FFH30S60STU [ONSEMI]

整流器,30A,600V,2.6V,TO-247(2 引线)STEALTH II;
FFH30S60STU
型号: FFH30S60STU
厂家: ONSEMI    ONSEMI
描述:

整流器,30A,600V,2.6V,TO-247(2 引线)STEALTH II

软恢复二极管 超快速软恢复二极管 局域网 PC
文件: 总5页 (文件大小:370K)
中文:  中文翻译
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Stealth II Rectifier  
30 A, 600 V  
FFH30S60S  
Description  
The FFH30S60S is stealth2 rectifier with soft recovery  
characteristics. It is silicon nitride passivated ionimplanted epitaxial  
planar construction.  
www.onsemi.com  
This device is intended for use as freewheeling of boost diode in  
switching power supplies and other power switching applications.  
Their low stored charge and hyperfast soft recovery minimize ringing  
and electrical noise in many power switching circuits reducing power  
loss in the switching transistors.  
Features  
High Speed Switching, t < 35 ns @ I = 30 A  
rr  
F
TO247  
2 LEAD  
CASE 340CL  
High Reverse Voltage and High Reliability  
This Device is PbFree and is RoHS Compliant  
Applications  
MARKING DIAGRAM  
General Purpose  
Switching Mode Power Supply  
Boost Diode in Continuous Mode Power Factor Corrections  
Power Switching Circuits  
$Y&Z&3&K  
F30S60S  
ABSOLUTE MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
C
Rating  
Symbol  
Value  
600  
600  
600  
30  
Unit  
V
Peak Repetitive Reverse Voltage  
Working Peak Reverse Voltage  
DC Blocking Voltage  
V
RRM  
RWM  
V
V
V
R
V
Average Rectified Forward Current  
I
A
F(AV)  
$Y  
= ON Semiconductor Logo  
@ T = 102°C  
C
&Z  
&3  
&K  
= Assembly Plant Code  
= Numeric Date Code  
= Lot Code  
NonRepetitive Peak Surge Current  
60 Hz Single HalfSine Wave  
I
300  
A
FSM  
F30S60S  
= Specific Device Code  
Operating and Storage Temperature  
Range  
T , T  
65 to  
+175  
°C  
J
STG  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
1. Cathode  
2. Anode  
THERMAL CHARACTERISTICS  
Parameter  
Symbol  
Value  
Unit  
ORDERING INFORMATION  
See detailed ordering and shipping information on page 2 of  
this data sheet.  
Maximum Thermal Resistance, Junction  
to Case  
R
1.1  
°C/W  
q
JC  
© Semiconductor Components Industries, LLC, 2007  
1
Publication Order Number:  
February, 2020 Rev. 5  
FFH30S60S/D  
FFH30S60S  
PACKAGE MARKING AND ORDERING INFORMATION  
Device  
Device Marking  
Package  
Reel Size  
Tape Width  
Quantity  
FFH30S60STU  
F30S60S  
TO2472L  
N/A  
N/A  
50 Units  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
C
Symbol  
Parameter  
Test Conditions  
Min  
Typ  
Max  
Unit  
V
FM  
(Note 1) I = 30 A  
T
C
T
C
= 25°C  
= 125°C  
2.1  
1.6  
2.6  
V
F
I = 30 A  
F
I
(Note 1)  
V
R
V
R
= 600 V  
= 600 V  
T
C
T
C
= 25°C  
= 125°C  
100  
500  
mA  
RM  
t
I = 1 A, di/dt = 100 A/ms, V = 30 V  
T
C
T
C
= 25°C  
= 25°C  
25.2  
30  
ns  
rr  
F
R
t
rr  
I
rr  
I = 30 A, di/dt = 200 A/ms, V = 390 V  
26  
2.4  
0.9  
43  
ns  
A
F
R
S factor  
Q
nC  
rr  
t
I
I = 30 A, di/dt = 200 A/ms, V = 390 V  
T
C
= 125°C  
75.1  
6.3  
ns  
A
rr  
rr  
F
R
S factor  
0.9  
Q
238  
nC  
mJ  
rr  
W
AVL  
Avalanche Energy (L = 40 mH)  
7.2  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
1. Pulse Test: Pulse Width = 300 ms, Duty Cycle = 2%  
TEST CIRCUIT AND WAVEFORMS  
Figure 1. trr Test Circuit  
Figure 2. trr Waveforms and Definitions  
Figure 3. Avalanche Energy Test Circuit  
Figure 4. Avalanche Current and Voltage Definitions  
www.onsemi.com  
2
 
FFH30S60S  
TYPICAL PERFORMANCE CHARACTERISTICS  
1000  
100  
200  
100  
TC = 125oC  
TC = 125oC  
TC = 75oC  
75oC  
10  
25oC  
10  
1
0.1  
T
C = 25oC  
0.01  
1
10  
100  
200  
300  
400  
500  
600  
0
1
2
3
4
5
Forward Voltage, VF [V]  
Reverse Voltage, VR [V]  
Figure 5. Typical Forward Voltage Drop vs. Forward  
Current  
Figure 6. Typical Reverse Current vs. Reverse Voltage  
350  
100  
Typical Capacitance  
at 0V = 271 pF  
280  
TC = 125oC  
80  
210  
140  
70  
TC = 75oC  
60  
TC = 25oC  
40  
0
20  
0.1  
1
10  
100  
100  
150  
200  
di/dt [A/ms]  
250  
300  
Reverse Voltage, VR [V]  
Figure 7. Typical Junction Capacitance  
Figure 8. Typical Reverse Recovery Time vs. di/dt  
10  
50  
40  
30  
20  
10  
0
8
TC = 125oC  
6
T
C = 75oC  
4
2
0
TC = 25oC  
100  
150  
200  
di/dt [A/ms]  
250  
300  
25  
50  
75 100 125 150 175 200  
Case temperature, TC [oC]  
Figure 9. Typical Reverse Recovery Current vs. di/dt  
Figure 10. Forward Current Derating Curve  
www.onsemi.com  
3
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
TO2472LD  
CASE 340CL  
ISSUE A  
DATE 03 DEC 2019  
GENERIC  
MARKING DIAGRAM*  
AYWWZZ  
XXXXXXX  
XXXXXXX  
XXXX = Specific Device Code  
A
Y
= Assembly Location  
= Year  
WW = Work Week  
ZZ  
= Assembly Lot Code  
*This information is generic. Please refer to  
device data sheet for actual part marking.  
PbFree indicator, “G” or microdot “G”, may  
or may not be present. Some products may  
not follow the Generic Marking.  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON13850G  
TO2472LD  
PAGE 1 OF 1  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically  
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the  
rights of others.  
© Semiconductor Components Industries, LLC, 2018  
www.onsemi.com  
onsemi,  
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates  
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.  
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information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use  
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ADDITIONAL INFORMATION  
TECHNICAL PUBLICATIONS:  
Technical Library: www.onsemi.com/design/resources/technicaldocumentation  
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