FDB031N08 [ONSEMI]

N 沟道 PowerTrench® MOSFET 75V,235A,3.1mΩ;
FDB031N08
型号: FDB031N08
厂家: ONSEMI    ONSEMI
描述:

N 沟道 PowerTrench® MOSFET 75V,235A,3.1mΩ

PC 开关 脉冲 晶体管
文件: 总10页 (文件大小:839K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
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2014 2 月  
FDB031N08  
N PowerTrench MOSFET  
75 V235 A3.1 mΩ  
®
特性  
说明  
N MOSFET 采用飞兆半导体先进PowerTrench® 工艺  
生产,这一先进工艺是专为最大限度地降低导通电阻并保持卓越  
开关性能而定制的。  
RDS(on) = 2.4 mΩ (Typ.)@VGS = 10 V, ID = 75 A  
快速开关速度  
低栅极电荷  
应用  
ATX/ 服务/ PSU 的同步整流  
高性能沟道技术可实现极低RDS(on)  
高功率和高电流处理能力  
RoHS 标准  
电池保护电路  
电机驱动和不间断电源  
D
D
G
G
S
D2-PAK  
S
MOSFET 最大额定TC = 25°C 除非另有说明。  
FDB031N08  
75  
符号  
VDSS  
VGSS  
参数  
单位  
V
漏极-源极电压  
栅极-源极电压  
±20  
V
A
235  
漏极电流  
- TC=25°C,硅片受限)  
- TC=100°C,硅片受限)  
- TC=25°C,封装受限)  
ID  
165  
A
120  
A
IDM  
940  
A
漏极电流  
- 脉冲  
(说1)  
(说2)  
(说3)  
EAS  
dv/dt  
1995  
5.5  
mJ  
V/ns  
W
单脉冲雪崩能量  
二极管恢dv/dt 峰值  
(TC = 25°C)  
375  
PD  
功耗  
2.5  
W/°C  
°C  
°C  
- 降低25°C 以上  
TJ, TSTG  
TL  
-55 +175  
300  
工作和存储温度范围  
用于焊接的最大引线温度,距离外1/8",持5 秒  
热性能  
FDB031N08  
0.4  
符号  
RθJC  
参数  
结至外壳热阻最大值。  
单位  
°C/W  
RθJA  
62.5  
结至环境热阻最大值。  
www.fairchildsemi.com  
©2008 飞兆半导体公司  
1
FDB031N08 Rev. C4  
封装标识与定购信息  
器件编号  
顶标  
封装  
D2-PAK  
包装方法  
卷带  
卷尺寸  
带宽  
数量  
FDB031N08  
FDB031N08  
330 mm  
24 mm  
800 个  
电气特TC = 25°C 除非另有说明。  
符号  
参数  
测试条件  
最小值 典型值 最大值  
单位  
关断特性  
BVDSS  
ID = 250 μA, VGS = 0 V, TC = 25°C  
D = 250 μA,温度参25°C  
75  
-
-
-
-
V
漏极-源极击穿电压  
ΔBVDSS  
/ ΔTJ  
击穿电压温度系数  
I
0.05  
V/°C  
VDS = 75 V, VGS = 0 V  
VDS = 75 V, TC = 150°C  
VGS = ±20 V, VDS = 0 V  
-
-
-
-
-
-
1
IDSS  
IGSS  
μA  
零栅极电压漏极电流  
500  
±100  
nA  
- 体漏电流  
导通特性  
VGS(th)  
RDS(on)  
gFS  
VGS = VDS, ID = 250 μA  
VGS = 10 V, ID = 75 A  
VDS = 10 V, ID = 75 A  
2.5  
3.5  
2.4  
180  
4.5  
3.1  
-
V
mΩ  
S
栅极阈值电压  
-
-
漏极至源极静态导通电阻  
正向跨导  
动态特性  
Ciss  
-
-
-
-
-
-
11400  
1360  
595  
169  
60  
15160  
1810  
800  
220  
-
pF  
pF  
pF  
nC  
nC  
nC  
输入电容  
VDS = 25 V, VGS = 0 V,  
f = 1 MHz  
Coss  
输出电容  
Crss  
反向传输电容  
Qg(tot)  
Qgs  
10 V 的栅极电荷总量  
- 源极栅极电荷  
- 电荷  
VDS = 60 V, ID = 75 A,  
V
GS = 10 V  
(说4)  
Qgd  
47  
-
开关特性  
td(on)  
tr  
td(off)  
tf  
-
-
-
-
230  
191  
335  
121  
470  
392  
680  
252  
ns  
ns  
ns  
ns  
导通延迟时间  
开通上升时间  
关断延迟时间  
关断下降时间  
VDD = 37.5 V, ID = 75 A,  
G = 25 Ω, VGS = 10 V  
R
(说4)  
- 源极二极管特性  
IS  
-
-
-
-
-
-
-
235  
940  
1.3  
-
A
A
- 源极二极管最大正向连续电流  
- 源极二极管最大正向脉冲电流  
- 源极二极管正向电压  
反向恢复时间  
ISM  
VSD  
trr  
VGS = 0 V, ISD = 75 A  
-
V
53  
77  
ns  
nC  
VGS = 0 V, ISD = 75 A,  
dIF/dt = 100 A/μs  
Qrr  
-
反向恢复电荷  
注意:  
1. 重复额定值:脉冲宽度受限于最大结温。  
2. L = 0.71 mHI = 75 AV = 50 VR = 25 Ω,启T = 25°C。  
AS  
DD  
G
J
3. I 75 Adi/dt 200 A/μsV BV  
,开T = 25°C。  
J
SD  
DD  
DSS  
4. 本质上独立于工作温度的典型特性。  
www.fairchildsemi.com  
©2008 飞兆半导体公司  
2
FDB031N08 Rev. C4  
典型性能特征  
1. 导通区域特性  
2. 传输特性  
3000  
500  
VGS = 15.0 V  
10.0 V  
8.0 V  
1000  
7.0 V  
6.5 V  
100  
100  
10  
1
6.0 V  
5.5 V  
5.0 V  
175oC  
-55oC  
25oC  
10  
1
*Notes:  
1. 250μs Pulse Test  
2. TC = 25oC  
*Notes:  
1. VDS = 20V  
2. 250μs Pulse Test  
0.1  
0.01  
0.1  
VDS,Drain-Source Voltage[V]  
1
2
4
6
8
VGS,Gate-Source Voltage[V]  
3. 导通电阻变vs. 漏极电流和栅极电压  
4. 体二极管正向电压变vs. 源极电流和温度  
0.0030  
400  
100  
VGS = 10V  
175oC  
25oC  
0.0025  
VGS = 20V  
10  
*Notes:  
1. VGS = 0V  
*Note: TC = 25oC  
300 400  
2. 250μs Pulse Test  
0.0020  
1
0.0  
0
100  
200  
0.5  
1.0  
1.5  
ID, Drain Current [A]  
VSD, Body Diode Forward Voltage [V]  
5. 电容特性  
6. 栅极电荷特性  
100000  
10  
C
C
C
= C + C (C = shorted)  
gs gd ds  
iss  
= C + C  
ds gd  
oss  
rss  
VDS = 15V  
= C  
gd  
VDS = 37.5V  
VDS = 60V  
8
6
4
2
0
Ciss  
10000  
1000  
*Note:  
1. VGS = 0V  
2. f = 1MHz  
Coss  
Crss  
*Note: ID = 75A  
150  
100  
0.1  
80  
1
10  
0
50  
100  
200  
VDS, Drain-Source Voltage [V]  
Qg, Total Gate Charge [nC]  
www.fairchildsemi.com  
©2008 飞兆半导体公司  
3
FDB031N08 Rev. C4  
典型性能特(接上页)  
7. 击穿电压变化与温度的关系  
8. 导通电阻变化与温度的关系  
3.0  
1.2  
2.5  
2.0  
1.5  
1.0  
1.1  
1.0  
0.9  
*Notes:  
1. VGS = 0V  
*Notes:  
1. VGS = 10V  
0.5  
2. ID = 10mA  
2. ID = 75A  
0.0  
-100  
0.8  
-100  
-50  
0
50  
100  
150  
200  
-50  
0
50  
100  
150  
200  
o
o
TJ, Junction Temperature [C]  
TJ, Junction Temperature [C]  
9. 最大安全工作区  
10. 最大漏极电vs. 外壳温度  
1000  
250  
100μs  
200  
100  
150  
1ms  
Limited by package  
Operation in This Area  
is Limited by R DS(on)  
10  
1
10ms  
100  
50  
0
100ms  
DC  
SINGLE PULSE  
TC = 25oC  
TJ = 175oC  
RθJC = 0.4oC/W  
0.1  
0.1  
1
10  
100  
25  
50  
75  
100  
125  
150  
175  
TC, Case Temperature [oC]  
VDS, Drain-Source Voltage [V]  
11. 瞬态热响应曲线  
0.5  
0.5  
0.1  
0.2  
0.1  
PDM  
0.05  
t1  
t2  
0.02  
0.01  
0.01  
*Notes:  
1. ZθJC(t) = 0.4oC/W Max.  
2. Duty Factor, D= t1/t2  
3. TJM - TC = PDM * ZθJC(t)  
Single pulse  
0.001  
10-5  
10-4  
10-3  
10-2  
10-1  
100  
101  
t1形脉冲持续时[ ]  
www.fairchildsemi.com  
©2008 飞兆半导体公司  
4
FDB031N08 Rev. C4  
I
= 常量  
G
12. 栅极电荷测试电路与波形  
RL  
VDS  
90%  
VDS  
VDD  
VGS  
RG  
10%  
VGS  
DUT  
V
GS  
td(on)  
tr  
td(off)  
tf  
t on  
t off  
13. 阻性开关测试电路与波形  
VGS  
14. 非箝位感性开关测试电路与波形  
www.fairchildsemi.com  
©2008 飞兆半导体公司  
5
FDB031N08 Rev. C4  
+
DUT  
VDS  
_
I SD  
L
Driver  
RG  
Same Type  
as DUT  
VDD  
VGS  
• dv/dt controlled by RG  
• ISD controlled by pulse period  
Gate Pulse Width  
--------------------------  
VGS  
D =  
Gate Pulse Period  
10V  
( Driver )  
IFM , Body Diode Forward Current  
I SD  
di/dt  
( DUT )  
IRM  
Body Diode Reverse Current  
Body Diode Recovery dv/dt  
VSD  
VDS  
( DUT )  
VDD  
Body Diode  
Forward Voltage Drop  
15. 峰值二极管恢dv/dt 测试电路与波形  
www.fairchildsemi.com  
©2008 飞兆半导体公司  
6
FDB031N08 Rev. C4  
机械尺寸  
2
16. TO263 (D PAK),模塑2 引脚,表面贴装  
封装图纸作为一项服务,提供给考虑飞兆半导体元件的客户。具体参数可能会有变化,且不会做出相应通知。请注意图纸上的版本和 /  
或日期联系飞兆半导体代表核实或获得最新版本装规格并不扩大飞兆公司全球范围内的条款与条件其是其中涉及飞兆公司  
产品保修的部分。  
随时访问飞兆半导体在线封装网页,可以获取最新的封装图纸:  
http://www.fairchildsemi.com/package/packageDetails.html?id=PN_TT263-0R2  
www.fairchildsemi.com  
©2008 飞兆半导体公司  
7
FDB031N08 Rev. C4  
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FDB031N08 Rev. C4  
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