FDA8440 [ONSEMI]

N 沟道,PowerTrench® MOSFET,逻辑电平,40 V,10 A,2.1 mΩ;
FDA8440
型号: FDA8440
厂家: ONSEMI    ONSEMI
描述:

N 沟道,PowerTrench® MOSFET,逻辑电平,40 V,10 A,2.1 mΩ

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April 2014  
FDA8440  
®
N-Channel Logic Level PowerTrench MOSFET  
40 V, 100 A, 2.1 mΩ  
Features  
Application  
RDS(on) = 1.46 mΩ (Typ.) @ VGS = 10 V, ID = 80 A  
QG(tot) = 345 nC (Typ.) @ VGS = 10 V  
Low Miller Charge  
Power tools  
Motor drives and Uninterruptible Power Supplies  
Synchronous Rectification  
Low Qrr Body Diode  
Battery Protection Circuit  
UIS Capability (Single Pulse and Repetitive Pulse)  
160 A Guarantee for 2 sec  
RoHS Compliant  
D
G
G
D
TO-3PN  
S
S
o
T
= 25 C unless otherwise noted.  
MOSFET Maximum Ratings  
C
Symbol  
Parameter  
FDA8440  
Unit  
VDSS  
VGSS  
Drain to Source Voltage  
Gate to Source Voltage  
Drain Current  
40  
V
V
±20  
A
100  
- Continuous (TC = 155oC)  
ID  
- Continuous (TA = 25oC, VGS = 10 V, RθJA = 40oC/W )  
30  
A
A
- Pulsed  
500  
EAS  
PD  
Single Pulsed Avalanche Energy  
Power dissipation  
Derate above 25oC  
(Note 1)  
1682  
306  
mJ  
W
2.04  
W/oC  
oC  
TJ, TSTG  
Operating and Storage Temperature  
-55 to +175  
Thermal Characteristics  
RθJC  
RθJA  
Thermal Resistance, Junction to Case, Max.  
Thermal Resistance, Junction to Ambient, Max.  
0.49  
40  
oC/W  
oC/W  
(Note 2)  
©2007 Fairchild Semiconductor Corporation  
FDA8440 Rev. C1  
1
www.fairchildsemi.com  
Package Marking and Ordering Information  
Part Number  
Top Mark  
Package  
Packing Method  
Reel Size  
Tape Width  
Quantity  
FDA8440  
FDA8440  
TO-3PN  
Tube  
N/A  
N/A  
30 units  
Electrical Characteristics  
T = 25°C unless otherwise noted  
C
Symbol  
Parameter  
Conditions  
Min. Typ. Max. Unit  
Off Characteristics  
BVDSS  
Drain to Source Breakdown Voltage  
Zero Gate Voltage Drain Current  
Gate to Body Leakage Current  
VGS = 0 V, ID = 250 μA  
40  
--  
--  
--  
--  
1
V
VDS = 32 V  
VGS = 0 V  
μA  
IDSS  
T
C = 150oC  
--  
--  
--  
--  
250  
μA  
IGSS  
VGS = ±20 V  
±100  
nA  
On Characteristics  
VGS(th) Gate to Source Threshold Voltage  
VDS = VGS, ID = 250 μA  
1
--  
--  
--  
3
V
VGS = 4.5 V, ID = 80 A  
1.56  
1.46  
2.2  
2.1  
RDS(on)  
Static Drain-Source On-Resistance  
V
GS = 10 V, ID = 80 A  
VGS = 10 V, ID = 80 A,  
C = 175oC  
mΩ  
--  
2.82  
4.1  
T
Dynamic Characteristics  
Ciss  
Input Capacitance  
--  
--  
--  
--  
--  
--  
--  
--  
--  
18600 24740  
pF  
pF  
pF  
Ω
V
DS = 25 V, VGS = 0 V,  
Coss  
Crss  
RG  
Output Capacitance  
1840  
1400  
1.1  
2450  
2100  
--  
f = 1 MHz  
Reverse Transfer Capacitance  
Gate Resistance  
VGS = 0.5 V, f = 1 MHz  
VGS = 0 V to 10 V  
VGS = 0 V to 2 V  
Qg(tot)  
Qg(2)  
Qgs  
Total Gate Charge at 10V  
Threshold Gate Charge  
345  
32.5  
49  
450  
--  
nC  
nC  
nC  
nC  
nC  
VDD = 20 V  
ID = 80 A  
Gate to Source Gate Charge  
Gate Charge Threshold to Plateau  
Gate to Drain “Miller” Charge  
--  
Ig = 1.0 mA  
Qgs2  
Qgd  
16.5  
74  
--  
--  
Switching Characteristics  
tON  
td(on)  
tr  
Turn-On Time  
Turn-On Delay Time  
Rise Time  
--  
--  
--  
--  
--  
--  
175  
43  
360  
95  
ns  
ns  
ns  
ns  
ns  
ns  
VDD = 20 V,ID = 80 A  
130  
435  
290  
730  
275  
875  
590  
1470  
V
GS = 10 V, RGEN = 7 Ω  
td(off)  
tf  
Turn-Off Delay Time  
Fall Time  
tOFF  
Turn-Off Time  
Drain-Source Diode Characteristics and Maximum Ratings  
I
I
SD = 80 A  
SD = 40 A  
--  
--  
--  
--  
--  
--  
1.25  
1.0  
--  
V
V
VSD  
Source to Drain Diode Voltage  
trr  
Reverse Recovery Time  
ISD = 75 A, dISD/dt = 100 A/μs  
ISD = 75 A, dISD/dt = 100 A/μs  
59  
77  
ns  
nC  
QRR  
Reverse Recovery Charge  
--  
NOTES:  
1: Starting T = 25°C, L = 1 mH, I = 58 A, V = 36 V, V = 10 V.  
J
AS  
DD  
GS  
2: Pulse width = 100 s.  
©2007 Fairchild Semiconductor Corporation  
FDA8440 Rev. C1  
2
www.fairchildsemi.com  
Typical Performance Characteristics  
Figure 1. On-Region Characteristics  
Figure 2. Transfer Characteristics  
400  
400  
100  
100  
VGS = 10.0 V  
7.0 V  
150oC  
-55oC  
5.0 V  
10  
3.5 V  
3.0 V  
2.5 V  
10  
25oC  
* Notes :  
1. 250μs Pulse Test  
2. TC = 25oC  
* Notes :  
1. VDS = 20V  
1
2. 250μs Pulse Test  
0.4  
0.04  
1
0.1  
1
0
2
4
6
VDS,Drain-Source Voltage[V]  
VGS,Gate-Source Voltage[V]  
Figure 3. On-Resistance Variation vs.  
Drain Current and Gate Voltage  
Figure 4. Body Diode Forward Voltage  
Variation vs. Source Current  
and Temperatue  
1.60  
1000  
VGS = 4.5V  
1.55  
100  
150oC  
25oC  
1.50  
10  
VGS = 10V  
Notes:  
1. VGS = 0V  
* Note : TJ = 25oC  
1.45  
2. 250μs Pulse Test  
1
0
50  
100  
150  
200  
250  
0.3  
0.6  
0.9  
1.2  
ID, Drain Current [A]  
VSD, Body Diode Forward Voltage [V]  
Figure 5. Capacitance Characteristics  
Figure 6. Gate Charge Characteristics  
30000  
24000  
18000  
12000  
6000  
0
10  
C
C
C
= C + C (C = shorted)  
gs gd ds  
iss  
VDS = 25V  
VDS = 20V  
VDS = 15V  
= C + C  
ds gd  
= C  
gd  
oss  
rss  
8
6
4
2
0
Ciss  
* Note:  
1. VGS = 0V  
2. f = 1MHz  
Coss  
Crss  
* Note : ID = 80A  
300  
10-1  
100  
VDS, Drain-Source Voltage [V]  
101  
20  
0
100  
200  
400  
Qg, Total Gate Charge [nC]  
©2007 Fairchild Semiconductor Corporation  
FDA8440 Rev. C1  
3
www.fairchildsemi.com  
Typical Performance Characteristics (Continued)  
Figure 7. Breakdown Voltage Variation  
vs. Temperature  
Figure 8. On-Resistance Variation  
vs. Temperature  
1.2  
1.1  
1.0  
2.5  
2.0  
1.5  
1.0  
0.9  
0.5  
* Notes :  
1. VGS = 0V  
* Notes :  
1. VGS = 10V  
2. ID = 250μA  
2. ID = 80A  
0.8  
-100  
0.0  
-100  
-50  
0
50  
100  
150  
200  
-50  
0
50  
100  
150  
200  
o
o
TJ, Junction Temperature [ C]  
TJ, Junction Temperature [ C]  
Figure 10. Safe Operating Area  
Figure 9. Unclamped Inductive Switching  
Capability  
200  
100  
5000  
1000  
100μs  
TJ = 25oC  
100  
10  
1
TJ = 150oC  
Operation in This Area  
is Limited by R DS(on)  
10  
1ms  
10ms  
* Notes :  
1. TC = 25oC  
2. TJ = 175oC  
100ms  
3. Single Pulse  
0.1  
1
0.01  
1
10  
50  
0.1  
1
10  
100  
1000 10000  
VDS, Drain-Source Voltage [V]  
tAV, TIME IN AVALANCHE(ms)  
Figure 11. Transient Thermal Response Curve  
1
0.1  
0.5  
0.2  
0.1  
PDM  
0.05  
t1  
t2  
0.02  
0.01  
0.01  
* Notes :  
1. ZθJC(t) = 0.49oC/W Max.  
Single pulse  
2. Duty Factor, D=t1/t2  
3. TJM - TC = PDM * ZθJC(t)  
0.001  
10-5  
10-4  
10-3  
10-2  
10-1  
100  
Rectangular Pulse Duration [sec]  
©2007 Fairchild Semiconductor Corporation  
FDA8440 Rev. C1  
4
www.fairchildsemi.com  
Figure 12. Gate Charge Test Circuit & Waveform  
Figure 13. Resistive Switching Test Circuit & Waveforms  
Figure 14. Unclamped Inductive Switching Test Circuit & Waveforms  
©2007 Fairchild Semiconductor Corporation  
5
www.fairchildsemi.com  
FDA8440 Rev. C1  
Figure 15. Peak Diode Recovery dv/dt Test Circuit & Waveforms  
©2007 Fairchild Semiconductor Corporation  
6
www.fairchildsemi.com  
FDA8440 Rev. C1  
Mechanical Dimensions  
Figure 16. TO3PN, 3-Lead, Plastic, EIAJ SC-65  
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner  
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or  
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specif-  
ically the warranty therein, which covers Fairchild products.  
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:  
http://www.fairchildsemi.com/package/packageDetails.html?id=PN_TT3PN-003  
©2007 Fairchild Semiconductor Corporation  
FDA8440 Rev. C1  
7
www.fairchildsemi.com  
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intended to be an exhaustive list of all such trademarks.  
AccuPower™  
AX-CAP *  
BitSiC™  
Build it Now™  
CorePLUS™  
CorePOWER™  
CROSSVOLT™  
CTL™  
F-PFS™  
FRFET  
®*  
®
®
®
tm  
®
Global Power ResourceSM  
GreenBridge™  
Green FPS™  
PowerTrench  
PowerXS™  
Programmable Active Droop™  
QFET  
QS™  
Quiet Series™  
RapidConfigure™  
®
TinyBoost  
TinyBuck  
®
TinyCalc™  
®
Green FPS™ e-Series™  
Gmax™  
GTO™  
®
TinyLogic  
TINYOPTO™  
TinyPower™  
TinyPWM™  
TinyWire™  
Current Transfer Logic™  
IntelliMAX™  
®
DEUXPEED  
ISOPLANAR™  
Marking Small Speakers Sound Louder  
and Better™  
MegaBuck™  
MICROCOUPLER™  
MicroFET™  
MicroPak™  
MicroPak2™  
MillerDrive™  
MotionMax™  
Dual Cool™  
TranSiC™  
®
EcoSPARK  
Saving our world, 1mW/W/kW at a time™  
SignalWise™  
SmartMax™  
TriFault Detect™  
TRUECURRENT *  
EfficentMax™  
ESBC™  
®
μSerDes™  
SMART START™  
®
Solutions for Your Success™  
®
®
SPM  
Fairchild  
®
®
STEALTH™  
SuperFET  
SuperSOT™-3  
SuperSOT™-6  
SuperSOT™-8  
SupreMOS  
SyncFET™  
Sync-Lock™  
UHC  
Fairchild Semiconductor  
FACT Quiet Series™  
®
Ultra FRFET™  
UniFET™  
VCX™  
VisualMax™  
VoltagePlus™  
XS™  
®
®
mWSaver  
OptoHiT™  
OPTOLOGIC  
OPTOPLANAR  
FACT  
FAST  
®
®
FastvCore™  
FETBench™  
FPS™  
®
®
? ? ™  
*Trademarks of System General Corporation, used under license by Fairchild Semiconductor.  
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Definition of Terms  
Datasheet Identification  
Product Status  
Definition  
Datasheet contains the design specifications for product development. Specifications  
may change in any manner without notice.  
Advance Information  
Formative / In Design  
Datasheet contains preliminary data; supplementary data will be published at a later  
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Rev. I68  
www.fairchildsemi.com  
©2007 Fairchild Semiconductor Corporation  
FDA8440 Rev. C1  
8
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