FDA8440 [ONSEMI]
N 沟道,PowerTrench® MOSFET,逻辑电平,40 V,10 A,2.1 mΩ;型号: | FDA8440 |
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描述: | N 沟道,PowerTrench® MOSFET,逻辑电平,40 V,10 A,2.1 mΩ 局域网 开关 脉冲 晶体管 |
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April 2014
FDA8440
®
N-Channel Logic Level PowerTrench MOSFET
40 V, 100 A, 2.1 mΩ
Features
Application
•
•
•
•
•
•
•
RDS(on) = 1.46 mΩ (Typ.) @ VGS = 10 V, ID = 80 A
QG(tot) = 345 nC (Typ.) @ VGS = 10 V
Low Miller Charge
•
•
•
•
Power tools
Motor drives and Uninterruptible Power Supplies
Synchronous Rectification
Low Qrr Body Diode
Battery Protection Circuit
UIS Capability (Single Pulse and Repetitive Pulse)
160 A Guarantee for 2 sec
RoHS Compliant
D
G
G
D
TO-3PN
S
S
o
T
= 25 C unless otherwise noted.
MOSFET Maximum Ratings
C
Symbol
Parameter
FDA8440
Unit
VDSS
VGSS
Drain to Source Voltage
Gate to Source Voltage
Drain Current
40
V
V
±20
A
100
- Continuous (TC = 155oC)
ID
- Continuous (TA = 25oC, VGS = 10 V, RθJA = 40oC/W )
30
A
A
- Pulsed
500
EAS
PD
Single Pulsed Avalanche Energy
Power dissipation
Derate above 25oC
(Note 1)
1682
306
mJ
W
2.04
W/oC
oC
TJ, TSTG
Operating and Storage Temperature
-55 to +175
Thermal Characteristics
RθJC
RθJA
Thermal Resistance, Junction to Case, Max.
Thermal Resistance, Junction to Ambient, Max.
0.49
40
oC/W
oC/W
(Note 2)
©2007 Fairchild Semiconductor Corporation
FDA8440 Rev. C1
1
www.fairchildsemi.com
Package Marking and Ordering Information
Part Number
Top Mark
Package
Packing Method
Reel Size
Tape Width
Quantity
FDA8440
FDA8440
TO-3PN
Tube
N/A
N/A
30 units
Electrical Characteristics
T = 25°C unless otherwise noted
C
Symbol
Parameter
Conditions
Min. Typ. Max. Unit
Off Characteristics
BVDSS
Drain to Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate to Body Leakage Current
VGS = 0 V, ID = 250 μA
40
--
--
--
--
1
V
VDS = 32 V
VGS = 0 V
μA
IDSS
T
C = 150oC
--
--
--
--
250
μA
IGSS
VGS = ±20 V
±100
nA
On Characteristics
VGS(th) Gate to Source Threshold Voltage
VDS = VGS, ID = 250 μA
1
--
--
--
3
V
VGS = 4.5 V, ID = 80 A
1.56
1.46
2.2
2.1
RDS(on)
Static Drain-Source On-Resistance
V
GS = 10 V, ID = 80 A
VGS = 10 V, ID = 80 A,
C = 175oC
mΩ
--
2.82
4.1
T
Dynamic Characteristics
Ciss
Input Capacitance
--
--
--
--
--
--
--
--
--
18600 24740
pF
pF
pF
Ω
V
DS = 25 V, VGS = 0 V,
Coss
Crss
RG
Output Capacitance
1840
1400
1.1
2450
2100
--
f = 1 MHz
Reverse Transfer Capacitance
Gate Resistance
VGS = 0.5 V, f = 1 MHz
VGS = 0 V to 10 V
VGS = 0 V to 2 V
Qg(tot)
Qg(2)
Qgs
Total Gate Charge at 10V
Threshold Gate Charge
345
32.5
49
450
--
nC
nC
nC
nC
nC
VDD = 20 V
ID = 80 A
Gate to Source Gate Charge
Gate Charge Threshold to Plateau
Gate to Drain “Miller” Charge
--
Ig = 1.0 mA
Qgs2
Qgd
16.5
74
--
--
Switching Characteristics
tON
td(on)
tr
Turn-On Time
Turn-On Delay Time
Rise Time
--
--
--
--
--
--
175
43
360
95
ns
ns
ns
ns
ns
ns
VDD = 20 V,ID = 80 A
130
435
290
730
275
875
590
1470
V
GS = 10 V, RGEN = 7 Ω
td(off)
tf
Turn-Off Delay Time
Fall Time
tOFF
Turn-Off Time
Drain-Source Diode Characteristics and Maximum Ratings
I
I
SD = 80 A
SD = 40 A
--
--
--
--
--
--
1.25
1.0
--
V
V
VSD
Source to Drain Diode Voltage
trr
Reverse Recovery Time
ISD = 75 A, dISD/dt = 100 A/μs
ISD = 75 A, dISD/dt = 100 A/μs
59
77
ns
nC
QRR
Reverse Recovery Charge
--
NOTES:
1: Starting T = 25°C, L = 1 mH, I = 58 A, V = 36 V, V = 10 V.
J
AS
DD
GS
2: Pulse width = 100 s.
©2007 Fairchild Semiconductor Corporation
FDA8440 Rev. C1
2
www.fairchildsemi.com
Typical Performance Characteristics
Figure 1. On-Region Characteristics
Figure 2. Transfer Characteristics
400
400
100
100
VGS = 10.0 V
7.0 V
150oC
-55oC
5.0 V
10
3.5 V
3.0 V
2.5 V
10
25oC
* Notes :
1. 250μs Pulse Test
2. TC = 25oC
* Notes :
1. VDS = 20V
1
2. 250μs Pulse Test
0.4
0.04
1
0.1
1
0
2
4
6
VDS,Drain-Source Voltage[V]
VGS,Gate-Source Voltage[V]
Figure 3. On-Resistance Variation vs.
Drain Current and Gate Voltage
Figure 4. Body Diode Forward Voltage
Variation vs. Source Current
and Temperatue
1.60
1000
VGS = 4.5V
1.55
100
150oC
25oC
1.50
10
VGS = 10V
Notes:
1. VGS = 0V
* Note : TJ = 25oC
1.45
2. 250μs Pulse Test
1
0
50
100
150
200
250
0.3
0.6
0.9
1.2
ID, Drain Current [A]
VSD, Body Diode Forward Voltage [V]
Figure 5. Capacitance Characteristics
Figure 6. Gate Charge Characteristics
30000
24000
18000
12000
6000
0
10
C
C
C
= C + C (C = shorted)
gs gd ds
iss
VDS = 25V
VDS = 20V
VDS = 15V
= C + C
ds gd
= C
gd
oss
rss
8
6
4
2
0
Ciss
* Note:
1. VGS = 0V
2. f = 1MHz
Coss
Crss
* Note : ID = 80A
300
10-1
100
VDS, Drain-Source Voltage [V]
101
20
0
100
200
400
Qg, Total Gate Charge [nC]
©2007 Fairchild Semiconductor Corporation
FDA8440 Rev. C1
3
www.fairchildsemi.com
Typical Performance Characteristics (Continued)
Figure 7. Breakdown Voltage Variation
vs. Temperature
Figure 8. On-Resistance Variation
vs. Temperature
1.2
1.1
1.0
2.5
2.0
1.5
1.0
0.9
0.5
* Notes :
1. VGS = 0V
* Notes :
1. VGS = 10V
2. ID = 250μA
2. ID = 80A
0.8
-100
0.0
-100
-50
0
50
100
150
200
-50
0
50
100
150
200
o
o
TJ, Junction Temperature [ C]
TJ, Junction Temperature [ C]
Figure 10. Safe Operating Area
Figure 9. Unclamped Inductive Switching
Capability
200
100
5000
1000
100μs
TJ = 25oC
100
10
1
TJ = 150oC
Operation in This Area
is Limited by R DS(on)
10
1ms
10ms
* Notes :
1. TC = 25oC
2. TJ = 175oC
100ms
3. Single Pulse
0.1
1
0.01
1
10
50
0.1
1
10
100
1000 10000
VDS, Drain-Source Voltage [V]
tAV, TIME IN AVALANCHE(ms)
Figure 11. Transient Thermal Response Curve
1
0.1
0.5
0.2
0.1
PDM
0.05
t1
t2
0.02
0.01
0.01
* Notes :
1. ZθJC(t) = 0.49oC/W Max.
Single pulse
2. Duty Factor, D=t1/t2
3. TJM - TC = PDM * ZθJC(t)
0.001
10-5
10-4
10-3
10-2
10-1
100
Rectangular Pulse Duration [sec]
©2007 Fairchild Semiconductor Corporation
FDA8440 Rev. C1
4
www.fairchildsemi.com
Figure 12. Gate Charge Test Circuit & Waveform
Figure 13. Resistive Switching Test Circuit & Waveforms
Figure 14. Unclamped Inductive Switching Test Circuit & Waveforms
©2007 Fairchild Semiconductor Corporation
5
www.fairchildsemi.com
FDA8440 Rev. C1
Figure 15. Peak Diode Recovery dv/dt Test Circuit & Waveforms
©2007 Fairchild Semiconductor Corporation
6
www.fairchildsemi.com
FDA8440 Rev. C1
Mechanical Dimensions
Figure 16. TO3PN, 3-Lead, Plastic, EIAJ SC-65
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
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Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
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©2007 Fairchild Semiconductor Corporation
FDA8440 Rev. C1
7
www.fairchildsemi.com
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©2007 Fairchild Semiconductor Corporation
FDA8440 Rev. C1
8
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