangerous conditions under transient or certain  
fault situations. Therefore, the FAN9612 contains  
dedicated protection circuits to monitor the individual  
peak currents in the boost inductors and in the power  
transistors. Furthermore, the boost output voltage is  
sensed by two independent mechanisms to provide  
over-voltage protection for the power transistors,  
rectifier diodes, and the output energy storage capacitor  
of the converter.  
Figure 11. Simple Zero-Current Detection Method  
The auxiliary winding can also be used to generate bias  
for the PFC controller when an independent bias power  
supply is not present in the system.  
At startup condition and in the unlikely case of missing  
zero current detection, the lack of an oscillator would  
© 2008 Fairchild Semiconductor Corporation  
FAN9612 • Rev. 1.1.7  
www.fairchildsemi.com  
10  
8. Power Limit  
The architecture and operating principle of FAN9612  
also provides inherent input power limiting capability.  
Figure 15. Automatic Phase-Control Operation  
10. Brownout Protection with Soft Recovery  
An additional protection function usually offered by PFC  
ICs is input brownout protection to prevent the converter  
from operating below a user-defined minimum input  
voltage level. For this function to work, the input voltage  
of the converter is monitored. When the voltage falls  
below the brownout protection threshold, the converter  
stops working. The output voltage of the boost converter  
falls until the load stops drawing current from the output  
capacitor or until the input voltage gets back to its  
nominal range and operation resumes.  
Figure 14. On-Time vs. VIN_RMS  
When the slope of the PWM ramp is made proportional  
to the square of the input RMS voltage, the maximum  
on-time of the boost power switch becomes inversely  
proportional to the square of VIN,RMS, as represented in  
Figure 14. In boundary-conduction mode, the peak  
current of the boost transistor is proportional to its on  
time. Therefore, controlling the maximum pulse width of  
the gate drive signal according to the curve shown is an  
effective method to implement an input-voltage  
independent power limit for the boost PFC.  
As the output falls, the voltage at the feedback pin falls  
proportionally, according to the feedback divider ratio.  
To facilitate soft recovery after a brownout condition, the  
soft-start capacitor – which is also the reference voltage  
of the error amplifier – is pulled lower by the feedback  
network. This effectively pre-conditions the error  
amplifier to provide closed-loop, soft-start-like behavior  
9. Light-Load Operation (Phase Management)  
One of the parameters determining the operating  
frequency of a boundary conduction mode converter is  
the output power. As the load decreases, lower peak  
currents are commanded by the pulse width modulator  
to maintain the output voltage at the desired set point.  
Lower peak current means shorter on-time for the power  
transistor and shorter time interval to ramp the inductor  
current back to zero at any given input voltage. As a  
result, the operating frequency of the converter  
increases under light load condition.  
during the converter’s recovery from  
a brownout  
situation. Once the input voltage goes above the  
brownout protection threshold, the converter resumes  
normal operation. The output voltage rises back to the  
nominal regulation level following the slowly rising  
voltage across the soft-start capacitor.  
11. Soft Starting the Converter  
As the operating frequency and corresponding switching  
losses increase, conduction losses diminish at the same  
time. Therefore, the power losses of the converter are  
dominated by switching losses at light load. This  
phenomenon is especially evident in a BCM converter.  
During startup, the boost converter peak charges its  
output capacitor to the peak value of the input voltage  
waveform. The final voltage level, where the output is  
regulated during normal operation, is reached after the  
converter starts switching. There are two fundamentally  
different approaches used in PWM controllers to control  
the startup characteristics of a switched-mode power  
supply. Both methods use some kind of soft-start  
mechanism to reduce the potential overshoot of the  
converter’s output after the desired output voltage level  
is reached.  
To improve light-load efficiency, FAN9612 disables one  
of the two interleaved boost converters automatically  
when the output power falls below approximately 13% of  
the maximum power limit level. By managing the  
number of phases used at light load, the FAN9612 can  
maintain high efficiency for a wider load range of the  
power supply.  
The first method is called open-loop soft-start and relies  
on gradually increasing the current or power limit of the  
converter during startup. In this case, the voltage error  
amplifier is typically saturated, commanding maximum  
current until the output voltage reaches its final value. At  
that time, the voltage between the error amplifier inputs  
changes polarity and the amplifier slowly comes out of  
saturation. While the error amplifier recovers and before  
it starts controlling the output voltage, the converter  
operates with full power. Thus, output voltage overshoot  
is unavoidable in converters utilizing the open-loop soft-  
start scheme.  
Normal interleaved operation of the two boost  
converters resumes automatically once the output  
power exceeds approximately 18% of the maximum  
power limit level of the converter.  
By adjusting maximum on-time (using RMOT), the phase  
management thresholds can be adjusted upward,  
described in the “Adjusting the Phase-Management  
Thresholds” section of this datasheet.  
© 2008 Fairchild Semiconductor Corporation  
FAN9612 • Rev. 1.1.7  
www.fairchildsemi.com  
11  
This method is especially dangerous in power-factor-  
corrector applications because the error amplifier’s  
bandwidth is typically limited to a very low crossover  
frequency. The slow response of the amplifier can  
cause considerable overshoot at the output.  
FAN9612 employs closed-loop soft-start where the  
reference voltage of the error amplifier is slowly  
increased to its final value. When the current and power  
limits of the converter are properly taken into  
consideration, the output voltage of the converter  
follows the reference voltage. This ensures that the  
error amplifier stays in regulation during soft start and  
the output voltage overshoot can be eliminated.  
Functional Description  
used as an indication that the chip is running.  
Potentially, this behavior can be utilized to control the  
inrush current limiting circuit.  
1. Detecting Zero Inductor Current  
(ZCD1, ZCD2)  
Each ZCD pin is internally clamped close to 0 V (GND).  
Any capacitance on the pin is ineffective in providing  
any delay in ZCD triggering. The internal sense circuit is  
a true differentiator to catch the valley of the drain  
waveforms. The resistor between the auxiliary winding  
of the boost inductor and the ZCD pin is only used for  
current limiting. The maximum source current during  
zero current detection must be limited to 0.5 mA. If the  
sourcing current is larger than 0.5 mA, the internal  
detection circuit is saturated and the ZCD circuit can be  
prematurely triggered before reaching the actual ZCD  
valley threshold. Source and sink capability of the pin  
are about 1 mA and 10 mA, respectively. The stronger  
sinking current capability provides sufficient margin for  
the higher sinking current required during the  
conduction time of the rectifier diode.  
Figure 17. 5 V Bias  
External  
Components  
Internal  
Circuits  
To arm ZCD  
detector  
PWM  
signal  
3. Maximum On-Time Control (MOT)  
Maximum on-time, MOT, (of the boost MOSFET) is set  
by a resistor to analog ground (AGND). The FAN9612  
implements input-voltage feedforward. The maximum  
on-time is a function of the RMS input voltage. The  
voltage on the MOT pin is 1.25 V during operation  
(constant DC voltage). The maximum on-time of the  
power MOSFETs can be approximated by:  
.
0.3/0.0V  
R
ZCD  
ARM  
(ready)  
INHIBIT  
1(2)  
ZCD  
ZCD Valley  
To ZCD  
winding  
Detector  
ZCD  
signal  
(true differentiator)  
2.4  
1
tON,MAX = RMOT 1201012  
Positive Negative  
Clamp Clamp  
(2)  
VI2NSNS,PK  
1.25  
Figure 16. Zero-Current Detect Circuit  
The RZCD resistor value can be approximated by:  
where VINSNS,PK is the peak of the AC input voltage as  
measured at the VIN pin (must be divided down, see  
the VIN pin description).  
VO  
N AUX  
1
RZCD  
=
(1)  
0.5mA  
2
N BOOST  
2. 5 V Bias Rail (5VB)  
This is the bypass capacitor pin for the internal 5 V bias  
rail powering the control circuitry. The recommended  
capacitor value is 220 nF. At least a 100 nF, good-  
quality, high-frequency, ceramic capacitor should be  
placed in close proximity to the pin.  
The 5 V rail is a switched rail. It is actively held LOW  
when the FAN9612is in under-voltage lockout. Once the  
UVLO turn-on threshold is exceeded at the VDD pin, the  
5 V rail is turned on, providing a sharp edge that can be  
Figure 18. Maximum On-Time Control (MOT)  
© 2008 Fairchild Semiconductor Corporation  
FAN9612 • Rev. 1.1.7  
www.fairchildsemi.com  
12  
the output voltage can not be raised. Therefore the FB  
voltage stays flat or even decays while the SS voltage  
keeps rising. This is a problem if closed-loop soft-start  
should be maintained. By clamping the SS voltage to  
the FB pin, this problem can be mitigated.  
4. Analog Ground (AGND) and Power Ground  
(PGND)  
Analog ground connection (AGND) is the GND for all  
control logic biased from the 5 V rail. Internally, the  
AGND and PGND pins are tied together by two anti-  
parallel diodes to limit ground bounce difference due to  
bond wire inductances during the switching actions of  
the high-current gate drive circuits. It is recommended to  
connect AGND and PGND pins together with a short,  
low-impedance trace on the PCB (right under the IC).  
Furthermore, during brownout condition, the output  
voltage of the converter might fall, which is reflected at  
the FB pin. When FB voltage goes 0.5 V below the  
voltage on the SS pin, it starts discharging the soft-start  
capacitor. The soft-start capacitor remains 0.5 V above  
the FB voltage. When the brownout condition is over,  
the converter returns to normal operation gracefully,  
following the slow ramp up of the soft-start capacitor at  
the non-inverting input of the error amplifier.  
PGND is the reference potential (0 V) for the high-  
current gate-drive circuit. Two bypass capacitors should  
be connected between the VDD pin and the PGND pin.  
One is the VDD energy storage capacitor, which provides  
bias power during startup until the bootstrap power  
supply comes up. The other capacitor shall be a good-  
quality ceramic bypass capacitor, as close as possible  
to PGND and VDD pins to filter the high peak currents  
of the gate driver circuits. The value of the ceramic  
bypass capacitor is a strong function of the gate charge  
requirement of the power MOSFETs and its  
recommended value is between 1 µF and 4.7 µF to  
ensure proper operation.  
5. Soft-Start (SS)  
Soft-start is programmed with a capacitor between the  
SS pin and AGND. This is the non-inverting input of the  
transconductance (gM) error amplifier.  
At startup, the soft-start capacitor is quickly pre-charged  
to a voltage approximately 0.5 V below the voltage on  
the feedback pin (FB) to minimize startup delay. Then a  
5 µA current source takes over and charges the soft-  
start capacitor slowly, ramping up the voltage reference  
of the error amplifier. By ramping up the reference  
slowly, the voltage regulation loop can stay closed,  
actively controlling the output voltage during startup.  
While the SS capacitor is charging, the output of the  
error amplifier is monitored. In case the error voltage  
(COMP) ever exceeds 3.5 V, indicating that the voltage  
loop is close to saturation, the 5 µA soft-start current is  
reduced. Therefore, the soft start is automatically  
extended to reduce the current needed to charge the  
output capacitor, reducing the output power during  
startup. This mechanism is integrated to prevent the  
voltage loop from saturation. The charge current of the  
soft-start capacitor can be reduced from the initial 5 µA  
to as low as 0.5 µA minimum.  
Figure 19. Soft-Start Programming  
6. Error Amplifier Compensation (COMP)  
COMP pin is the output of the error amplifier. The  
voltage loop is compensated by a combination of RS  
and CS to AGND at this pin. The control range of the  
error amplifier is between 0.195 V and 4.3 V. When the  
COMP voltage is below about 0.195 V, the PWM circuit  
skips pulses. Above 4.3 V, the maximum on-time limit  
terminates the conduction of the boost switches.  
Due to the input-voltage feedforward, the output of the  
error amplifier is proportional to the input power of the  
converter, independent of the input voltage. In addition,  
also due to the input-voltage feedforward, the maximum  
power capability of the converter and the loop gain is  
independent of the input voltage. The controller’s phase-  
management circuit monitors the error amplifier output  
and switches to single-phase operation when the COMP  
voltage falls below 0.73 V and returns to two-phase  
operation when the error voltage exceeds 0.93 V. These  
thresholds correspond to about 13% and 18% of the  
maximum power capability of the design.  
In addition to modulating the soft-start current into the  
SS capacitor, the SS pin is clamped 0.2 V above the FB  
pin. This is useful in preventing the SS capacitor from  
running away from the FB pin and defeating the closed-  
loop soft-start. During the zero crossing of the input  
source waveform, the input power is almost zero and  
© 2008 Fairchild Semiconductor Corporation  
FAN9612 • Rev. 1.1.7  
www.fairchildsemi.com  
13  
Figure 20. Error Amplifier Compensation Circuitry  
7. Output Voltage Feedback (FB)  
8. Secondary Output Voltage Sense (OVP)  
The feedback pin receives the divided-down output  
voltage of the converter. In regulation, the FB pin should  
be 3 V, which is the reference used at the non-inverting  
input of the error amplifier. Due to the gM type error  
amplifier, the FB pin is always proportional to the output  
voltage and can be used for over-voltage protection as  
A second-level latching over-voltage protection can be  
implemented using the OVP pin of the controller. The  
threshold of this circuit is set to 3.5 V. There are two  
ways to program the secondary OVP.  
Option 1, as shown in Figure 22, is to connect the OVP  
pin to the FB pin. In addition to the standard non-  
latching OVP (set at ~8%), this configuration provides a  
second OVP protection (set at ~15%), which is latched.  
well.  
A non-latching over-voltage detection circuit  
monitors the FB pin and prevents the boost MOSFETs  
from turning on when the FB voltage exceeds 3.25 V.  
Operation resumes automatically when the FB voltage  
returns to its nominal 3 V level.  
In the case where redundant over-voltage protection is  
preferred (also called double-OVP protection), a second  
separate divider from the output voltage can be used, as  
shown by Option 2 in Figure 22. In this case, the  
latching OVP protection level can be independently  
established below or above the non-latching OVP  
threshold, which is based on the feedback voltage (at  
the FB pin).  
The open feedback detection circuit is also connected to  
the FB pin. Since the output of the boost converter is  
charged to the peak of the input AC voltage when power  
is applied to the power supply, the detection circuit  
monitors the presence of this voltage. If the FB pin is  
below 0.5 V, which would indicate a missing feedback  
divider (or wrong value causing dangerously-high  
regulation voltage), the FAN9612 does not send out  
gate drive signals to the boost transistors.  
If latching OVP protection is not desired at all, the OVP  
pin should be grounded (Option 3).  
Figure 22. Secondary Over-Voltage Protection  
Circuit  
Figure 21. Output-Voltage Feedback Circuit  
© 2008 Fairchild Semiconductor Corporation  
FAN9612 • Rev. 1.1.7  
www.fairchildsemi.com  
14  
the integrator while the peak detector works properly  
during light-load operation.  
9. Input Voltage Sensing (VIN)  
The input AC voltage is sensed at the VIN pin. The input  
voltage is used in two functions: input under-voltage  
lockout (brownout protection), and input voltage  
feedforward in the PWM control circuit. All the functions  
require the RMS value of the input voltage waveform.  
Since the RMS value of the AC input voltage is directly  
proportional to its peak, it is sufficient to find the peak  
instead of the more complicated and slower method of  
integrating the input voltage over a half line cycle. The  
internal circuit of the VIN pin works with peak detection  
of the input AC waveforms. One of the important  
benefits of this approach is that the peak indicates the  
correct RMS value even at no load when the HF filter  
capacitor at the input side of the boost converter is not  
discharged around the zero crossing of the line  
waveform. Another notable benefit is that during line  
transients, when the peak exceeds the previously  
measured value, the input-voltage feedforward circuit  
can react immediately, without waiting for a valid  
integral value at the end of the half line period.  
Furthermore, lack of zero crossing detection could fool  
The valid range for the peak of the AC input is between  
approximately 0.925 V and 3.7 V. This range is  
optimized for universal input voltage range of operation.  
If the peak of the sense voltage remains below the  
0.925 V threshold, input under-voltage or brownout  
condition is declared and the FAN9612 stops operating.  
When the VIN voltage exceeds 3.7 V, the FAN9612 input  
voltage sense circuit saturates and the feedforward  
circuit is not able to follow the input any higher.  
Consequently, the slope of the PWM ramp remains  
constant corresponding to the VIN  
= 3.7 V level  
amplitude for any VIN voltage above 3.7 V.  
The input voltage is measured by a tracking analog-to-  
digital converter, which keeps the highest value (peak  
voltage) of the input voltage waveform. Once  
a
measurement is taken, the converter tracks the input for  
at least 12 ms before a new value is taken. This delay  
ensures at least one new peak value is captured before  
the new value is used.  
Figure 23. Input Voltage Sensing Circuit  
The measured peak value is then used in the following  
half-line cycle while a new measurement is executed to  
be used in the next half line cycle. This operation is  
synchronized to the zero crossing of the line waveform.  
Since the input voltage measurement is held steady  
during the line half periods, this technique does not feed  
any AC ripple into the control loop. If line zero crossing  
detection is missing, the FAN9612 measures the input  
voltage in every 32 ms; it can operate from a DC input  
as well. The following figures provide detail about the  
input voltage sensing method of the controller.  
As shown in the waveforms, input voltage feedforward is  
instantaneous when the line voltage increases and has  
a half line cycle delay when the input voltage decreases.  
Any increase in input voltage would cause output over  
voltage due to the slow nature of the voltage regulation  
loop. This is successfully mitigated by the immediate  
action of the input-voltage feedforward circuit.  
© 2008 Fairchild Semiconductor Corporation  
FAN9612 • Rev. 1.1.7  
www.fairchildsemi.com  
15  
Figure 24. Input Voltage Sensing Waveforms  
The purpose of the MillerDrive™ architecture is to  
10. Gate Drive Outputs (DRV1; DRV2)  
speed switching by providing high current during the  
Miller plateau region when the gate-drain capacitance of  
the MOSFET is being charged or discharged as part of  
the turn-on / turn-off process.  
High-current driver outputs DRV1 and DRV2 have the  
capability to sink a minimum of 2 A and source 1 A. Due  
to the low impedance of these drivers, the 1 A source  
current must be actively limited by an external gate  
resistor. The minimum external gate resistance is:  
The output pin slew rate is determined by VDD voltage  
and the load on the output. It is not user adjustable, but  
if a slower rise or fall time at the MOSFET gate is  
needed, a series resistor can be added.  
VDD  
RGATE  
=
(3)  
1A  
To take advantage of the higher sink current capability  
of the drivers, the gate resistor can be bypassed by a  
small diode to facilitate faster turn-off of the power  
MOSFETs. Traditional fast turn-off circuit using a PNP  
transistor instead of a simple bypass diode can be  
considered as well.  
It is also imperative that the inductance of the gate drive  
loop is minimized to avoid excessive ringing. If optimum  
layout is not possible or the controller is placed on a  
daughter card, it is recommended to use an external  
driver circuit located near the gate and source terminals  
of the boost MOSFET transistors. Small gate charge  
power MOSFETs can be driven by a single 1A gate  
driver, such as the FAN3111C; while higher gate charge  
devices might require higher gate drive current capable  
devices, such as the single-2 A FAN3100C or the dual-  
2 A FAN3227C family of drivers.  
11. MillerDrive™ Gate Drive Technology  
Figure 25. Current-Sense Protection Circuits  
FAN9612 output stage incorporates the MillerDrive™  
architecture shown in Figure 25. It is a combination of  
bipolar and MOS devices which are capable of providing  
large currents over a wide range of supply voltage and  
temperature variations. The bipolar devices carry the  
bulk of the current as OUT swings between 1/3 to 2/3  
VDD and the MOS devices pull the output to the high  
or low rail.  
© 2008 Fairchild Semiconductor Corporation  
FAN9612 • Rev. 1.1.7  
www.fairchildsemi.com  
16  
12. Bias Supply (VDD)  
This is the main bias source for the FAN9612. The  
operating voltage range is between 8 V and 18 V. The  
VDD voltage is monitored by the under-voltage lockout  
(UVLO) circuit. At power-up, the VDD voltage must  
exceed 12.5 V (±0.5 V) to enable operation. The  
FAN9612 stops operating when the VDD voltage falls  
below 7.5 V (±0.5 V). See PGND pin description for  
important bypass information.  
13. Current-Sense Protection (CS1, CS2)  
The FAN9612 uses independent over-current protection  
for each of the power MOSFETs. The current-sense  
thresholds at the CS1 and CS2 pins are approximately  
0.2 V. The current measurements are strictly for  
protection purposes and are not part of the control  
algorithm. The pins can be directly connected to the  
non-grounded end of the current-sense resistors  
because the usual R-C filters of the leading-edge  
current spike are integrated in the IC.  
Figure 26. Current-Sense Protection Circuits  
The time constant of the internal filter is approximately:  
τ = 27kΩ5pF = 130ns  
or  
(4)  
1
ωP  
=
= 1.2MHz  
2 π 27kΩ ⋅ 5pF  
© 2008 Fairchild Semiconductor Corporation  
FAN9612 • Rev. 1.1.7  
www.fairchildsemi.com  
17  
Application Information  
2. Startup with 12 V Bias (Less than UVLO)  
1. Synchronization and Timing Functions  
The FAN9612 is designed so that the controller can  
start even if the auxiliary bias voltage is less than the  
controller’s under-voltage lockout start threshold. This is  
useful if the auxiliary power is 12 V or below. This  
configuration also allows bias power designs using a  
bootstrap winding to start the FAN9612 without a  
dedicated startup resistor.  
The FAN9612 employs a sophisticated synchronization  
sub-system. At the heart of the system is a dual-channel  
switching-frequency detector that measures the  
switching period of each channel in every switching  
cycle and locks their operating phase 180 degrees out  
of phase from each other. The slower operating  
frequency channel is dominant, but there is no master-  
slave arrangement. Moreover, as the frequency  
constantly changes due to the varying input voltage,  
either channel can be the slower dominant channel.  
In the boost PFC topology, the output voltage is pre-  
charged to the peak line voltage by the boost diode. As  
soon as voltage is present at the output of the boost  
converter, current starts to flow through the feedback  
resistors from the boost output to GND. Using an  
external low-voltage MOSFET in series with the lower  
resistor in the feedback divider, as shown in Figure 27;  
this current can be diverted to charge the VDD bypass  
capacitor of the controller. The upper resistor becomes  
a current source to charge the capacitor. To accomplish  
this, a small external diode should be connected  
between the VDD and FB pins.  
As opposed to the most common technique, where the  
phase relationship between the channels is provided by  
changing the on-time of one of the MOSFETs, the  
FAN9612 controls the phase relationship by inserting a  
turn-on delay before the next switching period starts for  
the faster running phase. As shown in the literature[1],  
the on-time modulation technique is not stable under all  
operating conditions, while the off-time modulation (or  
delaying the turn-on) is unconditionally stable under all  
operating conditions.  
As VDD rises past the under-voltage lockout threshold of  
the IC, the 5 V reference is turned on, which turns on  
the external MOSFET and connects the resistor of the  
feedback divider to ground. The IC checks if the FB  
voltage is below 3.22 V, ensuring that the FB pin is in its  
normal operating voltage range, before enabling the rest  
of the IC operation. The diode between the FB pin and  
the VDD pin is reverse biased and the FB pin reverts to  
its normal role of output voltage sensing. A simplified  
circuit implementation for this proprietary startup method  
is shown in Figure 27.  
a. Restart Timer and Dead-Phase Detect  
Protection  
The restart timer is an integral part of the Sync-Lock™  
synchronizing circuit. It ensures exact 180-degree out-  
of-phase operation in restart timer operation. This is an  
important safety feature. In the case of a non-operating  
phase due to no ZCD detection, missing gate drive  
connection (for example no gate resistor), one of the  
power components failing in an open circuit, or similar  
errors, the other phase is locked into restart timer  
operation, preventing it from trying to deliver full power  
to the load. This is called the dead-phase detect  
protection.  
If, for whatever reason, the bias to the IC drops below  
the under-voltage lockout level, the startup process is  
repeated.  
The restart timer is set to approximately 16.5 kHz, just  
above the audible frequency range, to avoid any  
acoustic noise generation.  
b. Frequency Clamp  
Just as the restart timer, the frequency clamp is  
integrated into the synchronization and ensures exact  
180-degree out-of-phase operation when the operating  
frequency is limited. This might occur at very light-load  
operation or near the zero crossing region of the line  
voltage waveform. Limiting the switching frequency at  
light load can improve efficiency, but has a negative  
effect on power factor since the converter also enters  
true DCM operation. The frequency clamp is set to  
approximately 525 kHz.  
Figure 27. Simplified FAN9612 Startup Circuit Using  
the Output Feedback Resistors to Provide a  
Charging Current  
© 2008 Fairchild Semiconductor Corporation  
FAN9612 • Rev. 1.1.7  
www.fairchildsemi.com  
18  
The default thresholds can be adjusted upward based  
on the application requirement; for example, to meet the  
Energy STAR 5.0 or the Climate Savers Computing  
efficiency requirements at 20% of the load. The phase  
drop threshold can be adjusted upward (for example to  
25%) by adjusting the maximum on time.  
3. Adjusting the Output Voltage with Load  
In some applications, the output voltage of the PFC  
boost converter is decreased at low power levels to  
boost the light load efficiency of the power supply.  
Implementing this function with a circuit external to the  
FAN9612 is straightforward because the error amplifier  
reference (the positive input) is available on the soft-  
start (SS) pin, as shown in Figure 28. In the FAN9612  
architecture, the power of the converter is proportional  
to the voltage on the COMP pin, minus a small offset.  
The voltage on the COMP pin is monitored to determine  
the operating power of the supply. Therefore the voltage  
on the SS pin can be adjusted lower to achieve the  
desired lower output voltage.  
Several possible implementations to adjust the output  
voltage of the boost stage at light load are described in  
the application note AN-8021. It includes the universal  
output voltage adjust implementation which is  
modulated by input voltage to avoid the boost converter  
becoming a peak rectifier at high line and light load.  
Figure 29. Adjusting Phase Management Thresholds  
Since the phase management threshold is fixed at 13%  
and 18% of the maximum power limit level, the actual  
power management threshold as a percentage of  
nominal output power can be adjusted by the ratio  
between nominal power and maximum power limit level  
as shown in Figure 29. The second plot shows an  
example where the maximum power limit level is 1.4  
times of nominal output power. By adjusting the  
maximum on-time (using RMOT), the phase management  
thresholds can be adjusted upward.  
Phase management is implemented such that the  
output of the error amplifier (VCOMP) does not have to  
change when the system toggles between single-phase  
and two-phase operations, as shown in Figure 30. The  
output of the error amplifier is proportional to the output  
power of the converter independently, whether one or  
both phases are operating in the power supply.  
Furthermore, because the maximum on-time limit is  
applied independently to each pulse-width modulator,  
the power handling capability of the converter with only  
one phase running is approximately half of the total  
output power that can be delivered when both phases  
are utilized.  
Figure 28. Error Amplifier Configuration  
4. Adjusting the Output Voltage with Input  
Voltage  
In some applications, the output voltage of the PFC  
boost converter is adjusted based on the input voltage  
only. This boost follower implementations increases the  
efficiency of the downstream DC-DC converter and  
therefore of the overall power supply.  
Implementations for both the two-level boost and the  
linear boost follower (or tracking boost) are described in  
application note AN-8021.  
Additional details on adjusting phase management are  
provided in the application note AN-6086.  
5. Adjusting the Phase-Management  
Thresholds  
In any power converter, the switching losses become  
dominant at light load. For an interleaved converter  
where there are two or more phases, light-load  
efficiency can be improved by shutting down one of the  
phases at light load (also known as phase-shedding or  
phase-dropping operating).  
The initial phase-management thresholds are fixed at  
approximately 13% and 18% of the maximum load  
power level. This means when the output power  
reaches 13%, the FAN9612 automatically goes from a  
two-phase to a single-phase operation (phase shed or  
phase drop). When the output power comes back up to  
18%, the FAN9612 automatically goes from the single-  
phase to the two-phase operation (phase-add).  
MAX  
Figure 30. VCOMP vs. tON  
© 2008 Fairchild Semiconductor Corporation  
FAN9612 • Rev. 1.1.7  
www.fairchildsemi.com  
19  
6. Disabling the FAN9612  
d. Pull the VIN Pin to GND. Since the VIN sense  
circuit is configured to ride through a single line  
cycle dropout test without shutting down the power  
supply, this method results in a delayed shutdown  
of the converter. The FAN9612 stops operation  
approximately 20 ms to 32 ms after the VIN pin is  
pulled LOW. The delay depends on the phase of  
the line cycle at which the pull-down occurs. This  
method triggers the input brownout protection (input  
under-voltage lockout), which gradually discharges  
the compensation capacitor. As the output voltage  
decreases, the FB pin falls, pulling LOW the SS  
capacitor voltage. Similarly to the shutdown, once  
the VIN pin is released, operation resumes after  
several milliseconds of delay needed to determine  
that the input voltage is above the turn-on  
threshold. At least one line cycle peak must be  
detected above the turn-on threshold before  
operation can resume at the following line voltage  
zero-crossing. The converter starts following normal  
soft-start procedure.  
There are four ways to disable the FAN9612. It is  
important to understand how the part reacts for the  
various shutdown procedures.  
a. Pull the SS Pin to GND. This method uses the error  
amplifier to stop the operation of the power supply.  
By pulling the SS pin to GND, the error amplifier’s  
non-inverting input is pulled to GND. The amplifier  
senses that the inverting input (FB pin) is higher  
than the reference voltage and tries to adjust its  
output (COMP pin) to make the FB pin equal to the  
reference at the SS pin. Due to the slow speed of  
the voltage loop in PFC applications, this might take  
several line cycles. Thus, it is important to consider  
that by pulling the SS pin to GND, the power supply  
is not shut down immediately. Recovery from a shut  
down follows normal soft-start procedure when the  
SS pin is released.  
b. Pull the FB Pin to GND. By pulling the FB pin below  
the open feedback protection threshold of  
approximately 0.5 V, the power supply can be shut  
down immediately. It is imperative that the FB is  
pulled below the threshold very quickly since the  
power supply keeps switching until this threshold is  
crossed. If the feedback is pulled LOW softly and  
does not cross the threshold, the power supply tries  
to deliver maximum power because the FB pin is  
forced below the reference voltage of the error  
amplifier on the SS pin. Eventually, as FB is pulled  
to GND, the SS capacitor is pulled LOW by the  
internal clamp between the FB and SS pins. The  
SS pin stays approximately 0.5 V higher than the  
FB pin itself. Therefore, recovery from a shut down  
state follows normal soft-start procedure when the  
FB pin is released as the voltage across the SS  
capacitor starts ramping from a low value.  
7. Layout and Connection Guidelines  
For high-power applications, two or more PCB layers  
are recommended to effectively use the ground pattern  
to minimize the switching noise interference.  
The FAN9612 incorporates fast-reacting input circuits,  
short propagation delays, and strong output stages  
capable of delivering current peaks over 1.5 A to  
facilitate fast voltage transition times. Many high-speed  
power circuits can be susceptible to noise injected from  
their own output or external sources, possibly causing  
output re-triggering. These effects can be especially  
obvious if the circuit is tested in breadboard or non-  
optimal circuit layouts with long input or output leads.  
The following guidelines are recommended for all layout  
designs, but especially strongly for the single-layer PCB  
designs. (For example of a 1-layer PCB design, see the  
Application Note AN-6086.)  
c. Pulling the COMP Pin to GND. When the COMP  
pin is pulled below the PWM ramp offset,  
approximately 0.195 V, the FAN9612 stops sending  
gate drive pulses to the power MOSFETs. This  
condition is similar to pulse skipping under no-load  
condition. If any load is still present at the output of  
the boost PFC stage, the output voltage decreases.  
Consequently, the FB pin decreases and the SS  
capacitor voltage is pulled LOW by the internal  
clamp between the FB and SS pins. At that point,  
the operation and eventual recovery to normal  
operation is similar to the mechanism described  
above. If the COMP pin is held LOW for long  
enough to pull the SS pin LOW, the recovery  
follows normal soft-start procedure when the COMP  
pin is released. If the SS capacitor is not pulled  
LOW as a result of a momentary pull-down of the  
COMP pin, the recovery is still soft due to the fact  
that a limited current source is charging the  
compensation capacitors at the output of the error  
amplifier. Nevertheless, in this case, output voltage  
overshoot can occur before the voltage loop enters  
closed-loop operation and resumes controlling the  
output voltage again.  
General  
.
Keep high-current output and power ground paths  
separate from analog input signals and signal  
ground paths.  
.
For best results, make connections to all pins as  
short and direct as possible.  
Power Ground and Analog Ground  
.
.
.
.
.
Power ground (PGND) and analog ground (AGND)  
should meet at one point only.  
All the control components should be connected to  
AGND without sharing the trace with PGND.  
The return path for the gate drive current and VDD  
capacitor should be connected to the PGND pin.  
Minimize the ground loops between the driver  
outputs (DRV1, DRV2), MOSFETs, and PGND.  
Adding the by-pass capacitor for noise on the VDD  
pin is recommended. It should be connected as  
close to the pin as possible.  
© 2008 Fairchild Semiconductor Corporation  
FAN9612 • Rev. 1.1.7  
www.fairchildsemi.com  
20  
Gate Drive  
.
To minimize switching noise, current sensing  
should not make a loop.  
.
The gate drive pattern should be wide enough to  
handle 1 A peak current.  
Input Voltage Sensing (VIN)  
.
Keep the controller as close to the MOSFETs as  
possible. This minimizes the length and the loop  
area (series inductance) of the high-current gate  
drive traces. The gate drive pattern should be as  
short as possible to minimize interference.  
.
Since the impedance of voltage divider is large and  
FAN9612 detects the peak of the line voltage, the  
VIN pin can be sensitive to the switching noise. The  
trace connected to this pin should not cross traces  
with high di/dt to minimize the interference.  
Current Sensing  
.
The noise bypass capacitor for VIN should be  
connected as close to the pin as possible.  
.
Current sensing should be as short as possible.  
© 2008 Fairchild Semiconductor Corporation  
FAN9612 • Rev. 1.1.7  
www.fairchildsemi.com  
21  
Quick Setup Guide  
The FAN9612 can be configured following the next  
steps outlined in this section. This Quick Setup Guide  
refers to the schematic diagram and component  
references of Figure 33. It uses the equations derived  
and explained in Application Note AN-6086.  
Input Voltage Sense Divider  
Brownout Hysteresis Set  
Gate Drive Resistor  
RIN2  
RINHYST  
RG1, RG2  
DG1, DG2  
CVDD1  
Gate Drive Speed-Up Diode  
Bypass Capacitor for VDD_HF  
Startup Energy Storage for VDD  
Current Sense Resistor  
2.2μ  
47μ  
In preparation to calculate the setup component values,  
the power supply specification must be known.  
Furthermore, a few power stage components must be  
pre-calculated before the controller design begins as  
their values determine the component selections. An  
Excel design tool is also available to ease calculations.  
CVDD2  
RCS1, RCS2  
Step 1: Input Voltage Range  
Description  
From Power Supply Specification:  
Minimum AC RMS Input (Turn-On)  
Minimum AC RMS Input (Turn-Off)  
Minimum Line Frequency  
Name Value  
FAN9612 utilizes a single pin (VIN) for input voltage  
sensing. The VIN pin must be above 0.925 V (VIN_BO) to  
enable operation. The converter turns on at a higher  
VIN voltage (VIN_ON) set independently by the designer.  
The input voltage information is used for feedforward in  
the control algorithm as well. The input-voltage  
feedforward operates over a four-to-one range from  
0.925 V (VIN_BO) to 3.7 V (VFF_UL), as measured at the  
VIN pin.  
VLINE.ON  
VLINE.OFF  
fLINE,MIN  
VOUT  
Nominal DC Output  
Output Voltage Ripple (2 · fLINE  
)
VOUT,RIPPLE  
VOUT,LATCH  
POUT  
Latching Output OVP  
Nominal Output Power (to Load)  
Desired Hold-Up Time  
tHOLD  
Minimum DC Output (End of tHOLD  
Minimum Switching Frequency  
Maximum DC Bias  
)
VOUT,MIN  
fSW,MIN  
VDDMAX  
Pre-Calculated Power Stage Parameters:  
Estimated Conversion Efficiency  
Maximum Output Power per Channel  
Output Capacitance  
η
PMAX,CH  
COUT  
L
0.95  
Figure 31. VIN Turn-on and Turn-off Thresholds  
At VIN voltages above the 3.7 V upper limit (VFF_UL),  
input voltage feedforward is not possible. The input  
voltage-sense circuitry saturates at this point and the  
PWM ramp is modulated any longer. Above VFF_UL, the  
converter’s output power becomes a function of the  
input voltage as shown in Figure 32. It can also be  
expressed analytically as:  
Boost Inductance per Channel  
Maximum On-Time per Channel  
tON,MAX  
N
Other Variables Used During the Calculations:  
Turns Ratio (NBOOST / NAUX  
)
10  
Peak Inductor Current  
IL,PK  
2
VIN  
3.7  
Maximum DC Output Current (to Load)  
Calculated Component Values:  
IO,MAX  
(5)  
POUT_NO_FF = PMAX  
RZCD1  
RZCD2  
,
where VIN is the voltage at the VIN pin and PMAX is the  
desired maximum output power of the converter which  
will be maintained constant while the input voltage  
feedforward circuit is operational.  
Zero Current Detect Resistor  
Bypass Capacitor for 5 V Bias  
Maximum On-Time Set  
Soft-Start Capacitor  
C5VB  
RMOT  
CSS  
0.15μ  
Compensation Capacitor  
Compensation Resistor  
Compensation Capacitor  
Feedback Divider  
CCOMP,LF  
RCOMP  
CCOMP,HF  
RFB1  
Feedback Divider  
RFB2  
Figure 32. VIN Feedforward Range  
Over Voltage Sense Divider  
Over Voltage Sense Divider  
Input Voltage Sense Divider  
ROV1  
ROV2  
As can be seen, the converter’s output power capability  
RIN1  
will follow a square function above VFF_UL  
.
© 2008 Fairchild Semiconductor Corporation  
FAN9612 • Rev. 1.1.7  
www.fairchildsemi.com  
22  
Figure 33. Interleaved BCM PFC Schematic Using FAN9612  
Step 2: Estimated Conversion Efficiency  
Step 3: Maximum Output Power per  
Channel  
Use the estimated full-load power conversion efficiency.  
Typical value for an interleaved BCP PFC converter is in  
the 0.92 to 0.98 range. The efficiency is in the lower half  
of the range for low-power applications. Using state-of-  
the-art semiconductors, good quality ferrite inductors  
and selecting lower limit for minimum switching  
frequency positively impacts the efficiency of the  
system. In general, the value of 0.95 can be used  
unless a more accurate power budget is available.  
POUT  
2
PMAX,CH = 1.2 ⋅  
(6)  
A margin of 20% has been added to the nominal output  
power to cover reference inaccuracy, internal  
component tolerances, inductance mismatch, and  
current-sense resistor variation to the per-channel  
power rating.  
© 2008 Fairchild Semiconductor Corporation  
FAN9612 • Rev. 1.1.7  
www.fairchildsemi.com  
23  
Step 4: Output Capacitance  
Step 9: Zero Current Detect Resistors  
POUT  
COUT(RIPPLE)  
=
(7)  
(8)  
0.5 VOUT  
N0.5mA  
4fLINE,MIN VOUT VOUT,RIPPLE  
RZCD1 = RZCD2  
=
(14)  
2POUT tHOLD  
COUT(HOLD)  
=
2  
where 0.5·VOUT is the maximum amplitude of the  
resonant waveform across the boost inductor during  
zero current detection; N is the turns ratio of the boost  
inductor and the auxiliary winding utilized for the zero  
current detection; and 0.5 mA is the maximum current  
of the ZCD pin during the zero current detection period.  
VOUT,RIPPLE  
VOUT  
VO2UT,MIN  
2
The output capacitance must be calculated by two  
different methods. The first equation determines the  
capacitor value based on the allowable ripple voltage at  
the minimum line frequency. It is important to remember  
that the scaled version of this ripple is present at the FB  
pin. The feedback voltage is continuously monitored by  
the non-latching over voltage protection circuit. Its  
threshold is about 8% higher the nominal output voltage.  
To avoid triggering the OVP protection during normal  
operation, VOUT,RIPPLE should be limited to less 12% of  
Step 10: Maximum On-Time Setting  
Resistor  
RMOT = 4340106 tON,MAX  
(15)  
where RMOT should be between 40 kΩ and 130 kΩ.  
the nominal output voltage, VOUT  
.
Step 11: Output Voltage Setting Resistors  
(Feedback)  
The second expression yields the minimum output  
capacitance based on the required hold-up time based  
on the power supply specification. Ultimately, the larger  
of the two values satisfies both design requirements and  
3V VOUT  
3V  
IFB  
RFB2  
=
=
(16)  
PFB  
has to be selected for COUT  
.
where 3 V is the reference voltage of the error amplifier  
at its non-inverting input and PFB or IFB are selected by  
the designer. If the power loss associated to the  
feedback divider is critical to meet stand-by power  
consumption regulations, it might be beneficial to start  
the calculation by choosing PFB. Otherwise, the current  
of feedback divider, IFB should be set to approximately  
0.4 mA at the desired output voltage set point. This  
value ensures that parasitic circuit board and pin  
capacitances do not introduce unwanted filtering effect  
in the feedback path.  
Step 5: Boost Inductance per Channel  
η VL2INE,OFF  
(
VOUT  
2 VLINE,OFF  
)
LLINE,OFF  
=
=
(9)  
2fSW,MIN VOUT PMAX,CH  
ηVL2INE,MAX  
(
VOUT  
2 VLINE,MAX  
)
LLINE,MAX  
(10)  
2fSW,MIN VOUT PMAX,CH  
The minimum switching frequency can occur either at  
the lowest or at the highest input line voltage.  
Accordingly, two boost inductor values are calculated  
and the lower of the two inductances must be selected.  
This L value keeps the minimum operating frequency  
above fSW,MIN under all operating conditions.  
If the feedback divider is used to provide startup power  
for the FAN9612 (see AN-6086 for implementation  
details), the following equation is used to calculate RFB2  
:
3V ⋅  
[
2 VLINE,ON  
(
12.5V + 30.7V  
)
]
(17)  
RFB2  
=
Step 6: Maximum On-Time per Channel  
0.12mA VOUT  
2L PMAX,CH  
ηVL2INE,OFF  
tON,MAX  
=
where 3 V is the reference voltage of the error amplifier  
at its non-inverting input; 12.5 V is the controller’s  
UVLO turn-on threshold; 0.12 mA is the worst-case  
startup current required to start operation; and 3·0.7 V  
accounts for the forward voltage drop of three diodes in  
series of the startup current. Once the value of RFB2 is  
determined, RFB1 is given by the following formula:  
(11)  
Step 7: Peak Inductor Current per Channel  
2 VLINE,OFF  
(12)  
IL,PK  
=
tON,MAX  
L
V
OUT  
RFB1 =   
1RFB2  
(18)  
3V  
Step 8: Maximum DC Output Current  
2 PMAX,CH  
RFB1 can be implemented as a series combination of two  
or three resistors; depending on safety regulations,  
maximum voltage, and or power rating of the selected  
resistor type.  
IOUT,MAX  
=
(13)  
VOUT  
© 2008 Fairchild Semiconductor Corporation  
FAN9612 • Rev. 1.1.7  
www.fairchildsemi.com  
24  
Step 12: Soft-Start Capacitor  
The recommended fHFP frequency is around 120 Hz in  
PFC applications.  
5μA COUT  
(
RFB1 + RFB2  
)
CSS  
=
(19)  
0.3 IOUT,MAX RFB2  
Step 14: Over-Voltage Protection Setting  
(OVP)  
where 5 μA is the charge current of the soft-start  
capacitor and 0.3·IOUT,MAX is the maximum output  
current charging the output capacitor of the converter  
during the soft-start process. It is imperative to limit the  
charge current of the output capacitor to be able to  
maintain closed-loop soft-start of the converter. The  
0.3 factor used in the CSS equation can prevent output  
over voltage at the end of the soft-start period and  
provides sufficient margin to supply current to the load  
while the output capacitor is charging.  
3.5V VOUT,LATCH  
ROV2  
=
(24)  
POVP  
where 3.5 V is the threshold voltage of the OVP  
comparator and POVP is the total dissipation of the  
resistive divider network. Typical POVP power loss is in  
the 50 mW to 100 mW range.  
V
OUT,LATCH  
Step 13: Compensation Components  
ROV1  
=
1 ROV2  
(25)  
3.5V  
gM IOUT,MAX  
4.1VCOUT 2π f0  
RFB2  
CCOMP,LF  
=
(20)  
2
RFB1 +RFB2  
(
)
ROV1 can be implemented as a series combination of  
two or three resistors; depending on safety regulations,  
maximum voltage, and or power rating of the selected  
resistor type.  
where 4.1 V is the control range of the error amplifier  
and f0 is the desired voltage loop crossover frequency.  
It is important to consider that the lowest output ripple  
frequency limits the voltage loop crossover frequency.  
In PFC applications, that frequency is two times the AC  
line frequency. Therefore, the voltage loop bandwidth  
(f0), is typically in the 5 Hz to 15 Hz range.  
Step 15: Input Line Voltage Sense  
Resistors  
0.925V V 2  
LINE,MAX  
RIN2  
=
(26)  
2 VLINE,MIN P  
INSNS  
To guarantee closed-loop soft-start operation under all  
conditions, it is recommended that:  
where 0.925 V is the brownout protection threshold at  
the VIN pin. VLINE,MIN is the minimum input RMS  
operating voltage. Its divided down level at the VIN pin  
corresponds to the 0.925 V brownout protection  
threshold. VLINE,MAX is the maximum input RMS voltage  
anticipated in the design and PINSNS is the total power  
dissipation of the RIN1 - RIN2 divider when the input  
voltage equals VLINE,MAX. Typical PINSNS power loss is in  
the 50 mW to 100 mW range.  
CCOMP,HF < 4CSS  
(21)  
This relationship is determined by the ratio between the  
maximum output current of the gM error amplifier to the  
maximum charge current of the soft-start capacitor.  
Observing this correlation between the two capacitor  
values ensures that the compensation capacitor voltage  
can be adjusted faster than any voltage change taking  
place across the soft-start capacitor. Therefore, during  
startup the voltage regulation loop’s response to the  
increasing soft-start voltage is not limited by the finite  
current capability of the error amplifier.  
2 VLINE,MIN  
0.925V  
RIN1  
=
1 RIN2  
(27)  
RIN1 can be implemented as a series combination of two  
or three resistors; depending on safety regulations,  
maximum voltage, and or power rating of the selected  
resistor type.  
1
RCOMP  
=
(22)  
(23)  
2π f0 CCOMP,LF  
2 VLINE,ON RIN2  
RIN1 +RIN2  
1
0.925V  
CCOMP,HF  
=
(28)  
2π fHFP RCOMP  
RINHYST  
=
2μA  
where fHFP is the frequency of a pole implemented in  
the error amplifier compensation network against high-  
frequency noise in the feedback loop. The pole should  
be placed at least a decade higher than f0 to ensure  
that it does not interfere with the phase margin of the  
voltage regulation loop at its crossover frequency. It  
should also be sufficiently lower then the switching  
frequency of the converter so noise can be effectively  
attenuated.  
where 0.925 V is the threshold voltage of the line  
under-voltage lockout comparator and 2 μA is the sink  
current provided at the VIN pin during line under-  
voltage (brownout) condition. The sink current,  
together with the terminating impedance of the VIN pin  
determines the hysteresis between the turn-on and  
turn-off thresholds.  
© 2008 Fairchild Semiconductor Corporation  
FAN9612 • Rev. 1.1.7  
www.fairchildsemi.com  
25  
The FAN9612 sources high peak current to the  
MOSFET gate through RG and DON, where RG is used to  
control the turn-on transition time. When the MOSFET is  
commanded to turn off, QOFF conducts, shorting the gate  
to the source, where the turn-off speed can be  
controlled by the value of ROFF. Where maximum turn-  
off time is desired, the value of ROFF can be 0 . DON  
serves the dual purpose of protecting the QOFF base-  
emitter junction and blocking the MOSFET discharge  
current from sinking back through the FAN9612.  
Step 16: Gate Resistors  
It is recommended to place at least a 15 Ω resistor  
between each of the gate drive outputs (DRV1, DRV2)  
and their corresponding power devices. The gate drive  
resistors have a beneficial effect to limit the current  
drawn from the VDD bypass capacitor during the turn-on  
of the power MOSFETs and to attenuate any potential  
oscillation in the gate drive circuits.  
VDDMAX  
In addition to the high-speed turn-off, another advantage  
of this circuit is that the FAN9612 does not have to sink  
the high peak discharge current from the MOSFET,  
reducing the internal power dissipation in the gate drive  
circuitry by a factor of two. Instead, the current is  
discharged locally in a tighter, more controlled loop,  
minimizing parasitic trace inductance while protecting the  
FAN9612 from injected disturbances associated with  
ground bounce and ringing due to high-speed turn-off.  
RG1 = RG2  
=
(29)  
1.0A  
where 1.0 A is the recommended peak value of the  
gate drive current.  
Step 17: Current-Sense Resistors  
0.18V  
RCS1 = RCS2  
=
(30)  
IL,PK  
Figure 34. Recommended Gate Drive Schematic  
where 0.18 V is the worst-case threshold of the current  
limit comparator. The size and type of current sense  
resistors depends on their power dissipation and  
manufacturing considerations.  
A speed-up discharge diode that feeds switching current  
back into the IC is not recommended.  
42 VLINE,OFF  
9π VOUT  
1
6
PRCS1 = 1.5IL2,PK RCS1  
(31)  
where the 1.5 factor is used for the worst-case effect of  
the current-limit threshold variation. When the current-  
sense resistor is determined, the minimum current-  
sense threshold must be used to avoid activating over-  
current protection too early as the power supply  
approaches full-load condition. The worst-case power  
dissipation of the current sense resistor occurs when  
the current-sense threshold is at its maximum value  
defined in the datasheet. The ratio between the  
minimum and maximum thresholds squared (since the  
square of the current determines power dissipation)  
yields exactly the 1.5 factor used in the calculation.  
Figure 35. Discharge Diode is Not Recommended  
In cases where it is desirable to control the MOSFET  
turn-on and turn-off transition times independently, the  
circuit of Figure 36 can be used.  
Figure 36. Gate Drive Schematic with Independent  
Turn-On and Turn-Off  
© 2008 Fairchild Semiconductor Corporation  
FAN9612 • Rev. 1.1.7  
www.fairchildsemi.com  
26  
Typical Performance Characteristics — Supply  
Typical characteristics are provided at TA = 25°C and VDD = 12 V unless otherwise noted.  
Figure 37. ISTARTUP vs. Temperature  
Figure 38. Operating Current vs. Temperature  
Figure 39. UVLO Thresholds vs. Temperature  
Figure 40. UVLO Hysteresis vs. Temperature  
© 2008 Fairchild Semiconductor Corporation  
FAN9612 • Rev. 1.1.7  
www.fairchildsemi.com  
27  
Typical Performance Characteristics — Control  
Typical characteristics are provided at TA = 25°C and VDD = 12 V unless otherwise noted.  
Figure 41. Transfer Function  
(Maximum On Time vs. VIN)  
Figure 42. Maximum On Time vs. Temperature  
Figure 43. EA Transconductance (gM) vs.  
Temperature  
Figure 44. EA Reference vs. Temperature  
Figure 45. 5V Reference vs. Temperature  
Figure 46. Soft-Start Current vs. Temperature  
© 2008 Fairchild Semiconductor Corporation  
FAN9612 • Rev. 1.1.7  
www.fairchildsemi.com  
28  
Typical Performance Characteristics — Control  
Typical characteristics are provided at TA = 25°C and VDD = 12 V unless otherwise noted.  
Figure 47. Phase-Control Thresholds vs. Temperature  
Gate Drive 1  
Gate Drive 2  
Gate Drive 1  
Gate Drive 2  
Inductor Current 1  
Inductor Current 2  
Inductor Current 1  
Inductor Current 2  
Figure 48. Phase-Dropping Operation  
Figure 49. Phase-Adding Operation  
© 2008 Fairchild Semiconductor Corporation  
FAN9612 • Rev. 1.1.7  
www.fairchildsemi.com  
29  
Typical Performance Characteristics — Protection  
Typical characteristics are provided at TA = 25°C and VDD = 12 V unless otherwise noted.  
Figure 50. CS Threshold vs. Temperature  
Figure 52. Restart Timer Frequency vs. Temperature  
Figure 54. Brownout Threshold vs. Temperature  
Figure 51. CS to OUT Delay vs. Temperature  
Figure 53. Maximum Frequency Clamp  
vs. Temperature  
© 2008 Fairchild Semiconductor Corporation  
FAN9612 • Rev. 1.1.7  
www.fairchildsemi.com  
30  
Typical Performance Characteristics — Protection  
Typical characteristics are provided at TA = 25°C and VDD = 12 V unless otherwise noted.  
Figure 55. Non-Latching OVP vs. Temperature  
Figure 56. Latching OVP vs. Temperature  
Figure 57. OVP Hysteresis vs. Temperature  
© 2008 Fairchild Semiconductor Corporation  
FAN9612 • Rev. 1.1.7  
www.fairchildsemi.com  
31  
Typical Performance Characteristics — Operation  
Typical characteristics are provided at TA = 25°C and VDD = 12 V unless otherwise noted.  
IL1  
IL1  
IL2  
IL2  
I
L1 + IL2  
IL1 + IL2  
Figure 58. Ripple-Current Cancellation (110 VAC  
)
Figure 59. Ripple-Current Cancellation (110 VAC)  
VGATE  
VGATE  
VOUT  
VOUT  
Line Current  
Line  
Current  
Figure 60. No-Load Startup at 115 VAC  
Figure 61. Full-Load Startup at 115 VAC  
Line  
Vol  
110VAC  
220VAC  
VOUT  
COMP  
Line  
Current  
Figure 62. Input Voltage Feedforward  
Note:  
6. For full performance operational characteristics at both low line (110 VAC) and high line (220 VAC), as well as at  
no-load and full-load, refer to FEB388 Evaluation Board User Guide: 400 W Evaluation Board using  
FAN9611/12.  
© 2008 Fairchild Semiconductor Corporation  
FAN9612 • Rev. 1.1.7  
www.fairchildsemi.com  
32  
Evaluation Board  
FEB388: 400-W Evaluation Board Using FAN9611/12  
FEB388 is one of the evaluation boards for an interleaved  
dual boundary-conduction-mode PFC converter. It is  
rated at 400 W (400 V/1 A) power. With phase  
management, efficiency is maintained above 96% even  
down at 10% of the rated output power. The efficiencies  
for full-load condition exceed 96% as shown below.  
Figure 63 and Figure 64 show the phase management  
with the default minimum threshold values of the IC.  
They can be adjusted upwards to achieve a different  
efficiency profile (Figure 65 and Figure 66) where phase  
management thresholds are adjusted to 30% / 44% of  
the full load. For full specification, design schematic, bill  
of materials and test results; see FEB388 — FAN9611/12  
400W Evaluation Board User Guide (AN-9717).  
Input Voltage  
Rated Output Power  
Output Voltage (Rated Current)  
VIN Nominal: 85 V~264 VAC  
VDD Supply: 13 V~18 VDC  
400 W  
400 V (1 A)  
Figure 63. Measured Efficiency at 115 VAC  
(Default Thresholds)  
Figure 64. Measured Efficiency at 230 VAC  
(Default Thresholds)  
FAN9612 Efficiency vs. Load  
FAN9612 Efficiency vs. Load  
(230 VAC Input, 400 VDC Output, 400W)  
(115 VAC Input, 400 VDC Output, 400W)  
100  
100  
95  
95  
With Phase Management  
With Phase Management  
90  
90  
Without Phase Management  
Without Phase Management  
85  
85  
0
10  
20  
30  
40  
50  
60  
70  
80  
90  
100  
0
10  
20  
30  
40  
50  
60  
70  
80  
90  
100  
Output Power (%)  
Output Power (%)  
Figure 65. Measured Efficiency at 115 VAC  
(Adjusted Thresholds)  
Figure 66. Measured Efficiency at 230 VAC  
(Adjusted Thresholds)  
© 2008 Fairchild Semiconductor Corporation  
FAN9612 • Rev. 1.1.7  
www.fairchildsemi.com  
33  
Table 1. Related Products  
Part  
Number  
of Pins  
Description  
PFC Control  
Comments  
Number  
Industry Standard Pin-Out with  
Green Mode Functions  
FAN6961 Green Mode PFC  
Single BCM (CRM)  
Single BCM (CRM)  
Single BCM (CRM)  
8
8
8
FAN7527B Boundary Mode PFC Control IC  
Industry Standard Pin-Out  
Dual Output Critical Conduction  
FAN7528  
Low THD for Boost-Follower  
Implementation  
Mode PFC Controller  
Critical Conduction Mode PFC  
FAN7529  
Controller  
Single BCM (CRM)  
Single BCM (CRM)  
8
8
Low THD  
Critical Conduction Mode PFC  
Low THD, Alternate Pin-Out of  
FAN7529 (Pins 2 and 3 Reversed)  
FAN7530  
Controller  
PFC Ready pin, Frequency Limit,  
AC-Line-Absent Detection, Soft-  
Start to Minimize Overshoot,  
Critical Conduction Mode PFC  
FAN7930  
Controller  
Single BCM (CRM)  
8
Integrated THD Optimizer, TSD  
Interleaved Dual BCM PFC  
Dual BCM (CRM), 180°  
Out-of-Phase, 10.0V UVLO  
FAN9611  
Controller  
Dual BCM (CRM)  
16  
Interleaved Dual BCM PFC  
Controller  
Dual BCM (CRM), 180°  
Out-of-Phase, 12.5V UVLO  
FAN9612  
Dual BCM (CRM)  
16  
Related Resources  
.
.
.
AN-6086: Design Consideration for Interleaved Boundary Conduction Mode (BCM) PFC Using FAN9612  
AN-9717: Fairchild Evaluation Board User Guide FEB388: 400W Evaluation Board using FAN9611/12  
AN-8021: Building Variable Output Voltage Boost PFC Converters Using FAN9612  
References  
1. L. Huber, B. Irving, C. Adragna and M. Jovanovich, “Implementation of Open-Loop Control for Interleaved  
DCM/BCM Boundary Boost PFC Converters”, Proceedings of APEC ’08, pp. 1010-1016.  
2. C. Bridge and L. Balogh, “Understanding Interleaved Boundary Conduction Mode PFC Converters”,  
Fairchild Power Seminars, 2008-2009.  
© 2008 Fairchild Semiconductor Corporation  
FAN9612 • Rev. 1.1.7  
www.fairchildsemi.com  
34  
Physical Dimensions  
10.00  
9.80  
A
8.89  
16  
9
B
1.75  
4.00  
3.80  
6.00  
5.6  
1
8
PIN ONE  
INDICATOR  
0.51  
0.35  
1.27  
(0.30)  
1.27  
0.65  
M
0.25  
C B A  
LAND PATTERN RECOMMENDATION  
1.75 MAX  
SEE DETAIL A  
1.50  
1.25  
0.25  
0.19  
0.25  
0.10  
C
0.10 C  
0.50  
0.25  
X 45°  
NOTES: UNLESS OTHERWISE SPECIFIED  
(R0.10)  
(R0.10)  
A) THIS PACKAGE CONFORMS TO JEDEC  
MS-012, VARIATION AC, ISSUE C.  
B) ALL DIMENSIONS ARE IN MILLIMETERS.  
C) DIMENSIONS ARE EXCLUSIVE OF BURRS, MOLD  
FLASH AND TIE BAR PROTRUSIONS  
GAGE PLANE  
0.36  
8°  
0°  
D) CONFORMS TO ASME Y14.5M-1994  
E) LANDPATTERN STANDARD: SOIC127P600X175-16AM  
F) DRAWING FILE NAME: M16AREV12.  
SEATING PLANE  
0.90  
0.50  
(1.04)  
DETAIL A  
SCALE: 2:1  
Figure 67. 16-Lead SOIC Package  
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner  
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or  
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the  
warranty therein, which covers Fairchild products.  
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:  
http://www.fairchildsemi.com/packaging/.  
© 2008 Fairchild Semiconductor Corporation  
FAN9612 • Rev. 1.1.7  
www.fairchildsemi.com  
35  
© 2008 Fairchild Semiconductor Corporation  
FAN9612 • Rev. 1.1.7  
www.fairchildsemi.com  
36  
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