FCMT250N65S3 [ONSEMI]

功率 MOSFET,N 沟道,SUPERFET® III,Easy Drive,650 V,12 A,250 mΩ,Power88;
FCMT250N65S3
型号: FCMT250N65S3
厂家: ONSEMI    ONSEMI
描述:

功率 MOSFET,N 沟道,SUPERFET® III,Easy Drive,650 V,12 A,250 mΩ,Power88

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MOSFET – Power, N-Channel,  
SUPERFET III, Easy Drive  
650 V, 12 A, 250 mW  
FCMT250N65S3  
Description  
SUPERFET III MOSFET is ON Semiconductor’s brandnew high  
voltage superjunction (SJ) MOSFET family that is utilizing charge  
balance technology for outstanding low onresistance and lower gate  
charge performance. This advanced technology is tailored to minimize  
conduction loss, provide superior switching performance, and  
withstand extreme dv/dt rate.  
www.onsemi.com  
V
R
MAX  
I MAX  
D
DSS  
DS(ON)  
650 V  
250 m@ 10 V  
12 A  
Consequently, SUPERFET III MOSFET Easydrive series helps  
manage EMI issues and allows for easier design implementation.  
The Power88 package is an ultraslim surfacemount package (1  
D
2
mm high) with a low profile and small footprint (8x8 mm ).  
SUPERFET III MOSFET in a Power88 package offers excellent  
switching performance due to lower parasitic source inductance and  
separated power and drive sources. Power88 offers Moisture  
Sensitivity Level 1 (MSL 1).  
G
S1: Driver Source  
S2: Power Source  
S1  
S2  
POWER MOSFET  
Features  
700 V @ T = 150 °C  
J
Typ R  
= 210 mꢀ  
DS(on)  
Ultra Low Gate Charge (Typ. Q = 24 nC)  
g
Low Effective Output Capacitance (Typ. C  
100% Avalanche Tested  
These Devices are PbFree and are RoHS Compliant  
= 248 pF)  
S2  
oss(eff.)  
S2  
S1  
G
PQFN4 8X8 2P  
CASE 483AP  
Applications  
Telecom / Server Power Supplies  
Industrial Power Supplies  
UPS / Solar  
MARKING DIAGRAM  
Lighting / Charger / Adapter  
$Y&Z&3&K  
FCMT  
250N65S3  
$Y  
&Z  
&3  
&K  
= ON Semiconductor Logo  
= Assembly Plant Code  
= Data Code (Year & Week)  
= Lot Code  
FCMT250N65S3 = Specific Device Code  
ORDERING INFORMATION  
See detailed ordering and shipping information on page 2 of  
this data sheet.  
© Semiconductor Components Industries, LLC, 2017  
1
Publication Order Number:  
February, 2020 Rev. 5  
FCMT250N65S3/D  
FCMT250N65S3  
ABSOLUTE MAXIMUM RATINGS (T = 25°C, Unless otherwise specified)  
C
Symbol  
Parameter  
Value  
650  
30  
Unit  
V
V
DSS  
V
GSS  
Drain to Source Voltage  
Gate to Source Voltage  
DC  
V
AC (f > 1 Hz)  
30  
V
I
D
Drain Current  
Continuous (T = 25°C)  
12  
A
C
Continuous (T = 100°C)  
7.6  
C
I
Drain Current  
Pulsed (Note 1)  
30  
A
mJ  
A
DM  
E
Single Pulsed Avalanche Energy (Note 2)  
Avalanche Current (Note 2)  
Repetitive Avalanche Energy (Note 1)  
MOSFET dv/dt  
57  
AS  
AS  
I
2.3  
E
0.9  
mJ  
V/ns  
AR  
dv/dt  
100  
20  
Peak Diode Recovery dv/dt (Note 3)  
Power Dissipation  
P
(T = 25°C)  
C
90  
W
W/°C  
°C  
D
Derate Above 25°C  
0.72  
55 to +150  
300  
T , T  
Operating and Storage Temperature Range  
J
STG  
T
Maximum Lead Temperature for Soldering, 1/8from Case for 5 s  
°C  
L
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality  
should not be assumed, damage may occur and reliability may be affected.  
1. Repetitive rating: pulsewidth limited by maximum junction temperature.  
2. I = 2.3 A, RG = 25 starting T = 25°C  
AS  
J
3. I 6 A, di/dt 200 A/s, V 400 V, starting T = 25°C  
SD  
DD  
J
THERMAL CHARACTERISTICS  
Symbol  
Parameter  
Value  
1.39  
45  
Unit  
Thermal Resistance, Junction to Case, Max.  
°C/W  
R
R
JC  
JA  
Thermal Resistance, Junction to Ambient, Max. (Note 4)  
2
4. Device on 1 in pad 2 oz copper pad on 1.5 x 1.5 in. board of FR4 material.  
ORDERING INFORMATION  
Part Number  
Top Marking  
Package  
Reel Size  
Tape Width  
13.3 mm  
Shipping  
FCMT250N65S3  
FCMT250N65S3  
PQFN8  
13”  
3000 / Tape & Reel  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
www.onsemi.com  
2
 
FCMT250N65S3  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
C
Symbol  
Parameter  
Test Condition  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
BV  
Drain to Source Breakdown Voltage  
V
V
= 0 V, I = 1 mA, T = 25°C  
650  
700  
V
V
DSS  
GS  
D
J
= 0 V, I = 1 mA, T = 150°C  
GS  
D
J
B
V
Breakdown Voltage Temperature  
Coefficient  
I
= 1mA, referenced to 25°C  
0.67  
0.77  
V/°C  
DSS  
J
D
/
T  
I
Zero Gate Voltage Drain Current  
V
V
V
= 650 V, V = 0 V  
10  
A  
nA  
V
DSS  
DS  
DS  
GS  
GS  
= 520 V, T = 125 °C  
C
I
Gate to Source Leakage Current  
=
30 V, V = 0 V  
100  
GSS  
DS  
ON CHARACTERISTICS  
V
Gate Threshold Voltage  
V
V
V
= V , I = 0.29 mA  
2.5  
4.5  
GS(th)  
DS(on)  
GS  
GS  
DS  
DS  
D
R
Static Drain to Source On Resistance  
Forward Transconductance  
= 10 V, I = 6 A  
210  
7.4  
250  
mꢀ  
D
g
FS  
= 20 V, I = 6 A  
S
D
DYNAMIC CHARACTERISTICS  
C
Input Capacitance  
V
= 400 V, V = 0 V, f = 1 MHz  
1010  
25  
pF  
pF  
pF  
pF  
nC  
nC  
nC  
iss  
DS  
GS  
C
Output Capacitance  
oss  
C
Effective Output Capacitance  
Energy Related Output Capacitance  
Total Gate Charge at 10 V  
Gate to Source Gate Charge  
Gate to Drain “Miller” Charge  
Equivalent Series Resistance  
V
DS  
V
DS  
V
DS  
= 0 V to 400 V, V = 0 V  
248  
33  
oss(eff.)  
GS  
C
= 0 V to 400 V, V = 0 V  
GS  
oss(er.)  
Q
= 400 V, I = 6 A, V = 10 V,  
24  
g(tot)  
D
GS  
(Note 5)  
Q
6.1  
9.7  
1.1  
gs  
Q
gd  
ESR  
f = 1 MHz  
SWITCHING CHARACTERISTICS  
t
Turn-On Delay Time  
TurnOn Rise Time  
Turn-Off Delay Time  
TurnOn Fall Time  
V
= 400 V, I = 6 A, V = 10 V,  
GEN  
15  
13  
40  
7.2  
ns  
ns  
ns  
ns  
d(on)  
DD  
D
GS  
R
= 4.7 ꢀ  
t
r
(Note 5)  
t
d(off)  
t
f
SOURCEDRAIN DIODE CHARACTERISTICS  
I
Maximum Continuous Source to Drain Diode Forward Current  
Maximum Pulsed Source to Drain Diode Forward Current  
12  
30  
A
A
S
I
SM  
V
Source to Drain Diode Forward Voltage  
Reverse Recovery Time  
V
V
= 0 V, I = 6 A  
1.2  
V
SD  
GS  
SD  
t
= 400 V, I = 6 A,  
251  
3.4  
ns  
C  
rr  
DD  
F
SD  
di /dt = 100 A/s  
Q
Reverse Recovery Charge  
rr  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
5. Essentially independent of operating temperature typical characteristics.  
www.onsemi.com  
3
 
FCMT250N65S3  
TYPICAL PERFORMANCE CHARACTERISTICS  
30  
40  
10  
V
GS  
=10.0 V  
8.0 V  
7.0 V  
6.5 V  
6.0 V  
5.5 V  
V
= 20 V  
DS  
250 s Pulse Test  
10  
150°C  
1
25°C  
55°C  
250 s Pulse Test  
= 25°C  
T
C
1
0.1  
0.2  
1
10  
20  
3
4
V
5
6
7
8
9
V
DS  
, DrainSource Voltage (V)  
, GateSource Voltage (V)  
GS  
Figure 1. OnRegion Characteristics  
Figure 2. Transfer Characteristics  
0.5  
0.4  
0.3  
0.2  
0.1  
0.0  
100  
10  
1
V = 0 V  
GS  
250 s Pulse Test  
T
C
= 25°C  
150°C  
V
= 10 V  
25°C  
GS  
V
GS  
= 20 V  
0.1  
55°C  
0.01  
0.001  
0.0  
0.5  
1.0  
1.5  
0
5
10  
15  
20  
25  
V
SD  
, Body Diode Forward Voltage (V)  
I , Drain Current (A)  
D
Figure 4. Body Diode Forward Voltage  
Variation vs. Source Current and  
Temperature  
Figure 3. OnResistance Variation vs.  
Drain Current and Gate Voltage  
105  
104  
103  
102  
101  
10  
8
I
D
= 6 A  
V
DS  
= 130 V  
C
iss  
V
DS  
= 400 V  
6
C
oss  
4
V
= 0 V  
GS  
f = 1 MHz  
2
C
C
C
= C + C (C = shorted)  
100  
C
iss  
gs  
gd  
ds  
rss  
= C + C  
oss  
rss  
ds  
gd  
= C  
gd  
100  
101  
0
101  
101  
102  
103  
0
6
12  
18  
24  
30  
Q , Total Gate Charge (nC)  
V
DS  
, DrainSource Voltage (V)  
g
Figure 5. Capacitance Characteristics  
Figure 6. Gate Charge Characteristics  
www.onsemi.com  
4
FCMT250N65S3  
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)  
1.2  
1.1  
1.0  
0.9  
0.8  
3.0  
V
I
= 10 V  
= 6 A  
V
I
= 0 V  
= 10 mA  
GS  
GS  
D
D
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
50  
50  
100  
150  
0
50  
0
50  
100  
150  
T , Junction Temperature (5C)  
J
T , Junction Temperature (5C)  
J
Figure 7. Breakdown Voltage Variation  
vs. Temperature  
Figure 8. OnResistance Variation  
vs. Temperature  
15  
10  
5
100  
10  
1
30 s  
100 s  
1 ms  
10 ms  
DC  
Operation in this Area  
is Limited by R  
DS(on)  
0.1  
T
C
= 25°C  
T = 150°C  
J
Single Pulse  
0
0.01  
150  
1
10  
100  
1000  
25  
50  
75  
100  
125  
T , Case Temperature (5C)  
V
, DrainSource Voltage (V)  
C
DS  
Figure 9. Maximum Safe Operating Area  
Figure 10. Maximum Drain Current  
vs. Case Temperature  
6
4
2
0
0
130  
DS  
260  
390  
520  
650  
V
, Drain to Source Voltage (V)  
Figure 11. EOSS vs. Drain to Source Voltage  
www.onsemi.com  
5
FCMT250N65S3  
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)  
2
1
DUTY CYCLE DESCENDING ORDER  
D = 0.5  
0.2  
0.1  
P
0.05  
0.02  
0.01  
DM  
0.1  
0.01  
t
1
t
2
Z
R
(t) = r(t) x R  
JC  
= 1.39°C/W  
JC  
SINGLE PULSE  
104  
JC  
Peak T = P  
x Z (t) + T  
JC C  
J
DM  
Duty Cycle, D = t / t  
1
2
0.001  
105  
103  
102  
101  
100  
t, Rectangular Pulse Duration (sec)  
Figure 12. Transient Thermal Response Curve  
www.onsemi.com  
6
FCMT250N65S3  
V
GS  
R
Q
g
L
V
DS  
Q
Q
gs  
gd  
V
GS  
DUT  
I
G
= Const.  
Charge  
Figure 13. Gate Charge Test Circuit & Waveform  
R
L
V
DS  
GS  
90%  
90%  
10%  
90%  
V
DS  
V
DD  
V
GS  
R
G
10%  
V
DUT  
V
GS  
t
t
d(off)  
t
r
t
f
d(on)  
t
on  
t
off  
Figure 14. Resistive Switching Test Circuit & Waveforms  
L
2
1
2
EAS  
+
@ LIAS  
V
DS  
BV  
DSS  
I
D
I
AS  
R
G
V
DD  
I (t)  
D
DUT  
V
DD  
V
GS  
V
DS  
(t)  
t
p
Time  
t
p
Figure 15. Unclamped Inductive Switching Test Circuit & Waveforms  
www.onsemi.com  
7
FCMT250N65S3  
+
DUT  
V
DS  
I
SD  
L
Driver  
R
G
Same Type  
as DUT  
V
DD  
V
GS  
dv/dt controlled by R  
G
I controlled by pulse period  
SD  
Gate Pulse Width  
D +  
Gate Pulse Period  
V
GS  
10 V  
(Driver)  
I
, Body Diode Forward Current  
FM  
I
di/dt  
SD  
(DUT)  
I
RM  
Body Diode Reverse Current  
Body Diode Recovery dv/dt  
V
DS  
V
DD  
V
SD  
(DUT)  
Body Diode  
Forward Voltage Drop  
Figure 16. Peak Diode Recovery dv/dt Test Circuit & Waveforms  
SUPERFET is a registered trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or  
other countries.  
www.onsemi.com  
8
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
PQFN4 8X8, 2P  
CASE 483AP  
ISSUE A  
DATE 06 JUL 2021  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON13664G  
PQFN4 8X8, 2P  
PAGE 1 OF 1  
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