FDMS86101 [ONSEMI]

N 沟道,PowerTrench® MOSFET,100V,60A,8mΩ;
FDMS86101
型号: FDMS86101
厂家: ONSEMI    ONSEMI
描述:

N 沟道,PowerTrench® MOSFET,100V,60A,8mΩ

开关 脉冲 光电二极管 晶体管
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MOSFET - N‐Channel,  
POWERTRENCH)  
100 V, 60 A, 8 mW  
FDMS86101  
General Description  
This NChannel MOSFET is produced using ON Semiconductor’s  
advanced POWERTRENCH process that has been especially  
www.onsemi.com  
®
tailored to minimize the onstate resistance and yet maintain superior  
switching performance.  
S
D
D
D
Features  
S
S
G
Max r  
Max r  
= 8 mW at V = 10 V, I = 13 A  
GS D  
= 13.5 mW at V = 6 V, I = 9.5 A  
DS(on)  
DS(on)  
GS  
D
Advanced Package and Silicon combination for low r  
efficiency  
and high  
DS(on)  
D
MSL1 robust package design  
100% UIL tested  
N-Channel MOSFET  
100% Rg tested  
Top  
Bottom  
These Devices are PbFree and are RoHS Compliant  
D
D
Applications  
D
D
DCDC Conversion  
G
S
S
S
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
A
Power 56  
(PQFN8)  
CASE 483AE  
Symbol  
Parameter  
Drain to Source Voltage  
Gate to Source Voltage  
Drain Current:  
Value  
100  
20  
Unit  
V
V
DS  
GS  
V
V
MARKING DIAGRAM  
I
D
A
Continuous, T = 25°C  
60  
12.4  
200  
C
Continuous, T = 25°C (Note 1a)  
A
Pulsed  
$Y&Z&3&K  
FDMS  
86101  
E
AS  
Single Pulse Avalanche Energy  
(Note 3)  
173  
mJ  
W
P
D
Power Dissipation:  
T
= 25°C  
104  
2.5  
C
T = 25°C (Note 1a)  
A
$Y  
&Z  
&3  
&K  
= ON Semiconductor Logo  
= Assembly Plant Code  
= Data Code (Year & Week)  
= Lot  
T , T  
Operating and Storage Junction  
Temperature Range  
55 to +150  
°C  
J
STG  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
FDMS86101  
= Specific Device Code  
ORDERING INFORMATION  
See detailed ordering and shipping information on page 2 of  
this data sheet.  
© Semiconductor Components Industries, LLC, 2017  
1
Publication Order Number:  
December, 2020 Rev. 5  
FDMS86101/D  
FDMS86101  
PACKAGE MARKING AND ORDERING INFORMATION  
Device Marking  
Device  
Package  
Quantity  
FDMS86101  
FDMS86101  
Power 56 (PQFN8)  
(Pb-Free / Halogen Free)  
3000/Tape&Reel  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
THERMAL CHARACTERISTICS  
Symbol  
Parameter  
Thermal Resistance, Junction to Case  
Thermal Resistance, Junction to Ambient (Note 1a)  
Value  
1.2  
Unit  
°C/W  
R
q
JC  
R
50  
q
JA  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
J
Symbol  
Parameter  
Test Condition  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
BV  
Drain to Source Breakdown Voltage  
I
I
= 250 mA, V = 0 V  
100  
V
DSS  
D
GS  
DBV  
Breakdown Voltage Temperature  
Coefficient  
= 250 mA, referenced to 25°C  
66  
mV/°C  
DSS  
D
/DT  
J
DSS  
GSS  
I
Zero Gate Voltage Drain Current  
V
V
= 80 V, V = 0 V  
800  
100  
nA  
nA  
DS  
GS  
I
Gate to Source Leakage Current, Forward  
= 20 V, V = 0 V  
DS  
GS  
ON CHARACTERISTICS  
V
Gate to Source Threshold Voltage  
V
I
= V , I = 250 mA  
2.0  
2.9  
4.0  
V
GS(th)  
GS  
DS  
D
DV  
/DT  
Gate to Source Threshold Voltage  
Temperature Coefficient  
= 250 mA, referenced to 25°C  
9  
mV/°C  
GS(th)  
J
D
r
Static Drain to Source On Resistance  
Forward Transconductance  
V
GS  
V
GS  
V
GS  
V
DS  
= 10 V, I = 13 A  
6.3  
8.4  
10.9  
45  
8
mW  
DS(on)  
D
= 6 V, I = 9.5 A  
13.5  
14  
D
= 10 V, I = 13 A, T = 125°C  
D
J
g
FS  
= 10 V, I = 13 A  
S
D
DYNAMIC CHARACTERISTICS  
C
Input Capacitance  
V
DS  
= 50 V, V = 0 V, f = 1 MHz  
2255  
460  
30  
3000  
610  
45  
pF  
pF  
pF  
W
iss  
GS  
C
Output Capacitance  
Reverse Transfer Capacitance  
Gate Resistance  
oss  
C
rss  
R
0.1  
1.0  
3.0  
g
SWITCHING CHARACTERISTICS  
t
Turn-On Delay Time  
Rise Time  
V
= 50 V, I = 13 A, V = 10 V,  
GEN  
15  
11  
27  
7
27  
20  
44  
13  
55  
ns  
ns  
ns  
ns  
nC  
d(on)  
DD  
D
GS  
R
= 6 W  
t
r
t
Turn-Off Delay Time  
Fall Time  
d(off)  
t
f
Q
Total Gate Charge  
V
= 0 V to 10 V, V = 50 V,  
39  
g
GS  
DD  
I
= 13 A  
D
V
D
= 0 V to 5 V, V = 50 V,  
22  
31  
nC  
GS  
DD  
I
= 13 A  
Q
Gate to Source Charge  
V
DD  
V
DD  
= 40 V, I = 68 A  
9.5  
nC  
nC  
gs  
D
Q
Gate to Drain “Miller” Charge  
= 40 V, I = 68 A  
10.8  
gd  
D
www.onsemi.com  
2
FDMS86101  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted) (continued)  
J
Symbol  
Parameter  
Test Condition  
Min  
Typ  
Max  
Unit  
DRAIN-SOURCE DIODE CHARACTERISTICS  
V
Source to Drain Diode Forward Voltage  
V
V
= 0 V, I = 2.1 A (Note 2)  
0.7  
0.8  
56  
1.2  
1.3  
90  
V
SD  
GS  
S
= 0 V, I = 13 A (Note 2)  
GS  
S
t
Reverse Recovery Time  
I = 13 A, di/dt = 100 A/ms  
F
ns  
rr  
Q
Reverse Recovery Charge  
61  
98  
nC  
rr  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
2
1. R  
is determined with the device mounted on a 1 in pad 2 oz copper pad on a 1.5 × 1.5 in. board of FR4 material. R  
is determined  
CA  
q
q
JA  
by the user’s board design.  
NOTES:  
a. 50 °C/W when mounted on a  
1 in pad of 2 oz copper.  
b. 125 °C/W when mounted on a  
minimum pad of 2 oz copper.  
2
2. Pulse Test: Pulse Width < 300 ms, Duty cycle < 2.0%.  
3. E of 173 mJ is based on starting T = 25°C, L = 0.3 mH, I = 34 A, V = 75 V, V = 10 V. 100% test at L = 0.1 mH, I = 49 A.  
AS  
J
AS  
DD  
GS  
AS  
TYPICAL CHARACTERISTICS  
(T = 25°C unless otherwise noted)  
J
5
200  
VGS = 10 V  
PULSE DURATION = 80ms  
VGS = 4.5 V  
DUTY CYCLE = 0.5% MAX  
4
3
2
1
0
150  
VGS = 6 V  
VGS = 5 V  
VGS = 5.5 V  
VGS = 5.5 V  
100  
50  
VGS = 5 V  
VGS = 6 V  
VGS = 4.5 V  
VGS = 10 V  
PULSE DURATION = 80ms  
DUTY CYCLE = 0.5% MAX  
0
0
1
2
3
, DRAIN TO SOURCE VOLTAGE (V)  
4
5
0
50  
100  
, DRAIN CURRENT (A)  
D
150  
200  
I
V
DS  
Figure 1. On Region Characteristics  
Figure 2. Normalized OnResistance  
vs. Drain Current and Gate Voltage  
www.onsemi.com  
3
 
FDMS86101  
TYPICAL CHARACTERISTICS (continued)  
(T = 25°C unless otherwise noted)  
J
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
40  
30  
20  
10  
0
ID = 13 A  
GS = 10 V  
PULSE DURATION = 80ms  
DUTY CYCLE = 0.5% MAX  
ID = 13 A  
V
TJ = 125oC  
TJ = 25 oC  
75 50 25  
0
25 50 75 100 125 150  
4
6
8
10  
T , JUNCTION TEMPERATURE (5C)  
J
V , GATE TO SOURCE VOLTAGE (V)  
GS  
Figure 3. Normalized On Resistance  
vs. Junction Temperature  
Figure 4. OnResistance vs. Gate  
to Source Voltage  
200  
150  
100  
50  
100  
10  
PULSE DURATION = 80ms  
DUTY CYCLE = 0.5% MAX  
VGS = 0 V  
VDS = 5 V  
TJ = 150oC  
1
T
J = 25 o  
C
TJ = 150 o  
C
0.1  
TJ = 25 o  
C
TJ = 55oC  
TJ = 55oC  
0
0.01  
1
2
3
4
5
6
7
8
0.0  
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
V
, GATE TO SOURCE VOLTAGE (V)  
V
, BODY DIODE FORWARD VOLTAGE (V)  
GS  
SD  
Figure 5. Transfer Characteristics  
Figure 6. Source to Drain Diode  
Forward Voltage vs. Source Current  
10000  
10  
ID = 13 A  
VDD = 50 V  
Ciss  
8
VDD = 75 V  
V
DD = 25 V  
1000  
100  
10  
Coss  
6
4
Crss  
2
0
f = 1 MHz  
V
GS = 0 V  
0
10  
20  
30  
40  
0.1  
1
10  
100  
Q , GATE CHARGE (nC)  
g
V
DS  
, DRAIN TO SOURCE VOLTAGE (V)  
Figure 7. Gate Charge Characteristics  
Figure 8. Capacitance vs. Drain  
to Source Voltage  
www.onsemi.com  
4
FDMS86101  
TYPICAL CHARACTERISTICS (continued)  
(T = 25°C unless otherwise noted)  
J
90  
75  
60  
45  
100  
R
qJC = 1.2 oC/W  
TJ = 25 o  
C
VGS = 10 V  
10  
TJ = 100 o  
C
Limited by Package  
30  
15  
0
= 6 V  
VGS  
TJ = 125 o  
C
1
0.001  
0.01  
t
0.1  
1
10  
100  
25  
50  
75  
100  
125  
o
150  
, TIME IN AVALANCHE (ms)  
, CASE TEMPERATURE (  
T
C)  
AV  
c
Figure 9. Unclamped Inductive  
Switching Capability  
Figure 10. Maximum Continuous Drain  
Current vs. Case Temperature  
2000  
1000  
500  
100  
VGS = 10 V  
SINGLE PULSE  
qJA = 125oC/W  
A = 25oC  
R
T
10  
1
100  
10  
1 ms  
THIS AREA IS  
10 ms  
100 ms  
LIMITED BY r  
DS(on)  
0.1  
1 s  
SINGLE PULSE  
TJ = MAX RATED  
10 s  
DC  
R
qJA = 125oC/W  
0.01  
1
T
A = 25oC  
0.5  
0.001  
103  
102  
101  
t, PULSE WIDTH (sec)  
1
10  
100  
1000  
0.01  
0.1  
V
DS  
1
10  
100 500  
, DRAIN to SOURCE VOLTAGE (V)  
Figure 11. Forward Bias Safe  
Operating Area  
Figure 12. Single Pulse Maximum  
Power Dissipation  
2
1
DUTY CYCLEDESCENDING ORDER  
D = 0.5  
0.2  
0.1  
0.1  
0.05  
0.02  
0.01  
P
DM  
0.01  
t
1
t
2
NOTES:  
DUTY FACTOR: D = t /t  
SINGLE PULSE  
qJA = 125 oC/W  
1
2
0.001  
R
PEAK T = P x Z  
x R  
+ T  
qJA A  
J
DM  
qJA  
0.0005  
103  
102  
101  
t, RECTANGULAR PULSE DURATION (sec)  
11  
0
100  
1000  
Figure 13. JunctiontoAmbient Transient Thermal Response Curve  
POWERTRENCH is registered trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and or other  
countries.  
www.onsemi.com  
5
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
PQFN8 5X6, 1.27P  
CASE 483AE  
ISSUE C  
DATE 21 JAN 2022  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON13655G  
PQFN8 5X6, 1.27P  
PAGE 1 OF 1  
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