FDPF18N50T [ONSEMI]

功率 MOSFET,N 沟道,UniFETTM,500 V,18 A,265 mΩ,TO-220F;
FDPF18N50T
型号: FDPF18N50T
厂家: ONSEMI    ONSEMI
描述:

功率 MOSFET,N 沟道,UniFETTM,500 V,18 A,265 mΩ,TO-220F

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FDP18N50 / FDPF18N50 / FDPF18N50T  
TM  
N-Channel UniFET MOSFET  
500 V, 18 A, 265 mΩ  
Features  
RDS(on) = 220 mΩ (Typ.) @ VGS = 10 V, ID = 9 A  
Low Gate Charge (Typ. 45 nC)  
Low Crss (Typ. 25 pF)  
Description  
UniFETTM MOSFET is ON Semiconductor’s high voltage  
MOSFET family based on planar stripe and DMOS technology.  
This MOSFET is tailored to reduce on-state resistance, and to  
provide better switching performance and higher avalanche  
energy strength. This device family is suitable for switching  
power converter applications such as power factor correction  
(PFC), flat panel display (FPD) TV power, ATX and electronic  
lamp ballasts.  
100% Avalanche Tested  
Applications  
LCD/LED/PDP TV  
Lighting  
Uninterruptible Power Supply  
D
G
G
D
S
G
D
TO-220  
TO-220F  
S
S
Absolute Maximum Ratings TC = 25°C unless otherwise noted.  
FDPF18N50 /  
FDPF18N50T  
Symbol  
Parameter  
FDP18N50  
Unit  
VDSS  
Drain-Source Voltage  
Drain Current  
500  
V
ID  
- Continuous (TC = 25°C)  
- Continuous (TC = 100°C)  
18  
10.8  
18 *  
10.8 *  
A
A
(Note 1)  
IDM  
Drain Current  
- Pulsed  
72  
72 *  
A
V
VGSS  
EAS  
IAR  
Gate-Source voltage  
30  
945  
18  
(Note 2)  
Single Pulsed Avalanche Energy  
Avalanche Current  
mJ  
A
(Note 1)  
(Note 1)  
(Note 3)  
EAR  
dv/dt  
PD  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
23.5  
4.5  
mJ  
V/ns  
Power Dissipation  
(TC = 25°C)  
- Derate Above 25°C  
235  
1.88  
38.5  
0.3  
W
W/°C  
TJ, TSTG  
TL  
Operating and Storage Temperature Range  
-55 to +150  
300  
°C  
Maximum Lead Temperature for Soldering,  
1/8” from Case for 5 Seconds  
°C  
* Drain current limited by maximum junction temperature  
Thermal Characteristics  
FDPF18N50 /  
FDPF18N50T  
Symbol  
Parameter  
FDP18N50  
Unit  
RθJC  
RθJA  
Thermal Resistance, Junction-to-Case, Max.  
Thermal Resistance, Junction-to-Ambient, Max.  
0.53  
62.5  
3.3  
°C/W  
°C/W  
62.5  
©2012 Semiconductor Components Industries, LLC.  
November-2017, Rev 3  
Publication Order Number:  
FDPF18N50T/D  
Package Marking and Ordering Information  
Part Number  
FDP18N50  
Top Mark  
FDP18N50  
Package  
TO-220  
Packing Method  
Reel Size  
N/A  
Tape Width  
N/A  
Quantity  
50 units  
50 units  
50 units  
Tube  
Tube  
Tube  
FDPF18N50  
FDPF18N50T  
FDPF18N50  
FDPF18N50T  
TO-220F  
TO-220F  
N/A  
N/A  
N/A  
N/A  
Electrical Characteristics TC = 25°C unless otherwise noted.  
Symbol  
Parameter  
Conditions  
Min.  
Typ.  
Max  
Unit  
Off Characteristics  
BVDSS  
Drain-Source Breakdown Voltage  
VGS = 0 V, ID = 250 μA  
D = 250 μA, Referenced to 25°C  
500  
--  
--  
--  
--  
V
ΔBVDSS  
/ ΔTJ  
Breakdown Voltage Temperature  
Coefficient  
I
0.5  
V/°C  
IDSS  
Zero Gate Voltage Drain Current  
VDS = 500 V, VGS = 0 V  
VDS = 400 V, TC = 125°C  
--  
--  
--  
--  
1
10  
μA  
μA  
IGSSF  
IGSSR  
Gate-Body Leakage Current, Forward  
Gate-Body Leakage Current, Reverse  
VGS = 30 V, VDS = 0 V  
VGS = -30 V, VDS = 0 V  
--  
--  
--  
--  
100  
nA  
nA  
-100  
On Characteristics  
VGS(th) Gate Threshold Voltage  
RDS(on)  
VDS = VGS, ID = 250 μA  
VGS = 10 V, ID = 9 A  
VDS = 40 V, ID = 9 A  
3.0  
--  
--  
0.220  
25  
5.0  
0.265  
--  
V
Ω
S
Static Drain-Source  
On-Resistance  
gFS  
Forward Transconductance  
--  
Dynamic Characteristics  
Ciss  
Coss  
Crss  
Input Capacitance  
VDS = 25 V, VGS = 0 V,  
f = 1 MHz  
--  
--  
--  
2200  
330  
25  
2860  
430  
40  
pF  
pF  
pF  
Output Capacitance  
Reverse Transfer Capacitance  
Switching Characteristics  
td(on) Turn-On Delay Time  
tr  
td(off)  
tf  
VDD = 250 V, ID = 18 A,  
--  
--  
--  
--  
--  
--  
--  
55  
165  
95  
120  
340  
200  
190  
60  
ns  
ns  
V
GS = 10 V, RG = 25 Ω  
Turn-On Rise Time  
Turn-Off Delay Time  
Turn-Off Fall Time  
Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
ns  
(Note 4)  
(Note 4)  
90  
ns  
Qg  
VDS = 400 V, ID = 18 A,  
VGS = 10 V  
45  
nC  
nC  
nC  
Qgs  
Qgd  
12.5  
19  
--  
--  
Drain-Source Diode Characteristics and Maximum Ratings  
IS  
Maximum Continuous Drain-Source Diode Forward Current  
Maximum Pulsed Drain-Source Diode Forward Current  
--  
--  
--  
--  
--  
--  
--  
18  
72  
1.4  
--  
A
A
ISM  
VSD  
trr  
Drain-Source Diode Forward Voltage  
Reverse Recovery Time  
VGS = 0 V, IS = 18 A  
--  
V
VGS = 0 V, IS = 18 A,  
500  
5.4  
ns  
μC  
dIF/dt =100 A/μs  
Qrr  
Reverse Recovery Charge  
--  
Notes:  
1. Repetitive rating: pulse-width limited by maximum junction temperature.  
2. L = 5.2 mH, I = 18 A, V = 50 V, R = 25 Ω, starting T = 25°C.  
AS  
DD  
G
J
3. I 18 A, di/dt 200 A/μs, V BV  
, starting T = 25°C.  
SD  
DD  
DSS  
J
4. Essentially independent of operating temperature typical characteristics.  
www.onsemi.com  
2
Typical Performance Characteristics  
Figure 1. On-Region Characteristics  
Figure 2. Transfer Characteristics  
102  
101  
100  
VGS  
102  
101  
100  
10-1  
Top :  
15.0 V  
10.0 V  
8.0 V  
7.0 V  
6.5 V  
6.0 V  
Bottom : 5.5 V  
150oC  
25oC  
-55oC  
* Notes :  
1. 250μs Pulse Test  
* Notes :  
1. VDS = 40V  
2. 250μs Pulse Test  
10 12  
o
2. TC = 25 C  
10-1  
100  
101  
2
4
6
8
VDS, Drain-Source Voltage [V]  
VGS, Gate-Source Voltage [V]  
Figure 3. On-Resistance Variation vs.  
Drain Current and Gate Voltage  
Figure 4. Body Diode Forward Voltage  
Variation vs. Source Current  
and Temperatue  
102  
101  
100  
0.6  
0.5  
VGS = 10V  
0.4  
0.3  
VGS = 20V  
150oC  
25oC  
0.2  
* Notes :  
1. VGS = 0V  
2. 250μs Pulse Test  
o
* Note : TJ = 25 C  
0.1  
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
1.4  
1.6  
1.8  
2.0  
2.2  
2.4  
0
5
10 15 20 25 30 35 40 45 50 55 60 65 70  
VSD, Source-Drain voltage [V]  
ID, Drain Current [A]  
Figure 5. Capacitance Characteristics  
Figure 6. Gate Charge Characteristics  
5000  
12  
C
C
iss = Cgs + Cgd (Cds = shorted)  
oss = Cds + Cgd  
Crss = Cgd  
10  
8
4000  
3000  
2000  
1000  
0
VDS = 100V  
VDS = 250V  
Coss  
VDS = 400V  
C
iss  
6
4
* Note :  
1. VGS = 0 V  
2. f = 1 MHz  
C
rss  
2
* Note : ID = 18A  
0
10-1  
100  
101  
0
10  
20  
30  
40  
50  
VDS, Drain-Source Voltage [V]  
QG, Total Gate Charge [nC]  
www.onsemi.com  
3
Typical Performance Characteristics (Continued)  
Figure 7. Breakdown Voltage Variation  
vs. Temperature  
Figure 8. On-Resistance Variation  
vs. Temperature  
3.0  
2.5  
2.0  
1.5  
1.0  
1.2  
1.1  
1.0  
* Notes :  
1. VGS = 0 V  
0.9  
* Notes :  
1. VGS = 10 V  
2. ID = 250μA  
0.5  
2. ID = 9 A  
0.8  
-100  
0.0  
-100  
-50  
0
50  
100  
150  
200  
-50  
0
50  
100  
150  
200  
T, Junction Temperature [oC]  
TJ, Junction Temperature [oC]  
J
Figure 9-1. Maximum Safe Operating Area  
- FDP18N50  
Figure 9-2. Maximum Safe Operating Area  
- FDPF18N50 / FDPF18N50T  
102  
102  
10 μs  
10 μs  
100 μs  
1 ms  
10 ms  
100 ms  
DC  
100 μs  
1 ms  
101  
101  
100  
10-1  
10-2  
10 ms  
100 ms  
Operation in This Area  
is Limited by R DS(on)  
DC  
Operation in This Area  
is Limited by R DS(on)  
100  
-1  
10  
* Notes :  
* Notes :  
1. TC = 25 o  
C
2. TJ = 150 o  
C
1. TC = 25 o  
C
2. TJ = 150 o  
C
3. Single Pulse  
3. Single Pulse  
-2  
10  
100  
101  
102  
100  
101  
102  
VDS, Drain-Source Voltage [V]  
VDS, Drain-Source Voltage [V]  
Figure 10. Maximum Drain Current vs. Case Temperature  
20  
15  
10  
5
0
25  
50  
75  
100  
125  
150  
TC, Case Temperature [oC]  
www.onsemi.com  
4
Typical Performance Characteristics (Continued)  
Figure 11-1. Transient Thermal Response Curve - FDP18N50  
1 00  
D = 0.5  
0 .2  
10 -1  
0.1  
PDM  
0.05  
t1  
t2  
*
N o te s  
1 . Z θ JC (t)  
2 . D u ty F actor, D = t1/t2  
:
0 .02  
0 .01  
o
=
0.53 C /W M ax.  
10 -2  
3 . T JM  
-
T C  
=
P D M  
* Z θ JC (t)  
sing le p ulse  
10 -3  
1 0-5  
1 0-4  
10 -2  
10 -1  
1 00  
10 1  
t1 , S q u a re W a ve P u lse D u ra tio n [se c]  
Figure 11-2. Transient Thermal Response Curve - FDPF18N50 / FDPF18N50T  
D = 0.5  
1 00  
0 .2  
0.1  
0.05  
PDM  
10 -1  
0 .02  
t1  
0 .01  
t2  
*
N o te s  
:
o
1 . Z θ JC (t)  
=
3.3 C /W M ax.  
2 . D u ty F actor, D = t1/t2  
3 . T JM  
-
T C  
=
P D M  
* Z θ JC (t)  
sing le pu lse  
10 -3  
10 -2  
1 0-5  
1 0-4  
10 -2  
10 -1  
1 00  
10 1  
t1 , S q u a re W a ve P u lse D u ra tio n [se c]  
www.onsemi.com  
5
I
= const.  
G
Figure 12. Gate Charge Test Circuit & Waveform  
RL  
VDS  
90%  
VDS  
VDD  
VGS  
RG  
10%  
VGS  
DUT  
V
GS  
td(on)  
tr  
td(off)  
tf  
t on  
t off  
Figure 13. Resistive Switching Test Circuit & Waveforms  
VGS  
Figure 14. Unclamped Inductive Switching Test Circuit & Waveforms  
www.onsemi.com  
6
+
DUT  
VDS  
_
I SD  
L
Driver  
RG  
Same Type  
as DUT  
VDD  
VGS  
• dv/dt controlled by RG  
• ISD controlled by pulse period  
Gate Pulse Width  
--------------------------  
VGS  
D =  
Gate Pulse Period  
10V  
( Driver )  
IFM , Body Diode Forward Current  
I SD  
di/dt  
( DUT )  
IRM  
Body Diode Reverse Current  
Body Diode Recovery dv/dt  
VSD  
VDS  
( DUT )  
VDD  
Body Diode  
Forward Voltage Drop  
Figure 15. Peak Diode Recovery dv/dt Test Circuit & Waveforms  
www.onsemi.com  
7
Mechanical Dimensions  
Figure 16. TO220, Molded, 3-Lead, Jedec Variation AB  
Package drawings are provided as a service to customers considering ON Semiconductor components. Drawings may change in  
any manner without notice. Please note the revision and/or date on the drawing and contact a ON Semiconductor representative to  
verify or obtain the most recent revision. Package specifications do not expand the terms of ON Semiconductor’s worldwide terms and  
conditions, specif-ically the warranty therein, which covers ON Semiconductor products.  
www.onsemi.com  
8
Mechanical Dimensions  
Figure 17. TO220, Molded, 3-Lead, Full Pack, EIAJ SC91, Straight Lead  
Package drawings are provided as a service to customers considering ON Semiconductor components. Drawings may change in  
any manner without notice. Please note the revision and/or date on the drawing and contact a ON Semiconductor representative to  
verify or obtain the most recent revision. Package specifications do not expand the terms of ON Semiconductor’s worldwide terms and  
conditions, specif-ically the warranty therein, which covers ON Semiconductor products.  
www.onsemi.com  
9
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are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent  
coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.  
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability  
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Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,  
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or  
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer  
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not  
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification  
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized  
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