FDS6961A [ONSEMI]
双 N 沟道逻辑电平 PowerTrench® MOSFET 30V，3.5A，90mΩ;
| 型号： | FDS6961A |
| 厂家： | 
ONSEMI |
| 描述： | 双 N 沟道逻辑电平 PowerTrench® MOSFET 30V，3.5A，90mΩ PC 开关 光电二极管 晶体管 |
| 文件： | 总6页 (文件大小：255K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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onsemi andꢀꢀꢀꢀꢀꢀꢀand other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or
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or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application
by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized
for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for
implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and holdonsemi and its officers, employees,
subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
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Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. Other names and brands may be claimed as the property of others.
April 1999
FDS6961A
Dual N-Channel Logic Level PowerTrenchTM MOSFET
General Description
Features
3.5 A, 30 V. RDS(ON) = 0.090 W @ VGS = 10 V
RDS(ON) = 0.140 W @ VGS = 4.5 V.
Fast switching speed.
These N-Channel Logic Level MOSFETs are
produced
using
ON
Semiconductor's
advanced PowerTrench process that has been
especially tailored to minimize the on-state
resistance and yet maintain superior switching
performance.
Low gate charge (2.1nC typical).
High performance trench technology for extremely low
These devices are well suited for low voltage
and battery powered applications where low
RDS(ON)
.
in-line power loss and fast switching
required.
are
High power and current handling capability.
SuperSOTTM-6
SO-8
SOT-223
SuperSOTTM-8
SOIC-16
SOT-23
D2
5
4
D2
D1
6
3
2
D1
7
G2
S2
1
8
G1
1
pin
SO-8
S1
Absolute Maximum Ratings TA = 25oC unless other wise noted
Symbol
VDSS
VGSS
ID
Parameter
Ratings
Units
V
Drain-Source Voltage
30
Gate-Source Voltage
±20
V
Drain Current - Continuous
- Pulsed
(Note 1a)
3.5
A
14
PD
Power Dissipation for Single Operation
Power Dissipation for Single Operation
(Note 1)
2
1.6
W
(Note 1a)
(Note 1b)
(Note 1c)
1
0.9
TJ,TSTG
Operating and Storage Temperature Range
-55 to 150
°C
THERMAL CHARACTERISTICS
RqJA
RqJC
Thermal Resistance, Junction-to-Ambient (Note 1a)
Thermal Resistance, Junction-to-Case
78
40
°C/W
°C/W
(Note 1)
© 1999 Semiconductor Components Industries, LLC.
Publication Order Number:
October-2017, Rev.3
FDS6961A/D
Electrical Characteristics
( TA = 25 OC unless otherwise noted )
Symbol
Parameter
Conditions
Min
Typ
Max
Units
OFF CHARACTERISTICS
BVDSS
Drain-Source Breakdown Voltage
VGS = 0 V, I D = 250 µA
30
V
Breakdown Voltage Temp. Coefficient
Zero Gate Voltage Drain Current
ID = 250 µA, Referenced to 25 oC
25
mV/oC
DBVDSS/DTJ
IDSS
VDS = 24 V, VGS = 0 V
1
µA
µA
nA
nA
TJ = 55°C
10
IGSSF
IGSSR
Gate - Body Leakage, Forward
Gate - Body Leakage, Reverse
VGS = 20 V, VDS = 0 V
VGS = -20 V, VDS = 0 V
100
-100
ON CHARACTERISTICS (Note 2)
VGS(th)
Gate Threshold Voltage
VDS = VGS, ID = 250 µA
ID = 250 µA, Referenced to 25 oC
1
1.8
-5
3
V
Gate Threshold Voltage Temp. Coefficient
Static Drain-Source On-Resistance
mV/oC
DVGS(th)/DTJ
RDS(ON)
VGS = 10 V, I D = 3.5 A
0.076
0.11
0.09
0.155
0.14
W
TJ =125°C
VGS = 4.5 V, I D = 2.8 A
VGS = 10 V, VDS = 5 V
VDS = 15 V, I D = 3.5 A
0.107
ID(ON)
gFS
On-State Drain Current
14
A
S
Forward Transconductance
6
DYNAMIC CHARACTERISTICS
C
Input Capacitance
VDS = 15 V, VGS = 0 V,
f = 1.0 MHz
220
50
pF
pF
pF
iss
Coss
Crss
Output Capacitance
Reverse Transfer Capacitance
20
SWITCHING CHARACTERISTICS (Note 2)
tD(on)
tr
tD(off)
tf
Turn - On Delay Time
Turn - On Rise Time
VDS = 15 V, I D = 1 A
3
6
ns
ns
11
22
VGS = 10 V , RGEN = 6 W
Turn - Off Delay Time
Turn - Off Fall Time
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
7
14
6
ns
ns
3
Qg
Qgs
Qgd
VDS = 15 V, I D = 3.5 A,
VGS = 5 V
2.1
0.8
0.7
4
nC
nC
nC
DRAIN-SOURCE DIODE CHARACTERISTICS AND MAXIMUM RATINGS
IS
Maximum Continuous Drain-Source Diode Forward Current
Drain-Source Diode Forward Voltage
1.3
1.2
A
V
VSD
VGS = 0 V, IS = 1.3 A (Note 2)
0.73
Notes:
1. Rq is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. Rq is
JA
JC
guaranteed by design while RqCA is determined by the user's board design.
b. 125OC/W on a 0.02 in2
pad of 2oz copper.
c. 135OC/W on a minimum
mounting pad.
a. 78OC/W on a 0.5 in2
pad of 2oz copper.
Scale 1 : 1 on letter size paper
2. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%.
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2
Typical Electrical Characteristics
2.5
2
15
VGS = 10V
6.0V
12
VGS= 3.5V
4.5V
4.0 V
9
4.5 V
4.0V
1.5
1
5.0V
6.0V
6
3.5V
10V
12
3
3.0V
0.5
0
0
3
6
9
15
0
1
2
3
4
5
I
, DRAIN CURRENT (A)
V
, DRAIN-SOURCE VOLTAGE (V)
D
DS
Figure 2. On-Resistance Variation with
Drain Current and Gate Voltage.
Figure 1. On-Region Characteristics.
0.3
0.24
0.18
0.12
0.06
0
1.6
I D
= 3.5A
ID = 3.5A
V
= 10V
GS
1.4
1.2
1
125°C
25°C
0.8
0.6
2
4
6
8
10
-50
-25
0
25
50
75
100
125
150
V
, GATE TO SOURCE VOLTAGE (V)
T
, JUNCTION TEMPERATURE (°C)
GS
J
Figure 3. On-Resistance Variation with
Figure 4. On-Resistance Variation with
Gate-to-Source Voltage.
Temperature.
10
8
6
4
2
0
T = -55°C
J
VGS= 0V
VDS =5.0V
25°C
125°C
T = 125°C
1
0.1
J
25°C
-55°C
0.01
0.001
0.2
0.4
0.6
0.8
1
1.2
1
2
3
4
5
V
, BODY DIODE FORWARD VOLTAGE (V)
V
, GATE TO SOURCE VOLTAGE (V)
SD
GS
Figure 5. Transfer Characteristics.
Figure 6. Body Diode Forward Voltage
Variation with Source Current
and Temperature.
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3
Typical Electrical Characteristics
500
10
ID = 3.5A
VDS = 5V
C
C
iss
8
6
4
2
0
200
100
50
10V
15V
oss
f = 1 MHz
VGS = 0 V
20
10
C
rss
0.1
0.2
V
0.5
1
2
5
10
30
, DRAIN TO SOURCE VOLTAGE (V)
0
1
2
3
4
DS
Q
, GATE CHARGE (nC)
g
Figure 8. Capacitance Characteristics.
Figure 7. Gate Charge Characteristics.
30
30
SINGLE PULSE
10
5
25
20
15
10
5
RqJA =135 °C/W
A
T
= 25°C
2
1
0.5
VGS =10V
SINGLE PULSE
0.1
0.05
RqJA = 135°C/W
TA = 25°C
0
0.01
0.01
0.1
0.1
0.5
10
50 100
300
0.2
0.5
1
2
5
10
30 50
SINGLE PULSE TIME (SEC)
V
, DRAIN-SOURCE VOLTAGE (V)
DS
Figure 9. Maximum Safe Operating Area.
Figure 10. Single Pulse Maximum Power
Dissipation.
1
D = 0.5
0.5
R
(t) = r(t) * R
JA
q
JA
0.2
0.2
q
R
=135° C/W
JA
q
0.1
0.1
0.05
0.05
P(pk)
0.02
0.02
0.01
t1
t2
T - T = P * R (t)
JA
q
0.01
Single Pulse
0.005
J
A
Duty Cycle, D = t1 /t
2
0.002
0.001
0.0001
0.001
0.01
0.1
, TIME (sec)
1
10
100
300
t
1
Figure 11. Transient Thermal Response Curve.
Thermal characterization performed using the conditions described in note 1c.
Transient thermal response will change depending on the circuit board design.
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4
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
literature is subject to all applicable copyright laws and is not for resale in any manner.
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