FDB8860 [ONSEMI]
N 沟道,逻辑电平,PowerTrench® MOSFET,30V,80A,2.6mΩ;型号: | FDB8860 |
厂家: | ONSEMI |
描述: | N 沟道,逻辑电平,PowerTrench® MOSFET,30V,80A,2.6mΩ PC 开关 晶体管 |
文件: | 总9页 (文件大小:522K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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December 2010
FDB8860
®
N-Channel Logic Level PowerTrench MOSFET
30V, 80A, 2.6mΩ
Features
Applications
RDS(ON) = 1.9mΩ (Typ), VGS = 5V, ID = 80A
DC-DC Converters
Qg(5) = 89nC (Typ), VGS = 5V
Low Miller Charge
Low QRR Body Diode
UIS Capability (Single Pulse and Repetitive Pulse)
RoHS Compliant
©2010 Fairchild Semiconductor Corporation
FDB8860 Rev.A2
1
www.fairchildsemi.com
MOSFET Maximum Ratings TC = 25°C unless otherwise noted
Symbol
VDSS
VGS
Parameter
Ratings
30
Units
Drain to Source Voltage
Gate to Source Voltage
Drain Current
V
±20
V
80
A
Continuous (VGS = 10V, TC < 163oC)
Continuous (VGS = 5V, TC < 162oC)
Continuous (VGS = 10V, TC = 25oC, with RθJA = 43oC/W)
Pulsed
80
31
A
A
ID
Figure 4
9 4 7
A
EAS
S i n g l e P u l s e A v a l a n c h e E n e r g y ( N o t e 1 )
mJ
Power Dissipation
Derate above 25oC
254
W
PD
1.7
W/oC
oC
TJ, TSTG
Operating and Storage Temperature
-55 to +175
Thermal Characteristics
RθJC
RθJA
RθJA
Thermal Resistance Junction to Case
0.59
62
oC/W
oC/W
oC/W
Thermal Resistance Junction to Ambient (Note 2)
Thermal Resistance Junction to Ambient TO-263,1in2 copper pad area
43
Package Marking and Ordering Information
Device Marking
Device
Package
Reel Size
Tape Width
Quantity
800units
FDB8860
FDB8860
TO-263AB
330mm
24mm
Electrical Characteristics TJ = 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
Off Characteristics
BVDSS
Drain to Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate to Source Leakage Current
ID = 1mA, VGS = 0V
VDS = 24V
30
-
-
-
-
-
-
V
1
IDSS
μA
nA
V
GS = 0V
TJ = 150°C
-
250
±100
IGSS
VGS = ±20V
-
On Characteristics
VGS(th)
Gate to Source Threshold Voltage
VDS = VGS, ID = 250μA
ID = 80A, VGS = 10V
ID = 80A, VGS = 5V
ID = 80A, VGS = 4.5V
1
-
1.7
1.6
1.9
2.1
3
V
2.3
2.6
2.7
-
RDS(ON)
Drain to Source On Resistance
mΩ
-
I
D = 80A, VGS = 10V,
-
2.5
3.6
TJ = 175°C
Dynamic Characteristics
CISS
COSS
CRSS
RG
Input Capacitance
-
-
-
-
-
-
-
-
-
-
9460 12585
pF
pF
pF
Ω
VDS = 15V, VGS = 0V,
f = 1MHz
Output Capacitance
1710
1050
1.8
165
89
2275
Reverse Transfer Capacitance
Gate Resistance
1575
f = 1MHz
-
214
115
12
-
Qg(TOT)
Qg(5)
Qg(TH)
Qgs
Total Gate Charge at 10V
Total Gate Charge at 5V
Threshold Gate Charge
Gate to Source Gate Charge
Gate Charge Threshold to Plateau
Gate to Drain “Miller” Charge
VGS = 0V to 10V
VGS = 0V to 5V
nC
nC
nC
nC
nC
nC
VDD = 15V
D = 80A
Ig = 1.0mA
VGS = 0V to 1V
9.1
26
I
Qgs2
Qgd
18
-
33
-
©2010 Fairchild Semiconductor Corporation
FDB8860 Rev.A2
www.fairchildsemi.com
2
Electrical Characteristics TJ = 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
Switching Characteristics
t(on)
td(on)
tr
Turn-On Time
-
-
-
-
-
-
-
14
213
79
49
-
340
ns
ns
ns
ns
ns
ns
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Turn-Off Time
-
-
V
V
DD = 15V, ID = 80A
GS = 5V, RGS = 1Ω
td(off)
tf
-
-
toff
192
Drain-Source Diode Characteristics
I
SD = 80A
-
-
-
-
-
-
-
-
1.25
1.0
43
V
V
VSD
Source to Drain Diode Voltage
ISD = 40A
trr
Reverse Recovery Time
Reverse Recovery Charge
ISD = 80A, dISD/dt = 100A/μs
ISD = 80A, dISD/dt = 100A/μs
ns
nC
Qrr
29
Notes:
o
1: Starting T = 25 C, L =0.47mH, I = 64A , V = 30V, V = 10V.
J
AS
DD
GS
2: Pulse width = 100s
©2010 Fairchild Semiconductor Corporation
FDB8860 Rev.A2
3
www.fairchildsemi.com
Typical Characteristics TJ = 25°C unless otherwise noted
1.2
1.0
0.8
0.6
0.4
0.2
0.0
300
225
150
75
VGS = 10V
CURRENT LIMITED
BY PACKAGE
VGS = 5V
0
25
50
75
100
125
150
175
0
25
50
75
100
125
150
175
TC, CASE TEMPERATURE(oC)
TC, CASE TEMPERATURE (oC)
Figure 1. Normalized Power Dissipation vs Case
Temperature
Figure 2. Maximum Continuous Drain Current vs
Case Temperature
2
DUTY CYCLE-DESCENDING ORDER
1
D = 0.5
0.2
0.1
0.05
0.02
P
DM
0.01
0.1
t
1
t
2
NOTES:
DUTY FACTOR: D = t /t
SINGLE PULSE
1
2
PEAK T = P
x Z
x R
+ T
J
DM
θJC
θJC C
0.01
10-5
10-4
10-3
10-2
10-1
100
101
t, RECTANGULAR PULSE DURATION (s)
Figure 3. Normalized Maximum Transient Thermal Impedance
3000
o
T
= 25 C
C
FOR TEMPERATURES
o
ABOVE 25 C DERATE PEAK
1000
CURRENT AS FOLLOWS:
175 - T
150
C
I = I
25
100
50
SINGLE PULSE
10-5
10-4
10-3
10-2
t, PULSE WIDTH (s)
10-1
100
101
Figure 4. Peak Current Capability
©2010 Fairchild Semiconductor Corporation
FDB8860 Rev.A2
4
www.fairchildsemi.com
Typical Characteristics TJ = 25°C unless otherwise noted
1000
100
10
500
100
If R = 0
= (L)(I )/(1.3*RATED BV
10us
t
AV
- V
)
AS
DSS
DD
If R
AV
≠ 0
t
= (L/R)ln[(I *R)/(1.3*RATED BV
- V ) +1]
DSS DD
AS
100us
o
STARTING T = 25 C
J
CURRENT LIMITED
BY PACKAGE
10
1
1ms
1
10ms
OPERATION IN THIS
AREA MAY BE
o
STARTING T = 150 C
J
SINGLE PULSE
TJ = MAX RATED
TC = 25oC
100ms
DC
LIMITED BY RDS(ON)
0.1
1
0.1
1
10
100
1000
10000
10
60
tAV, TIME IN AVALANCHE (ms)
VDS, DRAIN TO SOURCE VOLTAGE(V)
NOTE: Refer to Fairchild Application Notes AN7514 and AN7515
Figure 6. Unclamped Inductive Switching
Capability
Figure 5. Forward Bias Safe Operating Area
160
120
VGS = 4V
PULSE DURATION = 80μs
DUTY CYCLE = 0.5% MAX
VGS = 3V
100
VDD = 5V
120
VGS = 5V
VGS = 10V
80
TJ = 175oC
TJ = 25oC
80
60
40
TJ = -55oC
40
0
20
PULSE DURATION = 80μs
DUTY CYCLE = 0.5% MAX
0
1.0
1.5
2.0
2.5
3.0
3.5
0.0
0.2
0.4
0.6
0.8
1.0
VGS, GATE TO SOURCE VOLTAGE (V)
VDS, DRAIN TO SOURCE VOLTAGE (V)
Figure 7. Transfer Characteristics
Figure 8. Saturation Characteristics
4.0
1.6
PULSE DURATION = 80μs
DUTY CYCLE = 0.5% MAX
PULSE DURATION = 80μs
DUTY CYCLE=0.5% MAX
ID = 40A
3.5
3.0
2.5
2.0
1.5
1.4
1.2
1.0
0.8
0.6
TJ = 175oC
TJ = 25oC
ID = 80A
VGS = 10V
3
4
5
6
7
8
9
10
-80
-40
0
40
80
120
160
200
TJ, JUNCTION TEMPERATURE( OC)
VGS, GATE TO SOURCE VOLTAGE (V)
Figure 9. Drain to Source On-Resistance
Variation vs Gate to Source Voltage
Figure 10. Normalized Drain to Source On
Resistance vs Junction Temperature
©2010 Fairchild Semiconductor Corporation
FDB8860 Rev.A2
5
www.fairchildsemi.com
Typical Characteristics TJ = 25°C unless otherwise noted
1.10
1.4
1.2
1.0
0.8
0.6
0.4
0.2
ID = 1mA
VGS = VDS
ID = 250μA
1.05
1.00
0.95
0.90
-80
-40
0
40
80
120
160
200
-80
-40
0
40
80
120
160
200
o
TJ, JUNCTION TEMPERATURE(oC)
TJ, JUNCTION TEMPERATURE( C)
Figure 11. Normalized Gate Threshold Voltage vs
Junction Temperature
Figure 12. Normalized Drain to Source
Breakdown Voltage vs Junction Temperature
10
20000
10000
VDD = 15V
Ciss
8
6
4
Coss
Crss
f = 1MHz
1000
2
ID = 80A
V
GS = 0V
ID = 1A
0
500
0.1
30
1
10
0
20 40 60 80 100 120 140 160 180
Qg, GATE CHARGE (nC)
VDS, DRAIN TO SOURCE VOLTAGE (V)
Figure 13. Capacitance vs Drain to Source
Voltage
Figure 14. Gate Charge vs Gate to Source Voltage
©2010 Fairchild Semiconductor Corporation
FDB8860 Rev.A2
6
www.fairchildsemi.com
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intended to be an exhaustive list of all such trademarks.
®
®
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PowerXS™
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Build it Now™
CorePLUS™
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®
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Green FPS™ e-Series™
Gmax™
GTO™
IntelliMAX™
ISOPLANAR™
MegaBuck™
MICROCOUPLER™
MicroFET™
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TinyBoost™
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RapidConfigure™
™
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®
TinyLogic
®
DEUXPEED
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Saving our world, 1mW/W/kW at a time™
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TRUECURRENT™*
μSerDes™
®
MicroPak2™
MillerDrive™
MotionMax™
Motion-SPM™
OptiHiT™
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SuperSOT™-3
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®
®
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Datasheet contains the design specifications for product development. Specifications
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Advance Information
Formative / In Design
Datasheet contains preliminary data; supplementary data will be published at a later
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First Production
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to
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Full Production
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Semiconductor. The datasheet is for reference information only.
Not In Production
Rev. I51
www.fairchildsemi.com
7
©2010 Fairchild Semiconductor Corporation
FDB8860 Rev.A2
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
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regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
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application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
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