FDC6331L [ONSEMI]
集成式负载开关;型号: | FDC6331L |
厂家: | ONSEMI |
描述: | 集成式负载开关 开关 驱动 光电二极管 接口集成电路 驱动器 |
文件: | 总6页 (文件大小:298K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
DATA SHEET
www.onsemi.com
Integrated Load Switch
FDC6331L
TSOT−23−6
CASE 419BL
Description
MARKING DIAGRAM
This device is particularly suited for compact power management in
portable electronic equipment where 2.5 V to 8 V input and 2.8 A
output current capability are needed. This load switch integrates
a small N−Channel power MOSFET (Q1) that drives a large
P−Channel power MOSFET (Q2) in one tiny SUPERSOTt−6
package.
&E&Y
&.331&G
&E
&Y
&.
331
&G
= Designates Space
= Binary Calendar Year Coding Scheme
= Pin One Dot
= Specific Device Code
= Date Code
Features
• −2.8 A, −8 V
♦ R
♦ R
♦ R
= 55 mW @ V = −4.5 V
GS
DS(on)
DS(on)
DS(on)
= 70 mW @ V = −2.5 V
GS
= 100 mW @ V = −1.8 V
GS
ORDERING INFORMATION
• Control MOSFET (Q1) Includes Zener Protection for ESD
Ruggedness (>6 kV Human Body Model)
• High Performance Trench Technology for Extremely Low R
• This is a Pb−Free and Halide Free Device
†
Device
FDC6331L
Package
Shipping
DS(on)
TSOT−23−6
(Pb−Free)
3000 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Applications
• Load Switch
• Power Management
V
,R1
4
5
3
2
V
, C1
OUT
IN
Q2
ON/OFF
R1, C1
V
OUT
, C1
Q1
6
R2
1
See Application Circuit (Figure 3)
Figure 1.
V
DROP
−
+
IN
OUT
ON/OFF
Figure 2. Equivalent Circuit
© Semiconductor Components Industries, LLC, 2007
1
Publication Order Number:
October, 2021 − Rev. 5
FDC6331L/D
FDC6331L
ABSOLUTE MAXIMUM RATINGS T = 25°C unless otherwise noted
A
Symbol
Parameter
Value
Unit
V
V
Maximum Input Voltage
High Level On/Off Voltage Range
8
−0.5 to 8
2.8
IN
ON/OFF
V
V
I
Load Current − Continuous (Note 1)
Load Current − Pulsed
A
Load
9
P
Maximum Power Dissipation (Note 1)
Operating and Storage Junction Temperature Range
0.7
W
D
T , T
−55 to 150
°C
J
STG
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
THERMAL CHARACTERISTICS T = 25°C unless otherwise noted
A
Symbol
Parameter
Thermal Resistance, Junction−to−Ambient (Note 1)
Thermal Resistance, Junction−to−Case (Note 1)
Value
180
60
Unit
°C/W
°C/W
R
q
JA
R
q
JC
ELECTRICAL CHARACTERISTICS T = 25°C unless otherwise noted
A
Symbol
Parameter
Test Conditions
Min
Typ
Max
Unit
OFF CHARACTERISTICS
BV
V
Breakdown Voltage
V
V
V
V
= 0 V, I = −250 mA
8
−
−
−
−
−
−
−
−
V
IN
IN
ON/OFF
D
I
Zero Gate Voltage Drain Current
Leakage Current, Forward
Leakage Current, Reverse
= 6.4 V, V = 0 V
ON/OFF
−1
mA
nA
nA
Load
IN
I
= 0 V, V = 8 V
−100
100
FL
RL
ON/OFF
ON/OFF
IN
I
= 0 V, V = −8 V
IN
ON CHARACTERISTICS (Note 2)
V
Gate Threshold Voltage
V
V
V
= V , I = −250 mA
ON/OFF D
0.4
−
0.9
34
1.5
55
70
100
4
V
ON/OFF(th)
IN
R
Static Drain−Source
On−Resistance (Q2)
= −4.5 V, I = −2.8 A
mW
DS(on)
DS(on)
GS
GS
D
= −2.5 V, I = −2.5 A
−
45
D
V
= −1.8 V, I = −2.0 A
−
64
GS
GS
GS
D
R
Static Drain−Source
On−Resistance (Q1)
V
V
= 4.5 V, I = 0.4 A
−
3.1
3.8
W
D
= 2.7 V, I = 0.2 A
−
5
D
DRAIN−SOURCE DIODE CHARACTERISTICS AND MAXIMUM RATINGS
Maximum Continuous Drain−Source Diode Forward Current
I
S
−
−
−
−
−0.6
−1.2
A
V
V
SD
Drain−Source Diode Forward
Voltage
V = 0 V, I = −0.6 A (Note 2)
ON/OFF S
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
NOTES:
1. R
is the sum of the junction−to−case and case−to−ambient thermal resistance where the case thermal reference is defined as the solder
q
JA
mounting surface of the drain pins. R
is guaranteed by design while R
is determined by the user’s board design.
q
q
JC
JA
2. Pulse Test: Pulse Width < 300 ms, Duty Cycle < 2.0%.
www.onsemi.com
2
FDC6331L
Q2
Q1
IN
OUT
C1
R1
Load
ON/OFF
R2
Figure 3. FDC6331L Load Switch Application Circuit
External Component Recommendation:
For additional in−rush current control, R2 and C1 can be added. For more information, see application note AN1030.
TYPICAL CHARACTERISTICS
0.40
0.40
V
V
= 2.5 V
V
V
= 1.8 V
IN
IN
0.35
0.30
0.25
0.20
0.35
0.30
0.25
0.20
= 1.5−8 V
= 1.5−8 V
ON/OFF
ON/OFF
PW = 300 ms, D < 2%
PW = 300 ms, D < 2%
T = 125°C
J
T = 125°C
J
T = 25°C
J
0.15
0.10
0.15
0.10
T = 25°C
J
0.05
0
0.05
0
0
1
2
3
4
5
6
0
1
2
3
4
5
6
I (A)
L
I (A)
L
Figure 4. Conduction Voltage Drop
Variation with Load Current
Figure 5. Conduction Voltage Drop Variation
with Load Current
0.40
0.35
0.150
0.125
V
V
= 4.5 V
IN
Q2
I = 1 A
L
= 1.5−8 V
ON/OFF
V
= 1.5−8 V
ON/OFF
PW = 300 ms, D < 2%
PW = 300 ms, D < 2%
0.30
0.25
0.100
0.075
0.050
0.025
0
T = 125°C
J
0.20
0.15
0.10
T = 125°C
J
T = 25°C
T = 25°C
J
J
0.05
0
0
1
2
3
4
5
6
1
2
3
4
5
I (A)
L
V
GS
, Gate to Source Voltage (V)
Figure 6. Conduction Voltage Drop
Variation with Load Current
Figure 7. On−Resistance Variation with
Input Voltage
www.onsemi.com
3
FDC6331L
TYPICAL CHARACTERISTICS (continued)
1
D = 0.5
R
R
(t) = r(t) * R
= 156°C/W
q
q
q
JA
JA
JA
0.2
0.1
0.1
P(pk)
t
1
0.05
0.02
t
2
T − T = P * R (t)
q
JA
J
A
Single Pulse
0.01
Duty Cycle, D = t /t
1
2
0.01
0.01
0.0001
0.001
0.1
t , Time (s)
1
10
100
1000
1
Figure 8. Transient Thermal Response Curve
NOTE: Thermal characterization performed on the conditions described in Note 2.
Transient thermal response will change depends on the circuit board design.
SUPERSOT is a trademark of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United
States and/or other countries.
www.onsemi.com
4
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
TSOT23 6−Lead
CASE 419BL
ISSUE A
1
DATE 31 AUG 2020
SCALE 2:1
GENERIC
MARKING DIAGRAM*
XXX MG
G
1
XXX = Specific Device Code
M
= Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present. Some products
may not follow the Generic Marking.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON83292G
TSOT23 6−Lead
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2018
www.onsemi.com
onsemi,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any
products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products
and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license
under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems
or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should
Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
ADDITIONAL INFORMATION
TECHNICAL PUBLICATIONS:
Technical Library: www.onsemi.com/design/resources/technical−documentation
onsemi Website: www.onsemi.com
ONLINE SUPPORT: www.onsemi.com/support
For additional information, please contact your local Sales Representative at
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