FCD5N60TM-WS [ONSEMI]

功率 MOSFET,N 沟道,SUPERFET®,Easy Drive,600 V,4.6 A,950 mΩ,DPAK;
FCD5N60TM-WS
型号: FCD5N60TM-WS
厂家: ONSEMI    ONSEMI
描述:

功率 MOSFET,N 沟道,SUPERFET®,Easy Drive,600 V,4.6 A,950 mΩ,DPAK

文件: 总10页 (文件大小:615K)
中文:  中文翻译
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2014 2 月  
FCD5N60  
N SuperFET MOSFET  
600 V, 4.6 A, 950 m  
®
特性  
说明  
SuperFET® MOSFET 是飞兆半导体第一代利用电荷平衡技术实  
现出色低导通电阻和更低栅极电荷性能的高压超级SJ)  
MOSFET 系列产品。这项技术专用于最小化导通损耗并提供卓  
越的开关性能dv/dt 额定值和更高雪崩能量。因此SuperFET  
MOSFET 非常适合开关电源应用功率因数校(PFC)务  
/ 电信电源、平板电视电源ATX 电源及工业电源应用。  
650 V @ TJ = 150°C  
Typ.RDS(on) = 810 m  
超低栅极电典型Qg = 16 nC)  
低有效输出电典型Coss(eff.)= 32 pF)  
100% 经过雪崩测试  
RoHS 标准  
应用  
LCD/LED 电视和显示器  
照明  
光伏逆变器  
AC-DC 电源  
D
D
G
G
S
D-PAK  
S
MOSFET 最大额定TC =25°C 除非另有说明。  
FCD5N60TM /  
FCD5N60TM_WS  
符号  
VDSS  
参数  
单位  
600  
4.6  
V
A
漏极-源极电压  
漏极电流  
- (TC=25°C)  
- (TC=100°C)  
- 脉冲  
ID  
2.9  
IDM  
13.8  
±30  
159  
4.6  
A
V
漏极电流  
(说1)  
VGSS  
EAS  
IAR  
栅极-源极电压  
单脉冲雪崩能量  
雪崩电流  
mJ  
A
(说2)  
(说1)  
(说1)  
(说3)  
EAR  
dv/dt  
5.4  
mJ  
V/ns  
W
重复雪崩能量  
二极管恢dv/dt 峰值  
4.5  
(TC = 25°C)  
54  
PD  
功耗  
0.43  
W/°C  
°C  
- 降低25°C 以上  
TJ, TSTG  
TL  
工作和存储温度范围  
-55 +150  
300  
°C  
用于焊接的最大引线温度,距离外1/8",持5 秒  
热性能  
FCD5N60TM /  
FCD5N60TM_WS  
符号  
参数  
单位  
RJC  
RJA  
2.3  
83  
结至外壳热阻最大值  
结至环境热阻最大值  
°C/W  
www.fairchildsemi.com  
©2008 飞兆半导体公司  
1
FCD5N60 Rev. C1  
封装标识与定购信息  
器件编号  
顶标  
封装  
包装方法  
卷带  
卷尺寸  
带宽  
数量  
FCD5N60TM  
FCD5N60  
D-PAK  
330 mm  
16 mm  
2500 个  
2500 个  
FCD5N60TM_WS  
FCD5N60  
D-PAK  
330 mm  
16 mm  
卷带  
电气特TC =25°C 除非另有说明。  
符号  
关断特性  
BVDSS  
参数  
测试条件  
最小值 典型值 最大值  
单位  
VGS = 0 V, ID = 250 μA, TC = 25°C  
VGS = 0 V, ID = 250 μA, TC = 150°C  
600  
-
-
-
-
V
V
漏极-源极击穿电压  
650  
BVDSS  
/ TJ  
BVDS  
IDSS  
IGSS  
ID = 250 μA,参考温度25°C  
-
0.6  
-
V/°C  
V
击穿电压温度系数  
VGS = 0 V, ID = 4.6 A  
-
-
-
-
700  
-
1
漏源极雪崩击穿电压  
VDS = 600 V, VGS = 0 V  
VDS = 480 V, TC = 125°C  
VGS = ±30 V, VDS = 0 V  
-
-
-
A  
零栅极电压漏极电流  
10  
±100  
nA  
- 体漏电流  
导通特性  
VGS(th)  
RDS(on)  
gFS  
VGS = VDS, ID = 250 A  
VGS = 10 V, ID = 2.3 A  
VDS = 40 V, ID = 2.3 A  
3.0  
-
5.0  
0.95  
-
V
S
栅极阈值电压  
-
-
0.81  
3.8  
漏极至源极静态导通电阻  
正向跨导  
动态特性  
Ciss  
-
-
-
-
-
470  
250  
22  
600  
pF  
pF  
pF  
pF  
pF  
输入电容  
VDS = 25 V, VGS = 0 V,  
f = 1 MHz  
Coss  
320  
输出电容  
Crss  
-
-
-
反向传输电容  
输出电容  
Coss  
VDS = 480 V, VGS = 0 V, f = 1 MHz  
12  
Coss(eff.)  
VDS = 0 V 400 V, VGS = 0 V  
32  
有效输出电容  
开关特性  
td(on)  
tr  
td(off)  
tf  
-
-
-
-
-
-
-
12  
40  
47  
22  
16  
2.8  
7
30  
90  
95  
55  
-
ns  
ns  
导通延迟时间  
VDD = 300 V, ID = 4.6 A,  
开通上升时间  
V
GS = 10 V, RG = 25   
ns  
关断延迟时间  
(说4)  
(说4)  
ns  
关断下降时间  
Qg(tot)  
Qgs  
Qgd  
nC  
nC  
nC  
10 V 的栅极电荷总量  
- 源极栅极电荷  
- 电荷  
V
V
DS = 480 V, ID = 4.6 A,  
GS = 10 V  
-
-
- 源极二极管特性  
IS  
-
-
-
-
-
-
-
4.6  
13.8  
1.4  
-
A
A
- 源极二极管最大正向连续电流  
- 源极二极管最大正向脉冲电流  
- 源极二极管正向电压  
反向恢复时间  
ISM  
VSD  
trr  
VGS = 0 V, ISD = 4.6 A  
-
V
295  
2.7  
ns  
C  
VGS = 0 V, ISD = 4.6 A  
dIF/dt = 100 A/s  
Qrr  
-
反向恢复电荷  
注意:  
1. 重复额定值:脉冲宽度受限于最大结温。  
2. I =2.3 AV =50 VR =25 ,开T =25°C。  
AS  
DD  
G
J
3. I 4.6 Adi/dt 200 A/sV BV  
,开T =25°C。  
J
SD  
DD  
DSS  
4. 本质上独立于工作温度的典型特性。  
www.fairchildsemi.com  
©2008 飞兆半导体公司  
2
FCD5N60 Rev. C1  
典型性能特征  
1. 导通区域特性  
2. 传输特性  
VGS  
Top :  
15.0 V  
10.0 V  
8.0 V  
7.0 V  
6.5 V  
6.0 V  
101  
101  
100  
10-1  
Bottom : 5.5 V  
150oC  
25oC  
100  
-55oC  
* Notes :  
1. 250s Pulse Test  
* Note  
1. VDS = 40V  
o
2. TC = 25 C  
2. 250s Pulse Test  
10-1  
10-1  
100  
101  
2
4
6
8
10  
VGS , Gate-Source Voltage [V]  
VDS, Drain-Source Voltage [V]  
3. 导通电阻变化与漏极电流和栅极电压的关系  
4. 体二极管正向电压变化与源极电流和温度的关系  
3.0  
2.5  
101  
VGS = 10V  
2.0  
1.5  
1.0  
0.5  
150oC  
25oC  
100  
-55oC  
VGS = 20V  
* Note  
1. VDS = 40V  
o
2. 250s Pulse Test  
* Note : TJ = 25 C  
10-1  
0.0  
2.5  
5.0  
7.5  
10.0  
12.5  
15.0  
2
4
6
8
10  
ID, Drain Current [A]  
VGS , Gate-Source Voltage [V]  
5. 电容特性  
6. 栅极电荷特性  
1500  
12  
Ciss = Cgs + Cgd (Cds = shorted)  
VDS = 100V  
VDS = 250V  
VDS = 400V  
C
oss = Cds + Cgd  
Crss = Cgd  
10  
8
* Notes :  
1. VGS = 0 V  
1000  
500  
2. f = 1 MHz  
Coss  
6
Ciss  
4
2
Crss  
* Note : ID = 4.6A  
15  
0
0
100  
101  
0
5
10  
QG, Total Gate Charge [nC]  
VDS, Drain-Source Voltage [V]  
www.fairchildsemi.com  
©2008 飞兆半导体公司  
3
FCD5N60 Rev. C1  
典型性能特(接上页)  
7. 击穿电压变化与温度的关系图  
8. 导通电阻变化与温度的关系  
3.0  
1.2  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
1.1  
1.0  
0.9  
0.8  
* Notes :  
1. VGS = 0 V  
* Notes :  
1. VGS = 10 V  
2. ID = 250 A  
2. ID = 2.3 A  
-100  
-50  
0
50  
100  
150  
200  
-100  
-50  
0
50  
100  
150  
200  
TJ, Junction Temperature [oC]  
TJ, Junction Temperature [oC]  
9. 最大安全工作区图  
10. 最大漏极电流与壳温的关系  
5
102  
101  
100  
10-1  
10-2  
Operation in This Area  
is Limited by R DS(on)  
4
3
2
1
0
10 us  
100 us  
1 ms  
10 ms  
100 ms  
DC  
* Notes :  
1. TC = 25 o  
C
2. TJ = 150 o  
C
3. Single Pulse  
100  
101  
102  
103  
25  
50  
75  
100  
125  
150  
TC, Case Temperature [oC]  
VDS, Drain-Source Voltage [V]  
11. 瞬态热响应曲线  
D=0.5  
0.2  
100  
10-1  
10-2  
* N otes  
:
1. ZJC (t) = 2.3 oC /W M ax.  
0.1  
2. D uty Factor, D =t1/t2  
0.05  
3. TJM - TC  
= PDM * ZJC(t)  
0.02  
0.01  
PDM  
t1  
t2  
single pulse  
10-5  
10-4  
10-3  
10-2  
10-1  
100  
101  
t1, Square W ave Pulse D uration [sec]  
www.fairchildsemi.com  
©2008 飞兆半导体公司  
4
FCD5N60 Rev. C1  
VGS  
Same Type  
as DUT  
50KΩ  
Qg  
12V  
200nF  
300nF  
VDS  
VGS  
Qgs  
Qgd  
DUT  
I = 常量  
G
Charge  
12. 栅极电荷测试电路与波形  
RL  
VDS  
90%  
VDS  
VDD  
VGS  
RG  
10%  
VGS  
DUT  
V
GS  
td(on)  
tr  
td(off)  
tf  
t on  
t off  
13. 阻性开关测试电路与波形  
BVDSS  
--------------------  
BVDSS - VDD  
L
1
2
2
----  
EAS  
=
L IAS  
VDS  
I D  
BVDSS  
IAS  
RG  
VDD  
ID (t)  
V
VDS (t)  
VDD  
DUT  
GS  
t p  
t p  
Time  
14. 非箝位感性开关测试电路与波形  
www.fairchildsemi.com  
©2008 飞兆半导体公司  
5
FCD5N60 Rev. C1  
+
DUT  
VDS  
_
I SD  
L
Driver  
RG  
Same Type  
as DUT  
VDD  
VGS  
• dv/dt controlled by RG  
• ISD controlled by pulse period  
Gate Pulse Width  
--------------------------  
VGS  
D =  
Gate Pulse Period  
10V  
( Driver )  
IFM , Body Diode Forward Current  
I SD  
di/dt  
( DUT )  
IRM  
Body Diode Reverse Current  
Body Diode Recovery dv/dt  
VSD  
VDS  
( DUT )  
VDD  
Body Diode  
Forward Voltage Drop  
15. 峰值二极管恢dv/dt 测试电路与波形  
www.fairchildsemi.com  
©2008 飞兆半导体公司  
6
FCD5N60 Rev. C1  
机械尺寸  
16. TO252 (D-PAK),模塑3 引脚,选AA&AB  
封装图纸作为一项服务,提供给考虑飞兆半导体元件的客户。具体参数可能会有变化,且不会做出相应通知。请注意图纸上的版本和 /  
或日期联系飞兆半导体代表核实或获得最新版本装规格并不扩大飞兆公司全球范围内的条款与条件其是其中涉及飞兆公司  
产品保修的部分。  
随时访问飞兆半导体在线封装网页,可以获取最新的封装图纸:  
http://www.fairchildsemi.com/package/packageDetails.html?id=PN_TT252-003  
www.fairchildsemi.com  
©2008 飞兆半导体公司  
7
FCD5N60 Rev. C1  
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AccuPower™  
AX-CAP *  
BitSiC™  
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CorePLUS™  
CorePOWER™  
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CTL™  
F-PFS™  
FRFET  
Sync-Lock™  
®*  
®
®
®
®
Global Power ResourceSM  
GreenBridge™  
Green FPS™  
PowerTrench  
PowerXS™  
Programmable Active Droop™  
QFET  
QS™  
Quiet Series™  
RapidConfigure™  
®
TinyBoost  
TinyBuck  
®
®
Green FPS™ e-Series™  
Gmax™  
GTO™  
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®
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®
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®
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®
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®
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®
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Definition of Terms  
Datasheet Identification  
Product Status  
Definition  
Datasheet contains the design specifications for product development. Specifications  
may change in any manner without notice.  
Advance Information  
Formative / In Design  
Datasheet contains preliminary data; supplementary data will be published at a later  
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FCD5N60 Rev. C1  
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