FDB9506L-F085 [ONSEMI]

Power MOSFET, P-Channel, Logic Level, Trench, -40 V, -110 A, 3.6 mΩ;
FDB9506L-F085
型号: FDB9506L-F085
厂家: ONSEMI    ONSEMI
描述:

Power MOSFET, P-Channel, Logic Level, Trench, -40 V, -110 A, 3.6 mΩ

文件: 总7页 (文件大小:228K)
中文:  中文翻译
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FDB9506L-F085  
Power MOSFET  
40 V, 3.6 mW, 110 A, Single PChannel  
Features  
Low R  
to Minimize Conduction Losses  
Low Q and Capacitance to Minimize Driver Losses  
DS(on)  
www.onsemi.com  
G
Wettable Flank Option for Enhanced Optical Inspection  
AECQ101 Qualified and PPAP Capable  
These Devices are PbFree, Halogen Free/BFR Free and are RoHS  
Compliant  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(ON)  
3.6 mW @ 10 V  
5.0 mW @ 4.5 V  
40 V  
80 A  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Parameter  
DraintoSource Voltage  
Symbol  
Value  
40  
Unit  
V
D
V
DSS  
GatetoSource Voltage  
V
GS  
16  
V
Continuous Drain  
Current R  
T
= 25°C  
= 100°C  
= 25°C  
I
110  
110  
176  
A
C
D
q
JC  
G
T
C
(Notes 1, 3)  
Steady  
State  
Power Dissipation  
T
C
P
W
A
D
R
(Note 1)  
q
JC  
T
C
= 100°C  
88  
S
Continuous Drain  
Current R  
T = 25°C  
A
I
D
24.5  
17.3  
3.5  
PCHANNEL MOSFET  
q
JA  
T = 100°C  
A
(Notes 1, 2, 3)  
Steady  
State  
Power Dissipation  
T = 25°C  
A
P
W
D
D
R
(Notes 1, 2)  
q
JA  
T = 100°C  
A
1.7  
G
S
Pulsed Drain Current  
T
= 25°C, t = 10 ms  
I
DM  
1260  
A
C
p
2
Operating Junction and Storage Temperature  
Range  
T , T  
55 to  
+175  
°C  
D PAK3  
J
stg  
TO263  
CASE 418AJ  
Source Current (Body Diode) (Note 1)  
I
S
110  
A
Single Pulse DraintoSource Avalanche  
E
AS  
370  
mJ  
Energy (I  
= 86 A)  
L(pk)  
MARKING DIAGRAM  
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
L
260  
°C  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
&Z&3&K  
FDB  
9506L  
THERMAL RESISTANCE MAXIMUM RATINGS  
Parameter  
Symbol  
Value  
0.85  
43  
Unit  
JunctiontoCase Steady State  
JunctiontoAmbient Steady State (Note 2)  
R
°C/W  
q
JC  
&Z  
&3  
&K  
= Assembly Plant Code  
= Numeric Date Code  
= Lot Code  
R
q
JA  
1. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
Maximum current is limited by package configuration.  
FDB9506L  
= Specific Device Code  
2
2. Surfacemounted on FR4 board using a 650 mm , 2 oz. Cu pad.  
3. Maximum current for pulses as long as 1 second is higher but is dependent  
on pulse duration and duty cycle.  
ORDERING INFORMATION  
See detailed ordering and shipping information on page 7 of  
this data sheet.  
© Semiconductor Components Industries, LLC, 2018  
1
Publication Order Number:  
December, 2018 Rev. 0  
FDB9506LF085/D  
 
FDB9506LF085  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
J
Parameter  
Symbol  
Test Conditions  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
DraintoSource Breakdown Voltage  
V
V
GS  
= 0 V, I = 250 mA  
40  
V
(BR)DSS  
D
DraintoSource Breakdown Voltage  
Temperature Coefficient  
V
/T  
22  
mV/°C  
(BR)DSS  
J
Zero Gate Voltage Drain Current  
I
V
= 0 V, V = 40 V, T = 25°C  
1  
mA  
mA  
nA  
DSS  
GS  
DS  
J
V
GS  
= 0 V, V = 40 V, T = 175°C  
1  
DS  
J
Zero Gate Voltage Drain Current  
ON CHARACTERISTICS (Note 4)  
Gate Threshold Voltage  
I
V
DS  
= 0 V, V =  
GS  
16 V  
100  
GSS  
V
GS(th)  
V
V
= V , I = 250 mA  
1  
1.8  
6.4  
2.8  
3  
V
GS  
DS  
D
Threshold Temperature Coefficient  
DraintoSource On Resistance  
V
/T  
mV/°C  
mW  
GS(th)  
J
R
V
GS  
= 10 V, I = 80 A  
3.6  
5.0  
DS(on)  
D
= 4.5 V, I = 40 A  
3.9  
GS  
D
CHARGES, CAPACITANCES & GATE RESISTANCE  
Input Capacitance  
C
V
= 0 V, f = 100 KHz, V = 20 V  
9100  
3300  
140  
19  
pF  
pF  
pF  
W
iss  
GS  
DS  
Output Capacitance  
Reverse Transfer Capacitance  
Gate Resistance  
C
oss  
C
rss  
R
V
GS  
= 0.5 V, f = 100 KHz  
g
Total Gate Charge  
Q
V
GS  
= 10 V, V = 32 V, I = 80 A  
126  
58  
nC  
G(TOT)  
DS  
D
V
GS  
= 4.5 V, V = 32 V, I = 80 A  
DS D  
Threshold Gate Charge  
GatetoSource Gate Charge  
GatetoDrain “Miller” Charge  
Plateau Voltage  
Q
V
GS  
= 0 to 1 V  
8
g(th)  
Q
V
DD  
= 32 V, I = 80 A  
27  
gs  
D
Q
16  
gd  
V
GP  
3.2  
V
SWITCHING CHARACTERISTICS  
Turn-On Delay Time  
t
V
GS  
= 20 V, I = 80 A,  
12  
9
ns  
ns  
ns  
ns  
d(on)  
DD  
D
V
= 10 V, R  
= 6 W  
GEN  
Turn-On Rise Time  
t
r
Turn-Off Delay Time  
t
474  
140  
d(off)  
Turn-Off Fall Time  
t
f
DRAINSOURCE DIODE CHARACTERISTICS  
SourcetoDrain Diode Voltage  
V
I
= 80 A, V = 0 V  
0.91  
0.84  
87  
1.25  
V
V
SD  
RR  
SD  
GS  
I
= 40 A, V = 0 V  
1.2  
SD  
GS  
Reverse Recovery Time  
Charge Time  
T
V
= 0 V, dI /dt = 100 A/ms  
ns  
GS  
SD  
= 80 A  
I
S
t
42  
a
Discharge Time  
t
45  
b
Reverse Recovery Charge  
Q
101  
nC  
RR  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
4. Pulse Test: pulse width v 300 ms, duty cycle v 2%.  
5. Switching characteristics are independent of operating junction temperatures.  
www.onsemi.com  
2
 
FDB9506LF085  
TYPICAL CHARACTERISTICS  
1.2  
1.0  
0.8  
0.6  
0.4  
200  
180  
160  
140  
120  
100  
80  
Current Limited by Package  
V
GS  
= 10 V  
60  
40  
0.2  
0
20  
0
0
25  
50  
75  
100  
125  
150  
175  
25  
50  
75  
100  
125  
150  
175  
T , CASE TEMPERATURE (°C)  
C
T , CASE TEMPERATURE (°C)  
C
Figure 1. Normalized Power Dissipation vs.  
Case Temperature  
Figure 2. Maximum Continuous Drain Current  
vs. Case Temperature  
2
1
50% Duty Cycle  
20%  
P
DM  
10%  
5%  
0.1  
t
1
2%  
t
2
1%  
Z
q
(t) = r(t) x R  
q
JC  
JC  
Peak T = P  
Duty Cycle, D = t /t  
x Z (t) + T  
q
JC C  
J
DM  
Single Pulse  
1
2
0.01  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
t, RECTANGULAR PULSE DURATION (s)  
Figure 3. Normalized Maximum Transient Thermal Impedance  
5000  
1000  
1000  
T
= 25°C  
C
V
GS  
= 10 V  
For temperatures above  
25°C derate peak current  
as follows:  
100  
10  
100 ms  
175 * T  
C
Ǹ
Operation in this  
area may be lim-  
ited by package  
I + I  
ƪ ƫ  
25  
150  
1 ms  
100  
10  
10 ms  
Operation in this  
area may be lim-  
ited by R  
100 ms  
Single Pulse  
T = Max Rated  
1
Single Pulse  
DS(on)  
J
T
C
= 25°C  
0.1  
0.000001  
0.0001 0.001 0.01  
0.1  
1
10  
0.1  
1
10  
100  
t, RECTANGULAR PULSE DURATION (s)  
V , DRAINTOSOURCE VOLTAGE (V)  
DS  
Figure 4. Peak Current Capability  
Figure 5. Forward Bias Safe Operating Area  
www.onsemi.com  
3
FDB9506LF085  
TYPICAL CHARACTERISTICS  
200  
100  
300  
If R = 0  
= (L)(I )/(1.3*Rated BV  
Pulse Duration = 250 ms  
Duty Cycle = 0.5% Max  
t
AV  
V  
)
AS  
DSS  
DD  
If R 0  
= (L/R)In[(I *R)/(1.3*Rated BV  
t
AV  
V ) +1]  
240  
180  
120  
V
DS  
= 5 V  
AS  
DSS  
DD  
T
= 25°C  
J(initial)  
T = 25°C  
J
10  
1
T
= 150°C  
J(initial)  
60  
0
T = 175°C  
J
NOTE: Refer to ON Semiconductor Application  
Notes AN7514 and AN7515  
T = 55°C  
J
0.01  
0.1  
1
10  
100  
1000 10,000  
1
0
2
2
3
4
5
t
, TIME IN AVALANCHE (mS)  
V , GATETOSOURCE VOLTAGE (V)  
AV  
GS  
Figure 6. Unclamped Inductive Switching  
Capability  
Figure 7. Transfer Characteristics  
300  
100  
300  
225  
150  
10 V  
7 V 5 V  
V
= 0 V  
GS  
4.5 V  
4.0 V  
10  
1
0.1  
T = 175°C  
V
= 3.5 V  
J
GS  
75  
0
0.01  
Pulse Width = 250 ms  
T = 25°C  
T = 55°C  
J
J
T = 25°C  
J
0.001  
0
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
1
2
3
4
5
V , BODY DIODE FORWARD VOLTAGE (V)  
V , DRAINSOURCE VOLTAGE (V)  
SD  
DS  
Figure 8. Forward Diode Characteristics  
Figure 9. Saturation Characteristics  
6
5
4
3
2
50  
40  
30  
20  
V
= 10 V  
7 V  
5 V  
Pulse Duration = 250 ms  
Duty Cycle = 0.5% Max  
GS  
I
D
= 80 A  
4.5 V  
4.0 V  
3.5 V  
10  
0
T = 175°C  
1
0
J
Pulse Width = 250 ms  
T = 25°C  
J
T = 25°C  
J
0
60  
120  
180  
240  
300  
3
4
5
6
7
8
9
10  
I , DRAIN CURRENT (A)  
D
V , GATETOSOURCE VOLTAGE (V)  
GS  
Figure 10. Normalized RDS(on) vs. Drain  
Current  
Figure 11. RDS(on) vs. Gate Voltage  
www.onsemi.com  
4
FDB9506LF085  
TYPICAL CHARACTERISTICS  
1.8  
1.6  
1.4  
1.2  
1.0  
1.3  
V
I
= V  
DS  
= 250 mA  
GS  
V
I
= 10 V  
= 80 A  
GS  
D
1.1  
0.9  
0.7  
D
0.5  
0.3  
0.8  
0.6  
80  
40  
0
40  
80  
120  
160  
200  
80  
40  
0
40  
80  
120  
160 200  
T , JUNCTION TEMPERATURE (°C)  
J
T , JUNCTION TEMPERATURE (°C)  
J
Figure 12. Normalized RDS(on) vs. Junction  
Temperature  
Figure 13. Normalized Gate Threshold Voltage  
vs. Temperature  
1.10  
1.05  
1.00  
100,000  
10,000  
I
D
= 5 mA  
C
ISS  
C
OSS  
1000  
100  
C
RSS  
0.95  
0.90  
10  
1
V
= 0 V  
GS  
f = 100 KHz  
80 40  
0
40  
80  
120  
160  
200  
0.1  
1
10  
40  
T , JUNCTION TEMPERATURE (°C)  
J
V , DRAINTOSOURCE VOLTAGE (V)  
DS  
Figure 14. Normalized DraintoSource  
Figure 15. Capacitance vs. DraintoSource  
Breakdown Voltage vs. Junction Temperature  
Voltage  
10  
8
V
DD  
= 20 V  
6
V
DD  
= 16 V  
V
DD  
= 24 V  
4
2
0
0
26  
52  
78  
104  
130  
Q , GATE CHARGE (nC)  
g
Figure 16. Gate Charge vs. GatetoSource  
Voltage  
www.onsemi.com  
5
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
D2PAK3 (TO263, 3LEAD)  
CASE 418AJ  
ISSUE F  
DATE 11 MAR 2021  
SCALE 1:1  
XXXXXX = Specific Device Code  
A
= Assembly Location  
WL  
Y
= Wafer Lot  
= Year  
GENERIC MARKING DIAGRAMS*  
WW  
W
M
G
AKA  
= Work Week  
= Week Code (SSG)  
= Month Code (SSG)  
= PbFree Package  
= Polarity Indicator  
XX  
AYWW  
XXXXXXXXG  
AKA  
XXXXXXXXG  
AYWW  
XXXXXX  
XXYMW  
XXXXXXXXX  
AWLYWWG  
*This information is generic. Please refer to  
device data sheet for actual part marking.  
PbFree indicator, “G” or microdot “ G”,  
may or may not be present. Some products  
may not follow the Generic Marking.  
IC  
Standard  
Rectifier  
SSG  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
98AON56370E  
D2PAK3 (TO263, 3LEAD)  
PAGE 1 OF 1  
DESCRIPTION:  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically  
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the  
rights of others.  
© Semiconductor Components Industries, LLC, 2018  
www.onsemi.com  
onsemi,  
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates  
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.  
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. onsemi reserves the right to make changes at any time to any  
products or information herein, without notice. The information herein is provided “asis” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the  
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use  
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products  
and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information  
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may  
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license  
under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems  
or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should  
Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
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Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
ADDITIONAL INFORMATION  
TECHNICAL PUBLICATIONS:  
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onsemi Website: www.onsemi.com  
ONLINE SUPPORT: www.onsemi.com/support  
For additional information, please contact your local Sales Representative at  
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